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KR101370235B1 - 탑재 장치 - Google Patents

탑재 장치 Download PDF

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Publication number
KR101370235B1
KR101370235B1 KR1020120019601A KR20120019601A KR101370235B1 KR 101370235 B1 KR101370235 B1 KR 101370235B1 KR 1020120019601 A KR1020120019601 A KR 1020120019601A KR 20120019601 A KR20120019601 A KR 20120019601A KR 101370235 B1 KR101370235 B1 KR 101370235B1
Authority
KR
South Korea
Prior art keywords
heat
cooling
heat exchanger
semiconductor wafer
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020120019601A
Other languages
English (en)
Korean (ko)
Other versions
KR20120098503A (ko
Inventor
히로시 야마다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20120098503A publication Critical patent/KR20120098503A/ko
Application granted granted Critical
Publication of KR101370235B1 publication Critical patent/KR101370235B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020120019601A 2011-02-28 2012-02-27 탑재 장치 Expired - Fee Related KR101370235B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-041934 2011-02-28
JP2011041934A JP5715444B2 (ja) 2011-02-28 2011-02-28 載置装置

Publications (2)

Publication Number Publication Date
KR20120098503A KR20120098503A (ko) 2012-09-05
KR101370235B1 true KR101370235B1 (ko) 2014-03-05

Family

ID=46718078

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120019601A Expired - Fee Related KR101370235B1 (ko) 2011-02-28 2012-02-27 탑재 장치

Country Status (5)

Country Link
US (1) US20120216559A1 (ja)
JP (1) JP5715444B2 (ja)
KR (1) KR101370235B1 (ja)
CN (1) CN102683241A (ja)
TW (1) TWI518822B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014001528A1 (de) * 2014-02-07 2015-08-13 Festo Ag & Co. Kg Achsanordnung
TWI629490B (zh) * 2017-07-07 2018-07-11 鴻勁精密股份有限公司 具下置式冷源輸送裝置之電子元件測試設備
US10781771B1 (en) * 2019-09-22 2020-09-22 Ghasem Kahe Automatic cooling system for combustion engine
CN113808928A (zh) * 2021-08-04 2021-12-17 北京华卓精科科技股份有限公司 一种激光退火方法和具备自主冷却功能的多孔吸盘

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07209373A (ja) * 1993-11-30 1995-08-11 Nec Corp 冷却試験装置
US5740016A (en) * 1996-03-29 1998-04-14 Lam Research Corporation Solid state temperature controlled substrate holder
US7048824B1 (en) * 1999-04-27 2006-05-23 Gebrüder Decker GmbH & Co. KG Device for treating silicon wafers
KR20090132515A (ko) * 2008-06-20 2009-12-30 도쿄엘렉트론가부시키가이샤 프로브 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3247715B2 (ja) * 1992-02-29 2002-01-21 アイシン精機株式会社 素子冷却試験装置
US6070414A (en) * 1998-04-03 2000-06-06 Raytheon Company Cryogenic cooler with mechanically-flexible thermal interface
JP2001284417A (ja) * 2000-03-30 2001-10-12 Nagase & Co Ltd プローバ及び該プローバを備えた低温試験装置
US6931863B2 (en) * 2000-08-22 2005-08-23 Sharp Kabushiki Kaisha Stirling refrigerator
CN1208545C (zh) * 2001-07-24 2005-06-29 三洋电机株式会社 史特林冷冻机
JP3619965B1 (ja) * 2003-07-22 2005-02-16 シャープ株式会社 スターリング機関
JP3773522B1 (ja) * 2005-01-18 2006-05-10 シャープ株式会社 スターリング機関
JP2007240035A (ja) * 2006-03-06 2007-09-20 Tokyo Electron Ltd 冷却加熱装置及び載置装置
US20070268944A1 (en) * 2006-05-22 2007-11-22 Frank Voss Gas purification in an excimer laser using a stirling cycle cooler
DE102007055712A1 (de) * 2007-12-05 2009-06-18 Bruker Biospin Ag Messmodul zur schnellen Messung von elektrischen, elektronischen und mechanischen Bauteilen bei kryogenen Temperaturen sowie Messeinrichtung mit einem solchen Messmodul
JP2011134992A (ja) * 2009-12-25 2011-07-07 Canon Anelva Corp 温度制御装置およびこの温度制御装置を備える真空処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07209373A (ja) * 1993-11-30 1995-08-11 Nec Corp 冷却試験装置
US5740016A (en) * 1996-03-29 1998-04-14 Lam Research Corporation Solid state temperature controlled substrate holder
US7048824B1 (en) * 1999-04-27 2006-05-23 Gebrüder Decker GmbH & Co. KG Device for treating silicon wafers
KR20090132515A (ko) * 2008-06-20 2009-12-30 도쿄엘렉트론가부시키가이샤 프로브 장치

Also Published As

Publication number Publication date
TWI518822B (zh) 2016-01-21
US20120216559A1 (en) 2012-08-30
JP5715444B2 (ja) 2015-05-07
JP2012178527A (ja) 2012-09-13
CN102683241A (zh) 2012-09-19
TW201308465A (zh) 2013-02-16
KR20120098503A (ko) 2012-09-05

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Termination date: 20171209