KR101342320B1 - Pressure-sensitive adhesive compositions and pressure-sensitive adhesive film comprising the same - Google Patents
Pressure-sensitive adhesive compositions and pressure-sensitive adhesive film comprising the same Download PDFInfo
- Publication number
- KR101342320B1 KR101342320B1 KR1020080085059A KR20080085059A KR101342320B1 KR 101342320 B1 KR101342320 B1 KR 101342320B1 KR 1020080085059 A KR1020080085059 A KR 1020080085059A KR 20080085059 A KR20080085059 A KR 20080085059A KR 101342320 B1 KR101342320 B1 KR 101342320B1
- Authority
- KR
- South Korea
- Prior art keywords
- meth
- acrylate
- weight
- sensitive adhesive
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 46
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 238000004132 cross linking Methods 0.000 claims abstract description 25
- 239000000945 filler Substances 0.000 claims abstract description 25
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 40
- 230000001681 protective effect Effects 0.000 claims description 34
- 239000000178 monomer Substances 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- -1 t- Butyl Chemical group 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 230000009477 glass transition Effects 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 125000000524 functional group Chemical group 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 239000013522 chelant Substances 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 claims description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 2
- 239000000920 calcium hydroxide Substances 0.000 claims description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000292 calcium oxide Substances 0.000 claims description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000004088 foaming agent Substances 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 239000012744 reinforcing agent Substances 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 239000013530 defoamer Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 19
- 239000000853 adhesive Substances 0.000 abstract description 14
- 239000002313 adhesive film Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000000704 physical effect Effects 0.000 abstract description 9
- 230000008859 change Effects 0.000 abstract description 7
- 229920006243 acrylic copolymer Polymers 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 21
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000002401 inhibitory effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
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- 125000003545 alkoxy group Chemical group 0.000 description 2
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- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
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- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
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- DBGSRZSKGVSXRK-UHFFFAOYSA-N 1-[2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]acetyl]-3,6-dihydro-2H-pyridine-4-carboxylic acid Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CCC(=CC1)C(=O)O DBGSRZSKGVSXRK-UHFFFAOYSA-N 0.000 description 1
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- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OZDGMOYKSFPLSE-UHFFFAOYSA-N 2-Methylaziridine Chemical compound CC1CN1 OZDGMOYKSFPLSE-UHFFFAOYSA-N 0.000 description 1
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- JYSWMLAADBQAQX-UHFFFAOYSA-N 2-prop-2-enoyloxyacetic acid Chemical compound OC(=O)COC(=O)C=C JYSWMLAADBQAQX-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
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- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- WYOXPIKARMAQFM-UHFFFAOYSA-N n,n,n',n'-tetrakis(oxiran-2-ylmethyl)ethane-1,2-diamine Chemical compound C1OC1CN(CC1OC1)CCN(CC1OC1)CC1CO1 WYOXPIKARMAQFM-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UOMUPDCRXJLVGR-UHFFFAOYSA-N propane-1,2,2-triol Chemical compound CC(O)(O)CO UOMUPDCRXJLVGR-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 description 1
- 229950001353 tretamine Drugs 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
본 발명은 점착제 조성물 및 상기를 사용하여 제조된 점착 필름에 관한 것이다. 본 발명의 점착제 조성물은 우수한 내구신뢰성을 가지는 동시에 높은 저속 박리력을 가져, 피착체로의 젖음성 등의 접착 물성이 우수하다. 또한, 본 발명의 점착제 조성물은 피착체의 온도 등의 물성 또는 외부 환경 변화에 따른 박리력 변화, 사용 시에 들뜸 현상 및 이물 유입 현상 등을 효과적으로 억제할 수 있다. 또한, 본 발명의 점착 필름은 낮은 고속 박리력을 가져 생산 과정에서의 시공성 등의 물성도 탁월하게 유지될 수 있다.The present invention relates to an adhesive composition and an adhesive film produced using the above. The pressure-sensitive adhesive composition of the present invention has excellent durability and at the same time has a high low-speed peeling force, and is excellent in adhesive physical properties such as wettability to the adherend. In addition, the pressure-sensitive adhesive composition of the present invention can effectively suppress the peeling force change due to physical properties such as the temperature of the adherend or the change of external environment, lifting phenomenon and foreign matter inflow phenomenon at the time of use. In addition, the pressure-sensitive adhesive film of the present invention has a low high-speed peeling force can be excellently maintained physical properties such as workability in the production process.
점착제 조성물, 충전제, 가교 밀도, 아크릴계 공중합체, 가교제, 저속 박리력, 고속 박리력Pressure-sensitive adhesive composition, filler, crosslinking density, acrylic copolymer, crosslinking agent, low speed peeling force, high speed peeling force
Description
본 발명은 점착제 조성물 및 상기를 사용하여 제조된 점착 필름에 관한 것이다.The present invention relates to an adhesive composition and an adhesive film produced using the above.
최근 플라즈마 디스플레이 패널, 액정표시장치, 냉장고, 세탁기 및 에어컨 등과 같은 전자 제품의 대형화에 따라, 이러한 전자 제품에 사용되는 부품 소재도 대형화되어 가는 추세이다. Recently, as electronic products such as plasma display panels, liquid crystal displays, refrigerators, washing machines, and air conditioners are enlarged, component materials used in such electronic products are also increasing in size.
디스플레이 장치나 가전 제품 등에 사용되는 부품들은 일반적으로 소재 제조 업체에서 제조되어, 전자 제품 제조 회사로 이송되고 있으며, 또한 제품 제조 회사 역시 제조된 완제품을 국내 또는 해외로 판매하기 위해 이송하고 있다.Parts used in display devices or home appliances are generally manufactured by a material manufacturer and transferred to an electronic product manufacturing company, and a product manufacturing company is also transferring the finished product to domestic or overseas sales.
위와 같은 부품 또는 전자 제품 등의 이송에는 주로 트럭이나 선박 등이 이용되는데, 이송 과정 중에는 부품 또는 완제품을 보호하기 위한 보호필름을 부착하는 것이 통상적이다. 즉, 이송 과정에서 부품 또는 전자 제품으로 이물이 유입되 거나, 긁힘 또는 찍힘 현상이 발생하면, 제품 제조 또는 사용 과정에서 매우 중요한 품질 문제가 될 수 있기 때문에, 보호필름을 통한 제품 등의 보호는 매우 중요한 요소이다.Trucks or ships are mainly used to transfer parts or electronic products as described above. During the transfer process, it is common to attach a protective film to protect the parts or the finished product. That is, if foreign matter enters into the part or electronic product, or scratches or chipping occurs during the transfer process, it can be a very important quality problem during the manufacturing or use of the product. It is an important factor.
상기와 같은 보호필름에 요구되는 주요 물성으로는 피착체로의 우수한 젖음성과 같은 접착 물성 및 내구신뢰성을 들 수 있다. 즉, 보호필름에 사용되는 점착제는 피착체의 표면을 잘 적셔주고, 주변 환경 변화에 덜 민감하여 들뜨는 현상이 없어야 한다. The main physical properties required for such a protective film include adhesive properties and durability, such as excellent wettability to the adherend. That is, the pressure-sensitive adhesive used in the protective film should be well wetted the surface of the adherend, and less susceptible to changes in the surrounding environment, there should be no lifting phenomenon.
보호필름에 요구되는 또 다른 특성은 박리 특성인데, 통상적으로 부품에 부착된 보호필름은 완제품 조립 과정 후반에 벗겨지고, 완제품 표면에 부착된 보호필름은 소비자에 의해 사용 전에 벗겨진다. 그런데, 특히 제품 제조 과정의 고속 박리 시 보호필름의 용이한 제거는 생산성 증대를 위한 필수적인 요소이다. Another property required for the protective film is peeling properties, typically the protective film attached to the part is peeled off later in the assembly process of the finished product, and the protective film attached to the finished product surface is peeled off before use by the consumer. However, in particular, easy removal of the protective film during high-speed peeling of the product manufacturing process is an essential factor for increasing productivity.
한국 공개특허 제2004-30615호는 고무 계열 수지에 점착성 부여 수지를 혼합하여 보호필름용 점착제를 제조하는 기술을 개시한다. 그러나, 상기 기술에서는 점착성 부여 수지의 선택에 따라서 피착체에 장기간 부착 시 박리력이 크게 상승하게 되며, 또한 점착제가 외부 환경 변화에 매우 민감하여 그 사용 범위가 제한적이라는 단점이 있다. Korean Patent Laid-Open Publication No. 2004-30615 discloses a technique for preparing a pressure-sensitive adhesive for a protective film by mixing a tackifier resin with a rubber-based resin. However, the above technique has a disadvantage in that the peeling force is greatly increased upon long-term adhesion to the adherend depending on the selection of the tackifying resin, and the pressure-sensitive adhesive is very sensitive to changes in the external environment, so that its use range is limited.
일본 공개특허 제2007-63298호는 유리전이온도가 한정된 아크릴계 공중합체에 계면 활성제를 혼합하여 저속 및 고속 박리력을 조절하고, 이온성 액체를 사용하여 대전 방지성을 부여하는 기술을 개시하고 있다. 그렇지만, 상기 기술에서는 첨가제로 사용된 계면활성제 및 이온성 액체가 피착체 표면으로 전사되기 쉽고, 이 에 따라 제품 또는 부품을 오염시킬 우려가 매우 높다는 단점이 있다.Japanese Laid-Open Patent Publication No. 2007-63298 discloses a technique of mixing a surfactant with an acryl-based copolymer having a limited glass transition temperature to control low and high speed peeling force and providing antistatic property using an ionic liquid. However, in the above technique, the surfactant and the ionic liquid used as the additive are easily transferred to the surface of the adherend, and thus there is a high risk of contaminating the product or the component.
본 발명은 전술한 종래 기술의 문제점을 고려하여 이루어진 것으로, 탁월한 내구신뢰성을 가지면서, 젖음성 등의 접착 물성 및 내구신뢰성이 우수하고, 낮은 고속 박리력을 가지는 점착제 조성물 및 상기를 사용한 점착 필름을 제공하는 것을 목적으로 한다.The present invention has been made in consideration of the above-described problems of the prior art, and has an excellent durability and excellent adhesive properties such as wettability and durability, and provides a pressure-sensitive adhesive composition having a low high-speed peeling force and an adhesive film using the same. It aims to do it.
본 발명은 상기 과제를 해결하기 위한 수단으로서, 유리전이온도가 -100℃ 내지 -25℃인 베이스 수지; 및 충전제를 포함하고,The present invention is a means for solving the above problems, a base resin having a glass transition temperature of -100 ℃ to -25 ℃; And fillers,
경화 후 가교 밀도가 50% 내지 97%인 점착제 조성물을 개시한다.An adhesive composition having a crosslinking density of 50% to 97% after curing is disclosed.
본 발명은 상기 과제를 해결하기 위한 다른 수단으로서, 기재 필름; 및 The present invention is another means for solving the above problems, a base film; And
상기 기재 필름의 일면 또는 양면에 형성되고, 본 발명에 따른 점착제 조성물을 함유하는 점착층을 포함하는 점착 필름을 개시한다.Disclosed is an adhesive film formed on one or both surfaces of the base film and including an adhesive layer containing the adhesive composition according to the present invention.
본 발명의 점착제 조성물은 우수한 내구신뢰성을 가지는 동시에 높은 저속 박리력을 가져, 피착체로의 젖음성 등의 접착 물성이 우수하다. 또한, 본 발명의 점착제 조성물은 피착체의 온도 등의 물성 또는 외부 환경 변화에 따른 박리력 변 화, 들뜸 및 이물 유입 현상 등을 효과적으로 억제할 수 있다. 또한, 본 발명의 점착 필름은 낮은 고속 박리력을 가져 생산 과정에서의 시공성 등의 물성도 탁월하게 유지될 수 있다.The pressure-sensitive adhesive composition of the present invention has excellent durability and at the same time has a high low-speed peeling force, and is excellent in adhesive physical properties such as wettability to the adherend. In addition, the pressure-sensitive adhesive composition of the present invention can effectively suppress the peel force change, lifting and foreign matter inflow phenomenon due to changes in physical properties such as the temperature of the adherend or external environment. In addition, the pressure-sensitive adhesive film of the present invention has a low high-speed peeling force can be excellently maintained physical properties such as workability in the production process.
본 발명은, 유리전이온도가 -100℃ 내지 -25℃인 베이스 수지; 및 충전제를 포함하고,The present invention, the base resin having a glass transition temperature of -100 ℃ to -25 ℃; And fillers,
경화 후 가교 밀도가 50% 내지 97%인 점착제 조성물에 관한 것이다.It relates to an adhesive composition having a crosslinking density of 50% to 97% after curing.
이하, 본 발명에 따른 점착제 조성물을 보다 상세히 설명한다.Hereinafter, the pressure-sensitive adhesive composition according to the present invention will be described in more detail.
본 발명에서는 점착제 조성물에 포함되는 베이스 수지의 유리전이온도가 -100℃ 내지 -25℃인 것을 특징으로 한다. 상기 유리전이온도가 -100℃ 미만이면, 계절의 변화 등 외부 환경에 따라서 박리력 변화가 크게 발생하여, 피착체로의 젖음성이 악화되거나, 들뜸 현상이 자주 발생할 우려가 있다. 또한, 상기 유리전이온도가 -25℃를 초과하면, 점착 필름의 고속 박리력이 크게 상승할 우려가 있다.In the present invention, the glass transition temperature of the base resin contained in the pressure-sensitive adhesive composition is characterized in that -100 ℃ to -25 ℃. When the glass transition temperature is less than -100 ° C, a change in peeling force is greatly generated according to the external environment such as a change in season, so that the wettability to the adherend may be deteriorated or the phenomenon of lifting may occur frequently. Moreover, when the said glass transition temperature exceeds -25 degreeC, there exists a possibility that the high speed peeling force of an adhesive film may raise significantly.
본 발명에서 사용되는 베이스 수지의 종류는 전술한 범위의 유리전이온도를 가지는 한, 특별히 한정되지 않으나, 중량평균분자량(Mw)이 10만 내지 200만인 베이스 수지를 사용하는 것이 바람직하다. 베이스 수지의 중량평균분자량이 10만 미만이면, 점착제의 응집력이 낮아져서, 박리 시에 피착체에 오염 물질이 잔존할 우려 가 있고, 200만을 초과하면, 점착 특성의 저하로 인해 피착체로의 젖음성이 악화되어, 외부 환경 변화에 따른 들뜸 현상 또는 기포 유입 등의 문제가 발생할 우려가 있다.The type of base resin used in the present invention is not particularly limited as long as it has a glass transition temperature in the above-mentioned range, but it is preferable to use a base resin having a weight average molecular weight (M w ) of 100,000 to 2 million. If the weight average molecular weight of the base resin is less than 100,000, the cohesive force of the pressure-sensitive adhesive is low, and there is a fear that contaminants remain in the adherend during peeling, and if it exceeds 2 million, the wettability to the adherend deteriorates due to the deterioration of the adhesive properties. As a result, problems such as lifting phenomenon or bubble inflow due to external environment change may occur.
본 발명에서 위와 같은 베이스 수지가 전술한 범위의 유리전이온도 및 중량평균분자량을 가지는 한, 그 구체적인 조성은 특별히 한정되지 않으며, 예를 들면, (메타)아크릴산 에스테르계 단량체 90 중량부 내지 99.9 중량부; 및 가교성 관능기 함유 단량체 0.1 중량부 내지 10 중량부를 포함하는 아크릴계 수지를 사용할 수 있다.In the present invention, as long as the base resin has a glass transition temperature and a weight average molecular weight in the above-described range, the specific composition is not particularly limited, and for example, 90 parts by weight to 99.9 parts by weight of the (meth) acrylic acid ester monomer ; And 0.1 parts by weight to 10 parts by weight of the crosslinkable functional group-containing monomer may be used.
상기에서 (메타)아크릴산 에스테르계 단량체의 종류는 특별히 한정되지 않는다. 다만, 상기 단량체에 포함되는 알킬기가 지나치게 장쇄가 되면, 점착제의 응집력이 저하되고, 유리전이온도(Tg) 및 점착성의 조절이 어려워질 우려가 있으므로, 탄소수가 1 내지 12인 알킬기를 가지는 (메타)아크릴산 에스테르계 단량체를 사용하는 것이 바람직하다. 이와 같은 단량체의 예로는 메틸 (메타)아크릴레이트, 에틸 (메타)아크릴레이트, n-프로필 (메타)아크릴레이트, 이소프로필 (메타)아크릴레이트, n-부틸 (메타)아크릴레이트, t-부틸 (메타)아크릴레이트, sec-부틸 (메타)아크릴레이트, 펜틸 (메타)아크릴레이트, 2-에틸헥실 (메타)아크릴레이트, 2-에틸부틸 (메타)아크릴레이트, n-옥틸 (메타)아크릴레이트, 이소옥틸 (메타)아크릴레이트, 이소노닐 (메타)아크릴레이트, 라우릴 (메타)아크릴레이트 및 테트라데실 (메타)아크릴레이트를 들 수 있으며, 상기 중 일종 또는 이종 이상의 혼합을 사용할 수 있다. 상기와 같은 (메타)아크릴산 에스테르계 단량체는 아크릴계 수지 내에 90 중량부 내지 99.9 중량부의 양으로 포함되는 것이 바람직하다. 상기 함량이 90 중량부보다 작으면, 점착제의 초기 접착력이 저하될 우려가 있고, 99.9 중량부를 초과하면, 응집력 저하로 인해 내구성에 문제가 발생할 우려가 있다.In the above, the kind of (meth) acrylic acid ester monomer is not specifically limited. However, when the alkyl group contained in the monomer is too long, the cohesive force of the pressure-sensitive adhesive is lowered, and the glass transition temperature (T g ) and the adhesiveness may be difficult to control. It is preferable to use an acrylic acid ester monomer. Examples of such monomers include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl ( Meth) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n-octyl (meth) acrylate, Isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, and tetradecyl (meth) acrylate can be mentioned, One or more kinds of the above can be used. The (meth) acrylic acid ester monomer as described above is preferably included in an amount of 90 parts by weight to 99.9 parts by weight in the acrylic resin. If the content is less than 90 parts by weight, there is a fear that the initial adhesive strength of the pressure-sensitive adhesive is lowered, if it exceeds 99.9 parts by weight, there is a fear that a problem in durability due to the cohesive force is lowered.
아크릴계 수지에 포함되는 가교성 관능기 함유 단량체는 점착제에 응집력 및 접착 강도를 부여하고, 고온 및/또는 고습 조건 하에서 내구신뢰성을 향상시키는 역할을 한다. 본 발명에서 사용될 수 있는 가교성 관능기 함유 단량체의 종류는 특별히 한정되지 않으며, 예를 들면, 카복실기 함유 단량체, 히드록시기 함유 단량체 또는 질소 함유 단량체의 일종 또는 이종 이상을 사용할 수 있다. 이 때 히드록시기 함유 단량체의 예로는, 2-히드록시에틸 (메타)아크릴레이트, 2-히드록시프로필 (메타)아크릴레이트, 4-히드록시부틸 (메타)아크릴레이트, 6-히드록시헥실 (메타)아크릴레이트, 8-히드록시옥틸 (메타)아크릴레이트, 2-히드록시에틸렌글리콜 (메타)아크릴레이트 또는 2-히드록시프로필렌글리콜 (메타)아크릴레이트를 들 수 있고, 카복실기 함유 단량체의 예로는 (메타)아크릴산, 2-(메타)아크릴로일옥시 아세트산, 3-(메타)아크릴로일옥시 프로필산, 4-(메타)아크릴로일옥시 부틸산, 아크릴산 이중체, 이타콘산, 푸마르산, 말레산 및 말레산 무수물을 들 수 있으며, 질소 함유 단량체의 예로는 (메타)아크릴아미드, N-비닐 피롤리돈 또는 N-비닐 카프로락탐 등을 들 수 있으나, 이에 제한되는 것은 아니다.The crosslinkable functional group-containing monomer included in the acrylic resin imparts cohesion and adhesive strength to the pressure-sensitive adhesive and serves to improve durability under high temperature and / or high humidity conditions. The kind of crosslinkable functional group-containing monomer which can be used in the present invention is not particularly limited, and for example, one or more kinds of carboxyl group-containing monomer, hydroxy group-containing monomer or nitrogen-containing monomer can be used. Examples of the hydroxy group-containing monomer at this time include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 6-hydroxyhexyl (meth). Acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate or 2-hydroxypropylene glycol (meth) acrylate, and examples of the carboxyl group-containing monomer include ( Meta) acrylic acid, 2- (meth) acryloyloxy acetic acid, 3- (meth) acryloyloxy propyl acid, 4- (meth) acryloyloxy butyl acid, acrylic acid duplex, itaconic acid, fumaric acid, maleic acid And maleic anhydride, and examples of the nitrogen-containing monomer include (meth) acrylamide, N-vinyl pyrrolidone or N-vinyl caprolactam, but are not limited thereto.
상기 가교성 관능기 함유 단량체는 수지 내에 0.1 중량부 내지 10 중량부의 양으로 포함되는 것이 바람직하다. 상기 함량이 0.1 중량부 미만이면, 고온 및/또 는 고습 조건 하에서 응집 파괴가 발생하는 등 내구 신뢰성이 저하될 우려가 있고, 10 중량부를 초과하면, 상용성 저하로 인해 유동 특성이 감소될 우려가 있다.It is preferable that the said crosslinkable functional group containing monomer is contained in 0.1 weight part-10 weight part in resin. If the content is less than 0.1 part by weight, the durability reliability may be lowered, such as agglomeration failure under high temperature and / or high humidity conditions, and if it exceeds 10 parts by weight, there is a fear that the flow characteristics due to the compatibility decreases have.
본 발명의 아크릴계 수지는 또한 하기 화학식 1로 표시되는 단량체를 추가로 포함할 수 있다. 이러한 단량체는 아크릴계 수지로의 점착력 및 응집력의 부여, 유리전이온도의 조절 및 기타 기능성 부여를 목적으로 부가될 수 있다. Acrylic resin of the present invention may also further comprise a monomer represented by the following formula (1). Such monomers may be added for the purpose of imparting adhesion and cohesion to acrylic resins, control of glass transition temperature, and imparting other functionality.
[화학식 1][Formula 1]
상기 식에서, R1 내지 R3는 각각 독립적으로 수소 또는 알킬을 나타내고, R4는 시아노; 알킬로 치환 또는 비치환된 페닐; 아세틸옥시; 또는 COR5를 나타내며, 이 때 R5는 알킬 또는 알콕시알킬로 치환 또는 비치환된 아미노 또는 글리시딜옥시를 나타낸다.Wherein R 1 to R 3 each independently represent hydrogen or alkyl, and R 4 represents cyano; Phenyl unsubstituted or substituted with alkyl; Acetyloxy; Or COR 5, wherein R 5 represents amino or glycidyloxy unsubstituted or substituted with alkyl or alkoxyalkyl.
상기 식의 R1 내지 R5의 정의에서 알킬 또는 알콕시는 탄소수 1 내지 8의 알킬 또는 알콕시를 의미하며, 바람직하게는 메틸, 에틸, 메톡시, 에톡시, 프로폭시 또는 부톡시이다. Alkyl or alkoxy in the definition of R1 to R5 in the above formula means alkyl or alkoxy having 1 to 8 carbon atoms, preferably methyl, ethyl, methoxy, ethoxy, propoxy or butoxy.
상기 화학식 1의 단량체의 구체적인 예로는 (메타)아크릴로니트릴, (메타)아크릴아미드, N-메틸 (메타)아크릴아미드 또는 N-부톡시 메틸 (메타)아크릴아미드와 같은 질소 함유 단량체; 스티렌 또는 메틸 스티렌과 같은 스티렌계 단량체; 메틸 (메타)아크릴레이트, 에틸 (메타)아크릴레이트 또는 글리시딜 (메타)아크릴레이트 와 같은 아크릴레이트; 또는 비닐 아세테이트와 같은 카르본산 비닐 에스테르 등의 일종 또는 이종 이상을 들 수 있으나, 이에 제한되는 것은 아니다. 상기와 같은 단량체가 아크릴계 수지에 포함될 경우에는, 그 함량이 20 중량부 이하인 것이 바람직하다. 상기 함량이 20 중량부를 초과하면, 점착제 조성물의 유연성 및/또는 박리력이 저하될 우려가 있다.Specific examples of the monomer of Formula 1 include nitrogen-containing monomers such as (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide or N-butoxy methyl (meth) acrylamide; Styrene-based monomers such as styrene or methylstyrene; Acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate or glycidyl (meth) acrylate; Or a carboxylic acid vinyl ester such as vinyl acetate, or the like, or a heterogeneous compound, but is not limited thereto. When such a monomer is included in the acrylic resin, the content thereof is preferably 20 parts by weight or less. When the content exceeds 20 parts by weight, there is a fear that the flexibility and / or peeling force of the pressure-sensitive adhesive composition is lowered.
위와 같은 아크릴계 수지를 제조하는 방법은 특별히 한정되지 않으며, 예를 들면 용액 중합, 광중합, 벌크 중합, 서스펜션 중합 또는 에멀션 중합과 같은 일반적인 중합법을 통하여 제조할 수 있다. 본 발명에서는 특히 용액 중합법을 사용하는 것이 바람직하며, 용액 중합은 각각의 단량체가 균일하게 혼합된 상태에서 개시제를 혼합하여, 50℃ 내지 140℃의 중합 온도로 수행하는 것이 바람직하다. 사용될 수 있는 개시제의 예로는 아조비스 이소부티로니트릴 또는 아조비스시클로헥산 카르보니트릴과 같은 아조계 중합 개시제; 및/또는 과산화 벤조일 또는 과산화 아세틸과 같은 과산화물 등의 통상의 개시제를 들 수 있고, 상기 중 일종 또는 이종 이상의 혼합을 사용할 수 있다.The method for producing the acrylic resin as described above is not particularly limited, and may be prepared, for example, through a general polymerization method such as solution polymerization, photopolymerization, bulk polymerization, suspension polymerization or emulsion polymerization. In the present invention, it is particularly preferable to use a solution polymerization method, and solution polymerization is preferably performed at a polymerization temperature of 50 ° C to 140 ° C by mixing an initiator in a state where each monomer is uniformly mixed. Examples of initiators that can be used include azo polymerization initiators such as azobis isobutyronitrile or azobiscyclohexane carbonitrile; And / or conventional initiators such as peroxides such as benzoyl peroxide or acetyl peroxide, and one or a mixture of two or more of them may be used.
본 발명의 점착제 조성물은 위와 같은 베이스 수지와 함께 충전제를 포함하는 것을 특징으로 하며, 이 때 포함되는 충전제는 하드 타입(hard type)의 충전제인 것이 바람직하다. 이 때 상기 충전제는 점착제 조성물 내에 균일하게 분산되어 점착제의 탄성률을 높이는 작용을 한다. 즉, 고속 박리력을 낮추기 위해 점착제 자체를 하드 타입으로 설계하는 경우, 저속 박리력이 함께 저하되어, 점착제 전체의 젖음성 및 들뜸 방지 성능 등이 악화되는 문제점이 있다. 이에 본 발명에서는 점착제 조성물 내에 하드 타입의 충전제를 분산시켜, 점착제가 저속 박리력은 높이면서도, 고속 박리력은 낮추어 박리 특성을 개선할 수 있게 된다. The pressure-sensitive adhesive composition of the present invention is characterized in that it comprises a filler together with the base resin as described above, wherein the filler is preferably a hard type of filler (hard type). At this time, the filler is uniformly dispersed in the pressure-sensitive adhesive composition serves to increase the elastic modulus of the pressure-sensitive adhesive. That is, when the pressure-sensitive adhesive itself is designed in a hard type in order to lower the high-speed peeling force, there is a problem in that the low-speed peeling force decreases together, and the wettability and the anti-floating performance of the entire pressure-sensitive adhesive deteriorate. Accordingly, in the present invention, by dispersing the hard-type filler in the pressure-sensitive adhesive composition, the pressure-sensitive adhesive is able to improve the peeling properties while lowering the high-speed peeling force while increasing the low-speed peeling force.
본 발명에서 사용되는 충전제는 평균 입경이 1 nm 내지 1,000 nm인 것이 바람직하며, 그 형상은 충전제 자체가 지나치게 각이 져서 가공 시에 코터 헤드 등의 장비에 손상이 가지 않을 정로라면, 특별히 한정되지 않는다. The filler used in the present invention preferably has an average particle diameter of 1 nm to 1,000 nm, and the shape thereof is not particularly limited as long as the filler itself is too angular so as not to damage the equipment such as the coater head during processing. .
본 발명에서는 위와 같은 충전제로서 유기 충전제 및 무기 충전제를 제한 없이 사용할 수 있으나, 소량으로 사용되어도 탄성률 향상 효과가 우수하다는 측면에서 무기 충전제를 사용하는 것이 바람직하다. 위와 같은 무기 충전제의 예로는 세라믹, 수산화물, 질화물, 탄화물 또는 카본 계열 충전제를 들 수 있고, 보다 구체적으로는 실리카, 산화 알루미늄, 수산화 알루미늄, 산화 마그네슘, 수산화 마그네슘, 산화 칼슘, 수산화 칼슘, 카본 블랙, 카본 파이버, 산화 안티몬, 오산화 안티몬, 지르코니아 또는 산화아연을 들 수 있으나, 이에 제한되는 것은 아니다. 본 발명에서는 전술한 충전제의 일종 또는 이종 이상의 혼합을 사용할 수 있다. 본 발명에서는 또한 사용되는 용도에 따란 투명성 충전제를 사용할 수도 있다.In the present invention, organic fillers and inorganic fillers may be used as the above fillers without limitation, but even when used in a small amount, it is preferable to use an inorganic filler in view of excellent elastic modulus improvement effect. Examples of such inorganic fillers include ceramic, hydroxide, nitride, carbide, or carbon-based fillers, and more specifically, silica, aluminum oxide, aluminum hydroxide, magnesium oxide, magnesium hydroxide, calcium oxide, calcium hydroxide, carbon black, Carbon fiber, antimony oxide, antimony pentoxide, zirconia or zinc oxide, but is not limited thereto. In the present invention, one or more kinds of the above-mentioned fillers may be used. In the present invention, it is also possible to use a transparent filler depending on the use used.
전술한 충전제는, 본 발명의 조성물 내에, 베이스 수지 100 중량부에 대하여 1.0 중량부 내지 30 중량부의 양으로 포함되는 것이 바람직하고, 5.0 중량부 내지 15 중량부의 양으로 포함되는 것이 보다 바람직하다. 상기 함량이 1.0 중량부 미만이면, 탄성률 증가 효과가 떨어져 고속 박리력이 저하될 우려가 있고, 30 중량부를 초과하면, 저속 박리력이 지나치게 저하되어, 젖음성 및 들뜸 방지 효과가 저하될 우려가 있다.The above-mentioned filler is preferably contained in the composition of the present invention in an amount of 1.0 parts by weight to 30 parts by weight, and more preferably 5.0 parts by weight to 15 parts by weight with respect to 100 parts by weight of the base resin. When the content is less than 1.0 part by weight, the effect of increasing the elastic modulus may be lowered, and the high-speed peeling force may be lowered. When the content is more than 30 parts by weight, the low-speed peeling force may be excessively lowered, and the wettability and the lifting prevention effect may be lowered.
본 발명의 점착제 조성물은 또한 전술한 베이스 수지 100 중량부에 대하여 0.1 중량부 내지 10 중량부의 가교제를 추가로 포함할 수 있다. 상기 가교제는 베이스 수지에 포함되는 가교성 관능기와 반응하여, 점착제의 응집력을 높여, 점착 특성을 조절하는 역할을 한다. The pressure-sensitive adhesive composition of the present invention may further include 0.1 to 10 parts by weight of the crosslinking agent based on 100 parts by weight of the base resin described above. The crosslinking agent reacts with a crosslinkable functional group contained in the base resin to increase the cohesive force of the pressure-sensitive adhesive, and serves to adjust the adhesive properties.
사용될 수 있는 구체적인 가교제의 종류는 특별히 한정되지 않으며, 예를 들면 이소시아네이트계 화합물, 에폭시계 화합물, 아지리딘계 화합물 및 금속 킬레이트계 화합물과 같은 일반적인 가교제를 사용할 수 있다. The kind of specific crosslinking agent that can be used is not particularly limited, and for example, a general crosslinking agent such as an isocyanate compound, an epoxy compound, an aziridine compound and a metal chelate compound may be used.
이 때 이소시아네이트계 화합물의 예로는 톨리렌 디이소시아네이트, 크실렌 디이소시아네이트, 디페닐메탄 디이소시아네이트, 헥사메틸렌 디이소시아네이트, 이소포름 디이소시아네이트, 테트라메틸크실렌 디이소시아네이트, 나프탈렌 디이소시아네이트 및 상기 중 어느 하나의 폴리올(ex. 트리메틸롤 프로판)과의 반응물로 이루어진 군으로부터 선택된 하나 이상을 들 수 있고; 에폭시계 화합물의 예로는 에틸렌글리콜 디글리시딜에테르, 트리글리시딜에테르, 트리메틸올프로판 트리글리시딜에테르, N,N,N',N'-테트라글리시딜 에틸렌디아민 및 글리세린 디글리시딜에테르로 이루어진 군으로부터 선택된 하나 이상을 들 수 있으며; 아지리딘계 화합물의 예로는 N,N'-톨루엔-2,4-비스(1-아지리딘카르복사미드), N,N'-디페닐메탄-4,4'-비스(1-아지리딘카르복사미드), 트리에틸렌 멜라민, 비스이소프로탈로일-1-(2-메틸아지리딘) 및 트리-1-아지리디닐포스핀옥시드로 이루어진 군으로부터 선택된 하나 이상을 들 수 있다. 또한, 상기 금속 킬레이트계 화합물의 예로는, 알루미늄, 철, 아연, 주석, 티탄, 안티몬, 마그네슘 및/또는 바나듐과 같은 다가 금속이 아세틸 아세톤 또는 아세토초산 에틸 등에 배위하고 있는 화합물을 사용할 수 있으나, 이에 제한되는 것은 아니다. At this time, examples of the isocyanate compound include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoform diisocyanate, tetramethylxylene diisocyanate, naphthalene diisocyanate and any one of the above polyols ( ex. trimethylol propane); Examples of epoxy compounds include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidyl ethylenediamine and glycerin diglycidyl ether. One or more selected from the group consisting of; Examples of aziridine compounds include N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxes) Mid), triethylene melamine, bisisoprotaloyl-1- (2-methylaziridine), and tri-1-aziridinylphosphine oxide. In addition, examples of the metal chelate-based compound may be a compound in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium is coordinated with acetyl acetone, ethyl acetoacetate, or the like. It is not limited.
이러한 가교제는 베이스 수지 100 중량부에 대하여 0.1 중량부 내지 10 중량부의 양으로 포함되는 것이 바람직하다. 상기 함량이 0.1 중량부보다 작으면, 점착제의 응집력이 떨어질 우려가 있고, 10 중량부를 초과하면, 젖음성 저하로 인해 층간 박리나 들뜸 현상이 발생할 우려가 있다.Such a crosslinking agent is preferably included in an amount of 0.1 parts by weight to 10 parts by weight with respect to 100 parts by weight of the base resin. When the content is less than 0.1 part by weight, the cohesive force of the pressure-sensitive adhesive may be lowered. When the content is more than 10 parts by weight, interlayer peeling or lifting may occur due to the decrease in wettability.
본 발명의 점착제 조성물은 또한, 발명의 효과에 영향을 미치지 않는 범위에서, 점착성 부여 수지, 에폭시 수지, 경화제, 자외선 안정제, 산화 방지제, 조색제, 보강제, 소포제, 계면 활성제, 가소제, 발포제 및 유기염으로 이루어진 군으로부터 선택된 하나 이상의 첨가제를 적절히 포함할 수 있다.The pressure-sensitive adhesive composition of the present invention may also be used as a tackifying resin, an epoxy resin, a curing agent, an ultraviolet stabilizer, an antioxidant, a colorant, a reinforcing agent, an antifoaming agent, a surfactant, a plasticizer, a foaming agent, and an organic salt within a range that does not affect the effect of the invention. One or more additives selected from the group consisting of may be included as appropriate.
위와 같은 성분을 포함하는 본 발명의 점착제 조성물은 경화 후의 가교밀도가 50% 내지 97%인 것이 바람직하고, 60% 내지 97%인 것이 보다 바람직하다. 상기 가교밀도가 50% 미만이면, 점착제의 응집력이 저하될 우려가 있고, 97%를 초과하면, 피착체로의 젖음성 저하 등으로 인해 들뜸 현상이 발생하는 등 내구신뢰성이 저하될 우려가 있다.It is preferable that the crosslinking density after hardening of the adhesive composition of this invention containing the above components is 50%-97%, and it is more preferable that it is 60%-97%. If the crosslinking density is less than 50%, the cohesive force of the pressure-sensitive adhesive may be lowered. If the crosslinking density is more than 97%, the durability may be lowered, such as a lifting phenomenon due to a decrease in wettability to the adherend.
본 발명은 또한, 기재 필름; 및The present invention also provides a base film; And
상기 기재 필름의 일면 또는 양면에 형성되고, 본 발명에 따른 점착제 조성물을 함유하는 점착층을 포함하는 점착 필름에 관한 것이다.It relates to an adhesive film formed on one side or both sides of the base film and comprising an adhesive layer containing the adhesive composition according to the present invention.
위와 같은 본 발명의 점착 필름은 높은 저속 박리력을 가져, 피착체로의 젖음성 등의 물성이 우수하고, 주위 환경 변화에 따른 들뜸 현상 및 이물질 유입 등의 문제가 최소화될 수 있다. 또한, 본 발명의 점착 필름은 낮은 고속 박리력을 가져 생산 과정에서의 시공성 등의 물성이 탁월하게 유지될 수 있다.The adhesive film of the present invention as described above has a high low-speed peeling force, excellent physical properties such as wettability to the adherend, and problems such as lifting phenomenon and foreign matter inflow due to changes in the surrounding environment can be minimized. In addition, the adhesive film of the present invention has a low high-speed peeling force can be maintained excellent properties such as workability in the production process.
이와 같은 본 발명의 점착 필름은 각종 전자 제품 또는 가정용 내/외장재에 사용되는 보호필름; 클리닝 시트; 반사 시트; 구조용 점착 필름; 사진용 점착 필름; 차선 표시용 점착 필름; 광학용 점착 제품; 다층 구조의 라미네이트 제품; 의료용 패치; 가열 활성용 점착제품(heat-activated pressure sensitive adhesive article); 또는 전자제품용 점착 필름 등의 각종 산업용 시트 또는 상업용 점착 제품 등에 효과적으로 응용될 수 있다.Such an adhesive film of the present invention is a protective film used for various electronic products or home interior / exterior materials; Cleaning sheets; Reflective sheet; Structural adhesive films; Photographic pressure-sensitive adhesive film; Adhesive film for lane marking; Optical adhesive products; Laminate products of multilayer structure; Medical patches; Heat-activated pressure sensitive adhesive articles; Alternatively, the present invention can be effectively applied to various industrial sheets such as adhesive films for electronic products or commercial adhesive products.
본 발명에서 사용되는 기재 필름으로는 이 분야의 일반적인 필름을 제한 없이 사용할 수 있으며, 그 예로는 폴리에틸렌테레프탈레이트 필름, 폴리테트라플루오르에틸렌 필름, 폴리에틸렌 필름, 폴리프로필렌 필름, 폴리부텐 필름, 폴리부타디엔 필름, 염화 비닐 공중합체 필름 또는 폴리이미드 필름과 같은 플라스틱 필름을 들 수 있다. 이러한 기재 필름은 단층으로 구성되거나, 2층 이상이 적층되어 있을 수도 있으며, 경우에 따라서는 방오층 또는 대전방지층 등의 기능성층을 추가로 포함할 수도 있다. 본 발명에서는 또한 용도에 따라서 상기 기재 필름으로서 투명성 필름을 사용할 수도 있으며, 기재 밀착성 향상의 관점에서 일면 또는 양면에 프라이머 처리와 같은 표면 처리를 수행할 수도 있다. 이러한 기재 필름의 두 께는 용도에 따라 적절히 선택되는 것으로 특별히 한정되지 않으며, 통상적으로 5 ㎛ 내지 500 ㎛, 바람직하게는 10 ㎛ 내지 100 ㎛의 두께로 형성된다. As the base film used in the present invention, a general film in this field can be used without limitation, and examples thereof include polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, polybutadiene film, And plastic films such as vinyl chloride copolymer films or polyimide films. Such a base film may consist of a single layer, or two or more layers may be laminated | stacked, and may further contain functional layers, such as an antifouling layer or an antistatic layer, in some cases. In the present invention, a transparent film may also be used as the base film according to the use, and surface treatment such as primer treatment may be performed on one or both sides from the viewpoint of improving the substrate adhesion. The thickness of such a base film is not specifically limited to be suitably selected according to a use, Usually, it is formed in the thickness of 5 micrometers-500 micrometers, Preferably it is 10 micrometers-100 micrometers.
위와 같은 기재 필름 상에 점착층을 형성하는 방법은 특별히 제한되지 않으며, 예를 들면 상기 필름에 바코터 등의 통상의 수단으로 점착제 조성물을 도포하고 건조 및 경화시키는 방법, 또는 점착제 조성물을 일단 박리성 기재의 표면에 도포하고 건조시킨 후에, 상기 박리성 기재를 사용하여 점착층을 기재 필름에 전사하여 숙성 및 경화시키는 방법 등을 사용할 수 있다.The method of forming an adhesive layer on the base film as described above is not particularly limited, and for example, a method of applying, drying and curing the pressure-sensitive adhesive composition to the film by a conventional means such as a bar coater, or peeling off the pressure-sensitive adhesive composition once After apply | coating to the surface of a base material and drying, the method of transferring an adhesive layer to a base film using the said peelable base material, and maturing and hardening can be used.
위와 같은 과정에서 조성물이 가교제를 포함할 경우, 상기 가교제는 균일한 코팅 수행의 관점에서, 점착층의 형성 시에는 작용기의 가교 반응이 진행되지 않도록 제어되는 것이 바람직하다. 즉, 가교제는 코팅 작업 후의 건조 및 숙성 과정에서 가교 구조를 형성하여 응집력을 향상시키고, 이에 따라 점착 제품의 점착 물성 및 절단성(cuttability) 등이 향상될 수 있다.In the above process, when the composition includes a crosslinking agent, the crosslinking agent is preferably controlled so that the crosslinking reaction of the functional group does not proceed when the pressure-sensitive adhesive layer is formed from the viewpoint of performing uniform coating. That is, the crosslinking agent forms a crosslinked structure in the drying and aging process after the coating operation to improve the cohesion, thereby improving the adhesive properties and cuttability (tacktability) of the adhesive product.
본 발명에서 점착제 조성물을 경화시키는 방법 역시 특별히 한정되지 않으며, 예를 들면, 적절한 열 또는 활성 에너지선(ex. 자외선 또는 전자선)을 가하여 수행하면 된다.The method for curing the pressure-sensitive adhesive composition in the present invention is also not particularly limited, and may be performed by, for example, applying a suitable heat or active energy ray (ex. Ultraviolet ray or electron beam).
위와 같은 공정을 통해 형성된 점착층의 두께는 특별히 한정되지 않으며, 예를 들면, 0.5 ㎛ 내지 50 ㎛, 바람직하게는 1 ㎛ 내지 30 ㎛일 수 있다. 점착층의 두께가 전술한 범위를 벗어나면, 균일한 점착층의 형성이 어려워져서 점착 필름의 물성이 불균일해질 우려가 있다.The thickness of the pressure-sensitive adhesive layer formed through the above process is not particularly limited, and may be, for example, 0.5 μm to 50 μm, preferably 1 μm to 30 μm. When the thickness of the adhesion layer is out of the above-mentioned range, formation of a uniform adhesion layer becomes difficult and there exists a possibility that the physical property of an adhesion film may become nonuniform.
이하, 본 발명에 따르는 실시예 및 본 발명에 따르지 않는 비교예를 통하여, 본 발명을 보다 상세히 설명하나, 본 발명의 범위가 하기 제시된 실시예에 의해 제한되는 것은 아니다.Hereinafter, the present invention will be described in more detail through examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited to the examples given below.
실시예Example 1 One
베이스 수지의 제조Preparation of Base Resin
질소 가스가 환류되고 온도조절이 용이하도록 냉각장치를 설치한 1 L의 반응기에 유리전이온도가 -65℃가 되도록 2-에틸헥실 아크릴레이트(2-EHA), n-부틸아크릴레이트(BA) 및 2-히드록시에틸아크릴레이트(2-HEA)를 혼합한 단량체 혼합물을 투입한 후, 용제로서 에틸아세테이트(EAc) 100 중량부를 투입하였다. 이어서 산소 제거를 위해 질소 가스를 1 시간 동안 퍼징한 후, 혼합물의 온도를 55℃로 유지하였다. 그 후, 상기 혼합물에 반응 개시제로서 에틸아세테이트에 50%의 농도로 희석시킨 아조비스이소부티로니트릴(AIBN) 0.05 중량부를 투입하고, 8 시간 동안 반응시켜 아크릴계 공중합체를 제조하였다.2-ethylhexyl acrylate (2-EHA), n-butyl acrylate (BA), and 1 L reactor equipped with a cooling device to allow nitrogen gas to be refluxed and easy to control temperature so that the glass transition temperature is -65 ° C. After the monomer mixture which mixed 2-hydroxyethyl acrylate (2-HEA) was thrown in, 100 weight part of ethyl acetate (EAc) was added as a solvent. Nitrogen gas was then purged for 1 hour for oxygen removal, and then the temperature of the mixture was maintained at 55 ° C. Thereafter, 0.05 parts by weight of azobisisobutyronitrile (AIBN) diluted to 50% in ethyl acetate as a reaction initiator was added to the mixture, and reacted for 8 hours to prepare an acrylic copolymer.
점착 필름의 제조Production of adhesive film
제조된 아크릴계 공중합체의 고형분 100 중량부를 기준으로, 가교제로 헥사메틸렌디이소시아네이트의 프리폴리머(HDI) 1.0 중량부 및 평균 입경이 16 nm인 실리카 5.0 중량부를 투입하였다. 이어서, 상기 혼합물을 적정의 농도로 희석하여 균일하게 혼합한 후, 두께 55 ㎛의 폴리에틸렌 필름의 일면에 코팅 및 건조하여, 10 ㎛ 두께의 점착층을 형성하였다. 그 후, 폴리에틸렌 필름의 일면에 코팅된 점착층을 그대로 권취하여, 60℃의 오븐에서 2일간 보관하여 숙성 과정을 충분히 시행하여 보호필름(점착 필름)을 제조하였다. 제조된 점착층의 가교 밀도는 75%였으며, 제조된 보호필름을 적당한 크기로 절단하여 SUS 304 표면에 부착하여 평가에 사용하였다. 이 때 점착제의 가교 밀도는 제조된 점착제를 60℃의 오븐에서 2 일간 숙성시키고, 점착제 10 g을 에틸아세테이트 용제 내에 1 일 동안 침지한 후, 스틸(steel) 재질의 200 메쉬(mesh)의 망으로 걸러 무게를 측정하여, 용제에 침지 전 및 후의 무게 변화 정도를 가교 밀도 값으로 사용하였다. 1.0 part by weight of a prepolymer (HDI) of hexamethylene diisocyanate and 5.0 parts by weight of silica having an average particle diameter of 16 nm were added as a crosslinking agent based on 100 parts by weight of the solid component of the prepared acrylic copolymer. Subsequently, the mixture was diluted to an appropriate concentration and uniformly mixed, and then coated and dried on one surface of a polyethylene film having a thickness of 55 µm to form an adhesive layer having a thickness of 10 µm. Thereafter, the adhesive layer coated on one side of the polyethylene film was wound as it was, and stored in an oven at 60 ° C. for 2 days to sufficiently undergo a aging process to prepare a protective film (adhesive film). The crosslinking density of the prepared adhesive layer was 75%, and the prepared protective film was cut to an appropriate size and adhered to the surface of SUS 304 to be used for evaluation. At this time, the crosslinking density of the pressure-sensitive adhesive was aged for 2 days in the prepared pressure-sensitive adhesive in an oven at 60 ℃, immersed 10 g of the pressure-sensitive adhesive in ethyl acetate solvent for 1 day, and then into a mesh of 200 mesh (steel) The weight was measured and the degree of weight change before and after immersion in the solvent was used as the crosslinking density value.
실시예Example 2 2
충전제로서 실리카 20 중량부를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 85%였다.A protective film was prepared in the same manner as in Example 1, except that 20 parts by weight of silica was used as the filler, and the crosslinking density of the prepared adhesive layer was 85%.
실시예Example 3 3
베이스 수지의 제조 시에, 에틸 아크릴레이트 대신 부틸 아크릴레이트를 사용하여, 수지의 유리전이온도가 -40℃가 되도록 하고, 충전제로서 평균 입경이 50 nm인 알루미나(alumina) 5.0중량부를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 77%였다.In preparing the base resin, butyl acrylate was used instead of ethyl acrylate so that the glass transition temperature of the resin was -40 ° C, and 5.0 parts by weight of alumina having an average particle diameter of 50 nm was used as a filler. The protective film was prepared in the same manner as in Example 1, and the crosslinking density of the prepared adhesive layer was 77%.
실시예Example 4 4
충전제로서 평균 입경이 50 nm인 알루미나 20중량부를 사용한 것을 제외하고는 실시예 3과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 89%였다.A protective film was prepared in the same manner as in Example 3, except that 20 parts by weight of alumina having an average particle diameter of 50 nm was used as a filler, and the crosslinking density of the prepared adhesive layer was 89%.
실시예Example 5 5
가교제의 함량을 3중량부로 조절한 것을 제외하고는 실시예 1과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 95%였다.A protective film was prepared in the same manner as in Example 1, except that the content of the crosslinking agent was adjusted to 3 parts by weight, and the crosslinking density of the prepared adhesive layer was 95%.
실시예Example 6 6
가교제의 함량을 3중량부로 조절한 것을 제외하고는 실시예 3과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 96%였다.A protective film was prepared in the same manner as in Example 3, except that the amount of the crosslinking agent was adjusted to 3 parts by weight, and the crosslinking density of the prepared adhesive layer was 96%.
비교예Comparative Example 1 One
베이스 수지의 유리전이온도가 -10℃가 되도록 부틸 아크릴레이트(BA), 에틸 아크릴레이트(EA), 메틸 아크릴레이트(MA) 및 히드록시에틸 메타크릴레이트(HEMA)를 조합하여 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 76%였다.Except for the combination of butyl acrylate (BA), ethyl acrylate (EA), methyl acrylate (MA) and hydroxyethyl methacrylate (HEMA) so that the glass transition temperature of the base resin is -10 ° C. A protective film was prepared in the same manner as in Example 1, and the crosslinking density of the prepared adhesive layer was 76%.
비교예Comparative Example 2 2
충전제를 사용하지 않은 것을 제외하고는 실시예 5와 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 92%였다.A protective film was prepared in the same manner as in Example 5, except that no filler was used. The crosslinking density of the prepared adhesive layer was 92%.
비교예Comparative Example 3 3
가교제를 사용하지 않은 것을 제외하고는 실시예 4와 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 45%였다.A protective film was prepared in the same manner as in Example 4 except that no crosslinking agent was used, and the crosslinking density of the prepared adhesive layer was 45%.
비교예Comparative Example 4 4
충전제로서 실리카 50중량부를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 99%였다.A protective film was prepared in the same manner as in Example 1, except that 50 parts by weight of silica was used as the filler, and the crosslinking density of the prepared adhesive layer was 99%.
비교예Comparative Example 5 5
가교제의 양을 12 중량부로 조절한 것을 제외하고는 실시예 3과 동일한 방법으로 보호필름을 제조하였고, 제조된 점착층의 가교 밀도는 99%였다.A protective film was prepared in the same manner as in Example 3, except that the amount of the crosslinking agent was adjusted to 12 parts by weight, and the crosslinking density of the prepared adhesive layer was 99%.
본 발명의 실시예 및 비교예에서 점착 필름의 제조에 사용된 베이스 수지의 유리전이온도(Tg), 점착제 조성물의 성분 및 제조된 점착층의 가교 밀도 등을 하기 표 1에 표시하였다.The glass transition temperature (Tg) of the base resin, the components of the pressure-sensitive adhesive composition and the crosslinking density of the pressure-sensitive adhesive layer prepared in the Examples and Comparative Examples of the present invention are shown in Table 1 below.
[표 1][Table 1]
함량(중량부)Crosslinking Agent (HDI)
Content (parts by weight)
Crosslinking density (%)
위와 같이 제조된 실시예 및 비교예의 보호필름을 이용하여 하기 제시된 방법으로 저속 및 고속 박리력, 및 들뜸 억제 효과를 측정하였다. Using the protective film of the Example and Comparative Example prepared as described above was measured the low-speed and high-speed peeling force, and the lifting inhibitory effect.
1. 저속 및 고속 1. Low speed and high speed 박리력의Peel force 측정(180° Measurement (180 ° 박리력Peel force ))
제조된 보호필름을 2.5 cm × 20 cm(가로 × 세로)의 크기로 절단하여 샘플을 제조하고, 상기 샘플을 JIS Z 0237에 따라 SUS 304에 2 Kg의 롤러로 부착하였다. 이어서, 샘플이 부착된 SUS 304를 23℃의 온도 및 55%의 상대습도 조건에서 24 시간 동안 보관한 후, 인장시험기를 사용하여 0.3 m/min의 박리 속도로 저속 박리력을 측정하고, 30 m/min의 박리속도로 고속 박리력을 측정하였다.The prepared protective film was cut to a size of 2.5 cm x 20 cm (width x length) to prepare a sample, and the sample was attached to SUS 304 with a roller of 2 Kg in accordance with JIS Z 0237. Subsequently, the SUS 304 to which the sample was attached was stored at a temperature of 23 ° C. and a relative humidity of 55% for 24 hours, and then a low speed peel force was measured at a peel rate of 0.3 m / min using a tensile tester, and 30 m The high speed peel force was measured at a peel rate of / min.
2. 들뜸 방지 효과의 측정 2. Measurement of the lifting effect
제조된 보호필름을 SUS 304에 부착한 후, 30 cm × 30 cm(가로 × 세로)의 크기로 절단하여 샘플을 제조하였다. 이어서, 상기 샘플을 45℃의 오븐에서 5일 간 보관한 후, 모서리 부분에서의 들뜸 현상을 관찰함으로써 고온 들뜸 억제 효과 를 측정하다. 또한, 상기 샘플을 5℃의 냉장고에서 5일 동안 보관한 후, 같은 방법으로 저온 들뜸 억제 효과를 관찰하였다. 이 때 들뜸 억제 효과는 하기 기준에 따라 평가하였다.The prepared protective film was attached to SUS 304, and then cut into a size of 30 cm × 30 cm (width × length) to prepare a sample. Subsequently, after storing the said sample for 5 days in 45 degreeC oven, the effect of suppressing high temperature lifting by measuring the lifting phenomenon in a corner part is measured. In addition, the sample was stored in a refrigerator at 5 ° C. for 5 days, and then the low temperature lifting inhibitory effect was observed in the same manner. The lifting inhibitory effect at this time was evaluated according to the following criteria.
○: 들뜸 또는 박리 현상 없음○: no lifting or peeling phenomenon
△: 들뜸 또는 박리 현상 약간 발생△: slight lifting or peeling phenomenon
×: 들뜸 또는 박리 현상 다량 발생X: A large amount of lifting or peeling phenomenon occurs
위와 같은 방법으로 측정한 결과를 하기 표 2에 정리하여 기재하였다.The results measured by the same method as described above are summarized in Table 2 below.
[표 2][Table 2]
상기 표 2로부터 알 수 있는 바와 같이, 본 발명에 따른 실시예의 경우, 대형화된 피착체에 부착 시에도 제거가 용이할 정도로 낮은 고속 박리력을 나타내었다, 반면, 사용된 베이스 수지의 유리전이온도가 지나치게 낮은 비교예 1의 경우, 피착체로의 젖음성 저하로 인해 들뜸 억제 효과가 매우 떨어졌으며, 충전제를 포함하지 않거나, 가교 밀도가 낮은 비교예 2 및 3의 경우, 고속 박리력이 지나치게 증가하여 대형화된 피착체로의 적용이 어려워질 수 있음을 알 수 있었다. 또한, 가교 밀도가 지나치게 높은 비교예 4 및 5의 경우, 매우 열악한 들뜸 억제 효과를 나타냄을 알 수 있었다.As can be seen from Table 2, in the case of the embodiment according to the present invention, even when attached to the large sized adherend showed a high-speed peeling force low enough to be easily removed, while the glass transition temperature of the base resin used In the case of Comparative Example 1 which is too low, the lifting inhibitory effect is very poor due to the decrease in the wettability to the adherend, and in Comparative Examples 2 and 3 that do not contain a filler or have a low crosslinking density, the high-speed peeling force is excessively increased to enlarge the size. It was found that application to the adherend can be difficult. In addition, it was found that the comparative examples 4 and 5, in which the crosslinking density was too high, showed a very poor lifting inhibitory effect.
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| JPH093413A (en) * | 1995-06-20 | 1997-01-07 | Sekisui Chem Co Ltd | Acrylic pressure-sensitive adhesive sheet |
| KR100594514B1 (en) * | 2004-01-20 | 2006-06-30 | 주식회사 엘지화학 | Acrylic Pressure-Sensitive Adhesive Composition for the Polarizing Film |
| JP2006104269A (en) | 2004-10-01 | 2006-04-20 | Bando Chem Ind Ltd | Adhesive sheet |
| JP2007100041A (en) | 2005-10-07 | 2007-04-19 | Toyo Ink Mfg Co Ltd | Adhesive and adhesive sheet using the same |
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| Publication number | Publication date |
|---|---|
| KR20100026161A (en) | 2010-03-10 |
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