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KR101264523B1 - Laminating apparatus of the panel for an electronic components - Google Patents

Laminating apparatus of the panel for an electronic components Download PDF

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Publication number
KR101264523B1
KR101264523B1 KR1020110018317A KR20110018317A KR101264523B1 KR 101264523 B1 KR101264523 B1 KR 101264523B1 KR 1020110018317 A KR1020110018317 A KR 1020110018317A KR 20110018317 A KR20110018317 A KR 20110018317A KR 101264523 B1 KR101264523 B1 KR 101264523B1
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panel
vacuum
vacuum chamber
bonding apparatus
space
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KR20120099848A (en
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박웅기
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박웅기
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Priority to CN201280011335.2A priority patent/CN103403783B/en
Priority to PCT/KR2012/001329 priority patent/WO2012118290A2/en
Priority to TW101106052A priority patent/TWI493247B/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Fluid Mechanics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

본 발명은 텔레비전, 각종 모니터, 휴대전화 등 다양한 디스플레이와 같은 전자부품의 용도로 제작되는 패널의 제작시 패널의 표면을 보호하기 위하여 표면에 표면보호부재를 접합시키기 위한 전자부품용 패널의 접합 장치에 관한 것이다.
본 발명에 의하면, 전자부품용 패널의 접합작업을 위한 장치에 있어서, 중앙의 패널접합장치와, 상기 패널접합장치의 개폐부재 외측에 설치되고 내부에 진공용 공간이 마련되는 일측의 제1진공챔버부재와, 그리고 상기 패널접합장치의 본체 외측에 설치되고 내부에 진공용 공간이 마련되는 대향측의 제2진공챔버부재를 포함하여 이루어지는 전자부품용 패널의 접합 장치를 제공한다.Industrial Applicability The present invention relates to a panel bonding apparatus for an electronic component for bonding a surface protection member to a surface to protect the surface of the panel when the panel is manufactured for use in electronic components such as televisions, various monitors, mobile phones, and the like. It is about.
According to the present invention, in the apparatus for joining a panel for an electronic component, a first vacuum chamber on one side, which is installed outside the central panel bonding apparatus and the opening / closing member of the panel bonding apparatus, and has a vacuum space therein. A member and an apparatus for joining a panel for an electronic component comprising a second vacuum chamber member on an opposite side, which is provided outside the main body of the panel bonding apparatus and has a vacuum space therein.

Description

전자부품용 패널의 접합 장치{Laminating apparatus of the panel for an electronic components}Laminating apparatus of the panel for an electronic components

본 발명은 텔레비전, 각종 모니터, 휴대전화 등 다양한 디스플레이와 같은 전자부품의 용도로 제작되는 디스플레이 패널의 제작시 디스플레이 패널의 표면에 터치패널, 강화유리 등을 포함하는 피접합패널을 접합시키기 위한 전자부품용 패널의 접합 장치에 관한 것이다.The present invention provides an electronic component for bonding a panel to be bonded including a touch panel, tempered glass, etc. to the surface of the display panel when manufacturing a display panel manufactured for use of electronic components such as televisions, various monitors, mobile phones, such as various displays It relates to the bonding apparatus of the panel for panels.

일반적으로 전자부품용 패널의 제작시 디스플레이 패널의 표면에 을 보호하기 위하여 마이크로 글라스 렌즈 등의 표면보호부재를 패널의 표면에 터치패널, 강화유리 등을 포함하는 피접합패널을 접합하여 활용하고 있다.In general, in order to protect the surface of the display panel during fabrication of the electronic component panel, a surface protection member such as a micro glass lens is bonded to a panel to be bonded including a touch panel, tempered glass, etc. on the surface of the panel.

이와 같이 패널과 피접합패널을 접합하기 위한 주요공정으로서 가압 접합작업의 경우, 도 1에 예시한 바와 같이, 진공챔버(100)의 내부에 마련한 별도의 작업공간(210)을 갖는 작업기구(200)를 이용하여 작업이 이루어져야만 하는 제약이 뒤따르게 된다.As described above, in the case of the pressure bonding operation as the main process for joining the panel and the panel to be joined, as shown in FIG. 1, a work mechanism 200 having a separate work space 210 provided inside the vacuum chamber 100. Is followed by the constraint that the work must be done.

따라서, 가압 접합작업을 위한 작업기구(200)와 이를 작동시키기 위한 설비(300)를 포함한 전체 상태 모두가 작업요건을 충족시키기 위한 진공챔버(100) 내부에 설치되어야만 하므로 전체적인 장비가 비대하여질 수밖에 없는 불합리한 문제점이 발생하고 있다.Therefore, the overall equipment including the work tool 200 for the pressure bonding operation and the facility 300 for operating the same must be installed inside the vacuum chamber 100 to satisfy the work requirements, so that the overall equipment can be enlarged. There is no unreasonable problem.

특히, 날로 대형화되어가고 있는 디스플레이 패널을 제조함에 있어서 이에 상응되게 충족하는 관련 제조설비를 제작하기 위해서는 막대한 설비비용은 물론 제품의 생산원가도 기하급수적으로 상승하게 되는 문제를 내포하고 있으나 종래의 방식으로 이를 개선하거나 해결하기 위한 방안이 제시되어 있지 못한 것이 현실이다.Particularly, in order to manufacture the related manufacturing equipment correspondingly correspondingly in manufacturing display panels that are becoming larger in size, there is a problem that the production cost of the product increases exponentially as well as the huge equipment cost. The reality is that no measures have been proposed to improve or solve this problem.

본 발명은 이와 같은 종래의 문제점을 해소하기 위하여 연구 개발이 이루어진 것으로 다음과 같은 목적을 갖는다.The present invention has been accomplished in order to solve the problems of the prior art, and has the following objectives.

본 발명의 목적은 작업을 위한 기본적인 요건으로서 진공챔버가 차지하게 되는 공간을 최소화하면서도 전자부품인 패널의 제조시에 필수적으로 직접 요구되는 가압 접합작업을 위한 기본 설비만을 내부에 위치시키고 공간을 많이 차지하게 되는 작동을 위한 설비들은 진공챔버의 외부에 설치할 수 있도록 근본적으로 개념을 달리한 장비를 제공하여 전체 제조장비가 차지하는 공간을 획기적으로 줄이면서 관련 제조설비를 제작하는 비용을 절감함은 물론 제품의 생산원가도 크게 절감할 수 있도록 하고자 함에 있다.The object of the present invention is to minimize the space occupied by the vacuum chamber as a basic requirement for the operation, but to occupy a lot of space and place only the basic equipment for the pressure bonding operation required directly required in the manufacture of the panel, an electronic component The equipments for the operation are provided with equipments that are fundamentally different in concept so that they can be installed outside the vacuum chamber, which dramatically reduces the space occupied by the entire manufacturing equipment and reduces the cost of manufacturing related equipment. The aim is to significantly reduce production costs.

본 발명의 다른 목적은 작업을 위한 기본적인 요건으로서 진공챔버가 차지하게 되는 공간을 최소화하면서 본 접합작업을 위한 작업공간도 필수적인 작업 공간만을 충족할 수 있을 정도로 효과적인 공간활용이 가능하도록 구성하여 기존의 자동화된 제조라인에 적용하고자 하는 경우에도 손쉽게 적용이 가능하여 관련 설비가 차지하게 되는 수직 또는 수평의 입체공간으로서 차지하게 되는 체적을 크게 줄이는 동시에 공간의 효율적인 활용이 가능하여 경제성을 향상시킬 수 있도록 하고자 함에 있다.Another object of the present invention is to minimize the space occupied by the vacuum chamber as a basic requirement for the work, and to make effective use of the space so that the work space for the joining work can only meet the essential work space, the existing automation It can be easily applied even if it is intended to be applied to a manufactured manufacturing line, so that the volume occupied as a vertical or horizontal three-dimensional space occupied by related equipment can be greatly reduced, and the efficient use of space can be improved to improve economic efficiency. have.

본 발명은 위와 같은 목적을 달성하기 위하여, 전자부품용 패널의 접합작업을 위한 장치에 있어서, 중앙의 패널접합장치와, 상기 패널접합장치의 개폐부재 외측에 설치되고 내부에 진공용 공간이 마련되는 일측의 제1진공챔버부재와, 그리고 상기 패널접합장치의 본체 외측에 설치되고 내부에 진공용 공간이 마련되는 대향측의 제2진공챔버부재를 포함하여 이루어지되, 상기 패널접합장치는 일측의 개폐부재와, 상기 개폐부재의 대향측에 위치하고 작업공간을 갖는 본체와, 상기 본체의 내부 작업공간에 설치되는 가압부재와, 그리고 상기 개폐부재와 상기 본체의 사이 가장자리에 설치되는 기밀유지부재를 포함하여 구성이 이루어지는 전자부품용 패널의 접합장치를 제공한다.The present invention, in order to achieve the above object, in the apparatus for joining the panel for electronic components, the panel bonding apparatus in the center, and the vacuum space is provided inside the opening and closing member of the panel bonding apparatus is provided therein A first vacuum chamber member on one side and a second vacuum chamber member on an opposite side which is installed outside the main body of the panel bonding apparatus and has a vacuum space therein, wherein the panel bonding apparatus opens and closes on one side. A member, a main body positioned on an opposite side of the opening / closing member and having a working space, a pressing member installed in the inner working space of the main body, and an airtight holding member installed at an edge between the opening and closing member and the main body. Provided is a bonding apparatus for a panel for an electronic component having a structure.

삭제delete

또한, 상기 패널접합장치, 상기 제1진공챔버부재 및 상기 제2진공챔버부재의 외측에 상기 패널접합장치, 상기 제1진공챔버부재 및 상기 제2진공챔버부재를 가동시키기 위한 유틸리티 설비를 별도로 설치하여 이루어지는 전자부품용 패널의 접합 장치를 제공한다.In addition, a utility facility for separately operating the panel bonding apparatus, the first vacuum chamber member, and the second vacuum chamber member is installed outside the panel bonding apparatus, the first vacuum chamber member, and the second vacuum chamber member. An apparatus for joining an electronic part panel is provided.

그리하여 본 발명인 전자부품용 패널의 접합 장치에 의하면, 작업을 위한 기본적인 요건으로서 진공챔버가 차지하게 되는 공간을 최소화하면서도 전자부품인 패널의 제조시에 필수적으로 직접 요구되는 가압 접합작업을 위한 기본 설비만을 내부에 위치시키고 공간을 많이 차지하게 되는 작동을 위한 설비들은 외부에 설치할 수 있도록 근본적으로 개념을 달리한 장비를 제공하여 전체 제조장비가 차지하는 공간을 획기적으로 줄이면서 관련제조설비를 제작하는 비용을 절감함은 물론 제품의 생산원가도 크게 절감할 수 있게 된다.Therefore, according to the bonding apparatus of the panel for an electronic component of the present invention, the basic equipment for pressure bonding operation required directly in the manufacture of an electronic component panel is required, while minimizing the space occupied by the vacuum chamber as a basic requirement for the operation. Facilities for operation that are located inside and occupy a lot of space provide equipment that is fundamentally different in concept so that they can be installed on the outside. In addition, the production cost of the product can be greatly reduced.

또한, 작업을 위한 기본적인 요건으로서 진공챔버가 차지하게 되는 공간을 최소화하면서 본 접합작업을 위한 작업공간도 필수적인 작업 공간만을 충족할 수 있을 정도로 효과적인 공간활용이 가능하도록 구성하여 기존의 자동화된 제조라인에 적용하고자 하는 경우에도 손쉽게 적용이 가능하여 관련 설비가 차지하게 되는 수직 또는 수평의 입체공간으로서 차지하게 되는 체적을 크게 줄이면서도 공간의 효율적인 활용이 가능하여 경제성을 향상시킬 수 있게 된다.In addition, as a basic requirement for work, the space required for the vacuum chamber is minimized, and the work space for the joining work is also configured to enable effective space utilization so that only the required work space can be met, thus making it possible to use the existing automated manufacturing line. Even if it is intended to be applied, it can be easily applied, so that the volume occupied as a vertical or horizontal three-dimensional space occupied by related equipment can be greatly reduced, and the economic efficiency can be improved by using the space efficiently.

도 1은 종래의 기술을 설명하기 위하여 나타낸 개략 구성도,
도 2는 본 발명의 바람직한 일례로서 개략 구성도,
도 3은 도 2의 개방시 분리 상태도,
도 4는 도 3의 부분 평면 사시도,
도 5는 도 2의 다른 일례를 나타낸 개략 구성도.1 is a schematic configuration diagram illustrating a conventional technology;
2 is a schematic configuration diagram as a preferred example of the present invention;
3 is a state of separation when the opening of Figure 2,
4 is a partial plan perspective view of FIG.
5 is a schematic configuration diagram showing another example of FIG. 2;

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 예에 대하여 보다 구체적이고도 상세하게 살펴보기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명의 바람직한 예에 의하면, 도 2 내지 도 5에 예시한 바와 같이, 전자부품용 패널의 접합작업을 위한 장치에 있어서, 중앙의 패널접합장치(1)와, 상기 패널접합장치(1)의 개폐부재(2) 외측에 설치되고 내부에 진공용 공간(30)이 마련되는 일측의 제1진공챔버부재(3)와, 그리고 상기 패널접합장치(1)의 본체(4) 외측에 설치되고 내부에 진공용 공간(50)이 마련되는 대향측의 제2진공챔버부재(5)를 포함하여 이루어지게 된다.According to a preferred embodiment of the present invention, as illustrated in FIGS. 2 to 5, in the apparatus for joining an electronic component panel, the center panel bonding apparatus 1 and the panel bonding apparatus 1 are provided. The first vacuum chamber member 3 on one side, which is installed outside the opening / closing member 2 and provided with a vacuum space 30 therein, and is installed outside the main body 4 of the panel bonding apparatus 1 and is inside. It includes a second vacuum chamber member 5 on the opposite side where the vacuum space 50 is provided.

또한, 상기 패널접합장치(1)는 일측의 개폐부재(2)와, 상기 개폐부재(2)의 대향측에 위치하고 작업공간(40)을 갖는 본체(4)와, 상기 본체(4)의 내부 작업공간(40)에 설치되는 가압부재(6)와, 그리고 상기 개폐부재(2)와 상기 본체(4)의 사이 가장자리에 설치되는 기밀유지부재(7)를 포함하여 구성이 이루어지게 된다.In addition, the panel bonding apparatus 1 includes a main body 4 having a work space 40 and a main body 4 positioned on opposite sides of the open / close member 2 on one side, and having a work space 40. The pressure member 6 is installed in the working space 40, and the airtight holding member 7 is installed on the edge between the opening and closing member 2 and the main body 4 is made of a configuration.

물론, 상기 패널접합장치(1)와 상기 제1진공챔버부재(3)의 사이 위치와, 그리고 상기 패널접합장치(1)와 상기 제2진공챔버부재(5)의 사이 위치엔 각각 별도의 기밀유지기구(8,8)를 설치하여 구성이 이루어지게 된다.Of course, a separate hermetic seal is provided between the panel bonding device 1 and the first vacuum chamber member 3 and between the panel bonding device 1 and the second vacuum chamber member 5. The configuration is achieved by installing the holding mechanism (8, 8).

또한, 상기 패널접합장치(1), 상기 제1진공챔버부재(3) 및 상기 제2진공챔버부재(5)의 외측에 상기 패널접합장치(1), 상기 제1진공챔버부재(3) 및 상기 제2진공챔버부재(5)를 가동시키기 위한 유틸리티 설비(9)를 별도로 설치하여 구성이 이루어지게 된다.In addition, the panel bonding apparatus 1, the first vacuum chamber member 3, and the outer side of the panel bonding apparatus 1, the first vacuum chamber member 3, and the second vacuum chamber member 5. The configuration is made by separately installing the utility equipment 9 for operating the second vacuum chamber member 5.

이때, 상기 유틸리티 설비(9)는 상기 패널접합장치(1)의 가압부재(6)와 기밀유지부재(7), 그리고 상기 기밀유지기구(8,8)에 가압매체로서 공기나 기타 기체 상태의 매체를 공급하기 위한 컴프레서 와 이 컴프레서와 연결되는 가압라인(60)을 포함하게 되고, 제1진공챔버부재(3)의 진공용 공간(30)이나 제2진공챔버부재(5)의 진공용 공간(50) 또는 패널접합장치(1)의 작업용 공간(40) 내부에 진공상태를 유지시키기 위한 진공펌프 및 이 진공펌프와 연결되는 진공라인(32,52,42)을 포함하게 된다.At this time, the utility facility 9 is a pressurized member 6 and the hermetic holding member 7 of the panel bonding apparatus 1 and the hermetic holding mechanisms 8 and 8 as air or other gaseous state as a pressurized medium. Compressor for supplying a medium and a pressure line 60 connected to the compressor, the vacuum space 30 of the first vacuum chamber member 3 or the vacuum space of the second vacuum chamber member 5 50 or a vacuum pump for maintaining a vacuum in the working space 40 of the panel bonding apparatus 1 and vacuum lines 32, 52, and 42 connected to the vacuum pump.

물론, 상기 기밀유지부재(7)나 기밀유지기구(8)는 패킹이나 시일 등 적절한 것을 선택하여 활용이 가능하다.Of course, the hermetic holding member 7 or the hermetic holding mechanism 8 can be utilized by selecting an appropriate one such as a packing or a seal.

또한, 상기 패널접합장치(1)에 있어서 본체(4)의 작업공간(40)에 설치되는 가압부재(6)의 경우 도 2에 도시한 바와 같이 다수의 벨로우즈를 설치하여 가압 작동이 이루어지도록 구성하거나, 아니면 도 5에 예시한 바와 같이 단일의 에어백 형태로 구성하여 구성이 이루어지도록 할 수도 있으며, 그 이외에도 다양한 형태의 가압수단 중 적절한 형태의 것을 선택하여 활용이 가능하다.In addition, in the case of the pressing member 6 installed in the work space 40 of the main body 4 in the panel bonding apparatus 1 is configured to install a plurality of bellows as shown in FIG. Alternatively, as illustrated in FIG. 5, a single airbag may be configured to form a configuration. In addition, various types of pressurization means may be selected and used.

다음은 전술한 바와 같이 이루어지는 본 발명에 대하여 그 작동이 이루어지는 과정을 살펴보기로 한다.Next, the process of the operation of the present invention made as described above will be described.

패널접합장치(1)의 본체(4)로부터 개폐부재(2)를 개방하고 작업공간(40)의 내부에 위치한 가압부재(6)에 접합하고자 하는 대상물을 서로 정렬하여 정위치시키는 준비작업을 행하고 나서, 개폐부재(2)를 닫아 작업공간(40)이 외부와 차단되는 기밀 상태를 유지하고 작업공간(40) 내부, 제1 및 제2진공챔버부재(3,5)의 진공용 공간(30,50)의 내부로부터 진공라인(42),(32,52)을 경유 내부 공기를 외부로 배출시켜 내부를 진공상태로 유지하면서, 가압부재(6)엔 가압라인(60)을 거쳐 외부에 설치된 컴프레서로부터 가압매체를 공급하여 위치변위에 의한 가압작동이 이루어져 접합하고자 하는 접합대상물에 대한 접합작업을 수행하게 된다.The opening and closing member 2 is opened from the main body 4 of the panel bonding apparatus 1, and the preparation work for aligning and positioning the objects to be bonded to the pressing member 6 located inside the work space 40 is performed. Then, the opening and closing member 2 is closed to maintain the airtight state in which the work space 40 is blocked from the outside, and the vacuum space 30 of the first and second vacuum chamber members 3 and 5 inside the work space 40 is maintained. The pressure member (6) is installed on the outside via the pressure line (60) while discharging the internal air through the vacuum lines (42), (32, 52) from the inside of the (50) to maintain the inside in a vacuum state. The pressurized medium is supplied from the compressor to pressurize by positional displacement to perform the joining operation for the joining object to be joined.

이때, 패널접합장치(1)에 있어서 작업공간(40)을 구성하게 되는 대부분의 면적을 차지하게 되는 부위로서 개폐부재(2) 및 본체(4)의 외측표면 부위에 제1 및 제2 진공챔버부재(3,5)의 진공용 공간(30,50)이 위치하게 되고, 전술한 접합작업 중 이들 작업공간(40) 및 진공용 공간(30,50) 내부의 압력이 동일한 진공부압이 작용하기 때문에 작업공간(40)의 내부는 작업에 요하는 충분한 진공부압이 유지되면서도 이러한 작업공간(40) 내부 진공부압과 작업공간(40)의 외부 대기압에 의한 내, 외부 압력차에 의하여 발생할 수 있는 개폐부재(2) 및 본체(4)의 변형현상을 사전에 예방할 수 있게 된다.At this time, the first and second vacuum chambers on the outer surface portions of the opening / closing member 2 and the main body 4 as a portion occupying most of the area constituting the work space 40 in the panel bonding apparatus 1. The vacuum spaces 30 and 50 of the members 3 and 5 are positioned, and the vacuum negative pressures having the same pressure in the working spaces 40 and the vacuum spaces 30 and 50 are operated during the above-described joining operation. Therefore, the interior of the workspace 40 is opened and closed due to the internal and external pressure difference caused by the vacuum negative pressure inside the workspace 40 and the external atmospheric pressure of the workspace 40 while maintaining sufficient vacuum negative pressure required for the work. The deformation of the member 2 and the main body 4 can be prevented in advance.

이와 같이 접합작업이 완료되면 진공라인(42)(32,52)을 통한 작업공간(40)과 제1 및 제2진공챔버부재(3,5)의 진공용 공간(30,50) 내부에 대한 진공작동을 중단하고 진공을 해제시키면 외부로부터 공기가 유입되어 이들 내부는 대기압 상태를 유지하고, 또한 가압라인(60)을 통한 가압부재(6)의 가압작동을 중단시키고 내부의 가압매체를 외부로 배출시켜 내부압력을 대기압 상태로 유지하여 가압부재(6)가 원위치로 복귀하도록 한 다음, 개폐부재(4)를 개방하고 작업공간(40)의 내부에 위치하고 접합작업이 완료된 접합대상물을 외부로 인출하고 다음의 접합작업을 위한 준비를 행하고 지속적인 접합작업이 가능하게 된다.As such, when the joining operation is completed, the working space 40 and the first and second vacuum chamber members 3 and 5 through the vacuum lines 42 and 32 and 52 may be applied to the inside of the vacuum spaces 30 and 50. When the vacuum operation is stopped and the vacuum is released, air flows in from the outside to maintain the atmospheric pressure, and also stops the pressurization of the pressurizing member 6 through the pressurizing line 60 and moves the pressurizing medium to the outside. By discharging, the internal pressure is maintained at atmospheric pressure to return the pressing member 6 to its original position, and then the opening and closing member 4 is opened and placed inside the work space 40 and withdrawn the joining object is completed. It is possible to prepare for the next joining operation and to make continuous joining work possible.

따라서, 본 발명에 의하면, 작업을 위한 기본적인 요건으로서 진공챔버가 차지하게 되는 공간을 제1 및 제2 진공챔버부재(3,5)를 채택하여 최소화하면서도 전자부품인 패널의 제조시에 필수적으로 직접 요구되는 가압 접합작업을 위한 기본 설비로서 패널접합장치(1)만을 내부에 위치시키고 공간을 많이 차지하게 되는 작동을 위한 설비로서 유티리티 설비(9)는 외부에 설치할 수 있도록 근본적으로 개념을 달리하여 전체 장비가 차지하는 공간을 획기적으로 줄이면서 제조비용을 절감함은 물론 접합제품의 생산원가도 크게 절감할 수 있게 된다.Therefore, according to the present invention, the first and second vacuum chamber members 3 and 5 minimize the space occupied by the vacuum chamber as a basic requirement for the operation, and are essential directly in manufacturing the electronic component panel. As the basic equipment for the required pressure bonding work, only the panel bonding device 1 is placed inside, and the facility for the operation takes up a lot of space. By dramatically reducing the space occupied by the entire equipment, not only the manufacturing cost can be reduced, but also the production cost of the bonded products can be greatly reduced.

특히, 작업을 위한 기본적인 요건으로서 진공챔버가 차지하게 되는 공간을 최소화하면서 본 접합작업을 위한 작업공간(40)도 필수적인 작업공간만을 충족할 수 있을 정도로 효과적인 공간활용이 가능하도록 구성하여 기존의 자동화된 제조라인에 적용하고자 하는 경우에도 손쉽게 적용이 가능하여 관련 설비가 차지하게 되는 수직 및 수평의 입체공간으로서 차지하게 되는 체적을 크게 줄이면서 공간의 효율적인 활용이 가능하여 경제성을 향상시킬 수 있게 된다.In particular, as the basic requirements for work, while minimizing the space occupied by the vacuum chamber, the work space 40 for the joining work is also configured to enable effective space utilization so as to satisfy only the necessary work space. Even if it is intended to be applied to a manufacturing line, it can be easily applied, so that the volume occupied as a vertical and horizontal three-dimensional space occupied by the related equipment can be greatly reduced and the efficient use of the space can improve economic efficiency.

1: 패널접합장치, 2: 개폐부재,
3: 제1진공챔버부재, 4: 본체,
5: 제2진공챔버부재, 6: 가압부재,
7: 기밀유지부재, 8: 기밀유지기구,
9: 유틸리티 설비, 30, 50: 진공용 공간,
32, 42, 52: 진공라인, 40: 작업공간,
60: 가압라인1: panel bonding device, 2: switching member,
3: first vacuum chamber member, 4: main body,
5: second vacuum chamber member, 6: pressing member,
7: absence of confidentiality, 8: confidentiality mechanism,
9: utility equipment, 30, 50: space for vacuum,
32, 42, 52: vacuum line, 40: workspace,
60: pressurization line

Claims (3)

전자부품용 패널의 접합작업을 위한 장치에 있어서,
중앙의 패널접합장치(1)와, 상기 패널접합장치(1)의 개폐부재(2) 외측에 설치되고 내부에 진공용 공간(30)이 마련되는 일측의 제1진공챔버부재(3)와, 그리고 상기 패널접합장치(1)의 본체(4) 외측에 설치되고 내부에 진공용 공간(50)이 마련되는 대향측의 제2진공챔버부재(5)를 포함하여 이루어지되,
상기 패널접합장치(1)는
일측의 개폐부재(2)와,
상기 개폐부재(2)의 대향측에 위치하고 작업공간(40)을 갖는 본체(4)와,
상기 본체(4)의 내부 작업공간(40)에 설치되는 가압부재(6)와, 그리고
상기 개폐부재(2)와 상기 본체(4)의 사이 가장자리에 설치되는 기밀유지부재(7)를 포함하여 구성이 이루어지는 것을 특징으로 하는 전자부품용 패널의 접합 장치.
In the device for joining the panel for electronic components,
A first vacuum chamber member 3 on one side, which is installed outside the panel joining apparatus 1 in the center, the opening / closing member 2 of the panel bonding apparatus 1, and the vacuum space 30 is provided therein; And a second vacuum chamber member 5 on the opposite side, which is installed outside the main body 4 of the panel bonding apparatus 1 and provided with a vacuum space 50 therein,
The panel bonding device 1
The opening and closing member 2 on one side,
A main body 4 positioned on an opposite side of the opening / closing member 2 and having a working space 40;
A pressing member 6 installed in the inner working space 40 of the main body 4, and
A device for joining an electronic part panel comprising a hermetic holding member (7) provided at an edge between the opening and closing member (2) and the main body (4).
제1항에 있어서,
상기 패널접합장치(1)는
일측의 개폐부재(2)와, 상기 개폐부재(2)의 대향측에 위치하고 작업공간(40)을 갖는 본체(4)와, 상기 본체(4)의 내부 작업공간(40)에 설치되는 가압부재(6)와, 그리고 상기 개폐부재(2)와 상기 본체(4)의 사이 가장자리에 설치되는 기밀유지부재(7)를 포함하여 구성이 이루어지되,
상기 패널접합장치(1)와 상기 제1진공챔버부재(3)의 사이 위치와, 그리고 상기 패널접합장치(1)와 상기 제2진공챔버부재(5)의 사이 위치엔 각각 별도의 기밀유지기구(8,8)를 설치하여 구성이 이루어지고,
상기 패널접합장치(1), 상기 제1진공챔버부재(3) 및 상기 제2진공챔버부재(5)의 외측에 상기 패널접합장치(1), 상기 제1진공챔버부재(3) 및 상기 제2진공챔버부재(5)를 가동시키기 위한 유틸리티 설비(9)를 별도로 설치하여 구성이 이루어지도록 하되,
상기 유틸리티 설비(9)는 상기 패널접합장치(1)의 가압부재(6)와 기밀유지부재(7), 그리고 상기 기밀유지기구(8,8)에 가압매체로서 공기나 기타 기체 상태의 매체를 공급하기 위한 컴프레서와 이 컴프레서와 연결되는 가압라인(60)을 포함하고, 상기 제1진공챔버부재(3)의 진공용 공간(30)이나 제2진공챔버부재(5)의 진공용 공간(50) 또는 패널접합장치(1)의 작업용 공간(40) 내부에 진공상태를 유지시키기 위한 진공펌프 및 이 진공펌프와 연결되는 진공라인(32,52,42)을 포함하여 이루어지는 것을 특징으로 하는 전자부품용 패널의 접합 장치.The method of claim 1,
The panel bonding device 1
One side opening and closing member 2, the main body 4 which is located on the opposite side of the opening and closing member 2 and has a working space 40, the pressing member is installed in the inner working space 40 of the main body 4 (6) and the airtight holding member 7 is installed on the edge between the opening and closing member 2 and the main body 4 is made,
Separate airtight holding mechanisms are provided at positions between the panel bonding apparatus 1 and the first vacuum chamber member 3 and positions between the panel bonding apparatus 1 and the second vacuum chamber member 5, respectively. Configuration is made by installing (8,8),
The panel bonding apparatus 1, the first vacuum chamber member 3, and the first outer side of the panel bonding apparatus 1, the first vacuum chamber member 3, and the second vacuum chamber member 5. By installing a separate utility equipment (9) for operating the vacuum chamber member (5) so that the configuration is made,
The utility facility 9 supplies air or other gaseous media as a pressurized medium to the pressurizing member 6 and the hermetic holding member 7 and the hermetic holding mechanisms 8 and 8 of the panel bonding apparatus 1. A compressor for supplying and a pressure line 60 connected to the compressor, wherein the vacuum space 30 of the first vacuum chamber member 3 or the vacuum space 50 of the second vacuum chamber member 5 is provided. Or an electronic component comprising a vacuum pump for maintaining a vacuum in the working space 40 of the panel bonding apparatus 1 and vacuum lines 32, 52, and 42 connected to the vacuum pump. Joining device for panels. 삭제delete
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KR1020110018317A KR101264523B1 (en) 2011-03-02 2011-03-02 Laminating apparatus of the panel for an electronic components
CN201280011335.2A CN103403783B (en) 2011-03-02 2012-02-22 The laminating apparatus of electronic component-use panel
PCT/KR2012/001329 WO2012118290A2 (en) 2011-03-02 2012-02-22 Laminating apparatus for panel as electronic component
TW101106052A TWI493247B (en) 2011-03-02 2012-02-23 Laminating system of panel for electronic components

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JPH08304836A (en) * 1995-04-28 1996-11-22 Hitachi Electron Eng Co Ltd Ultraviolet ray sealing material curing device
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CN2916690Y (en) * 2004-04-28 2007-06-27 鸿富锦精密工业（深圳）有限公司 Baseplate attaching device
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TWI493247B (en) 2015-07-21
TW201239466A (en) 2012-10-01

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