KR101330827B1 - Apparatus forming frost, laser processing system including the same and laser processing method using the same - Google Patents

Abstract

Laser processing system according to an embodiment of the present invention is a cold workpiece forming apparatus for forming a cooling workpiece formed with a cooling member on the bottom surface of the workpiece, a frost layer forming apparatus for forming a frost layer on the surface of the cooled workpiece, the frost layer is It may include a laser generating device for forming a fine hole in the frost layer and the cooling workpiece by irradiating a laser beam to the formed cooling workpiece. Therefore, the laser processing system according to an embodiment of the present invention forms a frosted layer on the surface of the cooled workpiece including the workpiece and the cooling member, and irradiates a laser beam to the cooled workpiece having the frosted layer to form fine holes in the cooled workpiece. By forming, the melt can be prevented from occurring on the inner wall of the fine hole due to the cooling action of the cooling member.

Description

Frost forming apparatus, laser processing system including the same and laser processing method using the same {APPARATUS FORMING FROST, LASER PROCESSING SYSTEM INCLUDING THE SAME AND LASER PROCESSING METHOD USING THE SAME}

The present invention relates to a frost forming apparatus, a laser processing system including the same, and a laser processing method using the same.

In general, in order to manufacture articles using various materials such as wafers, metals, plastics, and the like, processing procedures such as cutting, grooving, welding, and heat treatment are required, and laser processing apparatuses are used for such processing procedures.

The laser processing apparatus is a device which forms patterns, such as a fine hole, on a workpiece | work using the laser beam which generate | occur | produced in the laser generating apparatus, and is used for ultra-precision fine processing.

The laser beam of such a laser processing apparatus has a Gaussian distribution having a high energy density at the center and a low energy density at the edge.

In particular, in a drilling process in which fine holes are formed in a workpiece, a problem occurs in that the workpiece melted by the laser beam is resolidified on the inner wall of the fine hole. As such, the melt resolidified on the inner wall of the fine holes of the workpiece is difficult to wash. In addition, the workpiece surface is liable to be damaged by the plasma propagating around the laser beam and the plume in which the plasma is scattered.

The present invention is to solve the above-mentioned problems of the background art, frost forming apparatus that can suppress the generation of melt on the inner wall of the micro-holes when forming the micro-holes in the workpiece and to remove particles scattered on the surface of the workpiece, including It is intended to provide a laser processing system and a laser processing method using the same.

Laser processing system according to an embodiment of the present invention is a cold workpiece forming apparatus for forming a cooling workpiece formed with a cooling member on the bottom surface of the workpiece, a frost layer forming apparatus for forming a frost layer on the surface of the cooled workpiece, the frost layer is It may include a laser generating device for forming a fine hole in the frost layer and the cooling workpiece by irradiating a laser beam to the formed cooling workpiece.

The apparatus for forming a cold workpiece may include a vacuum chuck for adsorbing a surface of the workpiece, and a compression piston for compressing a cooling gas located on the bottom of the workpiece to form a cooling member on the bottom of the workpiece.

The cooling member may be solid dry ice.

The defrosting layer forming apparatus includes a fixed jig on which the cooled workpiece is mounted and which exposes only the surface of the cooled workpiece, a support plate positioned inside the fixed jig to support the cooled workpiece, and a buffer member provided between the fixed jig and the support plate. It may include.

The fixing jig may be made of heat insulating material.

The apparatus may further include a cleaning device for cleaning the cooled workpiece on which the fine holes are formed.

The cooled workpiece in which the fine holes are formed can be turned over and soaked in the cleaning liquid of the cleaning apparatus.

In addition, the laser processing method using a laser processing system according to an embodiment of the present invention comprises the steps of forming a cooled workpiece formed with a cooling member on the bottom surface of the workpiece, forming a frost layer on the surface of the cooled workpiece, the frost layer Irradiating a laser beam to the formed cooling workpiece may include forming fine holes in the frost layer and the cooling workpiece.

A cooling member may be formed on the bottom surface of the workpiece by compressing the cooling gas located on the bottom surface of the workpiece.

The cooling gas may be a mixed gas of carbon dioxide (CO ₂ ) and a fluorine-based gas.

The cooling gas may be a mixed gas of carbon dioxide (CO ₂ ) and oxygen (O ₂ ).

The cooling gas may include any one additive selected from naphthalene, anthracene, or tetracene.

The surface of the cooled workpiece mounted on a fixing jig made of a heat insulating material may be exposed to form a frost layer on the surface of the cooled workpiece over time.

The laser beam may be used to form fine holes in the cooling member so that particles of the cooling member may be ejected through the fine holes of the workpiece and the frost layer.

The method may further include the step of inverting the cooled workpiece having the fine holes formed therein and immersing it in a cleaning solution of the cleaning apparatus to vaporize the cooling member to remove particles inside the fine holes.

The cooling member may be vaporized and the frost layer may be liquefied to remove particles scattered on the frost layer.

In addition, the apparatus for forming a frost layer according to an embodiment of the present invention is mounted on the bottom surface of the workpiece, the cooling workpiece is formed with a cooling member is fixed jig which exposes only the surface of the cooling workpiece, the fixing jig is located inside the fixed jig It may include a support plate for supporting, a buffer member provided between the fixing jig and the support plate.

The fixing jig may be made of heat insulating material.

According to the present invention, a frosted layer is formed on the surface of a cooled workpiece including a workpiece and a cooling member, and a fine hole is formed on the cooled workpiece by irradiating a laser beam to the cooled workpiece on which the frosted layer is formed, thereby reducing the cooling effect of the cooling member. This can prevent the melt from occurring on the inner wall of the fine holes.

In addition, when forming the workpiece microhole by laser processing, by processing to the cooling member microhole, the cooling member particles generated during the cooling member microhole processing exploded through the microholes exploding through the microholes to remove the workpiece particles remaining on the inner wall of the workpiece microholes. Can be removed Therefore, the inner wall of the workpiece fine hole can be neatly processed.

In addition, by cooling the workpiece formed with fine holes into the cleaning apparatus to liquefy the frost layer, it is possible to remove the workpiece particles scattered on the frost layer during laser processing. Therefore, the workpiece particle scattered on the workpiece can be easily removed.

1 is a schematic diagram of a laser processing system according to one embodiment of the invention.
2 to 4 are diagrams sequentially illustrating steps of forming a cooled workpiece by using a cooling member forming apparatus of a laser processing system according to an embodiment of the present invention.
5 and 6 are diagrams sequentially illustrating steps of forming a frost layer on a surface of a cooled workpiece using a frost layer forming apparatus of a laser processing system according to an embodiment of the present invention.
7 and 8 are diagrams sequentially illustrating steps of forming fine holes in a frosted layer and a cooled workpiece using a laser generating apparatus of a laser processing system according to an embodiment of the present invention.
9 and 10 are diagrams sequentially illustrating steps of cleaning a cooling workpiece in which fine holes are formed by using a cleaning apparatus of a laser processing system according to an embodiment of the present invention.
11 is a graph showing the absorption rate of the UV laser beam according to the wavelength of the UV laser beam of the laser processing system according to an embodiment of each additive according to the cooling gas.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

Next, a laser processing system according to an exemplary embodiment of the present invention will be described in detail with reference to FIG. 1.

1 is a schematic diagram of a laser processing system according to one embodiment of the invention.

As shown in Figure 1, the laser processing system according to an embodiment of the present invention is a cold workpiece forming apparatus 100 for forming a cooling workpiece 10, the cooling member 12 is formed on the bottom surface of the workpiece 11, The frosted layer 20 is irradiated with a laser beam 30 on the frosted layer forming apparatus 200 which forms the frosted layer 20 on the surface of the cooled workpiece 10, and the cooled workpiece 10 in which the frosted layer 20 was formed. And a laser generator 300 for forming the fine holes 10a in the cooled workpiece 10, and a cleaning device 400 for cleaning the cooled workpiece 10 in which the fine holes 10a are formed.

The cold workpiece forming apparatus 100 includes a vacuum chuck 110 that sucks the surface of the workpiece 11, and a compression piston 120 that compresses the cooling gas 1 located at the bottom of the workpiece 11.

The vacuum chuck 110 is disposed on the workpiece 11 and sucks air to adsorb the surface of the workpiece 11 to fix the workpiece 11 to the vacuum chuck 110. The compression piston 120 compresses the cooling gas 1 positioned between the compression piston 120 and the workpiece 11 to form the cooling member 12 on the bottom surface of the workpiece 11. At this time, the cooling member 12 may be solid dry ice. The cooling member 12 plays a role of cooling the workpiece 11.

Defrosting layer forming apparatus 200 is a fixed jig 210, the fixing jig 210 is mounted on the cooling workpiece 10, the support plate 220, the fixing jig 210 and the support jig 10 to support the cooling workpiece 10 and The buffer member 230 is installed between the support plates 220.

The fixing jig 210 fixes the cooling workpiece 10 and is made of a heat insulating material to prevent the cooling workpiece 10 from being heat-exchanged with the outside. However, the fixing jig 210 has an opening 210a exposing only the surface of the cooling workpiece 10, and the surface of the cooling workpiece 10 exposed through the opening 210a of the fixing jig 210 is exposed to the outside. The frost layer 20 is formed by the temperature difference. The frost layer 20 is a solidified water vapor of the external saturated gas.

The shock absorbing member 230 keeps the focal length between the laser beam 30 and the workpiece 11 constant even when the cooling member 12 is evaporated to reduce the volume. The supporting plate 220 and the fixing jig 210 in contact with each other serves to prevent direct contact with each other.

The laser generator 300 includes a laser generator 300 for generating a laser beam 30 which is light amplified by induced emission, and a laser scanner 320 for adjusting the irradiation trajectory of the laser beam 30.

The laser beam 30 may be a UV laser beam advantageous for micromachining or a CO ₂ laser beam excellent in reactivity to dry ice. In addition, the laser beam 30 may be a Gaussian distribution beam of a Gaussian distribution whose energy density at the center portion is higher than that at the edge portion, or may be a planar laser beam having substantially the same energy density at the center portion and the edge portion.

The laser beam 30 forms the frost layer fine hole 20a, the workpiece fine hole 11a, and the cooling member fine hole 12a in the frost layer 20, the workpiece 11, and the cooling member 12, respectively. . In the case of forming the workpiece fine hole 11a, it is possible to prevent the melt from occurring on the inner wall of the workpiece fine hole 11a due to the cooling action of the cooling member 12.

In addition, when forming the workpiece fine hole 11a, by processing to the cooling member fine hole 12a, the cooling member particle 2 which generate | occur | produces at the time of processing the cooling member fine hole 12a explodes explosively through the fine hole 10a. The workpiece particle 3 remaining on the inner wall of the workpiece fine hole 11a can be removed. Therefore, the inner wall of the workpiece fine hole 11a can be neatly processed.

The cleaning device 400 may be a water tank 410 filled with the cleaning liquid 420. When the cooling workpiece 10 in which the fine holes 10a are formed is turned over and immersed in the cleaning apparatus 400, bubbles generated by vaporizing the cooling member 12 by the cleaning liquid 420 that has penetrated the cooling member fine holes 12a. The workpiece particle 3 of the inner wall of this workpiece fine hole 11a is removed. In addition, the cleaning liquid 420 may liquefy the frost layer 20 to remove the workpiece particles 3 scattered on the frost layer 20 during laser processing. Therefore, the workpiece particle 3 scattered on the workpiece 11 can be easily removed. The cleaning liquid 420 may be water or alcohol. On the other hand, the cleaning device 400 may be a device having a structure for spraying the cleaning liquid 420 or spraying hot air.

A laser processing method using a laser processing system according to an embodiment of the present invention will be described in detail below with reference to FIGS. 2 to 10.

2 to 4 are views showing in sequence the steps of forming a cooling workpiece by using the cooling member forming apparatus of the laser processing system according to an embodiment of the present invention, Figures 5 and 6 is an embodiment of the present invention 7 is a view illustrating a step of sequentially forming a frosted layer on the surface of a cooled workpiece using a frosted layer forming apparatus of a laser processing system according to an example, and FIGS. 7 and 8 are laser processing systems according to an embodiment of the present invention. FIG. 9 is a view illustrating steps of forming fine holes in a frost layer and a cooled workpiece by using a laser generator of FIG. 9, and FIGS. 9 and 10 are using a cleaning apparatus of a laser processing system according to an embodiment of the present invention. It is a figure which shows the process of washing | cleaning the cooled workpiece in which the microhole was formed in order.

First, as shown in FIG. 2, the workpiece 11 is fixed to the vacuum chuck 110, and the cooling gas 1 is positioned between the workpiece 11 and the compression piston 120.

The workpiece 11 may be a ceramic such as silicon carbide (SiC) or aluminum oxide (Al ₂ O ₃ ), or a metal such as iron (Fe).

The cooling gas 1 may be a mixed gas of carbon dioxide (CO ₂ ) and a fluorine-based gas. Examples of the fluorine-based gas include SF ₆ , CF ₄ , NF _3, or CHF ₃ . When the workpiece 11 is a silicon wafer, when the cooling gas 1, which is a mixed gas of carbon dioxide (CO ₂ ) and a fluorine-based gas, is compressed to form the cooling member 12, chemical effects such as dry etching during laser processing are added. The cleaning effect of removing the workpiece particle 3 of the inner wall of the workpiece fine hole 11a is further increased.

In addition, the cooling gas 1 may be a mixed gas of carbon dioxide (CO ₂ ) and oxygen (O ₂ ). When the workpiece 11 is a plastic-based material, when the cooling gas 1, which is a mixed gas of carbon dioxide (CO ₂ ) and oxygen (O ₂ ), is compressed to become the cooling member 12, the carbonization phenomenon is minimized during laser processing. The occurrence of the workpiece particle 3 can be minimized.

In addition, the cooling gas 1 may include any one of additives selected from naphthalene, anthracene, and tetratracene.

FIG. 11 is a graph illustrating absorption rates of UV laser beams according to wavelengths of UV laser beams of laser processing systems according to an exemplary embodiment of the present invention.

As shown in FIG. 11, as the number of benzene rings increases, that is, as the naphthalene (A) moves from anthracene (B) to tetracene (C), the absorption rate of the workpiece 11 absorbing the UV laser beam 30 increases. It can be seen that.

Moreover, the laser processing rate can be improved by containing an additive in cooling gas 1 suitably according to the wavelength of the UV laser beam 30 to be used. For example, in the case of using the UV laser beam 30 having a wavelength of 343 nm or 355 nm, anthracene having a high absorption at the wavelength can be applied to the cooling gas 1 as an additive to improve the laser processing rate.

Next, as shown in FIG. 3, the cooling gas 1 is compressed using the compression piston 120, and it is made into the liquid phase cooling member 1 '.

Next, as shown in FIG. 4, the liquid cooling member 1 ′ is further compressed using the compression piston 120 to form the cooling member 12 on the bottom surface of the workpiece 11 to form the cooling member 12. And a cooled workpiece 10 consisting of the workpiece 11. At this time, the cooling member 12 may be solid dry ice.

Next, as shown in FIG. 5, the cooled workpiece 10 including the cooling member 12 and the workpiece 11 is mounted on the fixing jig 210 of the frost-layer forming apparatus 200.

Next, as shown in FIG. 6, since the fixing jig 210 made of the heat insulating material exposes only the surface of the work piece 11 through the opening 210a, the surface of the work piece 11 that is not insulated may change over time. The frost layer 20 is formed to a thin thickness.

Next, as shown in FIG. 7, the fine beam 10a is applied to the frosted layer 20 and the cooled workpiece 10 by irradiating the laser beam 30 to the cooled workpiece 10 having the frosted layer 20 formed thereon. Form. The fine holes 10a include the frost layer fine holes 20a, the workpiece fine holes 11a, and the cooling member fine holes 12a formed in the frost layer 20, the workpiece 11, and the cooling member 12, respectively. .

At this time, it is possible to prevent the melt from occurring on the inner wall of the fine hole 10a by the cooling action of the cooling member 12. In addition, as shown in FIG. 8, the cooling member particles 2 generated during the processing of the cooling member fine holes 12a are exploded through the fine holes 10a and remain on the inner wall of the workpiece fine holes 11a. The workpiece particle 3 can be removed. Therefore, the inner wall of the workpiece fine hole 11a can be neatly processed.

In addition, the cooling member 12 can minimize the generation of the plasma by the laser beam 30, and thus can minimize the workpiece particle 3 deposited on the frost layer 20 by the plasma. In order to remove the workpiece particle 3 deposited on the frost layer 20, the cleaning apparatus 400 is used as follows.

Next, as shown in FIG. 9, the cooled workpiece 10 in which the fine hole 10a was formed is reversed and immersed in the washing | cleaning apparatus 400. FIG.

At this time, the bubble generated by the cleaning liquid 420 penetrating to the cooling member fine hole 12a by vaporizing the cooling member 12 removes the workpiece particle 3 of the inner wall of the workpiece fine hole 11a. In addition, the bubbles cause vibration to cause the workpiece particles 3 of the inner walls of the workpiece fine holes 11a to fall off better.

 In addition, the cleaning liquid 420 may liquefy the frost layer 20 to remove the workpiece particles 3 scattered on the frost layer 20 during laser processing. Therefore, the workpiece particle 3 scattered on the workpiece 11 can be easily removed.

Next, as shown in FIG. 10, the cooling member 12 is vaporized, and the processed material 11 in which the frosted layer 20 is liquefied is taken out from the cleaning device 400 and dried. Therefore, the workpiece particle 3 is completely removed from the workpiece fine hole 11a of the workpiece 11.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the following claims. Those who are engaged in the technology field will understand easily.

1: cooling gas 2: cooling member particles
3: workpiece particle 10: cooling workpiece
11: workpiece 12: cooling member
20: frost layer 30: laser beam
100: cooling workpiece forming apparatus 200: frost layer forming apparatus
300: laser generating device 400: cleaning device

Claims (18)

Cooled workpiece forming apparatus for forming a cooled workpiece having a cooling member formed on the bottom of the workpiece,
Defrosting layer forming apparatus for forming a frosting layer on the surface of the cooled workpiece,
A laser generating device for irradiating a laser beam to the cooled workpiece having the frosted layer formed thereon to form fine holes in the frosted layer and the cooled workpiece;
Cleaning apparatus for cleaning the cooled workpiece in which the fine holes are formed
Lt; / RTI >
And a bubble generated by inverting the cooled workpiece having the fine holes formed therein and immersing it in a cleaning liquid of a cleaning apparatus to vaporize the cooling member to remove particles inside the fine holes. In claim 1,
The cold workpiece forming apparatus
A vacuum chuck for adsorbing the surface of the workpiece,
Compression piston for compressing the cooling gas located on the bottom surface of the workpiece to form a cooling member on the bottom surface of the workpiece
Laser processing system comprising a. In claim 1,
And said cooling member is solid dry ice. In claim 1,
The frost layer forming apparatus is
A fixed jig in which the cooling workpiece is mounted and only the surface of the cooling workpiece is exposed;
A support plate positioned inside the fixing jig to support the cooling workpiece;
Shock absorbing member provided between the fixing jig and the support plate
Laser processing system comprising a. 5. The method of claim 4,
The fixing jig is a laser processing system made of insulation. delete In claim 1,
The laser processing system which flips the cooled workpiece in which the said microhole was formed, and immerses it in the washing | cleaning liquid of the said washing | cleaning apparatus. Forming a cooled workpiece having a cooling member formed on a bottom surface of the workpiece,
Forming a frosted layer on the surface of the cold workpiece,
Irradiating a laser beam on the cooled workpiece having the frosted layer formed thereon to form fine holes in the frosted layer and the cooled workpiece;
Inverting the cooling workpiece on which the fine holes are formed and immersing them in a cleaning liquid of a cleaning apparatus to vaporize the cooling member to remove particles in the fine holes;
. 9. The method of claim 8,
And a cooling member positioned on the bottom surface of the workpiece to form a cooling member on the bottom surface of the workpiece. The method of claim 9,
The cooling gas is a laser processing method is a mixed gas of carbon dioxide (CO ₂ ) and fluorine-based gas. The method of claim 9,
The cooling gas is a laser processing method is a mixed gas of carbon dioxide (CO ₂ ) and oxygen (O ₂ ). 11. The method according to claim 10 or 11,
The cooling gas is a laser processing method comprising any one of additives selected from naphthalene, anthracene, or tetracene. The method of claim 9,
A laser processing method for forming a frosted layer on the surface of the cooled workpiece over time by exposing the surface of the cooled workpiece mounted on a fixed jig made of a heat insulating material. 9. The method of claim 8,
And forming a fine hole in the cooling member by using the laser beam to cause particles of the cooling member to be ejected through the fine holes of the workpiece and the frost layer. delete 9. The method of claim 8,
And vaporizing the cooling member and liquefying the frost layer to remove particles scattered on the frost layer.
delete delete

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