KR101405299B9 - Substrate supporting plate and apparatus for depositing thin film having the same - Google Patents

Substrate supporting plate and apparatus for depositing thin film having the same

Info

Publication number: KR101405299B9
Authority: KR; South Korea
Prior art keywords: thin film; same; supporting plate; substrate supporting; depositing thin
Prior art date: 2007-10-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

KR1020070101917A

Other languages

Korean (ko)

Other versions

KR20090036722A (en

KR101405299B1 (en

Inventor

양철훈

황철주

Original Assignee

주성엔지니어링(주)

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-10-10

Filing date

2007-10-10

Publication date

2025-01-10

2007-10-10 Application filed by 주성엔지니어링(주) filed Critical 주성엔지니어링(주)

2007-10-10 Priority to KR1020070101917A priority Critical patent/KR101405299B1/en

2009-04-15 Publication of KR20090036722A publication Critical patent/KR20090036722A/en

2013-12-17 Priority to KR1020130157284A priority patent/KR101411385B1/en

2014-06-11 Application granted granted Critical

2014-06-11 Publication of KR101405299B1 publication Critical patent/KR101405299B1/en

2025-01-10 Publication of KR101405299B9 publication Critical patent/KR101405299B9/en

Status Active legal-status Critical Current

2027-10-10 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Chemical Vapour Deposition (AREA)

KR1020070101917A 2007-10-10 2007-10-10 Substrate support and thin film deposition apparatus having the same Active KR101405299B1 (en)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
KR1020070101917A KR101405299B1 (en)	2007-10-10	2007-10-10	Substrate support and thin film deposition apparatus having the same
KR1020130157284A KR101411385B1 (en)	2007-10-10	2013-12-17	Substrate supporting plate and apparatus for depositing thin film having the same

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
KR1020070101917A KR101405299B1 (en)	2007-10-10	2007-10-10	Substrate support and thin film deposition apparatus having the same

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020130157284A Division KR101411385B1 (en)	2007-10-10	2013-12-17	Substrate supporting plate and apparatus for depositing thin film having the same

Publications (3)

Publication Number	Publication Date
KR20090036722A KR20090036722A (en)	2009-04-15
KR101405299B1 KR101405299B1 (en)	2014-06-11
KR101405299B9 true KR101405299B9 (en)	2025-01-10

Family

ID=40761598

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020070101917A Active KR101405299B1 (en)	2007-10-10	2007-10-10	Substrate support and thin film deposition apparatus having the same

Country Status (1)

Country	Link
KR (1)	KR101405299B1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20100129566A (en) *	2009-06-01	2010-12-09	주식회사 유진테크	Substrate support unit and substrate processing apparatus including same
JP5038365B2 (en)	2009-07-01	2012-10-03	株式会社東芝	Susceptor and deposition system
TWI609991B (en) *	2013-06-05	2018-01-01	維克儀器公司	Improved wafer carrier having thermal uniformity-enhancing features
TWI650832B (en)	2013-12-26	2019-02-11	維克儀器公司	Wafer carrier having thermal cover for chemical vapor deposition systems
US9517539B2 (en)	2014-08-28	2016-12-13	Taiwan Semiconductor Manufacturing Company, Ltd.	Wafer susceptor with improved thermal characteristics
USD860146S1 (en)	2017-11-30	2019-09-17	Veeco Instruments Inc.	Wafer carrier with a 33-pocket configuration
USD854506S1 (en)	2018-03-26	2019-07-23	Veeco Instruments Inc.	Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en)	2018-03-26	2019-11-12	Veeco Instruments Inc.	Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en)	2018-03-26	2019-09-03	Veeco Instruments Inc.	Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en)	2018-03-26	2019-09-17	Veeco Instruments Inc.	Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en)	2018-03-26	2019-10-15	Veeco Instruments Inc.	Chemical vapor deposition wafer carrier with thermal cover
KR200495161Y1 (en) *	2019-07-05	2022-03-17	주성엔지니어링(주)	Substrate support and apparatus for processing substrate having the same
CN111816604B (en) *	2020-08-18	2021-03-12	北京智创芯源科技有限公司	Wafer etching method
US20230060609A1 (en) *	2021-08-31	2023-03-02	Veeco Instruments Inc.	Wafer carrier assembly with pedestal and cover restraint arrangements that control thermal gaps

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3090339B2 (en) *	1990-03-19	2000-09-18	株式会社東芝	Vapor growth apparatus and method
US6001183A (en)	1996-06-10	1999-12-14	Emcore Corporation	Wafer carriers for epitaxial growth processes
JP3810300B2 (en) *	2001-10-30	2006-08-16	京セラ株式会社	Electrostatic chuck
JP2005011934A (en)	2003-06-18	2005-01-13	Toshiba Corp	Semiconductor substrate cleaning device

2007
- 2007-10-10 KR KR1020070101917A patent/KR101405299B1/en active Active

Also Published As

Publication number	Publication date
KR20090036722A (en)	2009-04-15
KR101405299B1 (en)	2014-06-11

Publication	Publication Date	Title
KR101405299B9 (en)	2025-01-10	Substrate supporting plate and apparatus for depositing thin film having the same
EP2009685A4 (en)	2013-05-22	Vertical substrate conveyance device and film deposition equipment
GB2458986B (en)	2012-05-30	Apparatus for patterning thin films on continuous flexible substrates
IL185839A0 (en)	2008-01-06	Thin film dressing
ZA200707112B (en)	2008-09-25	Method for laminating flat support materials on substrates
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EP1969391A4 (en)	2009-12-09	Thin film emitter-absorber apparatus and methods
EP2035121A4 (en)	2010-04-28	Apparatus for holding solids for use with surface ionization technology
EP1996657A4 (en)	2009-11-25	Antistatic coating composition for polarizer films and antistatic polarizer film using the same
EP2116629A4 (en)	2010-11-24	Deposition source, deposition apparatus and method for forming organic thin film
EP2040924A4 (en)	2011-09-28	Transfer hardcoat films for graphic substrates
EP2221274A4 (en)	2013-02-27	Carbonaceous thin film and manufacturing method for same
SG126098A1 (en)	2006-10-30	Thin film photovoltaic device
GB2439599B (en)	2008-11-05	Thin film transistor array substrate and method fabricating the same
SG122925A1 (en)	2006-06-29	Rectangular substrate dividing apparatus
GB2438600B (en)	2008-07-09	Method for patterning thin films on moving substrates
TWI358759B (en)	2012-02-21	Apparatus for fabricating thin film pattern and me
GB0614545D0 (en)	2006-08-30	Coating Film
EP2043848A4 (en)	2011-11-16	Method and apparatus for thin film/layer fabrication and deposition
KR101411385B9 (en)	2025-01-10	Substrate supporting plate and apparatus for depositing thin film having the same
GB0712268D0 (en)	2007-08-01	Organic thin film transisitors
TWI316295B (en)	2009-10-21	Thin film transistor
GB0405883D0 (en)	2004-04-21	Polymeric film substrate
TWI316297B (en)	2009-10-21	Thin film transistor substrate
GB2463998B (en)	2012-10-31	Apparatus for forming films on substrates

Legal Events

Date	Code	Title	Description
2007-10-10	PA0109	Patent application	Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20071010
2009-04-15	PG1501	Laying open of application
2012-08-08	A201	Request for examination
2012-08-08	AMND	Amendment
2012-08-08	PA0201	Request for examination	Patent event code: PA02012R01D Patent event date: 20120808 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20071010 Comment text: Patent Application
2013-10-18	E902	Notification of reason for refusal
2013-10-18	PE0902	Notice of grounds for rejection	Comment text: Notification of reason for refusal Patent event date: 20131018 Patent event code: PE09021S01D
2013-12-17	A107	Divisional application of patent
2013-12-17	PA0107	Divisional application	Comment text: Divisional Application of Patent Patent event date: 20131217 Patent event code: PA01071R01D
2013-12-18	AMND	Amendment
2014-01-24	E601	Decision to refuse application
2014-01-24	PE0601	Decision on rejection of patent	Patent event date: 20140124 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20131018 Comment text: Notification of reason for refusal Patent event code: PE06011S01I
2014-02-20	J201	Request for trial against refusal decision
2014-02-20	PJ0201	Trial against decision of rejection	Patent event date: 20140220 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20140124 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20140326 Appeal identifier: 2014101000984 Request date: 20140220
2014-03-05	AMND	Amendment
2014-03-25	PB0901	Examination by re-examination before a trial	Comment text: Amendment to Specification, etc. Patent event date: 20140305 Patent event code: PB09011R02I Comment text: Request for Trial against Decision on Refusal Patent event date: 20140220 Patent event code: PB09011R01I Comment text: Amendment to Specification, etc. Patent event date: 20131218 Patent event code: PB09011R02I Comment text: Amendment to Specification, etc. Patent event date: 20120808 Patent event code: PB09011R02I
2014-03-26	B701	Decision to grant
2014-03-26	PB0701	Decision of registration after re-examination before a trial	Patent event date: 20140326 Comment text: Decision to Grant Registration Patent event code: PB07012S01D Patent event date: 20140325 Comment text: Transfer of Trial File for Re-examination before a Trial Patent event code: PB07011S01I
2014-06-02	GRNT	Written decision to grant
2014-06-02	PR0701	Registration of establishment	Comment text: Registration of Establishment Patent event date: 20140602 Patent event code: PR07011E01D
2014-06-02	PR1002	Payment of registration fee	Payment date: 20140602 End annual number: 3 Start annual number: 1
2014-06-11	PG1601	Publication of registration
2020-02-20	FPAY	Annual fee payment	Payment date: 20200221 Year of fee payment: 7
2020-02-20	PR1001	Payment of annual fee	Payment date: 20200221 Start annual number: 7 End annual number: 7
2021-06-01	PR1001	Payment of annual fee	Payment date: 20210601 Start annual number: 8 End annual number: 8
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2024-06-14	PR1001	Payment of annual fee	Payment date: 20240614 Start annual number: 11 End annual number: 11
2025-01-09	PG1701	Publication of correction	Publication date: 20250110