KR101289096B1 - High-temperature pressure sensor and fabrication method thereof - Google Patents

Abstract

The present invention provides a high temperature pressure sensor device and its manufacturing method.
The method of manufacturing the high temperature pressure sensor device includes a support member connection step of inserting and fixing one side of a support member into a central hole formed at a lower side of a sensor support, and inserting a sensor part in which a sensor hole is formed in the support member, and then attaching the sensor support to the housing. A sensor unit and a diaphragm mounting step of inserting a diaphragm having a through hole formed therein through the support member, and introducing a prestress into the diaphragm through the support member; The other side of the sealing, and the vacuum step of making the interior of the housing in a vacuum state, and by sealing the through hole of the diaphragm may be composed of a sealing step of sealing the inside of the housing.
As described above, according to the high temperature pressure sensor device and the manufacturing method thereof according to an embodiment of the present invention, when the inside of the high temperature pressure sensor device is maintained in a vacuum state, the high temperature pressure sensor device detects pressure in a high temperature environment. The remaining moisture and the like prevents the problem of deteriorating the function of the pressure sensor device due to evaporation, thereby providing an effect that can be accurately measured even in a high temperature and high pressure environment.

Description

High temperature pressure sensor device and its manufacturing method {HIGH-TEMPERATURE PRESSURE SENSOR AND FABRICATION METHOD THEREOF}

The present invention relates to a high temperature pressure sensor and a method of manufacturing the same, and more particularly, to a high temperature pressure sensor device and a method of manufacturing the same applicable in an environment of high temperature and high pressure.

Pressure sensors are devices and devices that detect the pressure of liquids or gases, convert them into electrical signals that are easy to use for measurement or control, and transmit them.

On the other hand, in the LNG generator combustion chamber, vibrations of high temperature and high pressure due to combustion, that is, combustion vibrations, occur, causing damage to the combustion chamber of the burner itself, and reducing the output of the turbine.

Therefore, there is a need for a pressure sensor that can monitor the combustion vibration in real time by measuring the screech tone which greatly affects the operation stability of the combustor and the combustor tuning. And, the pressure sensor used at this time should be able to withstand a temperature of about 500 ℃ or more and a pressure of about 20bar.

Conventionally, there is a method of installing a pressure sensor on the outside using a damping coil to measure the vibration of high temperature and high pressure and measuring the dynamic pressure of the generator, but in this case, it is impossible to measure the high frequency screech tone. There is. Therefore, a pressure sensor that can be installed directly on the generator has been developed.

However, such a pressure sensor has to withstand a considerably high temperature present in a combustion chamber of a generator, and the sensor functions in such a way that an incorrect measurement or an error occurs due to evaporation of moisture remaining in the pressure sensor in a high temperature environment. Degradation problems may occur.

Therefore, there is a need for a high temperature pressure sensor that is bonded to measure pressure in such a high temperature environment and provides accurate measurement results.

The present invention has been proposed to solve the conventional problems as described above, the object of the present invention is to maintain the interior of the high temperature pressure sensor device in a vacuum state, when the high temperature pressure sensor device detects the pressure in a high temperature environment, The present invention provides a high temperature pressure sensor device and a method of manufacturing the same, which can prevent a problem of deteriorating the function of the pressure sensor device due to evaporation of residual water and minimize defects of the pressure sensor.

In addition, an object of the present invention is to provide a high temperature pressure sensor device and a method of manufacturing the same that can easily introduce prestress.

As a technical aspect for achieving the above object, the present invention, the support member connecting step of inserting and fixing one side of the support member in the central hole formed on the lower side of the sensor support; A sensor unit and a diaphragm mounting step of fitting the sensor support to the housing and mounting a diaphragm having a through hole through the support member to one side of the housing; and prestressing the diaphragm through the support member. A pre-stress introduction step of introducing; and a vacuum step of sealing the other side of the housing and making the interior of the housing into a vacuum state; and a sealing step of sealing the inside of the housing by closing the through hole of the diaphragm. Provided is a method of manufacturing a sensor device.

Preferably, the supporting member connecting step may be fixedly coupled to the sensor support by combining the first screw thread formed in the central hole and the second screw thread formed on the upper outer peripheral surface of the support member.

On the other hand, preferably, the step of introducing the prestress, by connecting the nut to the third screw thread formed on the lower outer peripheral surface of the support member and applying the prestress by rotating the nut using a torque wrench, the housing and the sensor support can be welded. have.

Preferably, the torque applied to the torque wrench may be 2 to 4 kgf · cm.

Preferably, the vacuum step, the outer frame coupling step of coupling the outer frame to the housing so as to seal the other side of the housing; and the chamber into which the housing coupled to the outer frame into a vacuum chamber to form a vacuum state Input and vacuum forming step; may be provided.

At this time, preferably, the outer frame coupling step, the upper and lower coupling body coupling step of hermetically coupling one side of the upper and lower coupling body to the cable holder through which the output cable is penetrated; and the outer coupling body; And an outer coupling body coupling step of penetrating and coupling the outer side of the upper and lower coupling bodies and the cable holder.

Preferably, the chamber input and vacuum forming step may be performed after removing the support member from the sensor support.

Preferably, the sealing step may seal the housing so that the inside of the housing is maintained in a vacuum state by welding the plate to the through hole of the diaphragm.

In this case, preferably, the plate may be bonded to the diaphragm by electron beam welding.

On the other hand, the present invention as another aspect, the housing; and a diaphragm mounted on one side of the housing, the through-hole is formed and subjected to pressure; and a central hole fitted to the other side of the housing, the central hole formed on the side of the housing And a sensor support having a cable hole through which the input cable passes; and a sensor part mounted between the diaphragm and the sensor support and having a sensor hole formed in communication with the through hole and the central hole. And a plate for sealing a through hole of the diaphragm, wherein the housing is sealed while maintaining a vacuum state, and the diaphragm provides a high temperature pressure sensor device into which prestress is introduced.

Preferably, one side is coupled to the housing, the other side is coupled to the cable holder through which the output cable penetrates the outer frame for sealing the inside of the housing; may further include a.

Also preferably, the outer frame, the upper and lower coupling body is one side is hermetically coupled to the housing, the other side is hermetically coupled to the cable holder; and the outer coupling body is coupled through the outer side of the vertical coupling body and the cable holder It can include;

As described above, according to the high temperature pressure sensor device and the manufacturing method thereof according to an embodiment of the present invention, when the inside of the high temperature pressure sensor device is maintained in a vacuum state, the high temperature pressure sensor device detects pressure in a high temperature environment. The remaining moisture and the like prevents the problem of deteriorating the function of the pressure sensor device due to evaporation, thereby providing an effect that can be accurately measured even in a high temperature and high pressure environment.

In addition, according to the embodiment of the present invention, since the compressive force is applied to the diaphragm by using the hole and the support member, it is possible to obtain an effect of easily introducing prestress into the high temperature pressure sensor device.

1a to 1e is a schematic diagram showing a manufacturing method of a high temperature pressure sensor device according to an embodiment of the present invention.
2 is a view showing a step of electron beam welding the plate applied to the manufacturing method of the high temperature pressure sensor apparatus according to an embodiment of the present invention.
3 is a view showing a high temperature pressure sensor device according to an embodiment of the present invention.
4 is an experimental example using a high temperature pressure sensor apparatus according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

First, the embodiments described below are suitable embodiments for understanding the technical features of the high temperature pressure sensor device and the manufacturing method of the present invention. However, the technical features of the present invention are not limited by the embodiments to which the present invention is applied or explained in the following embodiments, and various modifications are possible within the technical scope of the present invention.

The high temperature pressure sensor device 100 according to an embodiment of the present invention and a manufacturing method thereof relate to a piezoelectric pressure sensor device capable of measuring pressure by vibration or the like in a high temperature and high pressure environment. The piezoelectric pressure sensor uses a piezoelectric effect that generates a voltage proportional to the pressure when a pressure is applied to the piezoelectric body, and is mainly used to measure dynamic pressure.

1a to 1e and 2 are related to the manufacturing method of the high temperature pressure sensor device 100 according to an embodiment of the present invention, Figure 3 is a high temperature pressure sensor device 100 according to an embodiment of the present invention. .

Referring to Figure 3, the high temperature pressure sensor device 100 according to an embodiment of the present invention, the housing 110, is mounted on one side of the housing 110, the through hole 121 is formed and is subjected to pressure A diaphragm 120, a central hole 131 formed on the other side of the housing 110, and a cable hole 133 through which the input cable C1 penetrates. And a sensor support 151 mounted between the sensor support 130 and the diaphragm 120 and the sensor support 130 and formed to communicate with the through hole 121 and the central hole 131. It may be configured to include a plate 170 for sealing the sensor unit 150 and the through-hole 121 of the diaphragm 120.

At this time, the housing 110 is formed so that one side and the other side is open so that the sensor support 130 or the diaphragm 120 may be fitted as described below.

The diaphragm 120 is a member to which pressure for measuring vibration of the sensor is applied. The diaphragm 120 may be mounted on one side of the housing 110 and a through hole 121 may be formed. The through hole 121 is formed in communication with the central hole 131 of the sensor support 130 and the sensor hole 151 of the sensor unit 150 to support the support member 200 in the manufacturing method of the high temperature pressure sensor device 100. ) Can be prestressed to the diaphragm 120 or the inside of the sensor device can be maintained in a vacuum state. A detailed description thereof will be described later.

The sensor support member may be provided on the other side of the housing 110, and may include a central hole 131 and a cable hole 133 through which the input cable C1 passes. .

In this case, the central hole 131 may be formed at one side of the sensor support 130, and the opening of the central hole 131 may be formed to be fitted to the housing 110. In addition, an input cable C1 connected to the sensor unit 150 to transmit a signal transmitted from the sensor unit 150 may be inserted into the cable hole 133. In this case, the center hole 131 and the cable hole 133 may be connected to the communication hole 135 to facilitate the formation of the inside of the sensor device in a vacuum state, as will be described later.

The input cable C1 is connected to an output cable C2 to be described later, thereby generating a voltage according to the pressure applied to the diaphragm 120. In this case, the input cable C1 may be, for example, a MI cable (mineral insulated cable). MI cable is insulated with mineral material on the outside of heating wire and coated with metal tube on the outside. It can be used at high temperature and high pressure.For example, it can be used continuously at 250 ℃, so it is used for high temperature and high pressure environment Suitable for sensor device

On the other hand, the sensor unit 150 is mounted between the diaphragm 120 and the sensor support 130, the sensor hole 151 formed in communication with the through-hole 121 and the central hole 131 It can be provided.

That is, the sensor unit 150 is supported by the sensor support 130 and is connected to an end of the input cable C1 mounted on the sensor support 130 to receive a signal according to the pressure received from the diaphragm 120. It can be delivered to the input cable (C1).

In addition, the sensor hole 151 may communicate with the through hole 121 of the diaphragm 120 and may communicate with the central hole 131 of the sensor support 130.

The plate 170 may be coupled to the diaphragm 120 to seal the through hole 121 of the diaphragm 120. Accordingly, the central hole 131, the sensor hole 151, and the through hole 121 may communicate with each other.

Meanwhile, the inside of the housing 110 is sealed while maintaining a vacuum state, and prestress may be introduced into the diaphragm 120.

That is, when the high temperature pressure sensor device 100 is manufactured, the central hole 131, the sensor hole 151, the through hole 121, and the communication hole 135 connected to the central hole 131 may be used. The inside of the housing 110 may be formed in a vacuum state, and the housing 110 may be sealed to maintain such a vacuum state.

Accordingly, the high temperature pressure sensor device 100 according to an embodiment of the present invention, since the inside is maintained in a vacuum state to minimize the influence of impurities due to moisture or the like when operating in a high temperature environment, the pressure sensor device 100 The high temperature operating characteristics of can be stabilized.

On the other hand, the high temperature pressure sensor device 100 according to an embodiment of the present invention, as shown in Figure 3, one side is coupled to the housing 110, the other side is the output cable (C2) is penetrated It may further include an outer frame 190 for sealing the inside of the housing 110 by being coupled to the cable holder (H).

That is, the housing 110 may be formed such that the plate 170 is coupled to one side and the outer frame 190 is coupled to the other side to seal the inside thereof, thereby maintaining an internal vacuum state.

In this case, the outer frame 190 may include an upper and lower coupling body 191 and an external coupling body 193.

The upper and lower coupling bodies 191 may be hermetically coupled to one side of the housing 110 and the other side hermetically coupled to the cable holder H.

That is, the housing 110 is provided with a cable holder (H) that is mounted on the output cable (C2) connected to the input cable (C1) mounted on the sensor support 130, the upper and lower coupling body 191 ) May seal the other side of the housing 110 while connecting the housing 110 and the cable holder (H). At this time, the upper and lower coupling body 191 is coupled to the housing 110, the other side is coupled to the cable holder (H), it may be hermetically coupled by welding.

On the other hand, the outer coupling body 193 may be coupled to penetrate through the outer side of the upper and lower coupling body 191 and the cable holder (H).

Accordingly, the cable holder H and the upper and lower coupling bodies 191 may be firmly coupled, and at the same time, the high temperature pressure sensor device 100 may be sealed to facilitate the maintenance of a vacuum inside the sensor device.

On the other hand, with reference to Figures 1 to 4 will be described a manufacturing method of the high temperature pressure sensor device 100 which is another aspect of the present invention. Hereinafter, detailed description of the same configuration as the above-described configuration will be omitted.

Method for manufacturing a high temperature pressure sensor device 100 according to an embodiment of the present invention, the support member connection step (S110), the sensor unit 150 and the diaphragm 120 mounting step (S120), prestress introduction step ( S130, the vacuum step (S140), and may include a sealing step (S150).

The supporting member connecting step S110 may be performed by inserting and fixing one side of the supporting member 200 into the central hole 131 formed at the lower side of the sensor support 130 as shown in FIG. 1A.

The sensor support 130 may have a central hole 131 having an opening formed at one side thereof, and may be inserted and fixed by inserting one side of the support member 200 into the central hole 131. At this time, the support member 200 may be configured in the form of a rod as shown in one embodiment, a portion of the upper side may be detachably inserted into the central hole (131). However, the shape of the support member is not limited to the illustrated rod shape, and various modifications are possible.

In addition, a cable hole 133 through which the input cable C1 may be inserted may be formed in the sensor support 130, and the cable hole 133 and the center hole 131 may communicate with the communication hole 135. Can be connected by The communication hole 135 may be formed to be connected to the cable hole 133 so as to extract air from the inside of the housing 110 in a vacuum step to be described later. However, the shape of the communication hole 135 is not limited to the illustrated case, and may be variously modified as long as it is easy to form the vacuum state of the housing 110.

On the other hand, preferably, the support member connecting step (S110), the first screw thread (not shown) formed in the central hole 131 and the second screw thread (not shown) formed on the upper outer peripheral surface of the support member 200 In combination, the support member 200 may be fixed to the sensor support 130.

That is, the upper side of the support member 200 may be fixedly coupled to the central hole 131 of the sensor support 130 by screwing. Accordingly, the support member 200 can be easily connected to the sensor support 130, and after the prestress is introduced using the support member 200, the support member 200 can be easily loosened by loosening a screw. It is configured to be separated from the sensor support 130.

Meanwhile, in the mounting of the sensor unit 150 and the diaphragm 120 (S120), as shown in FIG. 1B, the sensor unit 150 in which the sensor hole 151 is formed in the support member 200 is provided. Inserting the sensor support 130 into the housing 110 and mounting the diaphragm 120 having the through hole 121 through one side of the housing 110 while penetrating through the support member 200. Can be performed.

That is, the sensor unit 150 is inserted into the support member 200 so that the sensor unit 150 is connected to the lower portion of the sensor support 130. Can be inserted into the other opening. Accordingly, the sensor support 130 may be connected to the housing 110.

Next, the diaphragm 120 may be mounted in the other opening of the housing 110. In this case, the diaphragm 120 includes a through hole 121, and the through hole 121 is fitted to the support member 200 and then mounted to the housing 110.

Meanwhile, in the prestress introduction step S130, the prestress may be introduced into the diaphragm 120 through the support member 200.

Specifically, the prestress introduction step (S130), as shown in Figure c, the nut 250 is connected to the third screw thread (not shown) formed on the lower outer peripheral surface of the support member 200 and torque wrench Prestressing is applied by rotating the nut 250 using the welding method, and the housing 110 and the sensor support 130 may be welded to each other.

That is, a third screw thread (not shown) is formed on the lower outer circumferential surface of the support member 200. The hole of the nut 250 is inserted into a portion where the third screw thread is formed, and the nut 250 is torque wrench (not shown). By compressing the pressure, the compressive force is applied to the diaphragm 120. Then, the sensor unit 150 is installed so that the position is fixed to the sensor support 130 and the housing 110 receives a compressive force applied to the diaphragm 120. Accordingly, prestress may be introduced into the diaphragm 120.

In this case, the housing 110 and the sensor support 130 are welded to the diaphragm 120 in a prestressed state (w1), and the housing 110 and the diaphragm 120 are welded to the diaphragm 120. It is possible to maintain the state in which the prestress is introduced.

In this way, when the prestress is introduced into the high temperature pressure sensor device 100, when measuring the dynamic pressure inside the apparatus such as a combustion chamber in which the high temperature pressure sensor is mounted, not only the increasing pressure but also the decreasing pressure can be measured.

At this time, the high temperature pressure sensor device 100 according to an embodiment of the present invention, the first screw thread of the central hole 131 connected to the sensor support 130 and the second screw thread and the third screw thread of the support member 200. Since the compressive force is applied to the diaphragm 120 by rotating the nut 250 using a screw thread, prestress can be easily introduced into the sensor device.

In addition, since torque is applied to the nut 250 by using the torque wrench (not shown), there is an advantage in that accurate prestress can be applied as necessary.

Meanwhile, the torque applied to the torque wrench may be 2 to 4 kgf · cm.

4 is a graph showing the output voltage according to the pressure of the diaphragm 120 when a torque is applied to the nut 250 at a torque value of 2 to 4 kgf · cm. As shown, when the torque value is 2 to 4 kgf · cm, the output voltage according to the pressure (especially high pressure) in the high temperature environment can be clearly seen.

Meanwhile, a vacuum step S140 may be performed after the prestress introduction step S130.

The vacuum step S140 may be performed by sealing the other side of the housing 110 and making the inside of the housing 110 in a vacuum state, as shown in the embodiment illustrated in FIG. 1D.

As such, the inside of the housing 110 is made into a vacuum state, and as will be described later, both sides of the housing 110 are sealed to maintain the inside of the housing 110 in a vacuum state, thereby providing the high temperature pressure sensor device ( When 100 detects the pressure in a high temperature environment, it is possible to prevent the problem of deterioration of the function of the pressure sensor device 100 due to evaporation of remaining moisture.

Specifically, the vacuum step (S140), the outer frame coupling step (S145) for coupling the outer frame 190 to the housing 110 to seal the other side of the housing 110, and the outer frame 190 The combined chamber 110 may be introduced into a vacuum chamber 310 to form a chamber input and vacuum forming step (S147) to form a vacuum state.

That is, as shown in the embodiment shown in Figure 1d external frame coupling step (S145), the outer frame 190 is coupled to the housing 110 and the cable holder (H) by welding or the like of the housing 110 The other side is sealed.

In the chamber input and vacuum forming step (S147), the sensor unit 150 may be extracted by inserting the housing 110 coupled to the outer frame 190 into the vacuum chamber 310 to extract air from the inside of the housing 110. ) May be formed in a vacuum state inside the housing 110.

At this time, the chamber input and vacuum forming step (S147) may be performed after removing the support member 200 from the sensor support 130.

That is, when the support member 200 is removed, the inside of the housing 110 is vacuumed by extracting air through the hole formed by the central hole 131, the sensor hole 151, and the through hole 121. You can make it state. In this case, the central hole 131 is formed with a communication hole 135 to communicate with the cable hole 133 and the cable hole 133 is connected to the inside of the housing 110, the entire housing 110 It can be formed in a vacuum state.

On the other hand, the outer frame coupling step (S145), one side of the upper and lower coupling body 191 is hermetically coupled to the sensor support 130, the upper and lower coupling body coupling step of sealing the other side to the cable holder (H) ( S141 and the outer coupling body 193 may be configured to include an outer coupling body coupling step (S142) for penetrating the outer coupling body 191 and the outside of the cable holder (H).

At this time, the upper and lower coupling body 191 and the cable holder (H) and the sensor support 130 are welded (w3, w4) and the outer coupling body 193 and the upper and lower coupling body 191 and the cable By welding the holder (H6) (w6, w7), it can be sealed to prevent the inflow of air on one side of the housing (110). However, the coupling method of the outer frame 190 is not limited to the welding coupling, various modifications are possible if the sealing of the housing 110 is possible.

On the other hand, after the vacuum step may be a sealing step.

The sealing step S150 may be performed by sealing the inside of the housing 110 by closing the through hole 121 of the diaphragm 120 as shown in FIG. 1E.

Specifically, the sealing step (S150), by welding the plate 170 to the through-hole 121 of the diaphragm 120 may be performed by sealing the housing 110 so that the inside of the housing 110 is maintained in a vacuum state. have.

That is, after the other side of the housing 110 is sealed by the coupling of the outer frame 190, the inside of the housing 110 through the central hole 131, the sensor hole 151 and the through hole 121. After making the vacuum state, by sealing one side of the housing 110 by bonding the plate 170, the vacuum state inside the housing 110 can be maintained.

Meanwhile, the diaphragm 120 may be bonded to the plate 170 by electron beam welding, as shown in FIGS. 1E and 2.

Electron Beam Welding (EBW) is used in special fields such as aerospace, nuclear, and semiconductor equipment industries because of its inherent superior welding properties, and its field of use has gradually expanded. In the electron beam welding, the electron gun generates electrons, accelerates the generated electrons and focuses them on the surface of the welded object, and uses the high density of energy to weld the welded parts. The electron beam welder may be installed inside the vacuum chamber.

Therefore, as shown in FIG. 2, after the inside of the housing 110 is formed in a vacuum state in the vacuum chamber 310, the plate 170 and the diaphragm 120 are welded using an electron gun. The plate 170 may be bonded to the diaphragm 120. In this case, the housing 110 to which the outer frame is coupled is fixedly installed on a fixing table, and the plate 170 is positioned adjacent to the diaphragm 120 by the robot arm 330 installed in the vacuum chamber 310. And then welded.

Accordingly, the through-hole 121 of the diaphragm 120 is sealed, so that the inside of the housing may be sealed.

As described above, according to the high temperature pressure sensor device and the manufacturing method thereof according to an embodiment of the present invention, when the inside of the high temperature pressure sensor device is maintained in a vacuum state, the high temperature pressure sensor device detects pressure in a high temperature environment. Water remaining in the inside prevents the problem of deteriorating the function of the pressure sensor device due to evaporation, thereby providing an effect of minimizing the failure of the pressure sensor.

In addition, since the compressive force is applied to the diaphragm by using the hole and the support member, it is possible to obtain an effect of easily introducing prestress into the high temperature pressure sensor device.

While the invention has been shown and described in connection with specific embodiments so far, it will be appreciated that the invention can be variously modified and varied without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

100: high temperature pressure sensor device 110: housing
120: diaphragm 121: through hole
130: sensor support 131: central hole
150: sensor unit 151: sensor hole
170: plate 190: outer frame
191: up and down coupling body 193: outer coupling body
200: support member

Claims (12)

A support member connection step of inserting and fixing one side of the support member into the central hole formed at the lower side of the sensor support;
A sensor unit and a diaphragm mounting step of inserting a sensor unit having a sensor hole formed in the support member and then inserting the sensor support unit into a housing and mounting a diaphragm having a through hole through one side of the housing while passing through the support member;
A prestress introduction step of introducing a prestress into the diaphragm through the support member;
A vacuum step of sealing the other side of the housing and making the inside of the housing into a vacuum state; And
A sealing step of sealing the inside of the housing by closing the through hole of the diaphragm;
Method of manufacturing a high temperature pressure sensor device comprising a.
The method of claim 1, wherein the supporting member connection step
And a first screw thread formed in the central hole and a second screw thread formed on an upper outer circumferential surface of the support member to fix the support member to the sensor support.
The method of claim 1, wherein the prestressing step
Method of manufacturing a high temperature pressure sensor device characterized in that the pre-stress is applied by connecting the nut to the third screw thread formed on the lower outer peripheral surface of the support member and by rotating the nut using a torque wrench, and welding the housing and the sensor support. .
The method of claim 3,
The torque applied to the torque wrench is a manufacturing method of the high temperature pressure sensor device, characterized in that 2 to 4 kgf · cm.
The method of claim 1, wherein the vacuum step
An outer frame coupling step of coupling an outer frame to the housing to seal the other side of the housing; And
A chamber input and vacuum forming step of forming a vacuum state by injecting the housing, into which the outer frame is coupled, into a vacuum chamber;
Method for producing a high temperature pressure sensor device characterized in that it comprises a.
The method of claim 5, wherein the outer frame combining step
An upper and lower coupling body coupling step of hermetically coupling one side of the upper and lower coupling bodies to the sensor support, and sealing the other side to the cable holder through which the output cable passes; And
An outer coupling body coupling step of coupling an outer coupling body to the outside of the upper and lower coupling bodies and the cable holder;
Method of manufacturing a high temperature pressure sensor device characterized in that it comprises a.
The method of claim 5, wherein the chamber input and vacuum forming step
And removing the support member from the sensor support.
The method according to any one of claims 1 to 7, wherein the sealing step
And a plate is welded to the through-hole of the diaphragm to seal the housing so that the inside of the housing is kept in a vacuum state.
9. The method of claim 8,
And said plate is joined to said diaphragm by electron beam welding.
housing;
A diaphragm mounted on one side of the housing and having a through hole formed therein and under pressure;
A sensor support fitted to the other side of the housing, the sensor support having a central hole formed at the side fitted to the housing and a cable hole through which the input cable passes;
A sensor unit mounted between the diaphragm and the sensor support and having a sensor hole formed in communication with the through hole and the central hole; And
It includes; a plate for sealing the through-hole of the diaphragm, including,
The inside of the housing is sealed while maintaining a vacuum state, the diaphragm is a high temperature pressure sensor device that is prestressed.
The method of claim 10,
One side is coupled to the housing, the other side is coupled to the cable holder through which the output cable penetrates the outer frame for sealing the inside of the housing; high temperature pressure sensor device further comprising.
The method of claim 11, wherein the outer frame
One side of the upper and lower coupling body is hermetically coupled to the housing, the other side is hermetically coupled to the cable holder; And
An outer coupling body penetratingly coupled to the outer side of the upper and lower coupling bodies and the cable holder;
High temperature pressure sensor device comprising a.

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