KR101302132B1 - 멀티 밴드용 필터 모듈 및 그의 제작 방법 - Google Patents
멀티 밴드용 필터 모듈 및 그의 제작 방법 Download PDFInfo
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- KR101302132B1 KR101302132B1 KR1020060011154A KR20060011154A KR101302132B1 KR 101302132 B1 KR101302132 B1 KR 101302132B1 KR 1020060011154 A KR1020060011154 A KR 1020060011154A KR 20060011154 A KR20060011154 A KR 20060011154A KR 101302132 B1 KR101302132 B1 KR 101302132B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q16/00—Equipment for precise positioning of tool or work into particular locations not otherwise provided for
- B23Q16/02—Indexing equipment
- B23Q16/021—Indexing equipment in which only the positioning elements are of importance
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/587—Air-gaps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H2250/00—Indexing scheme relating to dual- or multi-band filters
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
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Abstract
Description
Claims (16)
- 적어도 하나의 상단필터가 상면에 적층되는 제1기판;상기 제1기판에 적층된 상기 상단필터를 패키징하는 제1패키징기판;적어도 하나의 하단필터가 상면에 적층되는 제2기판; 및상기 제2기판에 적층된 상기 하단필터를 패키징하는 제2패키징기판;을 포함하며,상기 제1기판의 저면과 상기 제2기판의 저면은 서로 마주보도록 접합되며,상기 적어도 하나의 상단필터는,상기 제1기판의 제1영역에 적층되어 제1주파수 밴드 내의 주파수를 필터링하는 제1필터; 및상기 제1기판의 제2영역에 상기 제1필터와 일정 거리 이격되도록 적층되어 제2주파수 밴드 내의 주파수를 필터링하는 제2필터; 중 적어도 하나를 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 제 1항에 있어서,상기 제1패키징기판은,상기 제1기판의 양측에 마련되는 제1 및 제2실링부를 통해 상기 제1기판과 접합되는 제1웨이퍼; 및상기 제1웨이퍼에 적층되며, 상기 적어도 하나의 상단필터와 전기적으로 연결되는 다수의 패드가 상단 표면에 마련되는 제2웨이퍼;를 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 제 1항에 있어서,상기 제2패키징기판은,상기 제2기판의 양측에 마련되는 제3 및 제4실링부를 통해 상기 제2기판과 접합되는 제3웨이퍼; 및상기 제3웨이퍼에 적층되며, 상기 적어도 하나의 하단필터와 전기적으로 연결되는 다수의 패드가 상단 표면에 마련되는 제4웨이퍼;를 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 삭제
- 제 1항에 있어서,상기 적어도 하나의 하단필터는,상기 제2기판에 적층되어 제3주파수 밴드 내의 주파수를 필터링하는 제3필터; 및상기 제2기판에 상기 3필터와 일정 거리 이격되도록 적층되어 4주파수 밴드 내의 주파수를 필터링하는 제4필터; 중 적어도 하나를 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 제 5항에 있어서,상기 적어도 하나의 상단필터 및 하단필터는 GSM(Global System for Mobile communication) 850 밴드 필터, GSM 900 밴드 필터, GSM 1800 밴드 필터 및 GSM 1900 밴드 필터 중 서로 다른 필터를 적어도 하나 포함하여 멀티 밴드 필터링을 수행하는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 제 5항에 있어서,상기 상단필터 및 하단필터 중 적어도 하나는 적어도 두 개의 다른 밴드 필터를 동일 기판 상에 집적화로 제작되는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 제 1항에 있어서,상기 적어도 하나의 상단필터 및 하단필터는 FBAR(Film Bulk Acoustic Resonator)인 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 제 8항에 있어서,상기 적어도 하나의 상단필터 및 하단필터는,각각 상기 제1 및 제2기판의 일정 영역에 이격되어 형성되는 공동부;상기 제1 및 제2기판 상에 위치하여 상기 공동부를 덮는 하부전극;상기 하부전극 상에 위치하는 압전층; 및상기 압전층 상에 위치하는 상부전극;을 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- 제 9항에 있어서,상기 제1기판 및 상기 제2기판은 각각 적어도 하나의 공동부를 가지며,상기 제1기판에 마련된 적어도 하나의 공동부 및 상기 제2기판에 마련된 적어도 하나의 공동부는 서로 대향하도록 접합되는 것을 특징으로 하는 멀티 밴드용 필터 모듈.
- (a) 적어도 하나의 상단필터를 제1기판의 상면에 적층하는 단계;(b) 상기 제1기판에 적층된 상기 상단필터를 패키징하는 단계;(c) 적어도 하나의 하단필터를 제2기판의 상면에 적층하는 단계;(d) 상기 제2기판에 적층된 상기 하단필터를 패키징하는 단계; 및(e) 상기 제1기판의 저면과 상기 제2기판의 저면이 서로 마주보도록 접합하는 단계;를 포함하며,상기 적어도 하나의 상단필터는,상기 제1기판의 제1영역에 적층되어 제1주파수 밴드 내의 주파수를 필터링하는 제1필터 및 상기 제1기판의 제2영역에 상기 제1필터와 일정 거리 이격되도록 적층되어 제2주파수 밴드 내의 주파수를 필터링하는 제2필터 중 적어도 하나를 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈 제작 방법.
- 제 11항에 있어서,상기 (a) 단계는 상기 적어도 하나의 상단필터를 상기 제1기판의 서로 다른 영역에 일정 거리 이격되도록 적층하며,상기 (b) 단계는,(b1) 상기 적어도 하나의 상단필터와 전기적으로 연결되는 다수의 패드가 상단 표면에 마련되는 제2웨이퍼를 제1웨이퍼에 적층하는 단계; 및(b2) 상기 제1기판의 양측에 마련되는 제1 및 제2실링부를 통해 상기 제1기판과 상기 제1웨이퍼를 접합하는 단계;를 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈 제작 방법.
- 제 11항에 있어서,상기 (c) 단계는 상기 적어도 하나의 하단필터를 상기 제2기판의 서로 다른 영역에 일정 거리 이격되도록 적층하며,상기 (d) 단계는,(d1) 상기 적어도 하나의 하단필터와 전기적으로 연결되는 다수의 패드가 상단표면에 마련되는 제4웨이퍼를 제3웨이퍼에 적층하는 단계; 및(d2) 상기 제2기판의 양측에 마련되는 제3 및 제4실링부를 통해 상기 제2기판과 상기 제3웨이퍼를 접합하는 단계;를 포함하는 것을 특징으로 하는 멀티 밴드용 필터 모듈 제작 방법.
- 제 11항에 있어서,상기 제1 필터 및 상기 제2 필터는 FBAR(Film Bulk Acoustic Resonator)인 것을 특징으로 하는 멀티 밴드용 필터 모듈 제작 방법.
- 제 11항에 있어서,상기 적어도 하나의 상단필터 및 하단필터는 GSM(Global System for Mobile communication) 850 밴드 필터, GSM 900 밴드 필터, GSM 1800 밴드 필터 및 GSM 1900 밴드 필터 중 서로 다른 필터를 적어도 하나 포함하여 멀티 밴드 필터링을 수행하는 것을 특징으로 하는 멀티 밴드용 필터 모듈 제작 방법.
- 제 15항에 있어서,상기 상단필터 및 하단필터 중 적어도 하나는 적어도 두 개의 다른 밴드 필터를 동일 기판 상에 집적화로 제작되는 것을 특징으로 하는 멀티 밴드용 필터 모듈 제작 방법.
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KR1020060011154A KR101302132B1 (ko) | 2006-02-06 | 2006-02-06 | 멀티 밴드용 필터 모듈 및 그의 제작 방법 |
US11/633,464 US7511595B2 (en) | 2006-02-06 | 2006-12-05 | Multi-band filter module and method of fabricating the same |
CN2006101566801A CN101018044B (zh) | 2006-02-06 | 2006-12-30 | 多带滤波器模块以及制造该模块的方法 |
JP2007025579A JP4707684B2 (ja) | 2006-02-06 | 2007-02-05 | マルチバンド用フィルタモジュール及び製造方法 |
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KR1020060011154A KR101302132B1 (ko) | 2006-02-06 | 2006-02-06 | 멀티 밴드용 필터 모듈 및 그의 제작 방법 |
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KR101302132B1 true KR101302132B1 (ko) | 2013-09-03 |
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