KR101272795B1 - Detergent composition for cleaning clean room - Google Patents
Detergent composition for cleaning clean room Download PDFInfo
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- KR101272795B1 KR101272795B1 KR1020060092746A KR20060092746A KR101272795B1 KR 101272795 B1 KR101272795 B1 KR 101272795B1 KR 1020060092746 A KR1020060092746 A KR 1020060092746A KR 20060092746 A KR20060092746 A KR 20060092746A KR 101272795 B1 KR101272795 B1 KR 101272795B1
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- 239000000203 mixture Substances 0.000 title claims abstract description 54
- 238000004140 cleaning Methods 0.000 title claims abstract description 52
- 239000003599 detergent Substances 0.000 title claims abstract description 13
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 14
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 12
- 239000001257 hydrogen Substances 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000080 wetting agent Substances 0.000 claims abstract description 9
- -1 alcohol ethylene oxide adducts Chemical class 0.000 claims description 19
- 239000012459 cleaning agent Substances 0.000 claims description 13
- 239000002202 Polyethylene glycol Substances 0.000 claims description 12
- 229920001223 polyethylene glycol Polymers 0.000 claims description 12
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 8
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 8
- 229920001451 polypropylene glycol Polymers 0.000 claims description 8
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229920002114 octoxynol-9 Polymers 0.000 claims description 7
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 4
- 239000000194 fatty acid Substances 0.000 claims description 4
- 229930195729 fatty acid Natural products 0.000 claims description 4
- 150000004665 fatty acids Chemical class 0.000 claims description 4
- 229940100555 2-methyl-4-isothiazolin-3-one Drugs 0.000 claims description 3
- 239000003906 humectant Substances 0.000 claims description 3
- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 claims description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 2
- 229940100484 5-chloro-2-methyl-4-isothiazolin-3-one Drugs 0.000 claims description 2
- DHNRXBZYEKSXIM-UHFFFAOYSA-N chloromethylisothiazolinone Chemical compound CN1SC(Cl)=CC1=O DHNRXBZYEKSXIM-UHFFFAOYSA-N 0.000 claims description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims description 2
- 150000002314 glycerols Chemical class 0.000 claims description 2
- 150000002334 glycols Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- CSNIZNHTOVFARY-UHFFFAOYSA-N 1,2-benzothiazole Chemical compound C1=CC=C2C=NSC2=C1 CSNIZNHTOVFARY-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 18
- 239000002216 antistatic agent Substances 0.000 abstract description 10
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 12
- 239000004094 surface-active agent Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 230000005611 electricity Effects 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- 229920001410 Microfiber Polymers 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 4
- 239000003658 microfiber Substances 0.000 description 4
- 238000010186 staining Methods 0.000 description 4
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000000845 anti-microbial effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002563 ionic surfactant Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000693 micelle Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 2
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 2
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
- DSXBTCVPYQKYLJ-UHFFFAOYSA-N 1,2-benzothiazol-3-one Chemical compound S1NC(C2=C1C=CC=C2)=O.S2NC(C1=C2C=CC=C1)=O DSXBTCVPYQKYLJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Chemical group CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 206010019233 Headaches Diseases 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000000855 fungicidal effect Effects 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 231100000869 headache Toxicity 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
반도체 및 액정표시소자(LCD) 제조 산업체의 크린룸 세정용 세정제 조성물이 개시된다. 상기 세정제 조성물은 기존의 제품보다 건조속도 및 잔류량이 개선된 것으로서, 하기 화학식 1로 표시되는 비이온성 계면활성제 0.01 내지 0.5 중량%, 하기 화학식 2로 표시되는 유기용매 0.5 내지 10중량%, 하기 화학식 3으로 표시되는 습윤제 0.01 내지 1중량%, 대전 방지제 0.01 내지 3중량% 및 나머지 물을 포함한다.Disclosed is a cleanroom cleaning composition for a semiconductor and liquid crystal display device (LCD) manufacturing industry. The detergent composition has improved drying rate and residual amount than conventional products, 0.01 to 0.5% by weight of the nonionic surfactant represented by the formula (1), 0.5 to 10% by weight of the organic solvent represented by the formula (2), formula 0.01 to 1% by weight of a wetting agent, 0.01 to 3% by weight of the antistatic agent and the remaining water.
[화학식 1] R1-C6H4-O-(C2H4O)n-H[Formula 1] R 1 -C 6 H 4 -O- (C 2 H 4 O) n -H
상기 화학식 1에서, R1은 탄소수 8 내지 16의 알킬기이며, n은 3 내지 20의 정수이다.In Formula 1, R 1 is an alkyl group having 8 to 16 carbon atoms, n is an integer of 3 to 20.
[화학식 2] R2-O-(CkH2kO)l-R3 [Formula 2] R 2 -O- (C k H 2k O) l -R 3
상기 화학식 2에서, R2 및 R3은 각각 독립적으로 수소 또는 탄소수 1 내지 4의 알킬기이며, k는 2 내지 3의 정수이고, l은 1 내지 2의 정수이다.In Formula 2, R 2 and R 3 are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, k is an integer of 2 to 3, l is an integer of 1 to 2.
[화학식 3] R4-O-(CkH2kO)n-R5 R 4 -O- (C k H 2k O) n -R 5
상기 화학식 3에서, R4 및 R5는 각각 독립적으로 수소 또는 탄소수 1 내지 4의 알킬기이며, k는 2 내지 3의 정수이고, n은 3 내지 20의 정수이며, R4와 R5는 동시에 수소일 수 없다.In Formula 3, R 4 and R 5 are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, k is an integer of 2 to 3, n is an integer of 3 to 20, R 4 and R 5 are simultaneously hydrogen Cannot be
세정제, 크린룸, 반도체, 액정표시소자 Cleaner, Clean Room, Semiconductor, Liquid Crystal Display Device
Description
본 발명은 크린룸 세정용 세정제 조성물에 관한 것으로서, 더욱 상세하게는 반도체 및 액정표시소자(LCD; Liquid Crystal Display) 제조 산업체의 크린룸 세정용 세정제 조성물에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleanroom cleaning composition, and more particularly, to a cleanroom cleaning composition of a semiconductor and liquid crystal display (LCD) manufacturing industry.
세정이란 오염된 사물의 표면을 깨끗하게 하는 것으로서, 세정 대상물 또는 오염원의 종류에 따라, 요구되는 청정도 및 세정 방법이 달라진다. 오늘날 세정제는 자동차, 전기, 전자, 정밀기기, 열처리, 도금 등의 다양한 산업 분야에서 사용되고 있다. 특히, 전자, 금속, 정밀기기, 드라이 크리닝 등의 산업에서는 세정제로서, CFC-113(ChloroFluoroCarbon, 염화불화탄소)가 널리 이용되었는데, 그 사용량은 1989년을 전후로 하여, 전체 CFC 사용량의 25~30%을 차지하였다. 그러나 CFC의 오존층 파괴 학설 발표(1974), 오존층 파괴로 인한 환경 문제의 심각한 대두(1980 초반), 비엔나 협약(1985) 및 몬트리올 의정서(1987) 채택, CFC를 비롯한 오존층 파괴 물질의 사용 규제 등의 일련의 조치에 따라, 선진국에서는 CFC 세정제를 사용하지 못하게 되었다. 따라서, CFC 세정제를 대체하기 위한 수많은 세정제 개발이 진행되었고, 그 결과 수계, 준수계, 대체 염소계, 탄화수소계, 알코올계, 불소계 등의 세정제가 개발되었다. 또한, 이들 대체 세정제들을 이용한 습식 세정에 있어서, 수계 및 준수계 세정제는 화재의 위험성, 환경 및 인체에 대한 위해성, 오존 파괴 위험성 등의 측면에서 기타 세정제들보다 우수한 효과를 보이기 때문에, 이에 대한 연구가 더욱 활발히 진행되고 있다.Cleaning is to clean the surface of the contaminated object, and the required degree of cleanliness and cleaning method vary depending on the type of the object or the source of cleaning. Today, cleaners are used in a variety of industries such as automotive, electrical, electronics, precision instruments, heat treatment and plating. In particular, CFC-113 (ChloroFluoroCarbon Chloride) was widely used as a cleaning agent in the electronics, metals, precision equipment, and dry cleaning industries. Occupied. However, the CFC published the Ozone Depletion Theory (1974), a serious rise in environmental issues from ozone depletion (early 1980), the Vienna Convention (1985) and the Montreal Protocol (1987), and the use of CFCs and other ozone depleting substances. As a result, CFC cleaners are not available in developed countries. Accordingly, a number of cleaners have been developed to replace CFC cleaners. As a result, cleaners such as water-based, semi-compliant, alternative chlorine-based, hydrocarbon-based, alcohol-based and fluorine-based cleaners have been developed. In addition, in the wet cleaning using these alternative cleaners, the water-based and non-compliant cleaners have superior effects to other cleaners in terms of fire risk, environmental and human risk, and ozone destruction risk. It is progressing more actively.
세정제의 세정효율은 용제의 종류, 계면활성제의 종류 및 농도, 친수 친유 발란스(HLB; Hydrophilic Lipophilic Balance), 임계 미셀 농도(CMC), 표면장력, 보조 계면활성제의 첨가 유무, 세정온도 및 계면활성제/물/오일 조성 등의 변수에 따라 달라질 수 있다. 따라서 다양한 산업 분야에서 특수한 목적으로 사용되는 세정제를 개발하기 위해서는, 상기 변수들의 특성 및 상기 변수와 세정효율간의 관계가 체계적으로 연구되어야 한다. 예를 들면, 세정제의 주요 성분인 계면활성제는 용해성의 유무에 따라 수용성 계면활성제 및 유용성 계면활성제로 구분되며, 수용성 계면활성제는 다시 이온성 및 비이온성 계면활성제로 구분된다. 에틸렌 옥사이드 등이 부가된 비이온성 계면활성제는 이온성 계면활성제에 비하여, 대체로 임계미셀온도가 낮고, 생분해도가 높아, 세정효율 및 환경 친화적인 측면에서 많은 장점이 있다.The cleaning efficiency of the cleaning agent was determined by solvent type, surfactant type and concentration, hydrophilic lipophilic balance (HLB), critical micelle concentration (CMC), surface tension, presence or absence of auxiliary surfactants, cleaning temperature and surfactant / It may vary depending on variables such as water / oil composition. Therefore, in order to develop a cleaner used for a special purpose in various industries, the characteristics of the variables and the relationship between the variables and the cleaning efficiency should be systematically studied. For example, surfactants, which are the main components of the detergent, are classified into water-soluble surfactants and oil-soluble surfactants depending on the presence or absence of solubility, and water-soluble surfactants are further classified into ionic and nonionic surfactants. Non-ionic surfactants, such as ethylene oxide, are added, compared with ionic surfactants, generally having a low critical micelle temperature, high biodegradability, and many advantages in terms of cleaning efficiency and environmental friendliness.
세정제로서, 반도체 장치의 웨이퍼 또는 액정표시소자(LCD) 기판 등의 세정을 위한 것은 많은 발명에서 공지되어 있는데, 이러한 세정제들은 일반적으로 2차 세척 공정을 필요로 한다. 예를 들면, 대한민국 특허공개 제1993-0014811호는 음이온계, 양이온계 및 양성이온계 계면활성제를 사용한 액정표시소자의 세정 방법을 개시하고 있으며, 대한민국 특허공개 제1997-0062017호는 액정표시소자 기판 표면의 세정을 위한 세정제 조성물을 개시하고 있으며, 대한민국 특허공개 제2005-0078903호는 유기용매 및 계면활성제를 포함하며, 동적표면장력이 낮은 세정액 조성물을 개시하고 있다.As a cleaning agent, cleaning of a wafer or a liquid crystal display (LCD) substrate of a semiconductor device is known in many inventions, and these cleaning agents generally require a second cleaning process. For example, Korean Patent Publication No. 199-0014811 discloses a method for cleaning a liquid crystal display device using anionic, cationic and zwitterionic surfactants, and Korean Patent Publication No. 1997-0062017 discloses a liquid crystal display substrate. A cleaning composition for cleaning a surface is disclosed, and Korean Patent Publication No. 2005-0078903 discloses a cleaning liquid composition containing an organic solvent and a surfactant and having low dynamic surface tension.
반면, 반도체 및 액정표시소자 제조 산업체의 크린룸 세정을 위한 세정제는 아직까지 그 개발이 미미한 수준이다. 크린룸 세정용 세정제 조성물의 바람직한 요건으로는, 세정 도구로 사용되는 극세사에 원활하게 흡수되어야 하며, 작업 후 건조속도가 높아야 하며, 잔유물이 남지 않고 얼룩이 쉽게 제거되어야 한다. 얼룩이나 잔유물이 남을 경우, 완전 건조 후 이물질이 비산되어 반도체나 LCD 공정에 치명적인 영향을 미칠 수 있기 때문이다. 또한, 크린룸 세정용 세정제 조성물은 세정 후 크린룸 재질 표면상에 발생되는 정전기를 방지하여, 먼지 또는 이물질의 재부착을 억제하여야 하고, 장기간 보관 시 미생물에 의한 오염 및 조성물의 변질이 발생하지 않아야 한다. 또한, 크린룸 세정용 세정제는 사용에 있어서 작업 기준이 표준화되어 있지 않기 때문에, 작업자의 주관에 따라 세정제의 사용량이 달라질 수 있다. 권장량을 사용할 경우에는 작업 후에도 잔존이나 얼룩 문제가 발생하 지 않지만, 과량을 사용할 경우에는 완전 건조가 되지 않거나 얼룩 등이 발생할 수 있어 건조 와이퍼 등으로 2차 세정을 하여야 한다. 이때 잔존물이나 얼룩 등이 쉽게 제거되어야 한다.On the other hand, the cleaning agent for the clean room cleaning of the semiconductor and liquid crystal display device manufacturing industry has yet to be developed. Preferred requirements of the cleanroom cleaning composition are to be smoothly absorbed by the microfiber used as a cleaning tool, to have high drying speed after the operation, and to easily remove stains without leaving residue. If stains or residues remain, foreign matters can be scattered after complete drying and have a fatal effect on the semiconductor or LCD process. In addition, the cleanroom cleaning agent composition should prevent static electricity generated on the surface of the cleanroom material after cleaning, to suppress reattachment of dust or foreign matter, and should not cause contamination of the composition and deterioration of the composition during long-term storage. In addition, since the cleaning standards for clean room cleaning agents are not standardized in use, the amount of the cleaning agents used may vary depending on the operator's supervision. If the recommended amount is used, there will be no residual or staining problem even after the operation. However, if the excess amount is used, it may not be completely dried or stains may occur. Therefore, the second cleaning should be performed with a dry wiper. At this time, residues or stains should be easily removed.
따라서, 본 발명의 목적은 건조속도가 빠르고, 잔류성이 없으며, 건조 표면의 얼룩의 발생이 없거나 쉽게 제거가 되며, 정전기 방지능 및 유기/무기물에 대한 세정력이 우수하고, 과량 사용시에도 건조 후 잔유 얼룩 등이 쉽게 제거될 수 있는 크린룸 세정용 세정제 조성물을 제공하는 것이다.Therefore, the object of the present invention is a fast drying speed, no residual, no occurrence of stains on the dry surface or easily removed, excellent antistatic performance and cleaning power for organic / inorganic, and residual oil stain after drying even in excessive use It is to provide a clean room cleaning composition for cleaning and the like can be easily removed.
본 발명의 다른 목적은 추가적인 추가 세척 공정이 필요 없고, 항균성 및 장기간 보관 안전성이 우수한 크린룸 세정용 세정제 조성물을 제공하는 것이다.Another object of the present invention is to provide a clean room cleaning agent composition which does not need an additional additional cleaning process and is excellent in antimicrobial activity and long-term storage safety.
상기 목적을 달성하기 위하여, 본 발명은 하기 화학식 1로 표시되는 비이온성 계면활성제 0.01 내지 0.5 중량%, 하기 화학식 2로 표시되는 유기용매 0.1 내지 10중량%, 하기 화학식 3으로 표시되는 습윤제 0.01 내지 1.0중량%, 대전 방지제 0.01 내지 3중량% 및 나머지 물을 포함하는 크린룸 세정용 세정제 조성물을 제공한다.In order to achieve the above object, the present invention is 0.01 to 0.5% by weight of the nonionic surfactant represented by the formula (1), 0.1 to 10% by weight of the organic solvent represented by the formula (2), 0.01 to 1.0 wetting agent represented by the formula (3) It provides a cleanroom cleaning composition comprising a weight%, 0.01 to 3% by weight of the antistatic agent and the remaining water.
상기 화학식 1에서, R1은 탄소수 8 내지 16의 알킬기이며, n은 3 내지 20의 정수이다.In Formula 1, R 1 is an alkyl group having 8 to 16 carbon atoms, n is an integer of 3 to 20.
상기 화학식 2에서, R2 및 R3은 각각 독립적으로 수소 또는 탄소수 1 내지 4의 알킬기이며, k는 2 내지 3의 정수이고, l은 1 내지 2의 정수이다.In Formula 2, R 2 and R 3 are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, k is an integer of 2 to 3, l is an integer of 1 to 2.
상기 화학식 3에서, R4 및 R5는 각각 독립적으로 수소 또는 탄소수 1 내지 4의 알킬기이며, k는 2 내지 3의 정수이고, n은 3 내지 20의 정수이며, R4와 R5는 동시에 수소일 수 없다.In Formula 3, R 4 and R 5 are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, k is an integer of 2 to 3, n is an integer of 3 to 20, R 4 and R 5 are simultaneously hydrogen Cannot be
상기 세정제 조성물은 5-클로로-2-메틸-4-이소티아졸린-3-온(5-chloro-2- methyl-4-isothiazolin-3-one), 2-메틸-4-이소티아졸린-3-온(2-methyl-4-isothiaz olin-3-one), 1,2-벤즈이소티아졸린-3-온(1,2-Benzisothiazolin-3-one) 및 이들의 혼합물로 이루어진 군으로부터 선택되는 살균제 0.01 내지 3중량%를 더욱 포함하는 것이 바람직하다.The detergent composition is 5-chloro-2-methyl-4-isothiazolin-3-one, 2-methyl-4-isothiazolin-3 -One (2-methyl-4-isothiaz olin-3-one), 1,2-benzisothiazolin-3-one (1,2-Benzisothiazolin-3-one) and mixtures thereof It is preferable to further contain 0.01 to 3% by weight of fungicide.
이하, 본 발명을 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail.
본 발명은 하기 화학식 1로 표시되는 비이온성 계면활성제 0.01 내지 0.5 중량%, 하기 화학식 2로 표시되는 유기용매 0.1 내지 10중량%, 하기 화학식 3으로 표시되는 습윤제 0.01 내지 1중량%, 대전 방지제 0.01 내지 3중량% 및 나머지 물을 포함하는 크린룸 세정용 세정제 조성물을 제공한다.The present invention is 0.01 to 0.5% by weight of the nonionic surfactant represented by the formula (1), 0.1 to 10% by weight of the organic solvent represented by the formula (2), 0.01 to 1% by weight of the wetting agent represented by the formula (3), antistatic agent 0.01 to It provides a cleanroom cleaning composition comprising 3% by weight and the remaining water.
본 발명에 따른 크린룸 세정용 세정제 조성물에 포함되는 비이온성 계면활성제는 하기 화학식 1로 표시된다. The nonionic surfactant included in the cleanroom cleaning composition according to the present invention is represented by the following formula (1).
[화학식 1][Formula 1]
R1-C6H4-O-(C2H4O)n-HR 1 -C 6 H 4 -O- (C 2 H 4 O) n -H
상기 화학식 1에서, R1은 탄소수 8 내지 16의 알킬기, 바람직하게는 탄소수 8 내지 11개의 알킬기이며, n은 3 내지 20의 정수이다. 여기서 n은 단위분자 구조내에서의 에틸렌옥사이드 부가량을 나타내며, 상기 탄소수 8 내지 16의 알킬기로는 옥틸, 노닐, 데실, 운데실, 도데실, 트리데실, 테트라데실, 펜타데실, 헥사데실기 등을 예시할 수 있다.In Formula 1, R 1 is an alkyl group having 8 to 16 carbon atoms, preferably an alkyl group having 8 to 11 carbon atoms, n is an integer of 3 to 20. N represents the addition amount of ethylene oxide in the unit molecule structure, and the alkyl group having 8 to 16 carbon atoms includes octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl group, and the like. Can be illustrated.
오염물질 제거 및 재흡착 방지를 위해 사용되는 상기 화학식 1로 표시되는 비이온성 계면활성제는 다양한 수의 탄소가 연결된 소수성기 및 복수의 알킬렌 옥사이드기를 포함하는 비이온성 화합물로서, 폴리옥시에틸렌옥틸페닐에테르, 폴리옥시에틸렌노닐페닐에테르, 폴리옥시에틸렌도데실페닐에테르 등을 사용할 수 있고, 표면장력 저하 및 세정력 향상을 위해 상기 화합물을 2종 이상 혼합하여 사용하는 것이 바람직하다. 상기 비이온성 계면활성제의 함량은 전체 세정제 조성물에 대하여 0.01 내지 0.5중량%가 바람직하며, 더욱 바람직하게는 0.02 내지 0.3중량%이다. 상기 비이온성 계면활성제의 함량이 0.01중량% 미만인 경우, 원하는 오염물질의 제거 및 재흡착 방지 효과를 얻을 수 없고, 0.5중량%를 초과할 경우, 더 이상의 추가적인 효과 향상은 없으며, 오히려 크린룸 세정 후, 바닥에 계면활성제가 잔류되는 등의 문제가 발생될 우려가 있다.The nonionic surfactant represented by Formula 1 used for removing pollutants and preventing resorption is a nonionic compound including a plurality of carbon-linked hydrophobic groups and a plurality of alkylene oxide groups, and polyoxyethylene octylphenyl ether, Polyoxyethylene nonyl phenyl ether, polyoxyethylene dodecyl phenyl ether, etc. can be used, It is preferable to mix and use 2 or more types of said compounds in order to reduce surface tension and improve washing power. The content of the nonionic surfactant is preferably 0.01 to 0.5% by weight, more preferably 0.02 to 0.3% by weight based on the total detergent composition. When the content of the nonionic surfactant is less than 0.01% by weight, it is not possible to obtain the effect of removing the desired contaminants and preventing resorption, and when the content is more than 0.5% by weight, there is no further effect improvement, but rather after the clean room cleaning, There exists a possibility that a problem, such as remain | surviving surfactant, may arise in the bottom.
또한, 본 발명에 따른 유기용매는 하기 화학식 2로 표시된다. In addition, the organic solvent according to the present invention is represented by the following formula (2).
[화학식 2][Formula 2]
R2-O-(CkH2kO)l-R3 R 2 -O- (C k H 2k O) l -R 3
상기 화학식 2에서, R2 및 R3은 각각 독립적으로 수소 또는 탄소수 1 내지 4의 알킬기, 예를 들면, 메틸, 에틸, 프로필, 부틸기이며, k는 2 내지 3의 정수이고, l은 1 내지 2의 정수이다. In Formula 2, R 2 and R 3 are each independently hydrogen or an alkyl group of 1 to 4 carbon atoms, for example, methyl, ethyl, propyl, butyl group, k is an integer of 2 to 3, l is 1 to Is an integer of 2.
상기 유기용매는 알킬렌글리콜모노알킬에테르 화합물로서, 디에틸렌글리콜모노메틸에테르, 디에틸렌글리콜모노에틸에테르, 디에틸렌글리콜모노부틸에테르, 디프로필렌글리콜모노메틸에테르, 에틸렌글리콜모노부틸에테르 또는 이들의 혼합물을 사용하는 것이 바람직하고, 디에틸렌글리콜모노부틸에테르를 사용하는 것이 더욱 바람직하다. 상기 유기용매의 함량은 전체 세정제 조성물에 대하여 0.1 내지 10중 량%이며, 바람직하게는 0.5 내지 5중량%이다. 상기 유기용매의 함량이 0.1중량% 미만일 경우, 원하는 세정 효과를 얻을 수 없고 건조된 표면에 잔류 얼룩이 발생하며, 10중량%를 초과할 경우, 추가적인 세정효과 향상은 없으며, 폐용제 처리 문제, 제조 단가 상승, 두통 유발 등의 문제점이 발생된다. The organic solvent is an alkylene glycol monoalkyl ether compound, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, ethylene glycol monobutyl ether or mixtures thereof It is preferable to use, and it is more preferable to use diethylene glycol monobutyl ether. The content of the organic solvent is 0.1 to 10% by weight based on the total detergent composition, preferably 0.5 to 5% by weight. When the content of the organic solvent is less than 0.1% by weight, the desired cleaning effect may not be obtained and residual stains may occur on the dried surface. When the content of the organic solvent exceeds 10% by weight, there is no additional cleaning effect. Problems such as elevation and headaches occur.
본 발명에서는 세정 작업 후 발생할 수 있는 미세 얼룩이 쉽게 제거될 수 있도록 습윤제를 도입하였다. 본 발명에 따른 습윤제는 하기 화학식 3으로 표시된다. In the present invention, a wetting agent is introduced so that fine stains that may occur after the cleaning operation can be easily removed. Wetting agents according to the present invention are represented by the following formula (3).
[화학식 3](3)
R4-O-(CkH2kO)n-R5 R 4 -O- (C k H 2k O) n -R 5
상기 화학식 3에서, R4 및 R5는 각각 독립적으로 수소 또는 탄소수 1 내지 4의 알킬기이며, k는 2 내지 3의 정수이고, n은 3 내지 20의 정수이며, R4와 R5는 동시에 수소일 수 없다.In Formula 3, R 4 and R 5 are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, k is an integer of 2 to 3, n is an integer of 3 to 20, R 4 and R 5 are simultaneously hydrogen Cannot be
상기 습윤제는 폴리에틸렌글리콜알킬에테르, 예를 들면, 트리에틸렌글리콜모노에틸에테르, 폴리에틸렌글리콜모노에틸에테르 또는 이들의 혼합계가 사용될 수 있으며, 바람직하게는 폴리에틸렌글리콜모노에틸에테르가 사용될 수 있다. 상기 습윤제의 함량은 전체 세정제 조성물에 대하여 0.01 내지 1.0중량%이며, 바람직하게는 0.01 내지 0.5중량%이다. 상기 습윤제가 0.01중량% 보다 적게 사용되면 미세 얼룩 제거에 대한 효과가 떨어지며, 1.0중량%를 초과하는 경우는 건조속도가 느려 지고 잔류물이 증가하는 문제가 발생한다. The humectant may be polyethylene glycol alkyl ether, for example, triethylene glycol monoethyl ether, polyethylene glycol monoethyl ether or a mixture thereof, and preferably polyethylene glycol monoethyl ether. The content of the humectant is 0.01 to 1.0% by weight, preferably 0.01 to 0.5% by weight based on the total detergent composition. If the wetting agent is used less than 0.01% by weight, the effect on the removal of fine stains is inferior, when it exceeds 1.0% by weight, there is a problem that the drying rate is slowed and the residue is increased.
본 발명에 사용되는 대전 방지제는 정전기 발생 방지를 위한 것으로서, 특정비이온성 계면활성제를 사용할 수 있으며, 예를 들면, 폴리에틸렌글리콜, 폴리프로필렌글리콜, 알킬페놀 에틸렌옥사이드 부가물, 고급알코올 에틸렌옥사이드 부가물, 고급지방산 아마이드 및 에틸렌옥사이드 부가물, 고급지방산의 글리세린 에스테르, 폴리에틸렌글리콜 에스테르 또는 이들의 혼합물을 사용할 수 있고, 바람직하게는 분자량 200 내지 2000, 더욱 바람직하게는 약 400의 폴리프로필렌글리콜, 폴리에톡시옥틸페닐에테르, 폴리에톡시노닐페닐에테르를 단독 또는 혼합하여 사용할 수 있다. 상기 대전 방지제의 함량은 전체 세정제 조성물에 대하여 0.01 내지 3중량%, 바람직하게는 0.03 내지 1중량%이다. 상기 대전 방지제의 함량이 0.01중량% 미만인 경우, 원하는 대전 방지효과를 얻을 수 없고, 3중량%를 초과할 경우, 지나친 거품이 발생되거나, 세정 후 잔류물이 많이 남고 얼룩이 심화되어, 2차 세정이 필요한 문제가 있다.The antistatic agent used in the present invention is to prevent the generation of static electricity, it is possible to use a specific nonionic surfactant, for example, polyethylene glycol, polypropylene glycol, alkylphenol ethylene oxide adduct, higher alcohol ethylene oxide adduct, Higher fatty acid amides and ethylene oxide adducts, glycerin esters of higher fatty acids, polyethylene glycol esters or mixtures thereof, may be used, preferably polypropylene glycol, polyethoxyoctyl having a molecular weight of 200 to 2000, more preferably about 400 Phenyl ether and polyethoxy nonyl phenyl ether can be used individually or in mixture. The content of the antistatic agent is 0.01 to 3% by weight, preferably 0.03 to 1% by weight based on the total detergent composition. When the content of the antistatic agent is less than 0.01% by weight, the desired antistatic effect is not obtained, when the content of the antistatic agent exceeds 3% by weight, excessive foaming occurs, or a large amount of residue is left after washing, and stains are deepened. There is a necessary problem.
본 발명에 따른 크린룸 세정용 세정제 조성물의 나머지를 구성하는 물은 순수 및 초순수 등을 사용할 수 있다.Pure water, ultrapure water, and the like may be used for the water constituting the rest of the cleanroom cleaning composition for cleaning according to the present invention.
이하, 실시예를 통하여 본 발명을 더욱 상세히 설명한다. 하기 실시예는 본 발명을 보다 구체적으로 설명하기 위한 것으로서, 본 발명의 범위가 이들 실시예에 의해 한정되는 것은 아니다. Hereinafter, the present invention will be described in more detail with reference to Examples. The following examples are intended to illustrate the present invention more specifically, but the scope of the present invention is not limited by these examples.
[실시예 1] Example 1
하기 표 1과 같이, 폴리옥시에틸렌옥틸페닐에테르 0.2중량%, 디에틸렌글리콜모노부틸에테르 1.0중량%, 폴리프로필렌글리콜 0.1중량%, 폴리에틸렌글리콜모노에틸에테르 0.08중량% 및 나머지 초순수를 혼합하여 세정제 조성물을 제조하였다.As shown in Table 1 below, 0.2 wt% of polyoxyethylene octylphenyl ether, 1.0 wt% of diethylene glycol monobutyl ether, 0.1 wt% of polypropylene glycol, 0.08 wt% of polyethylene glycol monoethyl ether, and the remaining ultrapure water were mixed. Prepared.
[실시예 2] [Example 2]
하기 표 1과 같이, 폴리옥시에틸렌옥틸페닐에테르 0.1중량%, 폴리옥시에틸렌노닐페닐에테르 0.1중량%, 디에틸렌글리콜모노부틸에테르 1.0중량%, 폴리프로필렌글리콜 0.1중량%, 폴리에틸렌글리콜모노에틸에테르 0.08중량% 및 나머지 초순수를 혼합하여 세정제 조성물을 제조하였다.As shown in Table 1, 0.1% by weight of polyoxyethylene octylphenyl ether, 0.1% by weight of polyoxyethylene nonylphenyl ether, 1.0% by weight of diethylene glycol monobutyl ether, 0.1% by weight of polypropylene glycol, 0.08% by weight polyethylene glycol monoethyl ether % And the remaining ultrapure water were mixed to prepare a detergent composition.
[비교예 1] Comparative Example 1
하기 표 1과 같이, 디에틸렌글리콜모노부틸에테르 1.0중량%를 사용하지 않은 것을 제외하고는 실시예 1과 동일한 방법으로 크린룸 세정용 세정제 조성물을 제조하였다.As shown in Table 1, except that 1.0% by weight of diethylene glycol monobutyl ether was not used, a clean room cleaning composition was prepared in the same manner as in Example 1.
[비교예 2] Comparative Example 2
하기 표 1과 같이, 디에틸렌글리콜모노부틸에테르 1.0중량% 대신에 1-메톡시 -2-프로판올 1.0중량%를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 크린룸 세정용 세정제 조성물을 제조하였다.As shown in Table 1, except that 1.0% by weight of 1-methoxy-2-propanol was used in place of 1.0% by weight of diethylene glycol monobutyl ether, a clean room cleaning composition was prepared in the same manner as in Example 1.
[비교예 3] [Comparative Example 3]
하기 표 1과 같이, 폴리프로필렌글리콜 0.1중량%를 사용하지 않은 것을 제외하고는 실시예 1과 동일한 방법으로 크린룸 세정용 세정제 조성물을 제조하였다.As shown in Table 1, except for not using 0.1% by weight of polypropylene glycol was prepared in a clean room cleaning composition in the same manner as in Example 1.
[비교예 4] [Comparative Example 4]
하기 표 1과 같이, 폴리에틸렌글리콜모노에틸에테르 0.08중량%를 사용하지 않은 것을 제외하고는 실시예 1과 동일한 방법으로 크린룸 세정용 세정제 조성물을 제조하였다.As shown in Table 1, except that 0.08% by weight polyethylene glycol monoethyl ether was not used to prepare a clean room cleaning composition in the same manner as in Example 1.
[비교예 5] [Comparative Example 5]
하기 표 1과 같이, 폴리옥시에틸렌옥틸페닐에테르 0.2중량%를 대신하여 폴리옥시에틸렌라우릴에테르 0.2중량%를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 크린룸 세정용 세정제 조성물을 제조하였다.As shown in Table 1, except for using 0.2% by weight of polyoxyethylene lauryl ether instead of 0.2% by weight of polyoxyethylene octylphenyl ether was prepared in the same manner as in Example 1 clean room cleaning detergent composition.
[비교예 6] [Comparative Example 6]
하기 표 1과 같이, 폴리옥시에틸렌옥틸페닐에테르 0.2중량%를 대신하여 폴리옥시에틸렌소르비탄 모노스테아레이트 0.2중량%를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 크린룸 세정용 세정제 조성물을 제조하였다.As shown in Table 1, except for using 0.2% by weight of polyoxyethylene sorbitan monostearate in place of 0.2% by weight of polyoxyethylene octylphenyl ether, a cleaning composition for a clean room was prepared in the same manner as in Example 1. .
상기 표 1에서, OP-10(한농화성, 제품명 KOREMUL OP-10)은 비이온성 계면활성제로서 폴리옥시에틸렌옥틸페닐에테르이고, NP-9(한농화성, 제품명 KOREMUL NP-9)은 비이온성 계면활성제로서 폴리옥시에틸렌노닐페닐에테르이며, LE-7(한농화성, 제품명 KOREMUL LE-7)은 계면활성제로서 폴리옥시에틸렌라우릴에테르이고, Tween 60(Aldrich 제품)는 계면활성제로서 폴리옥시에틸렌 소르비탄 모노스테아레이트이며, DEB는 유기용매로서 디에틸렌글리콜모노부틸에테르이고, MFG는 유기용매로서 1-메톡시-2-프로판올(Aldrich 제품)이며, PPG는 대전방지제로서 평균분자량 400인 폴리프로필렌글리콜이고, EPG는 습윤제로서 평균분자량 500 미만인 폴리에틸렌글리콜모노에틸에테르이며, PW는 초순수이다.In Table 1, OP-10 (Han Thickening, product name KOREMUL OP-10) is a polyoxyethylene octylphenyl ether as a nonionic surfactant, NP-9 (Han Thickening, product name KOREMUL NP-9) is a nonionic surfactant Is polyoxyethylene nonylphenyl ether, LE-7 (high concentration, KOREMUL LE-7) is polyoxyethylene lauryl ether as surfactant, Tween 60 (Aldrich) is polyoxyethylene sorbitan mono Stearate, DEB is diethylene glycol monobutyl ether as organic solvent, MFG is 1-methoxy-2-propanol (Aldrich) as organic solvent, PPG is polypropylene glycol with average molecular weight 400 as antistatic agent, EPG is polyethyleneglycol monoethylether having an average molecular weight of less than 500 as a wetting agent, and PW is ultrapure water.
[시험예] 세정제 조성물 평가 [Test Example] Evaluation of Cleaning Composition
상기 실시예 1 내지 2 및 비교예 1 내지 6에서 제조된 크린룸 세정용 세정제 조성물의 건조속도, 건조 후 잔류도, 정전기 발생 유무, 세정력 및 항균성을 하기의 방법으로 측정하고, 하기 표 2를 기준으로 평가하여, 그 결과를 하기 표 3에 나타내었다.The drying rate of the clean room cleaning agent compositions prepared in Examples 1 to 2 and Comparative Examples 1 to 6, residual after drying, the presence or absence of static electricity, cleaning power and antimicrobial properties were measured by the following method, based on Table 2 below. The results are shown in Table 3 below.
1) 건조속도: 극세사 한장당 5mL의 세정제 조성물을 흡수시키고, 이를 이용하여 스테인레스 스틸 판을 10회 문지른 후 초기 잔류량의 무게를 측정하고 시간의 경과에 따른 잔류량의 무게를 측정하면서 잔류량이 초기 대비 20% 미만이 되는 건조시간을 측정하였다. 1) Drying rate: Absorb 5mL of detergent composition per sheet of microfiber, rub the stainless steel plate 10 times using this, measure the weight of initial residue and measure the weight of residue over time. The drying time which became less than was measured.
2) 건조 후 잔류도 및 얼룩: 1)과 동일한 방법으로 테스트를 하고 10분 경과 후의 잔류량의 무게를 측정하고 얼룩 발생도를 평가하였다.2) Residualness and Stain after Drying: The test was carried out in the same manner as in 1), and the residual amount after 10 minutes was weighed and staining was evaluated.
3) 정전기 발생 유무: 유리판을 해당 조성물로 세정한 후, 폴리에스테르 재질의 극세사로 5회 문지른 후, 정전기를 측정하였다.3) presence or absence of static electricity: After cleaning the glass plate with the composition, after rubbing five times with a microfiber made of polyester material, the static electricity was measured.
4) 세정력: 유리판에 지문, 유성펜, 미세먼지 등으로 오염시킨 후, 조성물로 세정하고 육안 판단을 실시하였다.4) Cleaning power: After staining the glass plate with fingerprints, oil pens, fine dust, etc., the composition was washed with the composition and visually judged.
5) 미세얼룩제거율 : 완전 건조 후, 잔류하는 미세 얼룩을 폴리에스테르 재질의 극세사로 문지른 후 제거율을 평가하였다.5) Microstain removal rate: After complete drying, the residual stain was rubbed with a microfiber made of polyester material and then the removal rate was evaluated.
상기 표 3으로부터, 본 발명에 따른 실시예 1 및 2는 건조속도, 건조 후 잔류도, 세정력 및 미세얼룩 제거율이 우수하고 정전기 발생을 방지하였으나, 유기용매가 사용되지 않은 비교예 1에서는 건조속도가 다소 떨어지고 잔류물이 발생하며 미세얼룩이 제거되지 않아 그대로 잔류함을 알 수 있다. 속건성이 뛰어난 다른 종류의 유기용매를 사용한 비교예 2에서는 건조속도가 매우 빠름을 알 수 있지만 건조된 표면상에 얼룩이 발생하고 제거가 완전하지 않음을 알 수 있다. 대전방지제가 제외된 비교예 3에서는 정전기 방지가 되지 않았으며, 습윤제가 제외된 비교예 4에서는 잔류 미세얼룩의 제거가 이루어지지 않음을 알 수 있다. 다른 종류의 계면활성제를 사용한 비교예 5 및 비교예 6은 건조된 표면상에 잔류 얼룩이 발생하고 미세 얼룩이 완전 제거되지 않았으며, 정전기 방지효과도 다소 떨어짐을 알 수 있다. 이는 본 발명에서 사용되는 계면활성제와 대전방지제가 시너지 효과를 가짐을 알 수 있다.From Table 3, Examples 1 and 2 according to the present invention is excellent in the drying rate, residual after drying, cleaning power and fine stain removal rate and prevented the occurrence of static electricity, in Comparative Example 1 in which no organic solvent is used, the drying rate is It can be seen that it is slightly dropped and residues are generated and micro stains are not removed. In Comparative Example 2 using another type of organic solvent having excellent quick-drying, it can be seen that the drying speed is very fast, but staining occurs on the dried surface and the removal is not complete. In Comparative Example 3 in which the antistatic agent was excluded, the antistatic was not prevented, and in Comparative Example 4 in which the wetting agent was excluded, it can be seen that the removal of the residual fine stains was not performed. Comparative Examples 5 and 6 using different kinds of surfactants showed that residual stains occurred on the dried surface, fine stains were not completely removed, and the antistatic effect was also somewhat deteriorated. It can be seen that the surfactant and the antistatic agent used in the present invention has a synergistic effect.
이상 상술한 바와 같이, 본 발명에 따른 크린룸 세정용 세정제 조성물은 건 조속도가 빠르고, 잔류성이 적으며, 정전기 방지능 및 유기/무기물에 대한 세정력이 우수하다. 또한, 상기 크린룸 세정용 세정제 조성물은 과량 사용시에도 잔류물 등이 쉽게 제거가 되어 추가적인 수세 세척 공정이 필요 없는 것이 특징이다.As described above, the clean room cleaning agent composition according to the present invention has a fast drying speed, low residual property, and excellent antistatic ability and organic / inorganic cleaning ability. In addition, the clean room cleaning agent composition is characterized in that the residue is easily removed even when used in excess, and does not require an additional washing process.
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| KR20040035368A (en) * | 2002-10-22 | 2004-04-29 | 주식회사 엘지화학 | Rinse composition for semiconductor and tft-lcd |
| KR100447068B1 (en) * | 2003-10-10 | 2004-09-04 | (주)다래월드 | The components of funtional cleaning agent on the environmental affinity |
| JP2005504143A (en) | 2001-09-24 | 2005-02-10 | ザ プロクター アンド ギャンブル カンパニー | Detergency composition |
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| KR20030050809A (en) * | 2001-12-19 | 2003-06-25 | 주식회사 엘지생활건강 | Aquous detergent composition having superior prnerating properties |
| KR20040035368A (en) * | 2002-10-22 | 2004-04-29 | 주식회사 엘지화학 | Rinse composition for semiconductor and tft-lcd |
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