KR101324886B1 - Glass grinding apparatus using ultrasonic wave - Google Patents

Abstract

The present invention deviates from the method of polishing the edge of the glass substrate using a conventional polishing wheel, the tool having a groove with a rounded end is transmitted to the edge of the glass substrate by ultrasonic vibration, and along the edge of the glass substrate An object of the present invention is to provide a glass polishing apparatus that uses ultrasonic waves to polish while moving and to remove burrs (B).
According to the present invention, a plurality of air holes are formed and provided with a table on which a substrate support for adhering and fixing the glass substrate to be polished, and a fixed wall for lifting up and down to temporarily support the glass substrate, A fixing part for forming a vacuum pressure through an air hole, an X and Y axis transferring part installed at an upper end of the table and transferring an ultrasonic polishing machine for polishing the glass substrate on the X and Y axes, and the X and Y axes A Z-axis feeder configured to enable vertical movement and rotational movement of an ultrasonic polishing machine equipped with a tool having a groove having a rounded end, and a high frequency generator for supplying a high frequency power for generating ultrasonic waves to the ultrasonic polishing machine. Cooling circulation device for circulating the cooling water through the cooling hose connected to the ultrasonic polishing machine to prevent overheating inside the ultrasonic polishing machine, and It includes a controller for controlling the detachment of the glass substrate and the transfer and operation of the ultrasonic polishing machine in a predetermined order.
Therefore, according to the present invention, the edge of the glass substrate can be polished in a round shape, and since dust such as glass chips or powder hardly occurs, there is an effect of improving the cleanliness of the workplace.

Description

Glass grinding apparatus using ultrasonic wave

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass polishing apparatus using ultrasonic waves, and more particularly, to polish an edge of a glass substrate for constituting liquid crystal glass used in a liquid crystal display panel by using an ultrasonic processing method, The present invention relates to a glass polishing apparatus using ultrasonic waves for removing burrs generated as cutting marks at edges.

Among flat panel displays widely used in recent years, a liquid crystal display (LCD) is a typical example. In order to manufacture this, two thin glass substrates containing a liquid crystal material are required in the intermediate layer. After cutting the glass substrate in the process of processing the glass substrate, burrs (B) are formed at the edges of the edges. Sharply protruding areas remain. If the irregular shape is not removed, it may cause safety accidents, failures, and deterioration of quality, and thus, after the cutting process, the edge of the glass substrate is polished.

1 illustrates a polishing method according to the prior art that is commonly performed. The polishing wheel 100 that rotates at high speed along the shaft 101 by the rotating motor moves along the edge of the glass substrate P to perform polishing. According to Republic of Korea Patent Publication No. 10-0793040 (2008.01.03) is disclosed a glass substrate polishing apparatus of this general manner.

However, in the conventional method of polishing a glass substrate using a rotating polishing wheel, it is difficult to polish the corners in a round shape, and dust such as glass chips or powder is generated during the polishing process, and thus, the cleanliness of the workplace is reduced and thus requires fineness. There is a problem of degrading the quality of the display panel.

On the other hand, the ultrasonic processing method has the advantage that can be molded freely according to the shape of the tool.

Republic of Korea Patent Publication No. 10-0793040 (2008.01.03)

In order to solve the problems as described above, in the present invention, the tool having a groove with a rounded end of the glass substrate (P) is vibrated away from the method of grinding the edges of the glass substrate (P) by using a conventional polishing wheel. An object of the present invention is to provide a glass polishing apparatus that uses an ultrasonic wave to transmit an impact force to an edge and to polish and move burrs (B) while moving along the edge of the glass substrate.

A configuration for achieving the object includes a table provided with a substrate support for forming a plurality of air holes so that the glass substrate P to be polished is attracted and fixed; A fixing part having a fixed wall for moving up and down to temporarily support the glass substrate, the fixing part forming a vacuum pressure through an air hole of the substrate support; An X and Y axis transfer unit installed at an upper end of the table and transferring an ultrasonic polishing machine for polishing the glass substrate on an X axis and a Y axis; A Z-axis feeder mounted on the X- and Y-axis feeders to enable vertical movement and rotational movement of the ultrasonic polishing machine; A high frequency generator for supplying a high frequency power source for generating ultrasonic waves to the ultrasonic polisher; Cooling circulation device for circulating the cooling water through the cooling hose connected to the ultrasonic polishing machine to prevent overheating inside the ultrasonic polishing machine; And a controller for controlling the detachment of the glass substrate and the transfer and operation of the ultrasonic polisher in a predetermined order.

In still another aspect of the present invention, the fixing wall of the fixing part may be disposed in a 'b' or 'b' shape in a diagonal direction of the substrate support, and may be vertically moved by a moving cylinder.

In still another aspect of the present invention, the Z-axis transfer unit includes an ultrasonic polisher mounted at the end of the Z-axis transfer unit to polish the glass substrate; A lifting motor for feeding the ultrasonic polishing machine on the Z axis; A rotating motor for rotating the ultrasonic polishing machine at right angles; An inclination angle holder for maintaining an inclination angle of 45 degrees with respect to the table for the ultrasonic polishing machine; A pressurized cylinder providing pressure in the vibration direction to the ultrasonic polisher; And a forward adjustment screw for fine-adjusting the distance between the ultrasonic polisher and the glass substrate.

In still another aspect of the present invention, the ultrasonic polishing machine includes: an ultrasonic chamber having a vibrator and a coil generating ultrasonic waves therein; A horn for amplifying vibration generated in the vibrator; And a tool which is formed in a cylindrical shape having a semi-circular groove at the end and roundly polishes the edge of the glass substrate with an impact force by ultrasonic vibration.

As described above, the present invention does not use a conventional grinding wheel, and because the tool having a groove with a round end is polished to remove the burrs by transferring the impact force to the edge of the glass substrate by ultrasonic vibration, the round shape The edges can be polished, and since dust such as glass chips or powder is hardly generated, the cleanliness of the workplace is improved.

1 is a side view showing a glass substrate polishing method according to the prior art.
2 is a front view of the device according to the invention as a whole;
3 is a perspective view showing the glass substrate loading by the operation of the fixing wall according to the present invention.
4 is a front view showing a Z-axis feeder which is the main part of the device according to the invention.
5 is a side view showing a method of polishing by an apparatus according to the present invention.

1 is a side view showing a glass substrate polishing method according to the prior art.

2 is a front view of the device according to the invention as a whole.

Figure 3 is a perspective view showing the glass substrate loading by the operation of the fixing wall according to the present invention.

4 is a front view showing a Z-axis feeder which is the main part of the apparatus according to the present invention.

5 is a side view showing a method of polishing by the apparatus according to the present invention.

Hereinafter, the components according to the present invention will be described in detail with reference to the drawings.

Referring to FIGS. 2 and 3, first, a plurality of air holes 11a are formed, and a table 10 provided with a substrate support 11 for adsorbing and fixing the glass substrate P is provided. The air holes 11a of the substrate support 11 are formed at uniform intervals, and although not shown in the drawings, the air holes 11a of the substrate support 11 are connected to the suction line at the bottom thereof. The other end of the suction line is connected to the fixing portion 20 for generating the suction force.

The lower end of the table 10 is provided with a fixed wall 21 for raising and lowering to temporarily support the glass substrate P, and a fixing part 20 for forming a vacuum pressure in the air hole 11a is provided. . The fixing part 20 includes a vacuum pump installed at the other end of the suction line and a fixing wall 21 for guiding the loading of the glass substrate P while protruding or hiding the upper surface of the table 10.

At this time, the fixing wall 21 of the fixing part 20 is disposed in a 'b' or 'b' shape in the diagonal direction of the substrate support 11, each fixed wall 21 is moved by pneumatic operation The cylinder 22 moves up and down. Accordingly, the fixed wall 21, which is normally concealed in the table 10, is exposed to the upper surface of the table 10 only when the glass substrate P is loaded, so that the origin of the glass substrate P and the origin of the substrate support 11 are different. Quickly and accurately handles guiding actions to match.

The upper end of the table 10 is provided with an X, Y axis transfer unit 30 for transferring the ultrasonic polishing machine 41, which will be described later in the X, Y coordinate axis direction. The X and Y axis transfer unit 30 transfers the ultrasonic polishing machine 41 along the edge of the glass substrate P while polishing the glass substrate P, and may employ an AC servomotor.

The X- and Y-axis transfer units 30 are equipped with a Z-axis transfer unit 40 to enable vertical movement and rotational movement of the ultrasonic polishing machine 41.

Referring to FIG. 4, the Z-axis transfer unit 40 includes an ultrasonic polishing machine 41 for polishing the glass substrate P, a lifting motor 42 for transferring the ultrasonic polishing machine 41 on the Z-axis, and ultrasonic waves. The rotating motor 43 for rotating the grinding machine 41 in a right angle unit, the inclination angle holder 44 for maintaining the inclination angle of 45 degrees with respect to the table 10, and the ultrasonic polishing machine 41, and the ultrasonic polishing machine 41 in the vibration direction. And a forward adjustment screw 46 for fine-adjusting the distance between the pressurized cylinder 45 and the ultrasonic polishing machine 41 and the glass substrate P.

Ultrasonic polishing machine 41 is mounted on the end of the Z-axis transfer unit 40 to enable vertical movement and rotational movement, the ultrasonic chamber 41a for generating ultrasonic waves, and the horn for amplifying vibration in conjunction with the ultrasonic chamber 41a ( 41b) and the tool 41c which took the shape which can shape | mold the end of the horn 41b, and can process a to-be-processed object.

Although not shown in the figure, the inside of the ultrasonic chamber 41a is provided with a vibrator for generating ultrasonic vibrations. The vibrator is wound around a coil connected to the high frequency generator 50, which will be described later, to convert AC electrical energy into vibration energy. The vibration generated in the vibrator is transmitted to the horn 41b joined to the lower end of the vibrator. The joint between the vibrator and the horn 41b is brought into contact with the cooling pipe or cooled by the coolant sprayed from the coolant nozzle. The cooling pipe or the cooling water nozzle is installed to be connected to the cooling circulation device 60 to be described later to allow the cooling water to circulate.

The horn 41b amplifies the vibration and transmits the vibration to the tool. For example, the horn 41b may adopt a material of duralumin, an aluminum alloy having excellent strength to weight. The lower end of the horn 41b is made into a cylindrical protruding shape to function as the tool 41c. A groove is formed at the end of the cylindrical tool 41c. According to the characteristics of the ultrasonic processing, the workpiece is processed in the same manner as the shape of the tool, so that the end of the tool 41c is dug into a semi-circular shape in order to smoothly polish the edge of the glass substrate P.

The lifting and lowering motor 42 is installed on the support bracket 47 which serves to mount and fix the Z-axis transfer unit 40 on the X and Y-axis transfer units 30, or use a known stepping motor. General servo motor can be used in combination with position sensor. The elevating motor 42 is interlocked with the elevating cylinder 42a at the bottom and moves up and down the strut 42b which is moved in and out of the elevating cylinder 42a.

At the lower end of the support 42b, an inclination angle fixing stand 44 interlocked with the rotary motor 43 is installed to support the ultrasonic polishing machine 41 while maintaining a posture of 45 degrees with respect to the horizontal surface of the table 10. The rotary motor 43 employs a stepping motor and functions to rotate the ultrasonic polisher 41 in units of 90 degrees when one edge of the glass substrate P is polished and then transported to polish the other edge.

A pressure cylinder 45 which is operated by pneumatic pressure is installed at the coupling portion of the inclination angle holder 44 and the ultrasonic polishing machine 41 to add a constant pressure toward the workpiece when the edge is polished. In addition, the regulator 45a is used together with the pressure cylinder 45 to control the numerical pressure and the pressure actually applied. The regulator 45a selects how the pressing force is displayed on the display.

In addition, the forward adjustment screw 46 is provided on one side of the ultrasonic polishing machine 41, the position of the tool 41c transferred by the instruction of the controller 70 and the X, Y axis transfer portion and Z axis transfer portion. When the micro-gap occurs without completely contacting the edge of the glass substrate P, the ultrasonic polishing machine 41 is advanced to adjust the forward adjusting screw 46 to contact the tool 41c with the edge of the glass substrate P. do.

Referring again to FIG. 2, a high frequency generator 50 for supplying high frequency power to the ultrasonic polishing machine 41, a cooling circulation device 60 for supplying cooling water to the ultrasonic polishing machine 41, and a glass substrate P A controller 70 is provided at one side for controlling the removal and the transfer of the ultrasonic polishing machine 41 according to a pre-programmed order.

The controller 70 is based on a microcomputer circuit having a CPU, a memory, and an input / output interface. Various sensors and a regulator 45a are connected to an input terminal of the controller 70, and a relay for driving a lifting motor 42, a rotation motor 43, a pressure cylinder 45, and the like is connected to an output terminal.

Hereinafter, an operation method according to the present invention will be described.

Although not shown in the drawing with the power of the controller 70 turned on, when the execution of the initialization program is completed in the computer connected to the controller 70, the horizontal, vertical length and thickness of the glass substrate P are input or set. Subsequently, as shown in FIG. 3, the glass cylinder P is loaded in a state in which the reference block 21 is raised by operating the moving cylinder 22 not shown in the drawing, and when the vacuum pump of the fixing unit 20 is operated, the substrate support ( Vacuum pressure is formed in the air hole 11a of 11), and the glass substrate P is adsorbed and fixed. The fixing wall 21 is then lowered again to conceal the original position.

Then, the lifting motor 42 of the X, Y axis transfer unit 30 and the Z axis transfer unit 40 is operated so that the end of the tool 41c of the ultrasonic polishing machine 41 is at the edge of the glass substrate P. Position it. At this time, the end of the tool 41c is finely adjusted using the forward adjustment screw 46 so as to completely contact the edge of the glass substrate P. In this state, the pressure cylinder 45 is operated to generate an ultrasonic wave while maintaining a constant pressing force in a state where the tool 41c does not fall off the edge of the substrate to start polishing. The frequency for grinding the edges of the glass substrate P is set to about 40 kHz. Ultrasonic vibration generated in the vibrator inside the ultrasonic chamber 41a of the ultrasonic polishing machine 41 by the high frequency current supplied from the high frequency generator 50 is amplified while passing through the horn 41b to vibrate the tool 41c. At this time, the amplitude is set to 20 μm (micrometer) as an example.

Referring to FIG. 5, the tool 41c vibrates in contact with the edge of the glass substrate P to remove the burr B by its impact force and to polish the rounded shape such as the end of the tool 41c. The tool 41c is conveyed in the direction of the X axis or the Y axis so as to polish while moving along the edge.

Subsequently, in order to polish the adjacent edges, motors of the X and Y axis transfer units 30 operate to transfer the ultrasonic polishing machine 41 in the X or Y axis direction. Subsequently, the rotary motor 43 of the Z-axis transfer unit 40 operates to rotate the ultrasonic polisher 41 by 90 degrees so that the tool 41c contacts the adjacent corner. In this manner, the upper, lower, left and right corners of the four sides are polished by the rotary motor 43 of the X and Y axis transfer unit 30 and the Z axis transfer unit 40.

Although the present invention has been shown and described with respect to specific embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Anyone who can afford it will know.

10 table 11 substrate support
11a: air hole 20: fixing part
21: fixed wall 22: moving cylinder
30: X, Y axis transfer part 40: Z axis transfer part
41: ultrasonic polishing machine 41a: ultrasonic chamber
41b: Horn 41c: Tool
42: lifting motor 42a: lifting cylinder
42b: Shore 43: Revolving Motor
44: inclination angle fixing table 45: pressure cylinder
45a: Regulator 46: Forward adjustment screw
47: support bracket 50: high frequency generator
60: cooling circulation device 70: controller
P: glass substrate B: burr

Claims (4)

A table 10 in which a plurality of air holes 11a are formed so that the substrate support 11 for adsorbing and fixing the glass substrate P to be polished is installed;
A fixing part (20) having a fixing wall (21) for moving up and down to temporarily support the glass substrate (P), and forming a vacuum pressure through the air hole (11a) of the substrate support (11);
X, Y-axis transfer unit 30 is installed on the upper end of the table 10 to transfer the ultrasonic polishing machine 41 for polishing the glass substrate (P) on the X-axis and Y-axis;
A Z-axis transfer unit 40 mounted on the X- and Y-axis transfer units 30 to enable vertical movement and rotational movement of the ultrasonic polishing machine 41;
A high frequency generator (50) for supplying a high frequency power source for generating ultrasonic waves to the ultrasonic polishing machine (41);
Cooling circulation device 60 for circulating the cooling water through the cooling hose (X) connected to the ultrasonic polishing machine 41 to prevent overheating in the ultrasonic polishing machine 41; And
And a controller (70) for controlling the detachment of the glass substrate (P) and the transfer and operation of the ultrasonic polishing machine (41) in a set order. The method of claim 1,
The fixing wall 21 of the fixing portion 20 is disposed in a 'b' or 'b' shape in the diagonal direction of the substrate support 11, and the ultrasonic wave, characterized in that the vertical movement by the movable cylinder 22 Glass polishing device used. The method of claim 1,
The Z-axis transfer unit 40 and the ultrasonic polishing machine 41 is mounted on the end of the Z-axis transfer unit 40 to polish the glass substrate (P);
A lifting motor 42 for feeding the ultrasonic polishing machine 41 on the Z axis;
A rotating motor 43 for rotating the ultrasonic polishing machine 41 at right angles;
An inclination angle holder 44 for maintaining the ultrasonic polishing machine 41 at an inclination angle of 45 degrees with respect to the table 10;
A pressure cylinder 45 which provides pressure to the ultrasonic polishing machine 41 in the vibration direction; And
Ultrasonic polishing machine 41 and the glass polishing apparatus using the ultrasonic wave, characterized in that it comprises a; advance adjustment screw 46 for fine-tuning the distance between the glass substrate (P). The method of claim 3,
The ultrasonic polishing machine 41 includes an ultrasonic chamber 41a having a vibrator and a coil for generating ultrasonic waves therein;
A horn 41b for amplifying the vibration generated by the vibrator; And
A glass polishing apparatus using ultrasonic waves, comprising: a tool (41c) formed in a cylindrical shape having a semi-circular groove at its end to round the edge of the glass substrate (P) with an impact force by ultrasonic vibration.

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