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KR101261907B1 - Led module for lighting having advanced radiant heat performance - Google Patents

Led module for lighting having advanced radiant heat performance

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KR101261907B1
KR101261907B1 KR1020100136022A KR20100136022A KR101261907B1 KR 101261907 B1 KR101261907 B1 KR 101261907B1 KR 1020100136022 A KR1020100136022 A KR 1020100136022A KR 20100136022 A KR20100136022 A KR 20100136022A KR 101261907 B1 KR101261907 B1 KR 101261907B1
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South Korea
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printed circuit
circuit board
metal printed
heat dissipation
steel plate
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KR20120074070A (en
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정우철
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재단법인 포항산업과학연구원
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

조명용으로 사용되는 고휘도 LED셀이 금속인쇄회로기판(MPCB)에 실장될 때 LED에서 발생한 열이 효율적으로 방열되도록 한 방열성능이 개선된 조명용 엘이디 모듈이 소개된다.
이를 위해 본 발명은 금속인쇄회로기판(110); 상기 금속인쇄회로기판(110)의 상면에 배치되며, 일정한 간격으로 장착홀(121)이 천공되고, 상기 장착홀 주위로 회로패턴(122)이 구비된 절연층(120); 상기 장착홀(121)에 설치되는 LED셀(130)의 방열성능이 향상되도록, 상기 절연층(120)에 의해 가로막히지 않고 상기 회로패턴(122)을 관통하도록 상기 금속인쇄회로기판(110)에 직접 접촉되어 상기 장착홀(121)에 설치되는 LED셀(130); 상기 금속인쇄회로기판(110)의 하면에 배치되어 금속인쇄회로기판(110)으로 부터 전달받은 열을 방출하는 방열강판(140); 을 포함하되, 상기 방열강판(140)은 흑색강판으로 구성되고, 상기 금속인쇄회로기판(110)은 열전도성이 우수한 마그네슘 재질이 0.2~0.4mm 두께로 이루어지고, 상기 절연층은(120)은 유리질 성분을 갖는 DLC(Diamond Like Carbon) 코팅층이 2~5um 두께로 이루어지며, 상기 금속인쇄회로기판(110)과 상기 방열강판(140)은 열전달이 좋은 고온경화형 금속접합에폭시(150)를 통해 접합되는 것을 특징으로 한다.When the high brightness LED cell used for lighting is mounted on a metal printed circuit board (MPCB), the LED module for lighting that has improved heat dissipation performance will be introduced.
To this end, the present invention is a metal printed circuit board (110); An insulating layer 120 disposed on an upper surface of the metal printed circuit board 110 and having a mounting hole 121 drilled at regular intervals and having a circuit pattern 122 around the mounting hole; In order to improve heat dissipation performance of the LED cell 130 installed in the mounting hole 121, the metal printed circuit board 110 may pass through the circuit pattern 122 without being blocked by the insulating layer 120. LED cells 130 which are directly contacted and installed in the mounting holes 121; A heat dissipation steel plate 140 disposed on a lower surface of the metal printed circuit board 110 and dissipating heat transferred from the metal printed circuit board 110; Including, but the heat dissipation steel plate 140 is composed of a black steel plate, the metal printed circuit board 110 is made of a magnesium material excellent in thermal conductivity 0.2 ~ 0.4mm thickness, the insulating layer 120 is DLC (Diamond Like Carbon) coating layer having a glassy component is made of 2 ~ 5um thickness, the metal printed circuit board 110 and the heat dissipation steel plate 140 is bonded through a high temperature hardening type metal bonding epoxy 150 with good heat transfer. It is characterized by.

Description

방열성능이 개선된 조명용 엘이디 모듈{LED MODULE FOR LIGHTING HAVING ADVANCED RADIANT HEAT PERFORMANCE}LED module for lighting with improved heat dissipation performance {LED MODULE FOR LIGHTING HAVING ADVANCED RADIANT HEAT PERFORMANCE}

본 발명은 방열성능이 개선된 조명용 엘이디 모듈에 관한 것으로, 보다 상세하게는 조명용으로 사용되는 고휘도 LED셀이 금속인쇄회로기판(MPCB)에 실장될 때 LED에서 발생한 열이 효율적으로 방열되도록 한 방열성능이 개선된 조명용 엘이디 모듈에 관한 것이다.The present invention relates to an LED module for lighting with improved heat dissipation performance, and more particularly, a heat dissipation performance for efficiently dissipating heat generated from LEDs when a high-brightness LED cell used for lighting is mounted on a metal printed circuit board (MPCB). An improved LED module for illumination is provided.

일반적으로 조명을 위한 백색 광원으로 LED(Light Emitting Diode)를 사용하기 위해서 적(Red), 녹(Green), 청색(Blue)의 LED를 단일 패키지로 하여 3원광에 의한 백색광을 내거나(이 경우에 각 LED에 인가되는 전압 및 전류를 정밀하게 조정하여 각 빛의 조도가 균일하게 이루어지도록 해야 한다), 청색이나 황색의 LED에서 나오는 빛을 황색이나 청색 형광체를 통과하게 하여 단파장이 여러 가지 장파장의 빛으로 변하게 하여 의사 백색을 얻거나, 근자외선이 형광체를 통과하면서 형광 램프와 같이 백색을 내는 방식을 이용하고 있다.Generally, in order to use LED (Light Emitting Diode) as a white light source for lighting, white light by a tri-element light is emitted in a single package of red, green, and blue LEDs It is necessary to precisely adjust the voltage and current applied to each LED so that each light is uniformly illuminated), and the light emitted from the blue or yellow LED is passed through the yellow or blue phosphor to emit light of various wavelengths To obtain a pseudo-white color, or a near-ultraviolet ray passes through the fluorescent material to emit white light as a fluorescent lamp.

이 중에서 청색 LED나 자외선 LED와 형광 물질을 조합한 백색 광원이 주류를 이루고 있는 실정이다. 상기 형광 물질은 조명 기구의 반구형 커버에 코팅하거나, 형광체 테이프를 전면에 부착하는 방식을 이용하며, 경우에 따라서는 LED의 표면에 형광체를 코팅하여 구성할 수 있다.Among them, a white light source that is a combination of a blue LED or an ultraviolet LED and a fluorescent material is the mainstream. The fluorescent material may be coated on a hemispherical cover of a lighting device, or a method of attaching a fluorescent tape to the front surface may be used. In some cases, the surface of the LED may be coated with a fluorescent material.

상기와 같은 LED를 이용한 백색 광원은 발광 효율이 매우 우수하면서 광도가 높고, 고속 응답성이 우수하며 수명이 길기 때문에 새로운 조명 광원으로 각광받고 있다. 즉, 40~60W의 백열전구의 조도는 약 80개의 LED를 이용하여 5~10W의 전력으로 대체할 수 있으며, 100W의 백열전구는 128개의 LED를 이용하여 약 13W의 전력으로 같은 조도를 구현할 수 있다. 따라서 같은 조도 환경을 구현하기 위해서 소모되는 전력이 기존 "A" 타입 백열전구는 물론 형광 램프에 비해서도 매우 적게 소모된다.The white light source using the LED as described above has been widely regarded as a new illumination light source because it has excellent luminous efficiency, high brightness, high speed response, and long life. That is, the illuminance of an incandescent lamp of 40 to 60 W can be replaced with a power of 5 to 10 W using about 80 LEDs, and a 100 W incandescent lamp can realize the same illuminance with about 13 W power using 128 LEDs. Therefore, the power consumed to realize the same illumination environment is consumed very little in comparison with conventional "A" type incandescent lamps as well as fluorescent lamps.

그런데, 상기와 같은 특성을 가지는 LED 조명장치는 방출되는 광에 열 에너지가 포함되어 있지 않은 냉광원의 특성을 지닌다. 하지만, 반도체의 정션(JUNCTION) 부분에서는 인가되는 전력량에 비례하는 열이 발생하게 되며, 이러한 정션의 발열은 광의 색온도를 변화시키는 등 광원의 품질을 악화시킬 뿐만 아니라 LED 소재의 수명을 단축시키는 요인으로 작용하는 문제점이 있다.By the way, the LED lighting device having the above characteristics has the characteristics of a cold light source that does not contain thermal energy in the emitted light. However, in the junction of the semiconductor, heat is generated in proportion to the amount of power applied, and the heat generation of the junction not only deteriorates the quality of the light source such as changing the color temperature of light, but also shortens the life of the LED material. There is a problem at work.

따라서, LED 조명을 효율적으로 이용하기 위해서는 LED가 정상적으로 동작할 수 있는 온도 조건을 필수적으로 갖추어야 하는바, 이를 위해 종래의 LED 조명장치는 도1에 나타낸 바와 같은 방열구조를 채택하였다.
Therefore, in order to effectively use LED lighting, it is essential to have a temperature condition in which the LED can operate normally. For this purpose, the conventional LED lighting apparatus adopts a heat dissipation structure as shown in FIG.

도1은 종래 LED 조명장치의 방열구조를 개략적으로 나타낸 단면도이다.1 is a cross-sectional view schematically showing a heat radiation structure of a conventional LED lighting apparatus.

도1에서 보면, 기존의 통상적인 인쇄회로기판(PCB)와 달리 알루미늄과 같은 경금속을 사용하는 금속인쇄회로기판(10)을 마련하고, 상기 금속인쇄회로기판(10)의 상면에 전기적인 절연을 위하여 에폭시층(11)을 형성한다. 1, unlike a conventional PCB, a metal printed circuit board 10 using a light metal such as aluminum is provided, and electrical insulation is provided on an upper surface of the metal printed circuit board 10. In order to form the epoxy layer (11).

상기 금속인쇄회로기판(10)은 금속이므로 반드시 전기적 절연이 필요하다. 또한 상기 에폭시층(11)의 상부에는 일정간격 이격되게 회로패턴(12)을 마련하고, 상기 회로패턴(12)의 상부에 전기 에너지를 받으면 광에너지를 방출하는 LED셀(13)이 설치된다.
Since the metal printed circuit board 10 is a metal, electrical insulation is necessary. In addition, an upper portion of the epoxy layer 11 is provided with a circuit pattern 12 to be spaced apart by a predetermined interval, the LED cell 13 for emitting the light energy when the electrical energy is received on the upper portion of the circuit pattern 12 is installed.

그러나 상술한 바와 같은 종래 LED 조명장치의 방열구조는 전기적인 절연을 위해 LED셀(13)과 금속인쇄회로기판(10) 사이에 배치된 에폭시층(11)이 LED셀(13)의 열이 금속인쇄회로기판(10) 쪽으로 전달되지 못하도록 차단하는 역할을 하고 있어서 LED셀(13)의 방열성능을 저하시키는 문제점이 있다.However, in the heat dissipation structure of the conventional LED lighting device as described above, the epoxy layer 11 disposed between the LED cell 13 and the metal printed circuit board 10 is electrically heated in the LED cell 13 for electrical insulation. There is a problem in that the heat dissipation performance of the LED cell 13 is reduced because it serves to block the transfer to the printed circuit board 10.

또한, LED셀(13)을 회로패턴(12) 위에 설치하는 경우 도1에 도시된 바와 같이 회로패턴(12) 내부에 공간이 발생하게 되고, 이 공간을 채우기 위해 에폭시를 이용하여 충진하게 되지만, 이 경우 LED셀의 위치 고정 및 절연효과는 상승하는 반면 방열성능은 더욱 저하되어 광원의 품질 악화 및 LED의 수명을 단축하게 된다.
In addition, when the LED cell 13 is installed on the circuit pattern 12, as shown in FIG. 1, a space is generated in the circuit pattern 12 and filled with epoxy to fill the space. In this case, the position fixing and insulation effect of the LED cell increases while the heat dissipation performance is further deteriorated, thereby deteriorating the quality of the light source and shortening the life of the LED.

본 발명은 상술한 바와 같은 문제점을 해결하기 위한 것으로, 그 목적은 고휘도의 LED셀에서 발생하는 열이 신속하게 주위로 열전도되어 방열되도록 함으로써 장시간 LED를 사용해도 광원의 품질이 저하되거나 LED 수명이 단축되지 않도록 함에 있다.
The present invention is to solve the problems described above, the purpose is that the heat generated from the high-brightness LED cell is quickly heat-conducted to the surroundings to dissipate heat, so even if you use the LED for a long time, the quality of the light source is reduced or the LED life is shortened It is not to be.

상술한 바와 같은 목적을 해결하기 위하여 본 발명은,
금속인쇄회로기판; 상기 금속인쇄회로기판의 상면에 배치되며, 일정한 간격으로 장착홀이 천공되고, 상기 장착홀 주위로 회로패턴이 구비된 절연층; 상기 장착홀에 설치되는 LED셀의 방열성능이 향상되도록, 상기 절연층에 의해 가로막히지 않고 상기 회로패턴을 관통하도록 상기 금속인쇄회로기판에 직접 접촉되어 상기 장착홀에 설치되는 LED셀; 상기 금속인쇄회로기판의 하면에 배치되어 금속인쇄회로기판으로부터 전달받은 열을 방출하는 방열강판; 을 포함하되, 상기 방열강판은 공간 흑색강판으로 구성되고, 상기 금속인쇄회로기판은 열전도성이 우수한 마그네슘 재질이 0.2~0.4mm 두께로 이루어지고, 상기 절연층은은 유리질 성분을 갖는 DLC(Diamond Like Carbon) 코팅층이 2~5um 두께로 이루어지며, 상기 금속인쇄회로기판(110)과 상기 방열강판은 열전달이 좋은 고온경화형 금속접합에폭시를 통해 접합되는 것을 특징으로 한다.The present invention to solve the above object,
Metal printed circuit boards; An insulating layer disposed on an upper surface of the metal printed circuit board, the mounting holes are drilled at regular intervals, and a circuit pattern is provided around the mounting holes; An LED cell installed in the mounting hole in direct contact with the metal printed circuit board so as to penetrate the circuit pattern without being blocked by the insulating layer so as to improve heat radiation performance of the LED cell installed in the mounting hole; A heat dissipation steel sheet disposed on a lower surface of the metal printed circuit board to discharge heat transferred from the metal printed circuit board; Including, but the heat dissipation steel sheet is composed of a space black steel plate, the metal printed circuit board is a magnesium material excellent in thermal conductivity made of 0.2 ~ 0.4mm thickness, the insulating layer is DLC (Diamond Like) having a glassy component Carbon) coating layer is made of 2 ~ 5um thickness, the metal printed circuit board 110 and the heat dissipation steel sheet is characterized in that the heat transfer through the high temperature hardening type metal junction epoxy bonded.

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본 발명에 의하면, LED셀이 금속인쇄회로기판에 직접 접촉되어 LED에서 발생한 열이 금속인쇄회로기판으로 신속하게 열전달되고, 방열강판은 금속인쇄회로기판으로부터 열을 전달받아 방출함으로써 LED가 항상 일정한 온도를 유지할 수 있는바, 이에 따라 오랫동안 LED를 사용하여도 광원의 품질이 저하되지 않고 내구성이 향상되는 특유의 효과가 있다.
According to the present invention, the LED cell is in direct contact with the metal printed circuit board and heat generated from the LED is quickly transferred to the metal printed circuit board, and the heat-dissipating steel plate receives heat from the metal printed circuit board and emits the LED at a constant temperature. As a result, even if the LED is used for a long time, there is a unique effect that the quality of the light source is not degraded and durability is improved.

도1은 종래 LED 조명장치의 방열구조를 개략적으로 나타낸 단면도,
도2는 본 발명에 따른 방열 성능이 개선된 조명용 LED 모듈를 개략적으로 나타낸 단면도.1 is a cross-sectional view schematically showing a heat dissipation structure of a conventional LED lighting apparatus;
Figure 2 is a schematic cross-sectional view of the LED module for illumination improved heat dissipation performance according to the present invention.

이하, 본 발명의 바람직한 실시예를 첨부된 도면에 의거하여 상세하게 설명한다. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도2에 도시된 바와 같이 본 발명에 따른 방열성능이 개선된 조명용 엘이디 모듈(100)은 크게 금속인쇄회로기판(110)과, 절연층(120)과, LED셀(130) 및 방열강판(140)을 포함하여 이루어진다.As shown in FIG. 2, the LED module for lighting 100 having improved heat dissipation performance according to the present invention includes a metal printed circuit board 110, an insulating layer 120, an LED cell 130, and a heat dissipation steel plate 140. )

상기 금속인쇄회로기판(110)은 LED 모듈의 방열 및 냉각효율을 극대화하기 위하여 열전도성이 우수하고 경량 구조체인 마그네슘 재질의 판재가 사용되는바, 이 마그네슘 판재는 0.2 ~ 0.4mm 두께의 박판이 사용된다.The metal printed circuit board 110 is a plate of magnesium material, which is excellent in thermal conductivity and a light weight structure, is used to maximize the heat radiation and cooling efficiency of the LED module. do.

마그네슘 재질의 상기 금속인쇄회로기판(110)은 LED에서 발생한 열을 상기 방열강판(140)으로 효과적으로 전달하는 중간 매개체 역할을 하는 것으로, 마그네슘의 주된 특성인 우수한 열전도성을 이용하여 금속인쇄회로기판(110)의 전체온도를 균일하게 냉각하게 된다.
The metal printed circuit board 110 made of magnesium serves as an intermediate medium for effectively transferring heat generated from the LED to the heat-dissipating steel plate 140. The metal printed circuit board 110 uses excellent thermal conductivity, which is a main characteristic of magnesium. The entire temperature of 110 is cooled uniformly.

상기 절연층(120)은 상기 금속인쇄회로기판(110)의 상면에 배치되는 것으로, 상기 절연층(120)에는 일정한 간격으로 장착홀(121)이 천공되고, 상기 장착홀(121) 주위로 소정두께를 갖는 회로패턴(122)이 설치되어 상기 장착홀(121)에 의해 금속인쇄회로기판(110)의 일부분이 외부로 노출된다.The insulating layer 120 is disposed on the upper surface of the metal printed circuit board 110. The mounting layer 121 is drilled at regular intervals in the insulating layer 120, and is predetermined around the mounting hole 121. A circuit pattern 122 having a thickness is installed so that a part of the metal printed circuit board 110 is exposed to the outside by the mounting hole 121.

상기 절연층(120)은 종래와 같이 레진 또는 에폭시 성분이 아니고 유리질 성분을 갖는 DLC(Diamond Like Carbon)코팅층인 바, 상기 절연층(120)은 수지계통의 소재에 비해 얇고 안정적인 절연효과를 나타내며 상대적으로 우수한 방열특성을 갖도록 할 수 있으며, 고유 특성상 2 ~ 5um의 박막 형태를 이루도록 하는 것이 용이하다.The insulating layer 120 is a DLC (Diamond Like Carbon) coating layer having a glassy component instead of a resin or epoxy component as in the prior art, and the insulating layer 120 has a relatively thin and stable insulating effect compared to a resin-based material. It can be to have excellent heat dissipation characteristics, it is easy to form a thin film form of 2 ~ 5um in its inherent characteristics.

상기 절연층(120)에는 장착홀(121)이 천공되는데, 상기 장착홀(121)은 LED셀(130)의 저면이 절연층(120)에 의해 가로막히지 않고 상기 금속인쇄회로기판(110)에 직접 접촉될 수 있도록 하는 구성으로서, 상기 장착홀(121)이 형성될 부위에는 포토 마스크(photo mask)를 설치한 다음 DLC 코팅을 실시하여 포토 마스크가 위치한 곳에는 DLC층이 생성되지 않도록 함으로써 상기 장착홀(121)이 형성된다.A mounting hole 121 is drilled in the insulating layer 120, and the mounting hole 121 is formed on the metal printed circuit board 110 without the bottom surface of the LED cell 130 being blocked by the insulating layer 120. As a configuration to be in direct contact, the mounting hole 121 is formed by installing a photo mask (photo mask) in the site to be formed and then DLC coating is applied to prevent the DLC layer is generated where the photo mask is located The hole 121 is formed.

이때, 상기 장착홀(121) 주위에는 도2에 도시된 바와 같이 회로패턴(122)이 설치되는데, 상기 LED셀(130)은 종래와 같이 회로패턴(122)의 상부에 얹혀지는 것이 아니라 도시된 바와 같이 회로패턴(122)을 관통하여 금속인쇄회로기판(110)에 직접 실장되므로 구조적으로 방열성능이 향상될 수 있다.In this case, a circuit pattern 122 is installed around the mounting hole 121 as shown in FIG. 2, and the LED cell 130 is not mounted on the circuit pattern 122 as in the related art. As described above, the heat dissipation performance may be structurally improved since the circuit pattern 122 is directly mounted on the metal printed circuit board 110.

따라서, 상기 LED셀(130)은 상기 장착홀(121)에 삽입되어 금속인쇄회로기판(110)의 상면에 접합됨으로써 LED셀(130)의 저면이 금속인쇄회로기판(110)에 직접 접촉된다.
Therefore, the LED cell 130 is inserted into the mounting hole 121 and bonded to the top surface of the metal printed circuit board 110 so that the bottom surface of the LED cell 130 is in direct contact with the metal printed circuit board 110.

한편, 상기 방열강판(140)은 상기 금속인쇄회로기판(110)의 하면에 배치되는 구성으로서, 상기 방열강판(140)은 금속인쇄회로기판(110)으로부터 전달받은 열을 외부로 방출하는 기능을 담당한다.On the other hand, the heat dissipation steel plate 140 is disposed on the lower surface of the metal printed circuit board 110, the heat dissipation steel plate 140 has a function of dissipating heat received from the metal printed circuit board 110 to the outside. In charge.

상기 방열강판(140)은 방열용 흑색강판이 사용되는 것이 바람직한데, 흑색강판은 전열성능이 우수한 대신 열방출성이 떨어지는 상기 금속인쇄회로기판(110)의 단점을 보완하기 위한 것으로, 상기 금속인쇄회로기판(110)의 하면에 공간 열방출률이 높은 흑색강판을 부착하여 열전도성은 금속인쇄회로기판(110)이 담당하고 열방출은 방열강판(140)이 담당하도록 한다.The heat dissipation steel plate 140 is preferably used for the heat dissipation black steel plate, the black steel plate is to compensate for the shortcomings of the metal printed circuit board 110, which is excellent in heat transfer performance and poor heat dissipation, the metal printed circuit A black steel sheet having a high space heat release rate is attached to the bottom surface of the substrate 110 so that the thermal conductivity is the metal printed circuit board 110 and the heat dissipation steel plate 140 is responsible.

상기 방열강판(140)은 기계적 강도가 충분하므로 대형의 LED 모듈을 조명기구에 부착하는 경우 후면에 배치되어 있는 상기 방열강판(140)을 직접적인 지지구조로 사용할 수 있어 바람직하다.Since the heat dissipation steel plate 140 has sufficient mechanical strength, when the large-size LED module is attached to the lighting fixture, the heat dissipation steel plate 140 may be used as a direct support structure.

여기서, 상기 금속인쇄회로기판(110)과 방열강판(140)은 서로 면접촉하도록 직접 체결되어도 무방하지만, 본 발명에서는 열전달이 좋은 고온경화형 금속접합에폭시(150)를 통해 접합되는 것으로 구현된다.Here, the metal printed circuit board 110 and the heat dissipation steel plate 140 may be directly fastened to be in surface contact with each other. However, in the present invention, the metal printed circuit board 110 and the heat dissipation steel plate 140 may be bonded to each other through a high temperature hardenable metal joint epoxy 150 having good heat transfer.

즉, 상기 금속인쇄회로기판(110)과 방열강판(140) 사이에는 금속접합에폭시(150) 층이 형성되는데, 상기 금속접합에폭시(150)는 금속인쇄회로기판(110)과 방열강판(140)의 접합을 가능하게 하되, 금속인쇄회로기판(110)으로부터 방열강판(140)으로의 열전달을 저해하지 않도록 마련된다.That is, a metal junction epoxy 150 layer is formed between the metal printed circuit board 110 and the heat dissipation steel plate 140. The metal junction epoxy 150 is a metal printed circuit board 110 and the heat dissipation steel plate 140. The bonding is possible, but is provided so as not to inhibit heat transfer from the metal printed circuit board 110 to the heat dissipation steel plate 140.

상기 금속접합에폭시(150)는 고온에서 유기용제 및 바인더 성분이 증발하고 금속 성분의 경화에 의하여 접착층이 유지되므로 보다 효과적인 방열성 접착층이 형성될 수 있다.The metal bonding epoxy 150 may form a more effective heat dissipating adhesive layer because the organic solvent and the binder component evaporate at a high temperature and the adhesive layer is maintained by hardening the metal component.

이상, 본 발명을 바람직한 실시예를 사용하여 상세히 설명하였으나, 본 발명의 범위는 설명된 특정 실시예에 한정되는 것은 아니며, 당해 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 범위 내에서 얼마든지 구성요소의 치환과 변형이 가능한바, 이 또한 본 발명의 권리에 속하게 된다.
As mentioned above, although this invention was demonstrated in detail using the preferable Example, the scope of the present invention is not limited to the specific Example described, and the person of ordinary skill in the art is not limited within the scope of this invention. Substitution and modification of the components are possible, which also belongs to the rights of the present invention.

100 : LED 모듈 110 : 금속인쇄회로기판
120 : 절연층 121 : 장착홀
122 : 회로패턴 130 : LED셀
140 : 방열강판 150 : 금속접합에폭시100: LED module 110: metal printed circuit board
120: insulating layer 121: mounting hole
122: circuit pattern 130: LED cell
140: heat dissipation steel sheet 150: metal bonded epoxy

Claims (4)

금속인쇄회로기판(110);
상기 금속인쇄회로기판(110)의 상면에 배치되며, 일정한 간격으로 장착홀(121)이 천공되고, 상기 장착홀 주위로 회로패턴(122)이 구비된 절연층(120);
상기 장착홀(121)에 설치되는 LED셀(130)의 방열성능이 향상되도록, 상기 절연층(120)에 의해 가로막히지 않고 상기 회로패턴(122)을 관통하도록 상기 금속인쇄회로기판(110)에 직접 접촉되어 상기 장착홀(121)에 설치되는 LED셀(130);
상기 금속인쇄회로기판(110)의 하면에 배치되어 금속인쇄회로기판(110)으로 부터 전달받은 열을 방출하는 방열강판(140); 을 포함하되, 상기 방열강판(140)은 흑색강판으로 구성되고, 상기 금속인쇄회로기판(110)은 열전도성이 우수한 마그네슘 재질이 0.2~0.4mm 두께로 이루어지고, 상기 절연층은(120)은 유리질 성분을 갖는 DLC(Diamond Like Carbon) 코팅층이 2~5um 두께로 이루어지며, 상기 금속인쇄회로기판(110)과 상기 방열강판(140)은 열전달이 좋은 고온경화형 금속접합에폭시(150)를 통해 접합 되는 것을 특징으로 하는 방열 성능이 개선된 조명용 엘이디 모듈.
A metal printed circuit board 110;
An insulating layer 120 disposed on an upper surface of the metal printed circuit board 110 and having a mounting hole 121 drilled at regular intervals and having a circuit pattern 122 around the mounting hole;
In order to improve heat dissipation performance of the LED cell 130 installed in the mounting hole 121, the metal printed circuit board 110 may pass through the circuit pattern 122 without being blocked by the insulating layer 120. LED cells 130 which are directly contacted and installed in the mounting holes 121;
A heat dissipation steel plate 140 disposed on a lower surface of the metal printed circuit board 110 and dissipating heat transferred from the metal printed circuit board 110; Including, but the heat dissipation steel plate 140 is composed of a black steel plate, the metal printed circuit board 110 is made of a magnesium material excellent in thermal conductivity 0.2 ~ 0.4mm thickness, the insulating layer 120 is DLC (Diamond Like Carbon) coating layer having a glassy component is made of 2 ~ 5um thickness, the metal printed circuit board 110 and the heat dissipation steel plate 140 is bonded through a high temperature hardening type metal bonding epoxy 150 with good heat transfer. LED module for improved heat dissipation, characterized in that.
삭제delete 삭제delete 삭제delete
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Publication number Priority date Publication date Assignee Title
KR100646093B1 (en) * 2004-12-17 2006-11-15 엘지이노텍 주식회사 Light emitting device package
KR100824717B1 (en) * 2006-04-07 2008-04-24 박종길 Heat radiation board and its manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100646093B1 (en) * 2004-12-17 2006-11-15 엘지이노텍 주식회사 Light emitting device package
KR100824717B1 (en) * 2006-04-07 2008-04-24 박종길 Heat radiation board and its manufacturing method

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