KR101294569B1 - 터치 패널 및 이의 제조 방법 - Google Patents
터치 패널 및 이의 제조 방법 Download PDFInfo
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- KR101294569B1 KR101294569B1 KR1020110064111A KR20110064111A KR101294569B1 KR 101294569 B1 KR101294569 B1 KR 101294569B1 KR 1020110064111 A KR1020110064111 A KR 1020110064111A KR 20110064111 A KR20110064111 A KR 20110064111A KR 101294569 B1 KR101294569 B1 KR 101294569B1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 34
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- 239000007772 electrode material Substances 0.000 claims abstract description 14
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- 239000011810 insulating material Substances 0.000 claims description 10
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- 238000000576 coating method Methods 0.000 claims description 7
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- 238000005530 etching Methods 0.000 claims description 2
- 229910010272 inorganic material Inorganic materials 0.000 claims description 2
- 239000011147 inorganic material Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
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- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
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- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
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- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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Abstract
실시예에 따른 터치 패널의 제조 방법은, 기판 및 투명 전극용 기재를 준비하는 단계; 상기 투명 전극용 기재에 투명 전극을 형성하는 단계; 상기 투명 전극용 기재에 배선 전극 물질을 증착하는 단계; 및 상기 투명 전극용 기재에 반사방지층을 형성하는 단계를 포함한다.
Description
도 2는 도 1의 A 부분을 확대하여 도시한 평면도이다.
도 3은 도 1의 B-B'를 따라서 절단한 단면을 도시한 단면도이다.
도 4는 제2 실시예에 따른 터치 패널의 단면도이다.
도 5는 제3 실시예에 따른 터치 패널의 단면도이다.
도 6은 제4 실시예에 따른 터치 패널의 단면도이다.
도 7은 실시예에 따른 터치 패널의 제조 방법의 공정 흐름도이다.
Claims (18)
- 적어도 어느 한 면은 곡면을 포함하는 기판;
상기 기판의 어느 한 면에 위치하고, 투명 전극이 위치하는 투명 전극용 기재;
상기 투명 전극용 기재의 어느 한면에 위치하고, 일 방향으로 연장되는 제1 투명 전극; 및
상기 투명 전극용 기재의 어느 한면에 위치하고, 상기 제1 투명 전극과 교차하는 방향으로 연장되는 제2 투명 전극을 포함하고,
상기 투명 전극용 기재는 상기 기판과 이격되어 배치되고,
상기 제1 투명 전극과 상기 제2 투명 전극은 서로 다른 층에 배치되는 터치 패널. - 제1항에 있어서,
상기 제1 투명 전극 및 상기 제2 투명 전극이 상기 투명 전극용 기재의 동일한 면에 위치하고, 상기 제1 투명 전극 및 상기 제2 투명 전극 사이에 절연층이 위치하는 터치 패널. - 제2항에 있어서,
상기 투명 전극용 기재는 하드코팅층을 포함하고,
상기 하드코팅층 및 상기 절연층이 인덱스 매칭되는 터치 패널. - 제1항에 있어서,
상기 제1 투명 전극 및 상기 제2 투명 전극은 상기 투명 전극용 기재의 서로 반대되는 면에 위치하는 터치 패널. - 제1항에 있어서,
상기 투명 전극용 기재는 폴리 에틸렌 테레프탈레이트(poly(ethylene terephthalate), PET) 필름을 포함하는 터치 패널. - 제1항에 있어서,
상기 투명 전극용 기재의 어느 한 면에 위치하는 반사방지층을 더 포함하는 터치 패널. - 제1항에 있어서,
상기 기판 및 상기 투명 전극용 기재 사이에 광학용 투명 접착제(optically clear adhesive, OCA)가 포함되는 터치 패널. - 제1항에 있어서,
상기 기판의 적어도 어느 한 면은 곡면을 포함하는 터치 패널. - 적어도 어느 한 면은 곡면을 포함하는 기판 및 상기 기판과 이격되어 배치되는 투명 전극용 기재를 준비하는 단계;
상기 투명 전극용 기재에 투명 전극을 형성하는 단계;
상기 투명 전극용 기재에 배선 전극 물질을 증착하는 단계; 및
상기 투명 전극용 기재에 반사방지층을 형성하는 단계를 포함하고,
상기 투명 전극을 형성하는 단계는 일 방향으로 연장되는 제1 투명 전극 및 상기 제1 투명 전극과 교차하는 방향으로 연장되는 제2 투명 전극을 형성하는 단계를 포함하고,
상기 제1 투명 전극과 상기 제2 투명 전극은 서로 다른 층에 배치되는 터치 패널의 제조 방법. - 제9항에 있어서,
상기 투명 전극을 형성하는 단계는 일 방향으로 연장되는 제1 투명 전극 및 상기 제1 투명 전극과 교차하는 방향으로 연장되는 제2 투명 전극을 형성하는 단계를 포함하는 터치 패널의 제조 방법. - 제10항에 있어서,
상기 투명 전극을 형성하는 단계는 상기 제1 투명 전극 및 상기 제2 투명 전극이 상기 투명 전극용 기재의 동일한 면에 형성되고, 상기 제1 투명 전극 및 상기 제2 투명 전극 사이에 절연층을 형성하는 단계를 더 포함하는 터치 패널의 제조 방법. - 제11항에 있어서,
상기 절연층을 형성하는 단계는 절연물질을 코팅하는 단계를 포함하고, 상기 절연물질이 유기물을 포함하는 터치 패널의 제조 방법. - 제11항에 있어서,
상기 절연층을 형성하는 단계는 절연물질을 증착하는 단계를 포함하고, 상기 절연물질이 무기물을 포함하는 터치 패널의 제조 방법. - 제11항에 있어서,
상기 투명 전극용 기재는 하드코팅층을 포함하고,
상기 하드코팅층 및 상기 절연층이 인덱스 매칭되는 터치 패널의 제조 방법. - 제9항에 있어서,
상기 배선 전극 물질을 증착하는 단계 이후에, 상기 배선 전극 물질을 에칭하여 배선 전극을 형성하는 단계를 더 포함하는 터치 패널의 제조 방법. - 제15항에 있어서,
상기 배선 전극의 선폭이 10 um 내지 100 um 인 터치 패널의 제조 방법. - 제9항에 있어서,
상기 반사방지층을 형성하는 단계는 반사방지물질을 코팅하는 단계를 포함하는 터치 패널의 제조 방법. - 제9항에 있어서,
상기 반사방지층을 형성하는 단계는 반사방지 필름을 형성하는 단계를 포함하는 터치 패널의 제조 방법.
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CN201711157929.5A CN107885401B (zh) | 2011-06-29 | 2012-06-29 | 触摸面板和用于制造该触摸面板的方法 |
JP2014518811A JP6185462B2 (ja) | 2011-06-29 | 2012-06-29 | タッチパネル及びその製造方法 |
TW101123571A TWI612458B (zh) | 2011-06-29 | 2012-06-29 | 觸控面板及其製造方法 |
PCT/KR2012/005200 WO2013002609A2 (en) | 2011-06-29 | 2012-06-29 | Touch panel and method for manufacturing the same |
US14/130,259 US9433089B2 (en) | 2011-06-29 | 2012-06-29 | Touch panel and method for manufacturing the same |
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CN201280042477.5A CN103765359B (zh) | 2011-06-29 | 2012-06-29 | 触摸面板和用于制造该触摸面板的方法 |
US15/222,541 US9933890B2 (en) | 2011-06-29 | 2016-07-28 | Touch panel and method for manufacturing the same |
US15/792,383 US10088948B2 (en) | 2011-06-29 | 2017-10-24 | Touch panel and method for manufacturing the same |
US16/059,754 US10310666B2 (en) | 2011-06-29 | 2018-08-09 | Touch panel and method for manufacturing the same |
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US10310666B2 (en) | 2019-06-04 |
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US20140333850A1 (en) | 2014-11-13 |
US9433089B2 (en) | 2016-08-30 |
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US10088948B2 (en) | 2018-10-02 |
CN103765359A (zh) | 2014-04-30 |
US9933890B2 (en) | 2018-04-03 |
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US20160334927A1 (en) | 2016-11-17 |
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US20180348952A1 (en) | 2018-12-06 |
US10592043B2 (en) | 2020-03-17 |
US20180046315A1 (en) | 2018-02-15 |
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