KR101422270B1 - Manufacturing method of metal mesh for touch screen sensor and Touch screen sensor using the same - Google Patents

Abstract

A method of manufacturing a metal mesh for a touch screen sensor, the method comprising: forming a conductive layer on a carrier; forming a first blackening layer on the conductive layer; and forming the carrier, the conductive layer, Forming a second blackening layer on the conductive layer of the transparent substrate from which the carrier has been removed; and forming a first blackening layer on the conductive layer, Patterning the first blackening layer, the conductive layer, and the second blackening layer; and forming a third blackening layer on the top and sides of the patterned first blackening layer, the conductive layer, and the second blackening layer .

Description

Technical Field [0001] The present invention relates to a method of manufacturing a metal mesh for a touch screen sensor and a touch screen sensor using the touch screen sensor,

The present invention relates to a method of manufacturing a metal mesh for a touch screen sensor and a touch screen sensor using the same. More particularly, the present invention relates to a method of manufacturing a metal mesh for a touch screen sensor, And more particularly, to a touch screen sensor manufactured using the touch screen.

2. Description of the Related Art Recently, electronic devices having small display devices such as navigation and smart phones have been widely used, and display devices having input means such as touch screen panels have been widely used.

BACKGROUND ART A touch screen panel (TSP) is an electronic device equipped with input means capable of controlling a computer using a hand or a touch pen. The touch screen panel includes a resistive film type for sensing a pressure and a capacitive type for detecting movement of a charge. Various techniques for manufacturing structures and manufacturing methods for reducing manufacturing costs and minimizing input errors are being developed.

The touch screen panel generally comprises a window substrate, a black matrix layer, a transparent conductive layer, a metal electrode layer, a primer layer, and the like. First, a black matrix layer, a transparent conductive layer, and a metal electrode layer are sequentially formed on a window substrate, And then the touch screen panel is coupled to the display substrate. Among them, indium tin oxide (ITO) thin film is mainly used as a transparent electrode material.

Such indium tin oxide materials are excellent in transmittance and electrical characteristics, but they have drawbacks in that they can not be used as flexible materials because they are rarely supplied, inexpensive, and flexible because rare-earth metals are used.

Therefore, in order to replace the conventional indium tin oxide, a lot of research has been conducted on transparent electrode materials such as silver nano wire, carbon nanotube, graphene and zinc oxide, and a transparent electrode layer using other methods such as a metal mesh . Metal mesh, which is expected to replace indium tin oxide film in transparent electrode material, has a low resistance value because it uses metal such as silver (Ag) or copper (Cu), but also has a low point of low permeability.

Metal mesh can be substituted for indium tin oxide, which is a transparent electrode material, to manufacture electrode film by finely finishing the metal on a transparent material such as PET film to a thickness of several micrometers can do. In addition, it can be applied to a touch screen panel for a flexible display which can not be applied due to the crack characteristics of the existing indium tin oxide.

Up to now, metal mesh technology, which is mainly applied to middle and large sized products, has been developed with the process of miniaturizing the circuit width to 5 μm or less. Therefore, possibility to apply to mobile products has increased, and explosive growth is expected in the touch screen panel market do.

Metal mesh for touch screen panel is generally formed by forming a metal layer such as copper (Cu) or silver (Ag) on PET film by sputtering, transfer or plating method, And a peeling process. Such a method of producing a metal mesh is disclosed in Japanese Patent Application No. 2002-9484 and Japanese Patent Application No. 2009-76654.

Accordingly, a first object of the present invention is to provide a method of manufacturing a metal mesh for a touch screen sensor, in which the process cost is reduced by using a plating method, and the periphery of the metal mesh is blackened to improve display characteristics.

A second problem to be solved by the present invention is to provide a method of manufacturing a metal mesh for a touch screen sensor in which a manufacturing process is simplified by forming upper and lower portions of a metal mesh pattern on a carrier.

A third problem to be solved by the present invention is to provide a touch screen sensor manufactured using the method of manufacturing a metal mesh for a touch screen sensor.

According to another aspect of the present invention, there is provided a method of manufacturing a metal mesh for use in a touch screen sensor, the method comprising: forming a conductive layer on a carrier; forming a first blackening layer on the conductive layer; A method for manufacturing a semiconductor device, comprising the steps of: bonding a first blackening layer of a substrate on which a carrier, a conductive layer and a first blackening layer are sequentially formed on a transparent substrate; separating and removing the carrier from the conductive layer; Forming a second blackening layer on the patterned first blackening layer, the conductive layer, and the second blackening layer; patterning the first blackening layer, the conductive layer, and the second blackening layer; And forming a third blackening layer on the surface of the metal mesh.

According to an embodiment of the present invention, the step of forming the conductive layer on the carrier may be performed by a copper electroplating process or a copper electroless plating process.

According to another embodiment of the present invention, the first blackening layer, the second blackening layer or the third blackening layer may be formed of black nickel or black chrome formed by electrolytic plating or electroless plating.

According to another aspect of the present invention, there is provided a method of manufacturing a metal mesh for use in a touch screen sensor, comprising: forming a first copper layer on a carrier; forming a first blackening layer on the conductive layer; Forming a second copper layer on the first blackening layer; forming a second blackening layer on the second copper layer; forming a first copper layer, a first blackening layer, Bonding the second blackening layer of the substrate, in which the two blackening layers are formed in order, onto the transparent substrate; Separating and removing the first copper layer from the first copper layer, separating and removing the first copper layer from the first blackening layer, and patterning the first blackening layer, the second copper layer and the second blackening layer And forming a third blackening layer on the upper and side portions of the patterned first blackening layer, the second copper layer, and the second blackening layer.

According to an embodiment of the present invention, the first blackening layer, the second blackening layer or the third blackening layer may be formed of black nickel or black chrome formed by electrolytic plating or electroless plating.

In order to achieve the third object, the present invention provides a touch screen sensor manufactured by the manufacturing method.

Since the metal mesh for a touch screen sensor manufactured according to the manufacturing method of the present invention is formed with a blackening layer, the reflectivity of the display screen can be reduced, and the bright room contrast ratio can be increased. In addition, since the blackening layer is formed not only at the upper portion of the metal mesh but also at the side portion or the lower portion of the mesh pattern, the reflectivity with respect to the incident light from the side is also reduced, thereby further enhancing the quality of the display device.

The method of manufacturing a metal mesh for a touch screen sensor of the present invention can reduce the manufacturing cost of a metal mesh by using a plating method and form a conductive layer of a metal mesh on an aluminum carrier by using a transcription method, The process can be simplified.

1 is a cross-sectional view illustrating a method of manufacturing a metal mesh for a touch screen sensor according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a method of manufacturing a metal mesh for a touch screen sensor according to another embodiment of the present invention.

A method of manufacturing a metal mesh for a touch screen sensor, the method comprising: forming a conductive layer on a carrier; forming a first blackening layer on the conductive layer; and forming the carrier, the conductive layer, Forming a second blackening layer on the conductive layer of the transparent substrate from which the carrier has been removed; and forming a first blackening layer on the conductive layer, Patterning the first blackening layer, the conductive layer, and the second blackening layer; and forming a third blackening layer on the top and sides of the patterned first blackening layer, the conductive layer, and the second blackening layer .

The method of manufacturing a metal mesh for a touch screen sensor according to the present invention is characterized in that a conductive layer for forming a metal mesh is formed on a carrier such as an aluminum film and transferred to a transparent substrate. When a conductive layer is directly formed on a transparent substrate made of glass or a transparent polymer resin, an additional process such as plating a base layer such as a nickel-copper layer using sputtering is required in order to improve adhesion. However, in the case of using the transfer method, since the conductive layer is formed on the aluminum carrier as the conductive layer, there is an advantage that the process such as coating of the ground layer can be omitted.

According to the present invention, a blackening layer is formed on the copper layer formed on the carrier (in this case, the blackening layer constitutes the lower blackening layer in the case of the transparent substrate), and further a blackening layer is formed on the transferred copper layer , The blackening layer constitutes the upper blackening layer in the case of the transparent substrate), or a method in which a first copper layer, a first blackening layer, a second copper layer and a second blackening layer are formed on a carrier and transferred to a transparent substrate can do. In both of the above-mentioned methods, a blackening layer is formed on the upper and lower portions of the copper layer of the transparent substrate to improve display characteristics. Further, a blackening layer is further formed on the upper and side portions of the patterned conductive layer, so that the upper, lower, and both sides of the metal mesh pattern can be blackened. In the structure in which all four sides of the metal mesh are blackened, not only the light incident from the outside but also the light reflected from the inside can be absorbed in the pattern layer, so that better optical characteristics can be realized.

The metal mesh manufactured according to the present invention is used in a touch screen sensor and can replace a conventional transparent electrode using an indium tin oxide thin film and has low electrical resistance and high visibility. In addition, since it is manufactured by the plating method, the manufacturing cost can be reduced, and in particular, it can be advantageously applied to a flexible substrate such as a polymer substrate.

In the metal mesh for a touch screen of the present invention, the conductive layer forming the mesh pattern may be formed in various structures, and different blackening layer forming processes may be applied depending on the configuration of the conductive layer.

The mesh pattern layer applied to the metal mesh for a touch screen of the present invention includes a triple layer of nickel-copper layer / copper layer / nickel copper layer, a triple layer of nickel-copper layer / copper layer / nickel layer or a black nickel layer / copper layer / Black nickel layer. After the formation of the multi-layers, a patterning process may be performed through processes such as application of a patterned protective film and etching. Concretely, a type mainly composed of hydrochloric acid as the etching solution and a type mainly containing nitric acid, sulfuric acid and hydrogen peroxide can be applied.

A process of fabricating a metal mesh for a touch screen sensor by sequentially forming a copper layer and a blackening layer on a carrier in accordance with an embodiment of the present invention and transferring the same onto a transparent substrate will be described with reference to FIG.

First, a copper layer 102 is formed on the carrier 101 such as an aluminum film by electroplating or electroless plating (Fig. 1 (A)). Although not shown in the drawing, the surface of the carrier may be soft etched using sodium hydroxide (NaOH), potassium hydroxide (KOH), or the like to form a porous buffer layer, followed by forming a copper layer. In this case, it is easy to remove the carrier after the transfer by the porous buffer layer.

Next, a first blackening layer 103 is formed on the copper layer 102 (FIG. 1 (B)). As the method of forming the first blackening layer, black nickel plating, black oxide plating, or the like by black nickel plating, black chromium plating and electroless plating reaction by electrolytic plating can be applied. The black nickel treatment by electrolytic plating is performed for about 3 minutes at a current density of about 0.5 ASD at room temperature and at a working condition of about pH 6 using a solution of metal nickel salt, sodium sulfur compound, inorganic acid, . In the black nickel plating by the electroless chemical reaction, one of reducing agents such as sodium hypophosphite, boric acid, and dimethylaminoborne is used as a reducing agent, nickel sulfate is used as a metal source, ethylenediamine tetraacetic acid is used as a complexing agent, a sulfur compound and an inorganic additive Nickel-boron-zinc, nickel-boron-titanium, nickel-boron-titanium, nickel-nickel, and the like by plating at pH 4.5 and 80 ° C for about 5 minutes using an electroless black nickel plating solution having a composition of A blackening layer required through vacancies such as phosphorous-chromium or nickel-boron-chromium can be realized. In addition, the oxide treatment can be performed by oxidizing the copper layer 102 at a temperature of 75 DEG C for about 1 minute in a strong alkaline environment of pH 12 or more using sodium hypochlorite as an oxidizing agent.

Next, the first blackening layer 103 of the carrier substrate on which the carrier 101, the copper layer 102 and the first blackening layer 103 are sequentially formed is bonded to the transparent substrate 104 (Fig. 1 (c)). . In this case, the transparent substrate may be a glass substrate or a flexible polymer substrate, and an adhesive may be used for bonding the first blackening layer and the transparent substrate. The adhesive may be made of a material having good compatibility with a flexible transparent substrate such as Poly Ethylene Terephthalate (PET), polyimide, flexible epoxy, etc., and materials such as organic titanium and organosilane may be used, As a main component.

Subsequently, the carrier bonded to the transparent substrate 104 is removed (Fig. 1 (d)). When the carrier is a carrier made of aluminum, both a physical method and a chemical method can be used. Since aluminum and copper are dissimilar metals, they can be easily separated and can be generally separated by a physical method. It is also possible to remove only aluminum chemically by using chemicals.

Then, a second blackening layer 105 is formed on the copper layer 102 from which the carrier is removed (FIG. 1 (e)). The formation of the second blackening layer can be carried out in the same manner as the formation of the first blackening layer.

Then, the first blackening layer 103, the copper layer 102, and the second blackening layer 105 are patterned to form a metal mesh pattern (FIG. 1 (b)). The patterning method may be performed by coating a photosensitive resin, partially exposing and developing the mask with a mask to form a masking pattern, and then etching the masking pattern. As the etchant, a type mainly containing chloride chloride and a type mainly containing nitric acid, sulfuric acid and hydrogen peroxide can be applied.

Next, a third blackening layer 106 is formed on the upper and side portions of the patterned metal mesh pattern (Fig. 1 (i)). As a method of forming the third blackening layer, black nickel plating by electrolytic plating, black chromium plating and black nickel plating by electroless chemical reaction can be applied. The black nickel treatment by electrolytic plating is performed for about 3 minutes at a current density of about 0.5 ASD at room temperature and at a working condition of about pH 6 using a solution of metal nickel salt, sodium sulfur compound, inorganic acid, . In the black nickel plating by the electroless chemical reaction, one of reducing agents such as sodium hypophosphite, boric acid, and dimethylaminoborne is used as a reducing agent, nickel sulfate is used as a metal source, ethylene diamine tetraacetic acid is used as a complexing agent, Nickel-boron-zinc, nickel-boron-titanium, nickel-boron-titanium, nickel, and the like by plating at pH 4.5 and 80 ° C for about 5 minutes using an electroless black nickel plating solution having a composition of A blackening layer required through vacancies such as phosphorous-chromium or nickel-boron-chromium can be realized.

A process of fabricating a metal mesh for a touch screen sensor by sequentially forming a copper layer and a blackening layer on a carrier in accordance with another embodiment of the present invention and transferring the same to a transparent substrate will be described with reference to FIG.

First, the first copper layer 202 is formed on the carrier 201 such as an aluminum film by electroplating or electroless plating (FIG. 2 (A)). Although not shown in the drawing, the surface of the carrier may be soft etched using sodium hydroxide (NaOH), potassium hydroxide (KOH), or the like to form a porous buffer layer, followed by forming a copper layer. In this case, it is easy to remove the carrier after the transfer by the porous buffer layer.

Next, a first blackening layer 203 is formed on the first copper layer 202 (FIG. 2 (B)). As the method of forming the first blackening layer, black nickel plating, black oxide plating, or the like by black nickel plating, black chromium plating and electroless plating reaction by electrolytic plating can be applied. The black nickel treatment by electrolytic plating is performed for about 3 minutes at a current density of about 0.5 ASD at room temperature and at a working condition of about pH 6 using a solution of metal nickel salt, sodium sulfur compound, inorganic acid, . In the black nickel plating by the electroless chemical reaction, one of reducing agents such as sodium hypophosphite, boric acid, and dimethylaminoborne is used as a reducing agent, nickel sulfate is used as a metal source, ethylenediamine tetraacetic acid is used as a complexing agent, a sulfur compound and an inorganic additive Nickel-boron-zinc, nickel-boron-titanium, nickel-boron-titanium, nickel-nickel, and the like by plating at pH 4.5 and 80 ° C for about 5 minutes using an electroless black nickel plating solution having a composition of A blackening layer required through vacancies such as phosphorous-chromium or nickel-boron-chromium can be realized. In addition, the oxide treatment can be performed by oxidizing the copper layer 102 at a temperature of 75 DEG C for about 1 minute in a strong alkaline environment of pH 12 or more using sodium hypochlorite as an oxidizing agent.

Next, a second copper layer 204 is formed on the first blackening layer 203 (FIG. 2 (c)). The second copper layer may be formed by electroplating or electroless plating.

Next, a second blackening layer 205 is formed on the second copper layer 204 (Fig. 2 (d)). The formation of the second blackening layer can be carried out in the same manner as the formation of the first blackening layer.

The second blackening layer 205 of the carrier substrate, in which the carrier 201, the first copper layer 202, the first blackening layer 203, the second copper layer 204 and the second blackening layer 205 are sequentially formed, Is bonded to the transparent substrate 206, and the carrier is removed (FIG. 2 (e)). The transparent substrate may be made of glass or a flexible polymer resin, and an adhesive may be used for bonding the second blackening layer and the transparent substrate. The carrier may be removed by a physical or chemical method.

Then, the first copper layer 202 is removed (FIG. 2 (bar)). Removal of the primary copper layer may be accomplished by soft etching using an etchant that selectively etches copper.

Next, the second blackening layer 205, the second copper layer 204, and the first blackening layer 203 are patterned to form a metal mesh pattern (FIG. 2 (i)). The patterning method may be performed by coating a photosensitive resin, partially exposing and developing the mask with a mask to form a masking pattern, and then etching the masking pattern. As the etchant, a type mainly containing chloride chloride and a type mainly containing nitric acid, sulfuric acid and hydrogen peroxide can be applied.

Next, a third blackening layer 207 is formed on the upper and side portions of the patterned metal mesh pattern (Fig. 2 (a)). As a method of forming the third blackening layer, black nickel plating by electrolytic plating, black chromium plating and black nickel plating by electroless chemical reaction can be applied. The black nickel treatment by electrolytic plating is performed for about 3 minutes at a current density of about 0.5 ASD at room temperature and at a working condition of about pH 6 using a solution of metal nickel salt, sodium sulfur compound, inorganic acid, . In the black nickel plating by the electroless chemical reaction, one of reducing agents such as sodium hypophosphite, boric acid, and dimethylaminoborne is used as a reducing agent, nickel sulfate is used as a metal source, ethylene diamine tetraacetic acid is used as a complexing agent, Nickel-boron-zinc, nickel-boron-titanium, nickel-boron-titanium, nickel, and the like by plating at pH 4.5 and 80 ° C for about 5 minutes using an electroless black nickel plating solution having a composition of A blackening layer required through vacancies such as phosphorous-chromium or nickel-boron-chromium can be realized.

Hereinafter, a method for manufacturing a metal mesh for a touch screen sensor of the present invention will be described in detail with reference to the embodiments.

Example 1

1) Aluminum carrier film soft etching

The aluminum carrier film (Lotte Aluminum AL1235) was degreased at room temperature for 1 minute using a degreasing agent (Al-Clean 198, WiMet) consisting of potassium hydroxide as a curing agent to remove contaminants on the aluminum surface.

2) Copper layer formation

The cleaned aluminum carrier film material was plated at a pH of 13 and a temperature of 50 ° C. for about 10 minutes by using a copper plating solution (ICU-102, Wiemote) composed of copper cyanide as a periodic agent through the above step 1) A copper layer having a thickness of 2 to 4 탆 was formed.

3) Formation of the first blackening layer

The material formed of the copper layer as the conductive layer was treated with nickel sulfate (Umicore) as a metal source through the process of 2), and electrolytic black (BLS-17A, A current of 0.5 ASD was applied at a pH of 6 and a nickel plating solution at room temperature for 3 minutes to form a first blackening layer having a thickness of 0.2 to 0.6 탆.

4) Transfer to transparent PET film for touch screen

A polyester adhesive (YPE-105, WiMet) was coated on a transparent PET film (TOYOBO) for a touch screen in an amount of about 5 to 10 μm and then primary cured at 60 to 70 ° C for 5 minutes. Next, the first blackening layer formed in the step 3) was oriented toward the PET surface coated with the polyester adhesive, and then subjected to thermal lamination at a temperature of 100 캜 and a pressure of 3 kgf. Subsequently, the transferring process was completed by removing the aluminum carrier film.

5) Second Blackening Layer Formation

The aluminum carrier film was removed in the step 4), and the same steps as the formation of the first blackening layer in the step 3) were repeatedly performed on the exposed copper layer to form the second blackening layer.

6) Pattern formation using photolithography

Using a dry film as a masking material, a metal mesh pattern for a touch screen in the form of a mesh was formed through a conventional photolithography process (photosensitive dry film resin lamination, UV exposure, development, etching, peeling). At this time, in the pattern formation process using the photolithography process, the etching process was carried out by spraying at room temperature using an etching agent (YTE-25, Wyeth) having a nucleating agent as a cyclic agent.

7) Formation of the third blackening layer

Of the mesh patterns formed through the process of 6), since the copper layer is easily oxidized, a third blackening layer is formed on the exposed side of the copper layer to prevent oxidation.

The third blackening layer was formed by using an electroless black nickel plating solution (TF-724M, A, B, C or higher wafers) having sodium hypophosphite as a reducing agent and nickel sulfate as a metal source at pH 4.5 and 80 ° C For 5 minutes to form a third blackening layer having a plating thickness of about 0.1 to 0.3 mu m.

Example 2

1) Aluminum carrier film soft etching

The aluminum carrier film (Lotte Aluminum AL1235) was degreased at room temperature for 1 minute using a degreasing agent (Al-Clean 198, WiMet) consisting of potassium hydroxide as a curing agent to remove contaminants on the aluminum surface.

2) Primary copper layer formation

The cleaned aluminum carrier film material was plated at a pH of 13 and a room temperature for about 5 minutes using a substituted copper plating solution (ICU-102, Wiemote) composed of copper cyanide as a periodic agent to obtain a plating thickness of 0.5 To 1 mu m of the first copper layer.

3) Formation of the first blackening layer

The material formed of the first copper layer as the conductive layer through the above step 2) was prepared by using nickel sulphate (Umicore) as a metal source and drying with a lustrous additive (BLS-17A, WiMet) and a blackening additive (BLS-17B) A first blackening layer 203 having a thickness of 0.2 to 0.6 탆 was formed by applying an electric current of 0.5 ASD at a pH of 6 and an alkaline black nickel plating solution at room temperature for 3 minutes.

4) Second copper layer formation

Using the electrolytic copper plating solution that was dried with a gloss additive (BJ Brightener, WiMet) as a metal supply source, the material in which the first blackening layer was formed was used as a metal supply source by Yuansandong (XiAn Chemtech) Was applied for 5 minutes to form a second copper layer having a plating thickness of 2 탆.

5) Second Blackening Layer Formation

Through the process of 4), the material on which the second blackening layer was formed was subjected to oxide treatment for 1 minute at a temperature of 13 and 75 캜 using an oxidizing agent (GMB-A, B or above) using sodium hypochlorite as an oxidizing agent Thereby forming a second blackening layer on the second copper layer.

6) Transfer to transparent PET film for touch screen

A polyester adhesive (YPE-105, WiMet) was coated on a transparent PET film (TOYOBO) for a touch screen in an amount of about 5 to 10 μm and then primary cured at 60 to 70 ° C for 5 minutes. Next, the second blackening layer formed in the step 5) was oriented toward the PET surface coated with the polyester adhesive, and then subjected to thermal lamination at a temperature of 100 캜 and a pressure of 3 kgf. Subsequently, the transferring process was completed by removing the aluminum carrier film.

7) Removal of primary copper layer

In step 6), the aluminum carrier film was removed, and the exposed copper layer was treated with sulfuric acid / hydrogen peroxide as a cycle agent and an etching additive (SE-968, WiMatter) Lt; / RTI >

8) Pattern formation using photolithography

Using a dry film as a masking material, a metal mesh pattern for a touch screen in the form of a mesh was formed through a conventional photolithography process (photosensitive dry film resin lamination, UV exposure, development, etching, peeling). At this time, in the pattern formation process using the photolithography process, the etching process was carried out by spraying at room temperature using an etching agent (YTE-25, Wyeth) having a nucleating agent as a cyclic agent.

9) Third blackening layer formation

Of the mesh patterns formed through the process of 8), since the second copper layer is easily oxidized, a third blackening layer is formed on the exposed side of the second copper layer to prevent oxidation.

The third blackening layer was formed by using an electroless black nickel plating solution (TF-724M, A, B, C or higher wafers) having sodium hypophosphite as a reducing agent and nickel sulfate as a metal source at pH 4.5 and 80 ° C For 5 minutes to form a third blackening layer having a plating thickness of about 0.1 to 0.3 mu m.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the embodiments described in the present invention are not intended to limit the scope of the present invention but to limit the scope of the present invention. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

101: Carrier 102: Copper layer
103: first blackening layer 104: transparent substrate
105: second blackening layer 106: third blackening layer
201: Carrier 202: First copper layer
203: first blackening layer 204: second copper layer
205: second blackening layer 206: transparent substrate
207: third blackening layer

Claims (6)

A method of manufacturing a metal mesh for a touch screen sensor,
Soft-etching the aluminum carrier surface using an etchant to form a porous buffer layer;
Forming a copper layer on the porous buffer layer by displacement plating;
Forming a first blackening layer on the copper layer using an electrolytic black nickel plating solution;
Bonding the first blackening layer of the substrate on which the aluminum carrier, the porous buffer layer, the copper layer, and the first blackening layer are sequentially formed on the polymer transparent substrate by thermal laminating using an adhesive;
Separating and removing the aluminum carrier having the porous buffer layer formed thereon from the copper layer;
Forming a second blackening layer on the copper layer of the polymer transparent substrate from which the aluminum carrier is removed by using an electrolytic black nickel plating solution;
Patterning the first blackening layer, the copper layer and the second blackening layer; And
And performing electroless black nickel plating on top and sides of the patterned first blackening layer, the copper layer, and the second blackening layer to form a third blackening layer. A method of manufacturing a metal mesh for a touch screen sensor,
Soft-etching the aluminum carrier surface using an etchant to form a porous buffer layer;
Forming a first copper layer on the porous buffer layer by displacement plating;
Forming a first blackening layer on the first copper layer using an electrolytic black nickel plating solution;
Forming a second copper layer over the first blackening layer;
Forming a second blackening layer on the second copper layer by displacement plating;
Bonding the second blackening layer of the substrate formed with the porous buffer layer, the first copper layer, the first blackening layer, the second copper layer and the second blackening layer in order on the polymer transparent substrate by thermal laminating using an adhesive;
Separating and removing the aluminum carrier having the porous buffer layer formed thereon from the first copper layer;
Separating and removing the first copper layer from the first blackening layer;
Patterning the first blackening layer, the second copper layer and the second blackening layer;
And performing electroless black nickel plating on top and sides of the patterned first blackening layer, the second copper layer, and the second blackening layer to form a third blackening layer. A touch screen manufactured using the metal mesh produced by the manufacturing method of claim 1 or 2. delete delete delete

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