KR101320434B1 - 원료물질 공급 제어장치 - Google Patents
원료물질 공급 제어장치 Download PDFInfo
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- KR101320434B1 KR101320434B1 KR1020110044331A KR20110044331A KR101320434B1 KR 101320434 B1 KR101320434 B1 KR 101320434B1 KR 1020110044331 A KR1020110044331 A KR 1020110044331A KR 20110044331 A KR20110044331 A KR 20110044331A KR 101320434 B1 KR101320434 B1 KR 101320434B1
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- 239000000463 material Substances 0.000 title claims description 13
- 239000002994 raw material Substances 0.000 claims abstract description 235
- 230000008016 vaporization Effects 0.000 claims abstract description 34
- 238000009834 vaporization Methods 0.000 claims abstract description 32
- 238000012546 transfer Methods 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims abstract description 6
- 230000008021 deposition Effects 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 25
- 238000001816 cooling Methods 0.000 description 10
- 239000011368 organic material Substances 0.000 description 8
- 238000005137 deposition process Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/52—Means for observation of the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical Kinetics & Catalysis (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
도 2는 본 발명의 일 실시예에 따른 원료물질 공급 제어장치를 도시한 도면이고,
도 3은 도 2의 원료물질 공급 제어장치에서 원료 용기 내에 수용된 원료물질의 표면 부위를 확대한 도면이고,
도 4는 도 2의 원료물질 공급 제어장치의 제어부의 기능을 도시한 도면이다.
110 : 원료 용기
120 : 히터
130 : 냉각부
140 : 서브히터
150 : 이송유닛
160 : 센서부
170 : 제어부
Claims (4)
- 기판상에 증착되는 원료물질이 고체 또는 액체 상태로 수용되는 원료 용기와, 상기 원료 용기에 수용된 원료물질을 기화시키기 위하여 상기 원료 용기에 열을 공급하는 히터와, 기화된 원료물질이 분사되는 인젝터와 상기 원료 용기를 연결하는 연결관에 설치되며 기화되는 원료물질의 일부를 외부로 분사하는 노즐과, 상기 노즐과 마주보게 설치되고 상기 원료 용기로부터 이격되게 설치되며 상기 원료 용기로부터 기화되는 원료물질의 기화량을 감지하는 센서부와, 상기 원료 용기를 상하 방향으로 왕복이송시키는 이송유닛과, 상기 센서부에 의해 감지된 원료물질의 기화량에 따라 상기 원료 용기가 상이한 속도로 이송되도록 상기 이송유닛을 제어하는 제어부를 포함하며,
상기 제어부는,
상기 센서부에 의해 감지된 원료물질의 기화량을 입력받고, 입력된 원료물질의 기화량을 상기 기판에 증착되는 원료물질의 증착률로 환산하며,
환산된 원료물질의 증착률이 상기 기판에 증착되어야 하는 원료물질의 목표 증착률과 실질적으로 동일한 경우, 제1이송속도로 상기 원료 용기를 이송시키고,
환산된 원료물질의 증착률이 상기 원료물질의 목표 증착률보다 높은 경우, 상기 제1이송속도보다 느린 제2이송속도로 상기 원료 용기를 이송시키고,
환산된 원료물질의 증착률이 상기 원료물질의 목표 증착률보다 낮은 경우, 상기 제1이송속도보다 빠른 제3이송속도로 상기 원료 용기를 이송시키는 것을 특징으로 하는 원료물질 공급 제어장치. - 삭제
- 삭제
- 삭제
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KR1020110044331A KR101320434B1 (ko) | 2011-05-12 | 2011-05-12 | 원료물질 공급 제어장치 |
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KR101320434B1 true KR101320434B1 (ko) | 2013-10-23 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005042948A (ja) * | 2003-07-23 | 2005-02-17 | Alps Electric Co Ltd | 微量気化機 |
JP2006111926A (ja) | 2004-10-15 | 2006-04-27 | Hitachi Zosen Corp | 蒸着装置 |
JP2009084679A (ja) | 2007-09-10 | 2009-04-23 | Ulvac Japan Ltd | 蒸気発生装置、蒸着装置 |
KR100926437B1 (ko) * | 2008-11-17 | 2009-11-13 | 에스엔유 프리시젼 주식회사 | 증착 물질 공급 장치 및 이를 구비한 기판 처리 장치 |
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2011
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005042948A (ja) * | 2003-07-23 | 2005-02-17 | Alps Electric Co Ltd | 微量気化機 |
JP2006111926A (ja) | 2004-10-15 | 2006-04-27 | Hitachi Zosen Corp | 蒸着装置 |
JP2009084679A (ja) | 2007-09-10 | 2009-04-23 | Ulvac Japan Ltd | 蒸気発生装置、蒸着装置 |
KR100926437B1 (ko) * | 2008-11-17 | 2009-11-13 | 에스엔유 프리시젼 주식회사 | 증착 물질 공급 장치 및 이를 구비한 기판 처리 장치 |
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