KR101276237B1 - 저온소결 전도성 금속막 및 이의 제조방법 - Google Patents
저온소결 전도성 금속막 및 이의 제조방법 Download PDFInfo
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- KR101276237B1 KR101276237B1 KR1020100121967A KR20100121967A KR101276237B1 KR 101276237 B1 KR101276237 B1 KR 101276237B1 KR 1020100121967 A KR1020100121967 A KR 1020100121967A KR 20100121967 A KR20100121967 A KR 20100121967A KR 101276237 B1 KR101276237 B1 KR 101276237B1
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- conductive metal
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 192
- 239000002184 metal Substances 0.000 title claims abstract description 192
- 238000005245 sintering Methods 0.000 title abstract description 16
- 238000002360 preparation method Methods 0.000 title description 23
- 238000007639 printing Methods 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229920000642 polymer Polymers 0.000 claims abstract description 22
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- 238000007641 inkjet printing Methods 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 6
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 6
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 6
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 4
- 238000007646 gravure printing Methods 0.000 claims description 4
- 238000007645 offset printing Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000004880 explosion Methods 0.000 claims description 3
- 239000004034 viscosity adjusting agent Substances 0.000 claims description 3
- 239000003570 air Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- -1 copper nitride Chemical class 0.000 claims 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000005416 organic matter Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 abstract description 45
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- 238000001035 drying Methods 0.000 abstract 1
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- 238000000576 coating method Methods 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 238000004455 differential thermal analysis Methods 0.000 description 3
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
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- 229910001510 metal chloride Inorganic materials 0.000 description 2
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- 150000004767 nitrides Chemical class 0.000 description 2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 239000011229 interlayer Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0545—Dispersions or suspensions of nanosized particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
- Y10T428/24909—Free metal or mineral containing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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Abstract
본 발명에 따른 전도성 금속막 또는 패턴은 종래의 은 나노 입자가 아닌 구리 나노 입자를 사용함으로써 제조단가가 낮은 효과가 있다. 또한, 본 발명에 따른 전도성 금속막 또는 패턴은 소결온도가 낮은 효과가 있으며, 이에 따라 종래의 구리 나노 입자를 사용 시 소결온도가 높았던 종래의 문제점을 극복하여 플렉서블한 특징을 가지는 플라스틱 재질의 기판에 본 발명에 따른 전도성 금속막 또는 패턴을 적용할 수 있는 효과가 있다.
Description
도 2는 본 발명에 따른 전도성 금속막 또는 패턴의 제조방법을 개략적으로 나타낸 그림이고;
도 3은 본 발명에서 사용되는 전도성 금속잉크 중 금속염/고분자 혼합물을 시차열분석한 그래프이고;
도 4는 본 발명에서 사용되는 전도성 금속잉크 중 금속염/고분자 혼합물을 가열한 후 X-선 회절 분석을 수행한 그래프이고;
도 5는 본 발명에서 사용되는 전도성 금속잉크 중 금속염/고분자 혼합물을 가열한 후 주사전자현미경을 통하여 관찰한 사진이고;
도 6은 본 발명에 따른 전도성 막을 주사전자현미경을 통하여 관찰한 사진이다.
Claims (16)
- 구리 나노콜로이드;
구리염; 및
폴리비닐피롤리돈, 에틸렌 디아민, 및 디에틸렌아민을 포함하는 군으로부터 선택되고, 상기 구리염과 반응을 일으킬 수 있는 고분자;를 포함하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 금속막.
- 삭제
- 제1항에 있어서, 상기 구리 나노콜로이드는 1 내지 500 nm 크기인 금속입자를 포함하는 것을 특징으로 하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 금속막.
- 제1항에 있어서, 상기 구리 나노 콜로이드의 구리 함유량은 0.1 내지 80 중량%인 것을 특징으로 하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 금속막.
- 제1항에 있어서, 상기 구리염은 구리유기물, 구리 질화물 및 구리염화물을 포함하는 군으로부터 선택되는 것을 특징으로 하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 금속막.
- 삭제
- 제1항에 있어서, 상기 금속잉크는 점도조절제를 더 포함하는 것을 특징으로 하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 금속막.
- 제1항에 있어서, 상기 전도성 금속잉크의 인쇄는 그라비아 인쇄법, 오프셋 인쇄법, 잉크젯 프린팅, 스크린 프린팅, 임프린트(imprint) 및 스핀코팅을 포함하는 군으로부터 선택되는 방법으로 수행되는 것을 특징으로 하는 전도성 금속잉크를 인쇄하여 제조되는 전도성 금속막.
- 구리 나노콜로이드를 제조하는 단계(단계 1);
구리염 및 고분자를 혼합하여 혼합물을 제조하는 단계(단계 2);
상기 단계 1 및 단계 2에서 제조된 구리 나노콜로이드와 구리염/고분자 혼합물을 교반하여 금속잉크를 제조하는 단계(단계 3);
상기 단계 3에서 제조된 금속 잉크를 인쇄하는 단계(단계 4); 및
상기 단계 4의 인쇄물을 열처리하는 단계(단계 5)를 포함하는 것을 특징으로 하는 제1항의 전도성 금속막의 제조방법.
- 제9항에 있어서, 상기 단계 1의 구리 나노콜로이드는 전기선 폭발법을 통하여 제조되는 것을 특징으로 하는 전도성 금속막의 제조방법.
- 제9항에 있어서, 상기 단계 2의 구리염 및 고분자가 혼합되는 농도는 0.01 내지 1 mol 인 것을 특징으로 하는 전도성 금속막의 제조방법.
- 제9항에 있어서, 상기 단계 4의 인쇄는 그라비아 인쇄법, 오프셋 인쇄법, 잉크젯 프린팅, 스크린 프린팅, 임프린트(imprint) 및 스핀코팅을 포함하는 군으로부터 선택되는 방법으로 수행되는 것을 특징으로 하는 전도성 금속막의 제조방법.
- 제9항에 있어서, 상기 단계 4의 인쇄는 아르곤, 수소 및 공기로 이루어진 군으로부터 선택되는 가스 분위기에서 수행되는 것을 특징으로 하는 전도성 금속막의 제조방법.
- 제9항에 있어서, 상기 단계 5의 열처리는 100 내지 500 ℃의 온도에서 수행되는 것을 특징으로 하는 전도성 금속막의 제조방법.
- 제1항에 있어서, 상기 전도성 금속막은 패턴이 형성된 금속막인 것을 특징으로 하는 전도성 금속막.
- 제9항에 있어서, 상기 단계 4의 인쇄를 통해 패턴이 형성되는 것을 특징으로 하는 전도성 금속막의 제조방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020100121967A KR101276237B1 (ko) | 2010-12-02 | 2010-12-02 | 저온소결 전도성 금속막 및 이의 제조방법 |
US13/991,130 US9145503B2 (en) | 2010-12-02 | 2011-10-20 | Low temperature sintering conductive metal film and preparation method thereof |
PCT/KR2011/007841 WO2012074200A2 (ko) | 2010-12-02 | 2011-10-20 | 저온소결 전도성 금속막 및 이의 제조방법 |
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KR20150077609A (ko) * | 2013-12-28 | 2015-07-08 | 전자부품연구원 | 레이저에 의해 선택적 전도체 패턴 형성이 되는 3d 프린팅용 복합재료, 이를 이용한 전도체 패턴을 포함하는 3차원 형상 전자부품의 제조방법 및 그 전자부품 |
KR20150114603A (ko) | 2014-04-01 | 2015-10-13 | 전자부품연구원 | 나노산화구리 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법 |
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KR20150077609A (ko) * | 2013-12-28 | 2015-07-08 | 전자부품연구원 | 레이저에 의해 선택적 전도체 패턴 형성이 되는 3d 프린팅용 복합재료, 이를 이용한 전도체 패턴을 포함하는 3차원 형상 전자부품의 제조방법 및 그 전자부품 |
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US10477680B2 (en) | 2014-04-01 | 2019-11-12 | Korea Electronics Technology Institute | Ink composition for light sintering, wiring board using same and manufacturing method therefor |
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KR20160132226A (ko) | 2015-05-07 | 2016-11-17 | 전자부품연구원 | 광 소결용 잉크 조성물, 그를 이용한 배선기판 및 그의 제조 방법 |
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WO2012074200A2 (ko) | 2012-06-07 |
US20130251966A1 (en) | 2013-09-26 |
KR20120060450A (ko) | 2012-06-12 |
US9145503B2 (en) | 2015-09-29 |
WO2012074200A3 (ko) | 2012-07-26 |
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