KR101435352B1 - Laser processing apparatus and substrate position detecting method - Google Patents

Abstract

A camera 39 for sequentially picking up positioning marks provided on the substrate in the laser processing apparatus, a camera 39 for continuously moving the camera 39 on the positioning mark in succession without stopping the processing table, An image pickup instruction output section 25 for outputting an image pickup instruction to the camera 39 when the camera 39 is moved on the positioning mark, An image processing section 27 for calculating the position of the positioning mark based on the image of the positioning mark captured by the camera 39 while the movement instruction to the table is being output, , A positional shift amount calculating section (29) for calculating a positional shift amount of the substrate with respect to the processing table, and a positional shift amount calculating section re Performing a low processing and a laser processing part.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a laser processing apparatus,

The present invention relates to a laser processing apparatus and a substrate position detecting method for calculating a position shift amount with respect to a processing table of a substrate.

As a device for processing a work (workpiece) such as a printed board, there is a laser machining apparatus (micro laser machining apparatus) for performing a hole forming process by irradiating a work with laser light. In such a laser machining apparatus, the position of a positioning mark disposed on a work is detected, and based on the detection result, position correction (positional deviation correction) is performed during laser machining. When the position of the positioning mark is detected, for example, an image of the positioning mark is illuminated using a camera or the like, and the position of the positioning mark is detected by performing image processing on the illuminated image.

Since the work to be laser-machined may extend or contract in the work surface, it is necessary to set a large number of positioning marks in order to improve the positioning precision of the work. For example, in the laser processing apparatus described in Patent Document 1, the camera is moved on the positioning mark and image processing of the positioning mark is performed. Then, the displacement amount (position) of the positioning mark is detected. By repeating these processes with respect to all of the positioning marks, position detection of all the positioning marks is completed. Thereafter, the positional deviation correction is performed.

In the laser processing apparatus described in Patent Document 2, one of the positioning marks is moved to the lower side of the camera by moving the XY table. Thereafter, the positioning mark is imaged by the camera, and the coordinates of the positioning mark in the imaging area are obtained by the image processing apparatus. Then, based on the coordinates of the current position of the XY table and the coordinates of the positioning mark in the imaging area, the displacement amount of the positioning mark relative to the machine origin is obtained. In the laser machining apparatus, deviation amounts of a plurality of positioning marks are obtained. Then, the NC apparatus corrects the machining position command value to the substrate at the time of machining based on the displacement amount.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-176666 [Patent Document 2] Japanese Patent Laid-Open No. 10-328863

However, in the former and latter technologies, the process of moving the camera to the positioning mark and then stopping the image capturing and image processing is performed, and then the camera is moved to the positioning mark again. Therefore, the time required for image processing increases in proportion to the number of positioning marks. As a result, there has been a problem that it takes a long time to detect the position of the positioning mark.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus and a substrate position detecting method capable of detecting a positional deviation of a substrate in a short time.

In order to solve the above-described problems and to achieve the object, the present invention provides a laser processing apparatus comprising: a processing table on which a substrate to be processed is placed and which moves within a plane parallel to the main surface of the substrate; An image pick-up unit for picking up a positioning mark used for position detection on the substrate in a sequential order; and a control unit for controlling the processing so that the image pick-up unit continuously moves onto the positioning mark, A substrate position calculating section for calculating a relative position between the imaging section and the substrate on the basis of the position of the processing table; On the basis of the relative position corrected by the board position calculating section when the image is moved to the mark image, an image pickup instruction is outputted to the image pickup section And the position of the positioning mark is calculated on the basis of the image of the positioning mark captured by the imaging unit while the movement instruction output unit is outputting the movement command to the processing table A positional shift amount calculating section for calculating a positional shift amount of the substrate with respect to the processing table by using the position of the positioning mark calculated by the image processing section; And a laser machining section for performing laser machining while correcting the position by the calculated position displacement amount, wherein the substrate position calculating section calculates a position between the machining table and the substrate, which changes with the moving speed of the machining table, The shift amount is calculated based on the moving speed of the processing table, and the calculated position shift amount is used And the relative position is corrected.

According to the present invention, it is possible to detect the positional deviation of the substrate in a short time.

1 is a view showing a configuration of a laser machining apparatus according to an embodiment of the present invention.
2 is a view showing the configuration of a machining control apparatus and an XY table.
3 is a block diagram showing a configuration of a machining position calculating section according to the embodiment.
4 is a flowchart showing the procedure of calculating the positional shift amount of the substrate.
5 is a diagram showing an example of an image of a mark.
6 is a view showing an example of the arrangement position of marks.
Fig. 7 is a diagram showing an example of the imaging sequence of marks. Fig.
8 is a diagram for explaining the difference between the positional shift amount calculating process of the substrate in the embodiment and the conventionally used substrate positional deviation calculating process.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a laser machining apparatus and a position detecting method according to embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to these embodiments.

Embodiments.

1 is a view showing a configuration of a laser machining apparatus according to an embodiment of the present invention. The laser machining apparatus 100 is a device for performing a laser drilling process on a substrate (workpiece) 4 as a workpiece by irradiating the laser beam L (pulse laser beam). The laser machining apparatus 100 of the present embodiment performs the processing of moving the camera 39 onto the positioning mark and the image processing of the positioning mark (the processing of calculating the position of the positioning mark) simultaneously , And calculates the positional shift amount of the position on which the substrate 4 is placed.

The laser processing apparatus 100 includes a laser oscillator 1 for oscillating laser light L, a laser processing section 3 for laser processing the substrate 4, and a machining control apparatus 2. The laser oscillator 1 oscillates the laser light L and sends the laser light L to the laser processing unit 3. The laser machining unit 3 includes a Galvano mirror 35X and a YY mirror 35Y and a Galvano scanner 36X and a YY condenser lens 34. An XY table 30 and a camera 39).

The galvano scanners 36X and 36Y have a function of changing the trajectory of the laser light L and moving the irradiating position to the substrate 4. The laser light L is irradiated to the respective processing areas In two dimensions. The galvanometer scanners 36X and 36Y rotate the galvanometer mirrors 35X and 35Y at predetermined angles in order to scan the laser light L in the X-Y direction.

The galvanomirrors 35X and 35Y reflect the laser light L and deflect the laser light L at a predetermined angle. The galvanometer mirror 35X deflects the laser light L in the X direction and the galvanometer mirror 35Y deflects the laser light L in the Y direction.

The condenser lens 34 is a condenser lens having telecentricity. The condensing lens 34 deflects the laser light L in a direction perpendicular to the main surface of the substrate 4 and also fixes the laser light L to the processing position (hole position Hx) of the substrate 4 Condensed (irradiated).

The substrate 4 is an object to be processed such as a printed wiring board, and a plurality of through holes are formed to form through holes. The substrate 4 has a three-layer structure of, for example, a copper foil (conductor layer), a resin (insulating layer), and a copper foil (conductor layer).

The XY table 30 moves the substrate 4 in the XY plane by driving the motors 42X and 42Y to be described later while placing the substrate 4 thereon. Thereby, the XY table 30 moves the substrate 4 in the in-plane direction.

(Scanable area) that can be machined by the operation of the galvanometer mechanism (movement of the galvanometer scanner 36X, 36Y) without moving the XY table 30 is the machining area (scan area). In the laser machining apparatus 100, the XY table 30 is moved in the XY plane, and the laser beam L is two-dimensionally scanned by the galvanometer scanners 36X and 36Y. The XY table 30 is moved in order so that the center of each processing area is located just below the center of the condenser lens 34 (galvano origin). The galvanometer mechanism is operated so that each hole position Hx set in the machining area sequentially irradiates the laser light L. The movement between the processing areas by the XY table 30 and the two-dimensional scanning of the laser light L in the processing area by the Galvano mechanism are sequentially performed in the substrate 4. [ As a result, all the hole positions Hx in the substrate 4 are all laser-processed.

A camera (imaging section) 39 is disposed in the vicinity of a processing head (not shown) for irradiating the substrate 4 with the laser light L. The camera 39 picks up a plurality of positioning marks (hereinafter, referred to as mark 6) provided in advance on the substrate 4 and sends the picked-up image to the machining control device 2. In the present embodiment, the camera 39 captures an image of the mark 6 while moving the camera 39 on the substrate 4. [ For this reason, the camera 39 acquires an image in a short time by a shutter function or the like.

The mark 6 is an alignment mark for correcting the positional deviation of the substrate 4 caused by expansion and contraction of the substrate 4 or the like. The position of the camera 39 is fixed and the XY table 30 moves the position of the substrate 4 in the laser machining apparatus 100 so that the relative position between the camera 39 and the substrate 4 The position is changing. For convenience of explanation, the relative position between the camera 39 and the substrate 4 is changed by moving the position of the camera 39 to explain the operation of the laser machining apparatus 100 .

The processing control apparatus 2 is connected to a laser oscillator 1 and a laser processing section 3 (not shown), and controls the laser oscillator 1 and the laser processing section 3. The machining control apparatus 2 determines the predicted position of the mark 6 with respect to the actual position (detection result) of the mark 6 and the mechanical origin (reference position on the XY table 30) (The positional shift amount 208 described later) of the substrate 4 (the position of the substrate 4). In other words, the machining control apparatus 2 calculates the position shift amount 208 based on the detection result of the mark position by the camera 39, and performs laser processing of the substrate 4 to correct the position shift amount 208 Control the position.

The processing control apparatus 2 instructs the laser oscillator 1 and the laser processing section 3 to set the laser processing conditions set in the machining program when the substrate 4 is laser machined. The machining control apparatus 2 calculates the position shift amount 208 in the surface of the substrate 4 based on the detection position of the mark 6 before laser processing the substrate 4. [ The machining control apparatus 2 of the present embodiment does not stop the movement of the camera 39 (the XY table 30) when the mark 6 is picked up, . The processing control apparatus 2 captures the mark 6 by the camera 39 when the camera 39 comes on the mark 6 while moving the camera 39 in the XY plane. Thereby, the machining control apparatus 2 performs the moving process of the camera 39 and the image process (the process of calculating the position of the mark 6) using the picked-up image of the mark 6 at the same time.

The processing control unit 2 is constituted by a computer or the like and controls the laser oscillator 1 and the laser processing unit 3 by NC (Numerical Control) control or the like. The processing control apparatus 2 is configured by a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. When the processing control apparatus 2 controls the laser oscillator 1 or the laser processing section 3, the CPU reads the machining program stored in the ROM by an input from an input section (not shown) by the user (Expanded) into a program storage area in the RAM and executes various processes. Various data generated during this processing are temporarily stored in a data storage area formed in the RAM. Thereby, the machining control apparatus 2 controls the laser oscillator 1 and the laser machining section 3.

Next, the configuration of the machining control device 2 and the XY table 30 will be described. 2 is a view showing the configuration of a machining control apparatus and an XY table. The machining control apparatus 2 is connected to servo amplifiers 41X and 41Y and the servo amplifiers 41X and 41Y are connected to motors 42X and 42Y, respectively. The motors 42X and 42Y are connected to the encoders 43X and 43Y and also connected to the XY table 30, respectively.

The machining control device 2 outputs a control signal (X direction control command) for controlling the position of the XY table 30 in the X direction to the servo amplifier 41X. The machining control apparatus 2 outputs a control signal (Y direction control command) for controlling the position of the XY table 30 in the Y direction to the servo amplifier 41Y. The servo amplifiers 41X and 41Y amplify the X direction control command and the Y direction control command sent from the machining control device 2, respectively, and send them to the motors 42X and 42Y.

The motor 42X moves the XY table 30 to a position (X coordinate) in accordance with the X direction control command in the XY plane (within the plane parallel to the main surface of the substrate 4). The motor 42Y moves the XY table 30 to a position (Y coordinate) in accordance with the Y direction control command in the XY plane.

The XY table 30 includes a linear scale 40X for detecting the position (coordinate) in the X direction of the XY table 30 and a linear scale 40Y for detecting the position of the XY table 30 in the Y direction have. The linear scales 40X and 40Y send the position of the detected XY table 30 in the XY plane (hereinafter referred to as the table position 101) to the machining control device 2. The table position 101 is information indicating the relative position of the XY table 30 with respect to the camera 39.

The linear scales 40X and 40Y may be disposed in the vicinity of the XY table 30 or may be disposed at a different position from the XY table 30 to be separate from the XY table 30. [

The encoders 43X and 43Y are connected to the motors 42X and 42Y and the machining control device 2, respectively. The encoder 43X detects the state of the motor 42X (operating state in accordance with the X direction control command) and sends the detection result to the machining control device 2. The encoder 43Y detects the state of the motor 42Y (operation state in accordance with the Y direction control command) and sends the detection result to the machining control device 2. [

The camera 39 picks up a mark 6 placed on the substrate 4 and sends the picked-up image to the machining control device 2. [ The machining control apparatus 2 has a machining position calculating section 20. The machining position calculating section 20 calculates the position of the substrate 4 (XY plane (XY plane)) based on the image of the mark 6 picked up by the camera 39, the table position 101 measured by the linear scale 40X, (Hereinafter, referred to as substrate coordinates 201). The machining position calculating section 20 calculates the machining position calculating section 20 based on the correspondence relation between the moving speed of the XY table 30 and the positional shift amount G of the substrate 4 accompanying the movement of the XY table 30 (Substrate 151)) is used to correct the substrate coordinates 201.

The machining position calculating unit 20 takes the image of the mark 6 on the camera 39 and makes the image of the mark 6 captured when the coordinates of the substrate 6 after the correction of the substrate coordinates 201 become the coordinates of the mark 6 (Mark coordinates 205 to be described later) of the mark 6 based on the image. The processing position calculating section 20 uses the correspondence relationship between the moving speed of the XY table 30 and the time required until the image 6 is actually picked up after the imaging instruction of the mark 6 is outputted , The mark coordinates 205 are corrected. The machining position calculating section 20 calculates the difference between the mark coordinates 206 obtained by the correction of the mark coordinates 205 and the coordinates on the machining program of the mark 6 (mark position information 152 described later) As the positional displacement amount 208 of the positional deviation. The machining position calculating unit 20 calculates the positional displacement amount 208 of the substrate 4 for each mark 6. [ The processing control apparatus 2 corrects the laser processing position on the substrate 4 based on the position shift amount 208 of the substrate 4 calculated by the processing position calculation section 20. [

Next, the structure of the machining position calculating section 20 will be described. 3 is a block diagram showing a configuration of a machining position calculating section according to the embodiment. The processing position calculation section 20 includes a movement instruction output section 21, a velocity calculation section 22, a table position input section 23, a substrate position calculation section 24, an imaging instruction output section 25, an image input section 26 An image processing unit 27, a coordinate correcting unit 28, a position shift amount calculating unit 29, a substrate position shift information storing unit M1, a part program storing unit M2, an image pickup time storing unit M3, .

The substrate position misalignment information storage section M1 stores the misalignment of the substrate position indicating the correspondence between the moving speed of the XY table 30 and the misalignment amount G of the substrate 4 due to the movement of the XY table 30 A memory for storing information 151, and the like. The board position displacement information 151 is read by the board position calculation section 24. [

The machining program storage section M2 is a memory or the like for storing a machining program used for laser machining or positional deviation detection of the substrate 4. [ The machining program stored in the machining program storage unit M2 includes mark position information 152 indicating the position of the mark 6 (the coordinate in the substrate 4). The mark position information 152 is read by the movement instruction output section 21 and the imaging instruction output section 25. [

The imaging time required storage section M3 stores the time required until the camera 39 picks up the image of the mark 6 after the imaging instruction of the mark 6 is outputted as the imaging time required information 153 And the like. The imaging time required information 153 is read by the coordinate correcting unit 28. [

The movement command output unit 21 outputs control commands to the servo amplifiers 41X and 41Y in the X direction on the basis of the origin coordinates of the substrate 4 with respect to the reference position on the XY table 30 and the mark position information 152 Control command, Y direction control command). The X direction control command and the Y direction control command are information indicating the movement amount of the substrate 4 in the X direction and the movement amount in the Y direction, respectively.

The movement command output section 21 outputs control commands to the servo amplifiers 41X and 41Y so that the camera 39 sequentially passes the marks 6 on the marks 6 arranged on the substrate 4. [ . The movement instruction output section 21 also sends a control command to the speed calculation section 22 to be outputted to the servo amplifiers 41X and 41Y.

The speed calculating section 22 calculates the moving speed of the XY table 30 based on a control command output from the movement command output section 21. [ The speed calculating section 22 sends the calculated moving speed to the substrate position calculating section 24 and the coordinate correcting section 28 as the table moving speed Tv. The table position input section 23 receives the position (table position 101) of the XY table 30 sent from the linear scales 40X and 40Y and sends it to the substrate position calculating section 24. [

Based on the table position 101 from the table position input section 23 and the origin position of the substrate 4 with respect to the reference position on the XY table 30, the substrate position calculating section 24 calculates the substrate position (201). The substrate 4 and the XY table 30 have rigidity. Therefore, between the actual relative position between the camera 39 and the substrate 4 and the substrate coordinate 201 calculated based on the table position 101 detected by the linear scales 40X and 40Y, The positional deviation (positional deviation of the substrate 4) occurs. In this embodiment, the substrate coordinates 201 are corrected based on the substrate position displacement information 151 in the substrate position misalignment information storage unit M1 to calculate the position coordinates of the substrate coordinates 202 ) Is calculated.

The substrate position calculating section 24 calculates the position shift amount Gv of the substrate 4 corresponding to the moving speed of the XY table 30 based on the table moving speed Tv and the substrate position shift information 151 . The substrate position calculating section 24 calculates the substrate coordinates 202 by adding the calculated positional shift amount Gv of the substrate 4 to the substrate coordinates 201. [ The substrate position calculation section 24 sends the calculated substrate coordinates 202 to the imaging command output section 25 as the position of the substrate 4.

The imaging instruction output section 25 outputs an imaging instruction to the camera 39 based on the mark position information 152 and the position of the board 4 calculated by the board position calculation section 24. [ The imaging instruction output section 25 outputs an imaging instruction to the camera 39 at the timing when the camera 39 reaches the mark 6. [

The image input section 26 inputs an image of the mark 6 picked up by the camera 39 and sends it to the image processing section 27. The image processing section 27 calculates the center position of the mark 6 based on the image of the mark 6. [ The image processing unit 27 sends the calculated center of gravity position as the mark coordinates 205 to the coordinate correction unit 28. [

The coordinate correcting unit 28 corrects the mark coordinate 205 based on the imaging time required information 153 and the table moving speed Tv from the speed calculating unit 22, ). Specifically, the coordinate correcting unit 28 calculates the position shift amount of the mark coordinate 205 in accordance with the moving speed of the XY table 30, based on the imaging time required information 153 and the table moving speed Tv do. The coordinate correcting unit 28 calculates the mark coordinate 206 by adding the calculated position shift amount to the mark coordinate 205. [ The coordinate correcting unit 28 calculates the mark coordinates 206 for each mark 6. [ The coordinate correcting unit 28 sends the calculated mark coordinates 206 to the position shift amount calculating unit 29.

The positional shift amount calculating section 29 calculates the difference between the mark coordinate 206 and the abnormal coordinate of the mark 6 calculated based on the machining program (mark position information 152) 208). The position shift amount calculating section 29 calculates the position shift amount 208 for each mark 6. [ The position shift amount calculating section 29 stores the calculated position shift amount 208 in the machining program storage section M2.

Next, the processing procedure of the positional shift amount calculating process (mark position detecting process) of the substrate 4 by the laser machining apparatus 100 will be described. 4 is a flowchart showing the procedure of calculating the positional shift amount of the substrate by the laser processing apparatus.

After the substrate 4 to be laser-machined is placed on the XY table 30 of the laser machining apparatus 100, the machining position calculating section 20 calculates the positional shift amount of the substrate 4 ) Is started.

The movement instruction output unit 21 reads the mark position information 152 in the machining program from the machining program storage unit M2. The movement command output section 21 outputs a control command to the servo amplifiers 41X and 41Y based on the mark position information 152. [ In this embodiment, regardless of the operation of the camera 39 or the image processing by the image processing unit 27, the camera 39 is controlled so that the movement of the camera 39 is passed through the marks 6 in order, , And 41Y. Thereby, the camera 39 moves on the mark 6 in order without stopping. The movement instruction output section 21 also sends a control command to the speed calculation section 22 to be outputted to the servo amplifiers 41X and 41Y.

The speed calculating section 22 calculates the moving speed of the XY table 30 based on a control command output from the movement command output section 21. [ The speed calculating section 22 sends the calculated moving speed to the substrate position calculating section 24 as the table moving speed Tv.

The linear scales 40X and 40Y detect the position of the XY table 30 and send it to the table position input unit 23 when the XY table 30 moves. The table position input section 23 inputs the position of the XY table 30 sent from the linear scales 40X and 40Y as the table position 101 and sends it to the substrate position calculation section 24. [

The substrate position calculating section 24 calculates the substrate coordinates 201 based on the table position 101 from the table position input section 23 changing at different angles. The substrate position calculating section 24 calculates the positional shift amount Gv of the substrate 4 corresponding to the moving speed of the XY table 30 based on the table moving speed Tv and the substrate position shift information 151 ). The substrate position calculating section 24 adds the calculated positional shift amount Gv of the substrate 4 to the substrate coordinate 201 so as to determine the position of the substrate 39 relative to the camera 39, (202). Thereby, the substrate position calculating section 24 can calculate the exact position of the substrate 4 with respect to the mark 6 of the corner portion where the XY table 30 simultaneously moves in the X direction and the Y direction. The substrate position calculation section 24 sends the calculated substrate coordinates 202 to the imaging command output section 25 as the position of the substrate 4.

The imaging instruction output unit 25 calculates the distance to the position of the mark 6 (imaging position) based on the mark position information 152 and the substrate coordinate 202 calculated by the substrate position calculating unit 24 (Step S10).

The imaging instruction output unit 25 determines whether or not the camera 39 has reached the mark position (step S20). The imaging instruction output unit 25 determines that the camera 39 has reached the mark position when the substrate coordinate 202 becomes the same coordinate as the coordinate of the mark 6. [

When the camera 39 determines that the camera 39 has not reached the mark position (NO in step S20), the imaging instruction output unit 25 continues calculating the distance to the imaging position of the mark 6 (step S10). When the camera 39 determines that the camera 39 has reached the mark position (step S20, YES), the imaging instruction outputting section 25 outputs an imaging instruction to the camera 39. [ Thus, the camera 39 picks up the mark 6 (step S30). The camera 39 captures the mark 6 while moving so that the camera 39 picks up the mark 6 using a sufficient amount of light (illumination) enough to capture the mark 6. [

The camera 39 sends the captured image to the image input unit 26. The image input section 26 inputs an image of the mark 6 picked up by the camera 39 and sends it to the image processing section 27. The image processing section 27 performs image processing of the image sent from the image input section 26 (step S40). More specifically, the image processing section 27 calculates the feature quantity (e.g., the center of gravity of the mark 6) of the mark 6 based on the image of the mark 6. The image processing unit 27 sends the calculated center of gravity position as the mark coordinates 205 to the coordinate correction unit 28. [

The coordinate correcting unit 28 corrects the result of the image processing to calculate the mark position (step S50). More specifically, the coordinate correcting unit 28 corrects the mark coordinates 205 based on the image pickup time information 153 and the table moving speed Tv, thereby obtaining the mark coordinates 206 as the mark positions, .

In order to calculate the mark coordinate 206, the coordinate correcting unit 28 corrects the mark coordinates 205 (x, y) according to the moving speed of the XY table 30, based on the imaging time required information 153 and the table moving speed Tv ) Is calculated. The mark coordinates 206 are calculated by adding the calculated position shift amount to the mark coordinates 205. [

5 is a diagram showing an example of an image of a mark. It can not be said that the mark 6 overlaps the center 81 of the image 8 and the center of gravity 61 of the mark 6 due to the expansion and contraction of the substrate 4. [ The position shift amount between the center portion 81 of the camera 39 and the center of gravity 61 of the mark 6 is calculated as the mark coordinate 205 in this embodiment. The position shift amount 205 is corrected based on the image pickup time information 153, thereby calculating the mark coordinates 206. [

Here, the arrangement position of the mark 6 and the imaging sequence of the mark 6 will be described. 6 is a view showing an example of the arrangement position of marks. Fig. 7 is a diagram showing an example of the imaging sequence of marks. Fig. 6 and Fig. 7 show a view of the substrate 4 as viewed from above.

6, the marks 6 are formed in the vicinity of four apexes on the substrate 4 and in the vicinity of the periphery of the machining hole region (machining hole pattern) 5 in which the machining holes are formed And the like. 6 shows a case in which a plurality of machining hole regions 5 are set on the substrate 4 and four marks 6 are arranged in the vicinity of the periphery of each machining hole region 5. [

7 shows a case where the marks 6 are picked up in the order of the marks 61 to 68 in order. A mark 62 disposed in the vicinity of the first machining area 5 closest to the mark 61 is picked up after the mark 61 arranged near the top left corner of the substrate 4 is picked up, . The mark 63, the mark 64 and the mark 65 arranged in the periphery of the first machining hole area 5 are sequentially picked up.

The mark 66, the mark 67 and the mark 68 arranged in the vicinity of the second machining hole area 5 disposed in the vicinity of the first machining hole area 5 are successively picked up in order . The mark 6 is picked up in order according to a predetermined order in which the moving distance of the camera 39 is shortened.

The coordinate correcting unit 28 calculates the mark coordinates 206 for each mark 6. [ The coordinate correcting unit 28 sends the calculated mark coordinates 206 to the position shift amount calculating unit 29. The position shift amount calculating section 29 calculates the difference between the mark coordinates 206 and the coordinates on the machining program of the mark 6 (mark position information 152) as the position shift amount 208 of the substrate 4. The position shift amount calculating section 29 stores the calculated position shift amount 208 in the machining program storage section M2.

The imaging instruction output unit 25 instructs the camera 39 to issue an imaging instruction to all the marks 6 based on the mark position information 152 and the substrate coordinates 202 calculated by the substrate position calculating unit 24 It is determined whether or not it has been output. In other words, it is determined whether or not all the marks 6 have been picked up (step S60).

The imaging instruction output unit 25 performs the processes of steps S10 to S50 with respect to the next mark 6 if no imaging instruction is output to the camera 39 for all the marks 6 (step S60, NO) . The imaging instruction output unit 25 repeats the processes of steps S10 to S50 until all the marks 6 are outputted to the camera 39 with an imaging instruction.

When the image pickup instruction output section 25 outputs an image pickup instruction to all the marks 6 to the camera 39 (step S60, YES), the laser processing apparatus 100 ends the image pickup processing for the marks 6. [ As a result, all the marks 6 set in the respective machining hole areas 5 are picked up by the camera 39. Since the mark 6 is disposed at various positions on the substrate 4, the processing position calculating section 20 calculates the position shift amount 208 of the substrate 4 on each mark 6, The in-plane distribution of the positional shift amount 208 in the plane 4 can be calculated.

As described above, in this embodiment, the output processing of the movement command to the XY table 30 and the image processing of the mark 6 are independently performed. In other words, the operation of the movement instruction output section 21 (movement of the XY table 30) and the operation of the image processing section 27 are made independent.

Here, the difference between the positional shift amount calculating process of the substrate 4 and the conventionally used positional shift amount calculating process of the substrate 4 in the present embodiment will be described. 8 is a diagram for explaining the difference between the positional shift amount calculating process of the substrate in the embodiment and the conventionally used substrate positional deviation calculating process.

8 (1), conventionally, after the movement 71 of the XY table 30, the movement of the XY table 30 is stopped (72), and thereafter the image processing of the mark 6 (73). Conventionally, when calculating the position shift amount of the substrate 4, the movement 71, the stop 72, and the image processing 73 are repeated in order. Therefore, the stop 72 of the XY table 30 and the image processing 73 of the mark 6 are performed between the movement 71 and the movement 71 of the XY table 30. Therefore, in the process of calculating the position shift amount of the substrate 4, the stop 72 and the time of the image processing 73 are required for the same number of times as the number of the marks 6. Therefore, as the number of marks 6 increases, the stop 72 increases and the productivity decreases.

On the other hand, in the present embodiment, the movement 71 of the XY table 30 is continuously performed without stopping the XY table 30 as shown in (2) of FIG. The image processing 73 of the mark 6 is performed while the XY table 30 is moved. In other words, the mark image is acquired and image processing (feature amount extraction) is performed while the XY table 30 is moved. As described above, in the present embodiment, since the task of the movement 71 is separate from the task of the image processing 73, it is possible to execute the image processing 73 during the movement 71. [

Therefore, even if the number of marks 6 to be subjected to position detection is increased, the time required for the feature amount extraction of the mark 6 does not increase and the time required for the movement of the XY table 30 increases Nothing more. Therefore, it is possible to reduce the processing time of the stop 72 and the image processing 73, thereby making it possible to shorten the tact time. As a result, in the present embodiment, it is possible to calculate the position shift amount of the substrate 4 in a shorter time than the conventional method, and the substrate 4 can be laser-processed without lowering the productivity.

After the position shift amount calculating section 29 stores the position shift amount 208 of all marks 6 in the machining program storage section M2, the machining control device 2 starts laser machining of the substrate 4 do. The laser beam is irradiated onto the substrate 4 on the basis of the positional shift amount 208 of the substrate 4 calculated by the machining position calculating unit 20 when laser processing the substrate 4 is performed, Correct the machining position.

More specifically, the movement instruction output unit 21 reads the machining program and the position shift amount 208 from the machining program storage unit M2. The movement instruction output unit 21 corrects the coordinates of the machining hole Hx set in the machining program based on the position displacement amount 208 for each position of the machining hole Hx. Then, a movement command corresponding to the coordinates of the machining hole Hx after correction is output to the servo amplifiers 41X and 41Y. Thereby, while the position of the processing hole Hx is corrected only by the positional shift amount of the substrate 4, the laser processing of the processing hole Hx is performed.

The calculation of the positional shift amount of the substrate 4 is performed each time the substrate 4 is placed on the XY table 30. In other words, when laser processing the substrate 4, the substrate 4 is placed on the XY table 30 to calculate the positional shift amount of the substrate 4, and the substrate 4 is laser-processed. When the next substrate 4 is laser-processed, the next substrate 4 is placed on the XY table 30, and the positional shift amount of the next substrate 4 is calculated. As a result, in the laser machining apparatus 100, the substrate 4 is placed on the XY table 30, the positional shift amount of the substrate 4 is calculated, and the laser processing on the substrate 4 is repeated .

Further, the laser machining apparatus 100 may calculate the substrate coordinates 201 without using the linear scales 40X and 40Y. In this case, the substrate coordinates 201 are calculated using the deviation information (droop amount) which is the difference between the command value to the motors 42X and 42Y and the actual number of rotations of the motors 42X and 42Y.

More specifically, the table position 101 is calculated by subtracting the deviation information from the integrated value (sum value) of the control command output from the movement command output unit 21 by the substrate position calculation unit 24. [ The command values to the motors 42X and 42Y correspond to control commands to the servo amplifiers 41X and 41Y. The actual number of rotations of the motors 42X and 42Y is detected by the encoders 43X and 43Y. Therefore, the deviation information is a difference between the present value of the control command to the servo amplifiers 41X and 41Y and the rotational speed (current value) detected by the encoders 43X and 43Y. Since the moving speed of the XY table 30 changes in accordance with the control command to the servo amplifiers 41X and 41Y, the deviation information also changes in accordance with the moving speed of the XY table 30. [ Therefore, the substrate coordinates 201 calculated using the deviation information also change with the moving speed of the XY table 30. [

When the substrate coordinates 201 are calculated using the linear scales 40X and 40Y, when the encoder 43X and 43Y are unnecessary and the substrate coordinate 201 is calculated using the deviation information, 40X, and 40Y are unnecessary.

The correction from the mark coordinate 205 to the mark coordinate 206 is not limited to the correction using the imaging time required information 153 and the table movement speed Tv. For example, the coordinate correction amount from the mark coordinate 205 to the mark coordinate 206 according to the table moving speed Tv may be stored in a predetermined database or the like in advance. In this case, the coordinate correction amount in accordance with the table moving speed Tv is calculated in advance using the imaging time required information 153 and the table moving speed Tv.

It is also possible to include the shutter speed of the camera 39 in the image pickup time information 153. The imaging instruction output unit 25 may output an imaging instruction to the camera 39 a little sooner in consideration of the shutter speed of the camera 39. [ The number of the cameras 39 is not limited to one but may be plural. In this case, a plurality of marks 6 are simultaneously picked up by the plurality of cameras 39. The movement of the substrate 4 (the XY table 30) may be a constant velocity motion or a subrange motion.

When the movement of the substrate 4 is equal to the constant velocity movement, the correction from the substrate coordinates 201 to the substrate coordinates 202 is facilitated. When the movement of the substrate 4 is a constant velocity movement, the correction from the mark coordinate 205 to the mark coordinate 206 is facilitated.

The moving speed of the XY table 30 is not limited to the case of calculating based on the control command to the servo amplifiers 41X and 41Y and may be obtained by directly measuring the moving speed of the XY table 30 in practice.

As described above, according to the embodiment, the image processing (calculation of the position of the mark 6) of the image of the image of the mark 6 is performed while the movement process to each mark 6 is performed, It is possible to detect the positional deviation of the substrate 4 placed on the substrate 4 in a short time.

Since the substrate coordinates 201 are corrected to the substrate coordinates 202 by using the substrate position shift information 151 and the table movement speed Tv, the position on the substrate 4 can be accurately calculated. Therefore, it becomes possible to pick up an image of the mark 6 at the position on the substrate 4 accurately.

It is also possible to calculate the position of the correct mark 6 by correcting the mark coordinates 205 using the image pickup time information 153 and the table movement speed Tv with the mark coordinates 206. [ Therefore, it is possible to calculate the positional deviation of the substrate 4 accurately.

When the substrate coordinate 201 is calculated using deviation information which is a difference between a command value to the motors 42X and 42Y and an actual rotation number of the motors 42X and 42Y, the linear scales 40X and 40Y ) Becomes unnecessary, it becomes possible to calculate the substrate coordinates 201 with a simple configuration.

≪ Industrial Availability >

INDUSTRIAL APPLICABILITY As described above, the laser machining apparatus and the substrate position detecting method according to the present invention are suitable for calculating the positional shift amount with respect to the processing table of the substrate.

1 laser oscillator 2 processing control device
3 laser processing part 4 substrate
5 Machining hole area 6 marks
20 Processing position calculating section 21 Movement command output section
22 speed calculating section 23 table position input section
24 substrate position calculating section 25 imaging instruction output section
26 Image input unit 27 Image processing unit
28 Coordinate correction section 29 Position shift amount calculation section
30 XY Table 39 Camera
40X, 40Y linear scale 43X, 43Y encoder
100 Laser processing equipment L laser light
M1 Substrate position misalignment information storage section M2 The machining program storage section
M3 imaging required time storage unit

Claims (6)

A processing table on which a substrate to be processed is placed and which moves within a plane parallel to the main surface of the substrate;
An imaging unit provided on the substrate for imaging the positioning marks used for position detection on the substrate in order;
A movement instruction output unit for outputting a movement instruction to the machining table so that the image pick-up unit sequentially moves onto the positioning mark without stopping the machining table,
A substrate position calculating section for calculating a relative position between the imaging section and the substrate based on the position of the processing table,
An image pickup instruction output unit for outputting an image pickup instruction to the image pickup unit based on the relative position corrected by the substrate position calculating unit when the image pickup unit moves onto the positioning mark,
An image processing section for calculating the position of the positioning mark based on the image of the positioning mark captured by the imaging section while the movement instruction output section is outputting the movement instruction to the processing table;
A position shift amount calculating unit for calculating a position shift amount of the substrate with respect to the processing table by using the position of the positioning mark calculated by the image processing unit;
And a laser machining section for performing laser machining while correcting the position of the substrate by the positional shift amount calculated by the positional displacement calculating section,
The substrate position calculating section calculates a position shift amount between the machining table and the substrate that changes according to the moving speed of the machining table based on the moving speed of the machining table, And corrects the relative position. delete The method according to claim 1,
Further comprising a linear scale for detecting a position of the machining table,
And the substrate position calculating section calculates the relative position based on the position of the machining table detected by the linear scale. The method according to claim 1,
A motor for moving the machining table,
Further comprising an encoder for detecting the number of revolutions of the motor,
Wherein the substrate position calculating section calculates the relative position by using a control command to the motor corresponding to a movement command to the machining table, a detection result of the encoder, and an integration value of a movement command to the machining table And the laser beam is irradiated with the laser beam. The method according to any one of claims 1, 3, and 4,
The position of the positioning mark calculated by the image processing section is corrected based on the time required for outputting the image pickup instruction until the image of the positioning mark is picked up and the moving speed of the processing table And a coordinate correcting unit for correcting the coordinates
Wherein the position shift amount calculating section calculates the position shift amount of the substrate with respect to the processing table by using the position of the positioning mark corrected by the coordinate correcting section. A processing table on which a substrate to be laser-processed is placed and which moves within a plane parallel to the main surface of the substrate, and an image pickup section provided on the substrate and adapted to sequentially pick up a positioning mark used for position detection on the substrate A step of outputting a movement command to the machining table so that a laser machining apparatus sequentially moves the imaging section onto the positioning mark without stopping the machining table;
A relative position between the imaging section and the substrate is calculated on the basis of the position of the processing table and a positional deviation amount between the processing table and the substrate, which varies with the moving speed of the processing table, A step of calculating based on the moving speed of the machining table and correcting the relative position by using the calculated positional shift amount;
Outputting an image pickup instruction to the image pickup section based on the corrected relative position when the image pickup section has moved to the positioning mark;
Calculating a position of the positioning mark based on an image of the positioning mark captured by the image pickup unit while a movement instruction to the processing table is being output;
And calculating the positional shift amount of the substrate with respect to the processing table using the calculated position of the positioning mark.

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