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KR101275159B1 - Manufacturing method of fpcb antenna for mobile phone - Google Patents

Manufacturing method of fpcb antenna for mobile phone Download PDF

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KR101275159B1
KR101275159B1 KR1020120150668A KR20120150668A KR101275159B1 KR 101275159 B1 KR101275159 B1 KR 101275159B1 KR 1020120150668 A KR1020120150668 A KR 1020120150668A KR 20120150668 A KR20120150668 A KR 20120150668A KR 101275159 B1 KR101275159 B1 KR 101275159B1
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antenna
pattern
terminal
coverlay
fpcb
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한상학
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일신전자 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Aerials (AREA)

Abstract

본 발명은 스마트폰 등의 안테나로 사용되는 모바일기기용 FPCB 안테나의 제조기술에 관한 것으로서, 일면에 안테나패턴을 갖는 단면 FPCB이고, 상기 안테나패턴 위에 커버레이의 일부를 제거함에 의해 형성된 패턴개방부를 갖는 커버레이가 적층 결합되어지되 커버레이의 패턴개방부에 의해 안테나패턴의 단자부가 노출되는 안테나몸체; 상기 안테나몸체 측에 표면실장기술(SMT), 솔더링, 이방성 전도성 접착필름(ACF) 본딩의 결합방식 중에서 선택된 어느 하나의 방식으로 결합되며, 상기 커버레이의 패턴개방부에 의해 노출 상태에 있는 안테나패턴의 단자부와 전기적으로 연결되는 패턴연결 단자부가 구비되는 단자품; 을 포함하여 구성되며, 단면 FPCB의 사용 및 간단한 제조공정에 의해 기존에 비해 전체적인 제조공정 및 제조시간을 절감할 수 있음은 물론 제품단가를 낮출 수 있고 안테나의 두께를 절감할 수 있으며 생산성을 높일 수 있는 모바일기기용 FPCB 안테나 및 그 제조방법에 관한 것이다.The present invention relates to a manufacturing technology of an FPCB antenna for a mobile device used as an antenna of a smart phone, the cross-sectional FPCB having an antenna pattern on one surface, having a pattern opening formed by removing a part of the coverlay on the antenna pattern An antenna body to which the coverlay is laminated and coupled but the terminal portion of the antenna pattern is exposed by the pattern opening of the coverlay; The antenna pattern is coupled to the antenna body by any one method selected from a bonding method of surface mount technology (SMT), soldering, and anisotropic conductive adhesive film (ACF) bonding, and the antenna pattern is exposed by the pattern opening of the coverlay. A terminal product having a pattern connection terminal electrically connected to the terminal of the terminal; It is configured to include, and by using the single-sided FPCB and simple manufacturing process, not only can reduce the overall manufacturing process and manufacturing time, but also can reduce the cost of the product, reduce the thickness of the antenna, and increase productivity It relates to an FPCB antenna for a mobile device and a method of manufacturing the same.

Description

모바일기기용 에프피시비 안테나의 제조방법{MANUFACTURING METHOD OF FPCB ANTENNA FOR MOBILE PHONE}Manufacturing method of FPC antenna for mobile device {MANUFACTURING METHOD OF FPCB ANTENNA FOR MOBILE PHONE}

본 발명은 스마트폰 등 모바일기기용 에프피시비(FPCB; Flexible Printed Circuit Board) 안테나의 제조기술에 관한 것으로서, 더욱 상세하게는 단면 FPCB의 사용이 가능하며 기존에 실시되던 비어홀 가공 및 2번의 도금 공정을 수행하지 않아도 되는 등 제조공정 및 제조시간을 절감할 수 있고 제품단가를 낮춰 제조할 수 있는 모바일기기용 FPCB 안테나의 제조방법에 관한 것이다.
The present invention relates to a manufacturing technology of a flexible printed circuit board (FPCB) antenna for a mobile device such as a smart phone, and more particularly, it is possible to use a single-sided FPCB and to perform the via hole processing and the two plating processes that have been previously performed. The present invention relates to a method for manufacturing an FPCB antenna for a mobile device, which can reduce the manufacturing process and manufacturing time, such as not to be performed, and can be manufactured by lowering a product cost.

일반적으로 안테나는 통신 및 데이터 교환을 위해 일정 주파수대역의 전파를 공간으로 보내거나 받기 위한 장치로서, 스마트폰과 같은 이동통신단말기들은 물론 노트북이나 컴퓨터 등과 같은 다양한 정보 기기들과도 각종 데이터 등을 주고받을 수 있도록 지원하며, 다양한 분야에서 광범위하게 활용될 수 있다.In general, an antenna is a device for transmitting or receiving radio waves of a certain frequency band into a space for communication and data exchange, and transmits various data to various information devices such as laptops and computers as well as mobile communication terminals such as smartphones. It can be used for a wide range of applications.

이러한 안테나는 스마트폰과 같은 이동통신단말기에 적용시 단말기의 슬림화를 위해 FPCB(Flexible Printed Circuit Board, 연성인쇄회로기판) 타입이 많이 사용되고 있다.Such antennas are frequently used in a flexible printed circuit board (FPCB) type for slimming the terminal when applied to a mobile communication terminal such as a smartphone.

종래 스마트폰 등에 사용되고 있는 FPCB 타입 모바일기기용 안테나 및 그 제조기술에 대해 개략적으로 살펴보면, 도 1에서 보여주는 바와 같이, 안테나몸체(10)와, 상기 안테나몸체(10)의 하측단부에 결합되고 모바일기기의 메인회로기판과 전기적으로 연결하기 위한 단자탭(20)을 포함하여 구성된다.An FPCB type mobile device antenna and a manufacturing technology thereof, which are conventionally used in a smart phone, will be described in brief. As shown in FIG. 1, an antenna body 10 and a lower end of the antenna body 10 are coupled to a mobile device. It comprises a terminal tab 20 for electrically connecting with the main circuit board of the.

상기 안테나몸체(10)는 단자탭(20)과의 결합성 및 이에 따른 도전성을 위해 양면에 패턴 형성이 가능한 양면 FPCB를 기판으로 주로 사용하고 있으며, 잉크 인쇄 또는 에칭을 포함하는 포토리소그래피(photolithography) 공정에 따라 단면 또는 양면으로 안테나패턴(11)이 형성될 수 있다.The antenna body 10 mainly uses a double-sided FPCB capable of forming patterns on both sides as a substrate for bonding to the terminal tab 20 and conductivity thereof, and includes photolithography including ink printing or etching. According to the process, the antenna pattern 11 may be formed in one or both surfaces.

상기 안테나몸체(10)에는 단면 또는 양면에 형성될 수 있는 안테나패턴(11)과 안테나몸체의 하측단부에 결합되는 단자탭(20)과의 전기적 연결 또는 패턴간 연결을 위한 용도로 활용하기 위해 일측에 비어홀(12)이 형성된다.The antenna body 10 has one side for use as an electrical connection or a pattern-to-pattern connection between the antenna pattern 11 which may be formed on one side or both sides and the terminal tab 20 coupled to the lower end of the antenna body. A via hole 12 is formed in the hole.

이때, 상기 비어홀(12) 내에는 동도금 작업을 통해 단자탭(20)과의 전기적 연결(도전성 접촉)을 위한 도전층(13)이 형성되는데, 도전층(13)의 안정된 형성 및 빠른 전착을 위해 화학적 동도금의 전처리를 수행한 후에 전해동도금 또는 전해금도금을 수행하고 있다.At this time, in the via hole 12, a conductive layer 13 for electrical connection (conductive contact) with the terminal tab 20 is formed through copper plating, for stable formation and rapid electrodeposition of the conductive layer 13. After pretreatment of chemical copper plating, electrolytic copper plating or electroplating is performed.

상기 단자탭(20)은 안테나몸체(10)의 도전층(13)에 일측단부가 결합되어 전기적인 연결관계를 형성하게 되는 것으로서, 안테나몸체(10) 측에 납땜으로 결합된다.The terminal tab 20 is one end is coupled to the conductive layer 13 of the antenna body 10 to form an electrical connection relationship, it is coupled to the antenna body 10 by soldering.

그런데, 상술한 바와 같은 종래 모바일기기용 FPCB 안테나(1)를 제조함에 있어서는 비어홀(12)을 위한 홀 가공처리와 도전층(13)을 위한 2번의 도금처리 등 다수의 공정처리가 요구되므로 제조공정 및 제조시간이 길어지는 문제점이 있었으며, 도금액 사용 등에 의한 사후처리 및 작업환경의 개선 등이 지적되고 있으며, 양면 FPCB를 기판으로 사용하고 있고 다수의 공정 처리가 요구되는 등 제품단가의 절감을 구현하는데 상당한 어려움이 있었다.However, the manufacturing process of the conventional FPCB antenna 1 for the mobile device as described above requires a number of processes such as hole processing for the via hole 12 and two plating treatments for the conductive layer 13. And there is a problem that the manufacturing time is long, post-processing and improvement of the working environment by the use of the plating solution has been pointed out, and using the double-sided FPCB as the substrate and requires a number of process treatments to realize a reduction in product cost There was considerable difficulty.

또한, 양면 FPCB를 기판으로 하는 안테나몸체(10)의 하면에 단자탭(20)이 결합되는 구조로 제조되는 종래 모바일기기용 FPCB 안테나의 두께가 두꺼워지는 문제점이 있었다.
In addition, there is a problem in that the thickness of a conventional FPCB antenna for a mobile device manufactured in a structure in which the terminal tab 20 is coupled to the bottom surface of the antenna body 10 having a double-sided FPCB as a substrate.

본 발명은 상술한 종래의 문제점 등을 해소 및 이를 감안하여 안출된 것으로서, 단면 FPCB의 사용이 가능하며 기존에 실시되던 비어홀 가공 및 2번의 도금 공정을 수행하지 않아도 되는 등 제조공정 및 제조시간을 절감할 수 있고 제품단가를 낮춰 제조할 수 있으며 안테나의 두께를 절감할 수 있도록 한 모바일기기용 FPCB 안테나의 제조방법을 제공하는데 그 목적이 있다.The present invention has been made in view of solving the above-mentioned conventional problems and the like, it is possible to use the cross-sectional FPCB and to reduce the manufacturing process and manufacturing time, such as do not have to perform the conventional via hole processing and two plating processes The purpose of the present invention is to provide a method for manufacturing an FPCB antenna for a mobile device, which can reduce the cost of the product and reduce the thickness of the antenna.

또한, 본 발명은 기존 도금 공정수행을 위해 사용된 도금액의 사후 처리에 따른 처리비용을 없앨 수 있는 등 경제성을 도모할 수 있으면서 작업환경의 개선효과까지 추구할 수 있는 모바일기기용 FPCB 안테나의 제조방법을 제공하는데 그 목적이 있다.
In addition, the present invention provides a method for manufacturing an FPCB antenna for a mobile device that can be economical, such as eliminating the processing cost due to the post-treatment of the plating solution used for performing the existing plating process and can also pursue the effect of improving the working environment. The purpose is to provide.

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상기한 목적을 달성하기 위한 본 발명에 따른 모바일기기용 FPCB 안테나의 제조방법은, 안테나패턴을 갖는 안테나몸체와, 상기 안테나몸체 상의 안테나패턴과 모바일기기의 메인회로기판 간 전기적인 연결을 돕기 위한 단자품의 결합 구성으로 이루어지게 하는 모바일기기용 FPCB 안테나의 제조방법에 있어서,
a) 일면에 안테나패턴을 갖는 안테나몸체를 구비하는 단계;
b) 상기 안테나패턴을 커버 및 보호하기 위한 커버레이를 구비하되, 상기 안테나패턴과 단자품을 전기적으로 연결할 부위에 해당하는 커버레이의 측면단부의 일부를 단자품의 폭에 대응하는 크기로 제거함에 의해 외측단면이 동일평면상에서 측면 개방된 오픈형 구조로 단자품의 끼움 삽입을 가능하게 하는 패턴개방부를 커버레이에 형성하는 단계;
c) 상기 안테나패턴 위에 외측단면이 동일평면상에서 측면 개방된 오픈형 구조의 패턴개방부를 갖는 커버레이를 적층 결합하되, 패턴개방부에 의해 안테나패턴의 단자부가 노출되도록 커버레이를 결합하는 단계;
d) 상기 커버레이의 패턴개방부에 단자품을 끼워맞추도록 삽입하여 단자품의 패턴연결 단자부를 안테나패턴의 단자부와 전기적으로 연결하되, 상기 커버레이와 단자품이 상호간 적층되지 않고 하나의 단층으로 동일평면상에 위치되게 하는 단계; 를 포함하여 이루어지며,
상기 a)단계에서는 PI필름, PET필름, PC필름, PES필름 중에서 어느 1종인 연성기판의 일면에 도전성잉크를 인쇄하거나 또는 단면 동박적층필름(FCCL)의 구리층을 식각 처리함에 의해 안테나패턴을 형성시키고; 상기 d)단계에서는 표면실장기술(SMT), 솔더링, 이방성 전도성 접착필름(ACF) 본딩의 결합방식 중에서 선택된 어느 하나의 방식이 사용되는 것을 특징으로 한다.
Method for manufacturing a FPCB antenna for a mobile device according to the present invention for achieving the above object, a terminal for assisting the electrical connection between the antenna body having an antenna pattern, the antenna pattern on the antenna body and the main circuit board of the mobile device In the manufacturing method of the FPCB antenna for mobile devices to be made of a combined configuration of the product,
a) providing an antenna body having an antenna pattern on one surface;
b) a coverlay for covering and protecting the antenna pattern, by removing a portion of the side end portion of the coverlay corresponding to a portion of the antenna pattern and the terminal product electrically connected to the width of the terminal product. Forming a pattern opening in the coverlay to allow the insertion of the terminal product into an open type structure in which an outer end surface is laterally opened on the same plane;
c) stacking the coverlays having the pattern openings of the open structure having the outer side surface open on the same plane on the antenna pattern, and coupling the coverlays so that the terminal portions of the antenna patterns are exposed by the pattern openings;
d) Insert the terminal part to fit the pattern opening of the coverlay to electrically connect the pattern connection terminal part of the terminal product with the terminal part of the antenna pattern, but the coverlay and the terminal product are the same in one single layer without being laminated to each other. Positioning on a plane; And,
In the step a), an antenna pattern is formed by printing a conductive ink on one surface of a flexible substrate, which is one of a PI film, a PET film, a PC film, and a PES film, or etching a copper layer of a single-side copper clad laminated film (FCCL). To; In step d), any one method selected from bonding methods of surface mount technology (SMT), soldering, and anisotropic conductive adhesive film (ACF) bonding may be used.

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삭제delete

본 발명에 의하면, 단면 FPCB의 사용 및 간단한 제조공정에 의해 기존에 비해 전체적인 제조공정 및 제조시간을 절감할 수 있음은 물론 제품단가를 낮출 수 있고 안테나의 두께를 절감할 수 있으며 생산성을 높일 수 있는 모바일기기용 FPCB 안테나를 제조할 수 있다.According to the present invention, the use of a single-sided FPCB and a simple manufacturing process can reduce the overall manufacturing process and manufacturing time, as well as lower the product cost, reduce the thickness of the antenna and increase productivity compared to the conventional one. FPCB antenna for mobile devices can be manufactured.

또한, 본 발명은 기존에 실시하던 비어홀 가공 및 2번의 도금 공정을 수행하지 않아도 되며, 도금 공정을 수행하지 않아도 되므로 도금액의 사후 처리에 따른 처리비용 및 환경문제유발의 문제점을 없앨 수 있고 작업환경의 개선을 구현할 수 있으며 경제성을 도모할 수 있는 유용함을 달성할 수 있다.
In addition, the present invention does not have to perform the via hole processing and the two plating processes that have been conventionally performed, and do not have to perform the plating process, thereby eliminating the problems of processing cost and environmental problems caused by the post-treatment of the plating liquid and Improvements can be made and usefulness can be achieved.

도 1은 종래기술에 따른 모바일기기용 FPCB 안테나의 구조 및 제조기술을 설명하기 위해 나타낸 단면도.
도 2 및 도 3은 본 발명의 실시예에 따른 모바일기기용 FPCB 안테나를 나타낸 사시도.
도 4는 본 발명의 실시예에 따른 모바일기기용 FPCB 안테나를 나타낸 단면도.
도 5는 본 발명의 실시예에 따른 모바일기기용 FPCB 안테나의 제조방법을 설명하기 위해 나타낸 개략적 공정 순서도.1 is a cross-sectional view for explaining the structure and manufacturing technology of the FPCB antenna for mobile devices according to the prior art.
2 and 3 are perspective views showing an FPCB antenna for a mobile device according to an embodiment of the present invention.
4 is a cross-sectional view showing an FPCB antenna for a mobile device according to an embodiment of the present invention.
Figure 5 is a schematic process flow diagram illustrating a method for manufacturing a FPCB antenna for a mobile device according to an embodiment of the present invention.

본 발명에 대해 첨부한 도면을 참조하여 바람직한 실시예를 설명하면 다음과 같으며, 이와 같은 상세한 설명을 통해서 본 발명의 목적과 구성 및 그에 따른 특징들을 보다 잘 이해할 수 있게 될 것이다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

본 발명의 실시예에 따른 모바일기기용 FPCB 안테나(100)는 도 2 내지 도 4에 나타낸 바와 같이, 안테나패턴(111)을 갖는 안테나몸체(110)와, 상기 안테나몸체(110) 상의 안테나패턴(111)과 모바일기기의 메인회로기판(미 도시됨) 간 전기적인 연결을 돕는 매개체가 되는 단자품(120)의 결합 구성으로 이루어진다.As shown in FIGS. 2 to 4, the FPCB antenna 100 for a mobile device according to an embodiment of the present invention includes an antenna body 110 having an antenna pattern 111 and an antenna pattern on the antenna body 110. 111) and the main circuit board (not shown) of the mobile device is made of a coupling configuration of the terminal product 120 that serves as a medium to help the electrical connection.

상기 안테나몸체(110)는 일면에 안테나패턴만 구비되어도 되므로 단면 FPCB를 사용함이 바람직하며, 이를 통해 제품단가의 절감 및 경제성을 추구할 수 있다 할 것이다.Since the antenna body 110 may be provided with only one antenna pattern on one surface, it is preferable to use a single-sided FPCB, thereby reducing the cost of the product and pursuing economic feasibility.

상기 안테나몸체(110) 상에 형성되는 안테나패턴(111)은 연성기판의 일면에 도전성잉크를 인쇄함에 의해 얻어지는 인쇄방식 또는 단면 동박적층필름(FCCL; Flexible Copper Clad Layer)에 대해 노광 및 에칭을 포함하는 포토리소그래피(photolithography) 공정이나 레이저 등에 의한 동박(구리층)의 식각 처리에 의해 얻어지는 식각방식 등이 사용될 수 있다.The antenna pattern 111 formed on the antenna body 110 includes exposure and etching to a printing method or a single-sided copper foil laminated film (FCCL) obtained by printing a conductive ink on one surface of a flexible substrate. An etching method obtained by an etching process of a copper foil (copper layer) by a photolithography process or a laser or the like may be used.

이때, 작업환경의 개선을 위해 인쇄방식이 더욱 바람직하다 할 수 있다.In this case, the printing method may be more preferable to improve the working environment.

상기 안테나몸체(110)는 일면에 안테나패턴(111)을 갖는 싱글사이드 FPCB 제품으로서, 안테나패턴(111)의 위로는 회로패턴의 보호를 위한 커버레이(112)가 적층 결합되어 있다 할 것이다.The antenna body 110 is a single-sided FPCB product having an antenna pattern 111 on one surface, and the coverlay 112 for protecting the circuit pattern is stacked on the antenna pattern 111.

이에 따라, 상기 안테나몸체(110)에는 안테나패턴(111)과 상기 단자품(120)과의 전기적 연결관계를 형성하는 상호간 결합 및 단자품(120)의 측면삽입 결합을 통한 두께 절감효과를 위해 커버레이(112)의 측면단부 일부를 단자품의 폭에 대응하는 크기를 갖도록 제거함에 의해 외측단면이 동일평면상에서 측면 개방되는 오픈형 구조의 패턴개방부(113)가 요구된다.Accordingly, the antenna body 110 has a cover for reducing the thickness through the mutual coupling to form an electrical connection relationship between the antenna pattern 111 and the terminal product 120 and the side insertion coupling of the terminal product 120 By removing a portion of the side end portion of the ray 112 to have a size corresponding to the width of the terminal product, the pattern opening portion 113 of the open type structure in which the outer end surface is laterally opened on the same plane is required.

상기 커버레이(112)의 측면단부 일부를 제거함에 의해 형성되는 외측단면 오픈형 구조의 패턴개방부(113)는 레이저 식각이나 에칭 등에 의해 이루어질 수도 있으나, 안테나패턴(111)의 보호를 위해 커버레이(112)의 구비단계시 사전에 패턴개방부(113)를 형성시킨 상태에서 안테나몸체(110) 상에 결합함이 바람직하다.The pattern opening 113 of the outer side open type structure formed by removing a part of the side end portion of the coverlay 112 may be made by laser etching or etching, but the coverlay When the pattern opening portion 113 is formed in advance during the provision step of 112, it is preferable to couple on the antenna body (110).

상기 단자품(120)은 안테나몸체(110)의 일면에 형성된 안테나패턴(111) 측과 전기적으로 연결하기 위한 패턴연결 단자부(121)와, 모바일기기의 메인회로기판(미 도시됨) 측과 전기적으로 연결하기 위한 메인연결 단자부(122)를 포함하여 구성된다.The terminal product 120 is a pattern connection terminal 121 for electrically connecting with the antenna pattern 111 side formed on one surface of the antenna body 110, and the main circuit board (not shown) side of the mobile device It is configured to include a main connection terminal 122 for connecting.

이때, 상기 패턴연결 단자부(121) 및 메인연결 단자부(122)는 다양한 형태 또는 구조로 형성될 수 있다 할 것이다.In this case, the pattern connection terminal 121 and the main connection terminal 122 may be formed in various forms or structures.

상기 단자품(120)은 패턴연결 단자부(121)가 커버레이(112)의 패턴개방부(113) 상에 위치하여 안테나몸체(110) 측에 결합되며, 커버레이(112)와 동일평면상에 위치된 상태로 안테나패턴(111)과 전기적으로 연결됨을 형성하게 된다.The terminal product 120 has a pattern connection terminal 121 is located on the pattern opening portion 113 of the coverlay 112 is coupled to the antenna body 110 side, and on the same plane as the coverlay 112 It is formed to be electrically connected to the antenna pattern 111 in the positioned state.

이때, 상기 단자품(120)은 안테나몸체(110) 측에 표면실장기술(SMT; Surface Mount Technology)로 탑재하거나 솔더링(soldering) 또는 이방성 전도성 접착필름(ACF; Anisotropic Conductive Film) 본딩(bonding) 등의 결합방식에 의해 결합될 수 있다.In this case, the terminal product 120 is mounted on the antenna body 110 side by Surface Mount Technology (SMT) or soldering or anisotropic conductive film (ACF) bonding It can be combined by the coupling method of.

한편, 도 5는 상술한 구성을 갖는 본 발명의 실시예에 의한 모바일기기용 FPCB 안테나(100)를 제조하기 위한 공정 순서도로서, 이를 설명하면 다음과 같다.On the other hand, Figure 5 is a flow chart for manufacturing a FPCB antenna 100 for a mobile device according to an embodiment of the present invention having the above-described configuration, it will be described as follows.

도 5의 (a)에서와 같이, 연성기판의 일면에 도전성잉크를 인쇄하거나 또는 단면 동박적층필름(FCCL; Flexible Copper Clad Layer)의 동박(구리층)을 노광 및 에칭을 포함하는 포토리소그래피 공정이나 레이저 등을 통해 식각 처리함으로써 일면에 안테나패턴(111)을 형성시킨 안테나몸체(110)를 구비한다.As shown in FIG. 5A, a photolithography process including printing conductive ink on one surface of a flexible substrate or exposing and etching a copper foil (copper layer) of a single-sided copper clad laminated film (FCCL; An antenna body 110 having an antenna pattern 111 formed on one surface by etching through a laser or the like is provided.

이때, 연성기판은 PI(poly imide), PET(Poly ethylene terephthalate), PC(poly carbonate), PES(poly ether sulfone) 소재에 의한 필름이 사용될 수 있다.In this case, the flexible substrate may be a film made of PI (poly imide), PET (poly ethylene terephthalate), PC (poly carbonate), PES (poly ether sulfone) material.

상기 안테나몸체(110) 상에 형성시킨 안테나패턴(111)을 커버 및 보호하기 위한 커버레이(112)를 구비하되, 도 5의 (b)에서와 같이, 커버레이(112)의 측면단부 일부를 단자품(120)의 폭에 대응하는 크기로 제거함에 의해 외측단면이 동일평면상에서 측면 개방되는 오픈형 구조로 단자품(120)의 끼움 삽입을 가능하게 하는 패턴개방부(113)를 커버레이(112) 상에 형성시킨다.A coverlay 112 is provided to cover and protect the antenna pattern 111 formed on the antenna body 110. As shown in (b) of FIG. 5, a portion of the side end of the coverlay 112 is disposed. Cover pattern 112 for opening the pattern opening 113 to enable the insertion of the terminal product 120 in an open structure in which the outer end surface is laterally opened on the same plane by removing the size corresponding to the width of the terminal product 120. ) To form on.

이때, 상기 패턴개방부(113)는 안테나몸체(110) 상에 형성된 안테나패턴(111)과 개별 분리제품인 단자품(120)과의 전기적 연결을 위해 요구되는 외측단면 오픈형 개방구조로서, 단자품(120)을 결합시 측방향에서의 끼움 삽입을 통해 커버레이(112)와 동일평면상에 위치된 상태로 안테나패턴(111)과 전기적으로 연결시킬 수 있도록 한 것이며, 이를 통해 제조되는 안테나의 전반적인 두께 절감을 도모할 수 있도록 한 것이다.At this time, the pattern opening portion 113 is an open-sided open cross-section of the outer side required for electrical connection between the antenna pattern 111 formed on the antenna body 110 and the terminal product 120 which is a separate product. 120 is to be electrically connected to the antenna pattern 111 in the state positioned on the same plane as the coverlay 112 through the insertion in the lateral direction when coupling, the overall thickness of the antenna manufactured through this It was designed to save money.

도 5의 (c)에서와 같이, 안테나패턴(111) 위에 패턴개방부(113)를 갖는 커버레이(112)를 라미네이팅 등을 통해 적층 결합함으로써 싱글사이드 패턴을 갖는 FPCB를 완성한다.As shown in FIG. 5C, the FPCB having a single side pattern is completed by laminating a coverlay 112 having the pattern opening 113 on the antenna pattern 111 through lamination or the like.

이때, 커버레이(112)의 패턴개방부(113)는 안테나패턴(111)의 단자부(111a)가 형성된 위치에 배치되며, 안테나패턴(111)에서 단자부(111a)만이 노출되게 한다.In this case, the pattern opening portion 113 of the coverlay 112 is disposed at a position where the terminal portion 111a of the antenna pattern 111 is formed, and only the terminal portion 111a is exposed from the antenna pattern 111.

도 5의 (d)에서와 같이, 안테나패턴(111)의 단자부(111a) 부위에 대해 커버레이(112)의 패턴개방부(113)를 통해 노출시킨 상태에서 개별 구비제품인 단자품(120)을 커버레이(112)의 패턴개방부(113)를 통해 측방향에서 끼워맞춰지도록 삽입하여 커버레이(112)와 단자품(120)이 상호간 적층되지 않고 하나의 단층을 이루도록 동일평면상에 위치시킨 상태를 만들어 안테나몸체(110) 측에 결합함으로써 모바일기기용 FPCB 안테나(100)를 제조해낸다.As shown in FIG. 5 (d), the terminal products 120, which are individual products, are exposed to the terminal portion 111a of the antenna pattern 111 through the pattern opening portion 113 of the coverlay 112. The coverlay 112 and the terminal product 120 are inserted in the lateral direction through the pattern opening portion 113 of the coverlay 112 so that the coverlay 112 and the terminal product 120 are positioned on the same plane so as to form a single layer without being stacked on each other. By making a coupling to the antenna body 110 side to manufacture the FPCB antenna 100 for mobile devices.

이때, 상기 단자품(120)은 안테나몸체(110)의 일면에 형성된 안테나패턴(111) 측과 전기적으로 연결하기 위한 패턴연결 단자부(121)와, 모바일기기의 메인회로기판(미 도시됨) 측과 전기적으로 연결하기 위한 메인연결 단자부(122)를 포함하여 구성되는 것으로서, 패턴연결 단자부(121)를 안테나패턴(111)의 단자부(111a)에 연결시킨다.In this case, the terminal product 120 is a pattern connection terminal 121 for electrically connecting with the antenna pattern 111 side formed on one surface of the antenna body 110, the main circuit board (not shown) side of the mobile device It is configured to include a main connection terminal portion 122 for electrically connecting to, and connects the pattern connection terminal portion 121 to the terminal portion 111a of the antenna pattern 111.

여기서, 패턴연결 단자부(121)와 안테나패턴(111)의 단자부(111a) 간의 전기적인 연결에는 표면실장기술(SMT; Surface Mount Technology), 솔더링(soldering), 이방성 전도성 접착필름(ACF; Anisotropic Conductive Film) 본딩(bonding) 등의 결합방식 중에서 어느 1종이 선택 적용될 수 있다.Here, the electrical connection between the pattern connection terminal 121 and the terminal 111a of the antenna pattern 111 may include surface mount technology (SMT), soldering, and anisotropic conductive adhesive film (ACF). ) Any one of bonding methods such as bonding may be selected and applied.

따라서, 본 발명에 의해서는 단면 FPCB의 사용 및 간단한 제조공정에 의해 기존에 비해 전체적인 제조공정 및 제조시간을 절감할 수 있음은 물론 제품단가를 낮출 수 있고 안테나의 두께를 절감할 수 있는 모바일기기용 FPCB 안테나(100)를 제조할 수 있으며, 생산성을 높일 수 있다.Therefore, according to the present invention, the overall manufacturing process and manufacturing time can be reduced by using a single-sided FPCB and a simple manufacturing process as well as the product cost can be reduced and the thickness of the antenna can be reduced for a mobile device. The FPCB antenna 100 can be manufactured and productivity can be improved.

이상에서 설명한 실시예는 본 발명의 바람직한 실시예를 설명한 것에 불과하다 할 것으로서, 이러한 실시예에 극히 한정되지 않는다 할 것이고, 때에 따라 공정순서의 치환 또는 수정 등이 이루어질 수 있다 할 것이며, 이는 본 발명의 권리범위 내에 귀속된다 할 것이다.
The embodiments described above are merely to explain the preferred embodiments of the present invention, and are not limited to these embodiments, and may be replaced or modified in some cases the process order, which is the present invention Will fall within the scope of the right.

100: FPCB 안테나
110: 안테나몸체 111: 안테나패턴
111a: 단자부 112: 커버레이
113: 패턴개방부
120: 단자품 121: 패턴연결 단자부100: FPCB Antenna
110: antenna body 111: antenna pattern
111a: terminal portion 112: coverlay
113: pattern opening
120: terminal product 121: pattern connection terminal

Claims (4)

안테나패턴을 갖는 안테나몸체와, 상기 안테나몸체 상의 안테나패턴과 모바일기기의 메인회로기판 간 전기적인 연결을 돕기 위한 단자품의 결합 구성으로 이루어지게 하는 모바일기기용 FPCB 안테나의 제조방법에 있어서,
a) 일면에 안테나패턴을 갖는 안테나몸체를 구비하는 단계;
b) 상기 안테나패턴을 커버 및 보호하기 위한 커버레이를 구비하되, 상기 안테나패턴과 단자품을 전기적으로 연결할 부위에 해당하는 커버레이의 측면단부의 일부를 단자품의 폭에 대응하는 크기로 제거함에 의해 외측단면이 동일평면상에서 측면 개방된 오픈형 구조로 단자품의 끼움 삽입을 가능하게 하는 패턴개방부를 커버레이에 형성하는 단계;
c) 상기 안테나패턴 위에 외측단면이 동일평면상에서 측면 개방된 오픈형 구조의 패턴개방부를 갖는 커버레이를 적층 결합하되, 패턴개방부에 의해 안테나패턴의 단자부가 노출되도록 커버레이를 결합하는 단계;
d) 상기 커버레이의 패턴개방부에 단자품을 끼워맞추도록 삽입하여 단자품의 패턴연결 단자부를 안테나패턴의 단자부와 전기적으로 연결하되, 상기 커버레이와 단자품이 상호간 적층되지 않고 하나의 단층으로 동일평면상에 위치되게 하는 단계; 를 포함하여 이루어지며,
상기 a)단계에서는 PI필름, PET필름, PC필름, PES필름 중에서 어느 1종인 연성기판의 일면에 도전성잉크를 인쇄하거나 또는 단면 동박적층필름(FCCL)의 구리층을 식각 처리함에 의해 안테나패턴을 형성시키고;
상기 d)단계에서는 표면실장기술(SMT), 솔더링, 이방성 전도성 접착필름(ACF) 본딩의 결합방식 중에서 선택된 어느 하나의 방식이 사용되는 것을 특징으로 하는 모바일기기용 FPCB 안테나의 제조방법.In the manufacturing method of the FPCB antenna for a mobile device to be made of a combination of the antenna body having an antenna pattern, and the terminal product to help the electrical connection between the antenna pattern on the antenna body and the main circuit board of the mobile device,
a) providing an antenna body having an antenna pattern on one surface;
b) a coverlay for covering and protecting the antenna pattern, by removing a portion of the side end portion of the coverlay corresponding to a portion of the antenna pattern and the terminal product electrically connected to the width of the terminal product. Forming a pattern opening in the coverlay to allow the insertion of the terminal product into an open type structure in which an outer end surface is laterally opened on the same plane;
c) stacking the coverlays having the pattern openings of the open structure having the outer side surface open on the same plane on the antenna pattern, and coupling the coverlays so that the terminal portions of the antenna patterns are exposed by the pattern openings;
d) Insert the terminal part to fit the pattern opening of the coverlay to electrically connect the pattern connection terminal part of the terminal product with the terminal part of the antenna pattern, but the coverlay and the terminal product are the same in one single layer without being laminated to each other. Positioning on a plane; And,
In the step a), an antenna pattern is formed by printing a conductive ink on one surface of a flexible substrate, which is one of a PI film, a PET film, a PC film, and a PES film, or etching a copper layer of a single-side copper clad laminated film (FCCL). To;
In the step d), a method of manufacturing an FPCB antenna for a mobile device, characterized in that any one selected from a bonding method of surface mount technology (SMT), soldering, anisotropic conductive adhesive film (ACF) bonding is used. 삭제delete 삭제delete 삭제delete
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