KR101221336B1 - Light emitting device and method of fabricating the same - Google Patents

Abstract

A light emitting device and a method of manufacturing the same are disclosed. This light emitting element includes a buffer layer formed on a substrate. A plurality of rod-shaped light emitting cells are spaced apart from each other on the buffer layer. The light emitting cells have an N layer, an active layer, and a P layer, respectively. Meanwhile, the light emitting cells spaced apart by wires are connected in series. At least one of the N layer and the P layer has a cylindrical rod shape. Accordingly, by connecting the light emitting cells to be driven by the current flowing in the opposite direction using an electric wire, it is possible to provide a light emitting device that can be driven directly by using an AC power source.

Description

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME}

The present invention relates to a light emitting device, and more particularly, to a light emitting device having a plurality of light emitting cells that can be driven directly by using an AC power supply by having a plurality of light emitting cells forming series arrays on one substrate. will be.

A light emitting diode is a photoelectric conversion semiconductor device having a structure in which an N-type semiconductor having a majority carrier as an electron and a P-type semiconductor having a plurality of carriers are bonded to each other, and emits predetermined light by recombination of these electrons and holes. Such a light emitting diode is used as a display device and a backlight, and is replacing a conventional incandescent lamp and a fluorescent lamp, and is widening its use area for general lighting purposes.

Light emitting diodes consume less power and have a longer lifetime than conventional light bulbs or fluorescent lamps. Compared with a conventional lighting device, the power consumption of the light emitting diode is only a few to several tens of times, and the lifetime is several to several tens of times, which is very excellent in terms of power consumption reduction and durability.

However, the light emitting diode repeats on / off in accordance with the direction of the current. Therefore, when the light emitting diode is directly connected to the AC power supply, there is a problem that is easily broken. Therefore, it is difficult to connect such a light emitting element directly to a home AC power source and use it for general lighting.

The technical problem to be achieved by the present invention is to provide a light emitting device made of light emitting diodes, which can be driven by directly connecting to an AC power source.

Another object of the present invention is to provide a method of manufacturing a light emitting device that can be driven by directly connecting to an AC power source.

In order to achieve the above technical problem, an aspect of the present invention provides a light emitting device having a plurality of light emitting cells connected in series. The light emitting device according to an aspect of the present invention includes a buffer layer formed on a substrate. A plurality of rod-shaped light emitting cells are spaced apart from each other on the buffer layer. Each of the plurality of light emitting cells includes an N layer, an active layer, and a P layer. Meanwhile, wires connect the spaced light emitting cells in series or in parallel. Accordingly, by connecting the array of light-emitting cells connected in series to be driven by the current flowing in the opposite direction, it is possible to provide a light emitting device that can be driven directly by using an AC power source.

The light emitting device of the present invention has a plurality of light emitting diodes on one substrate. Therefore, the "light emitting cell" means each of the plurality of light emitting diodes formed on one substrate. In addition, the "serial light emitting cell array" means a structure in which a plurality of light emitting cells are connected in series.

On the other hand, an electrode may be interposed between the wire and the P layer. The electrode forms a ohmic contact with the P layer to lower the junction resistance.

Another aspect of the present invention provides a method of manufacturing a light emitting device having a plurality of light emitting cells connected in series. The manufacturing method according to another aspect of the present invention includes forming a buffer layer on a substrate. A plurality of stacked bar light emitting cells in which N layers, active layers, and P layers are sequentially formed are formed on the buffer layer. Thereafter, the P layer and some of the active layers are sequentially etched until some of the N layers are exposed. As a result, a plurality of light emitting cells are formed. In addition, wires connecting the exposed N layers and the etched P layer are formed to connect the plurality of light emitting cells in series or in parallel. According to another aspect of the present invention, it is possible to provide a light emitting device having a plurality of light emitting cells connected in series that can be driven by being connected directly to an AC power source. In addition, since the stacked bars spaced apart from each other on the buffer layer can be formed, the etching process for separating the light emitting cells can be omitted.

On the other hand, after forming the insulating film, an electrode may be formed on the P layer. The electrode forms an ohmic contact with the P layer to reduce the junction resistance.

According to embodiments of the present invention, it is possible to provide a light emitting device which is made of light emitting diodes and which can be driven by being connected directly to an AC power source. Therefore, the light emitting device can be used for general lighting using a household AC power source. In addition, it is possible to provide a method of manufacturing a light emitting device that can be driven by directly connecting to an AC power source. According to this method, the etching process for separating the light emitting cells can be omitted.

1 is a circuit diagram illustrating an operation principle of a light emitting device having a plurality of light emitting cells connected in series according to an embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing a light emitting device having a plurality of light emitting cells connected in series according to an embodiment of the present invention.
3A to 5 are cross-sectional views illustrating a method of manufacturing a light emitting device having a plurality of light emitting cells connected in series according to an embodiment of the present invention. 3B is a perspective view of FIG. 3A.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a circuit diagram illustrating an operation principle of a light emitting device having a plurality of light emitting cells according to an embodiment of the present invention.

Referring to FIG. 1, light emitting cells 51a, 51b, and 51c are connected in series to form a first serial array 51, and another light emitting cells 53a, 53b, and 53c are connected in series to form a second series. The array 53 is formed.

Both ends of the first and second series arrays 51 and 53 are connected to the AC power source 55 and the ground, respectively. The first and second series arrays are connected in parallel between the AC power source 55 and ground. That is, both ends of the first and second series arrays are electrically connected to each other.

Meanwhile, the first and second series arrays 51 and 53 are arranged to drive the light emitting cells by currents flowing in opposite directions. That is, as illustrated, the anode and cathode of the light emitting cells included in the first series array 51 and the anode and the cathode of the light emitting cells included in the second series array 53 are opposite to each other. Is placed.

Therefore, when the AC power source 55 is in a positive phase, the light emitting cells included in the first series array 51 are turned on to emit light, and the light emitting cells included in the second series array 53 are turned off. On the contrary, when the AC power source 55 is in a negative phase, the light emitting cells included in the first series array 51 are turned off, and the light emitting cells included in the second series array 53 are turned on.

As a result, the first and second series arrays 51 and 53 alternately turn on and off by AC power so that the light emitting device including the first and second series arrays continuously emits light. Release.

The light emitting chips consisting of one light emitting diode may be connected and driven using an AC power source as in the circuit of FIG. 1, but the space occupied by the light emitting chips increases. However, since the light emitting device of the present invention can be driven by connecting an AC power source to one chip, the space occupied by the light emitting device does not increase.

Meanwhile, the circuit of FIG. 1 is configured such that both ends of the first and second series arrays are connected to the AC power source 55 and the ground, respectively, but the both ends may be connected to both terminals of the AC power source. In addition, the first and second series arrays are each composed of three light emitting cells, but this is only an example to help explain, and the number of light emitting cells may be further increased as necessary. In addition, the number of the serial arrays may be further increased.

2 is a flowchart illustrating a method of manufacturing a light emitting device having a plurality of light emitting cells connected in series according to an embodiment of the present invention, and FIGS. 3A to 5 illustrate a method of manufacturing a light emitting device according to the flowchart. Sections for doing so. 3B is a perspective view of FIG. 3A.

2 and 3A, a substrate 21 on which light emitting cells are to be prepared is prepared (step 1). The substrate 21 may include sapphire (Al ₂ O ₃ ), silicon carbide (SiC), zinc oxide (ZnO), silicon (Si), gallium arsenide (GaAs), gallium phosphorus (GaP), and lithium aluminum-aluminum oxide (LiAl _2). O ₃ ), boron nitride (BN), aluminum nitride (AlN) or gallium nitride (GaN) substrates. The substrate 21 is selected in consideration of the lattice constant of the semiconductor layer to be formed thereon. For example, when a GaN-based semiconductor layer is formed on the substrate 21, the substrate 21 is preferably a sapphire substrate.

A buffer layer 23 is formed on the substrate 21 (step 3). The buffer layer 23 is used to relieve stress due to the lattice constant difference between the semiconductor layer and the substrate 21 to be formed thereon. As the buffer layer, a semiconductor layer such as III-N series, that is, AlN, GaN or InN, may be used. In this case, impurities are not doped separately to prevent excessive current from flowing through the buffer layer 23. The buffer layer 23 may be formed using hydride vapor phase epitaxy (HVPE), chemical vapor deposition (CVD), or metal organic chemical vapor deposition (MOCVD). Therefore, it is possible to form the buffer layer 23 thinly.

N-type semiconductor bars 25, active layer 27, and P-type semiconductor bars 29 are sequentially stacked on the buffer layer 23 to form stacked bars 26 (step 5). The stacked bars 26 can be formed using HVPE, CVD and MOCVD. In this case, as illustrated in FIG. 3B, the stacked bars 26 are formed to be spaced apart from each other on the buffer layer 23. In addition, as shown in FIG. 3B, the N-type semiconductor rod 25 may have a cylindrical shape, and the P-type semiconductor rod 29 may also have a cylindrical shape. In addition, the stacking bars 26 may have a cylindrical shape.

The N-type semiconductor rod may be GaN doped with an impurity such as silicon (Si), and the P-type semiconductor rod may be GaN doped with an impurity such as magnesium (Mg). On the other hand, the active layer 27 generally has a multilayer film structure in which a quantum well layer and a barrier layer are repeatedly formed. The quantum well layer and the barrier layer may be formed using an Al _x In _y Ga _{1 −x− y} N (0 ≦ x, y ≦ 1, 0 ≦ x + y ≦ 1) compound, and may be N-type or P-type. Impurities may be injected.

An insulating film 31 is formed on the substrate having the stacked bars 26 to fill empty spaces between the stacked bars 26 (step 7). The insulating layer 31 may be formed of a silicon oxide layer (SiO ₂ ) using chemical vapor deposition (CVD). After chemical vapor deposition is used to form a silicon oxide film of sufficient thickness, the insulating film is planarized until the top surfaces of the stacked bars 26 are exposed. As a result, an insulating film 31 filling the empty space is formed, and the laminated bars 26 are exposed on the upper surface of the insulating film.

2 and 4, an electrode 33 may be formed on the exposed stacked bars 26. The electrode 33 may be formed by forming an electrode layer on the substrate on which the insulating layer 31 is formed and patterning the electrode layer. The electrode 33 is formed on the P-type semiconductor rod 29 to form an ohmic contact with the P-type semiconductor rod 29.

2 and 5, the P-type semiconductor rod 29 and the active layer are etched to expose the N-type semiconductor rods 25. As a result, light emitting cells 26a including the N-type semiconductor rod 25, the etched active layer 27a, and the etched P-type semiconductor rod 29a are formed (step 11).

While etching the P-type semiconductor rod 29 and the active layer 27, the adjacent insulating layer 31 may be etched. In addition, the electrode 33 may be formed during the present etching process. That is, after the electrode layer is formed, the electrode 33 may be formed by sequentially etching the P-type semiconductor rod and the active layer together with the electrode layer. In this case, a separate patterning process for forming the electrode 33 may be omitted.

Thereafter, metal wires 35 are formed to electrically connect the N-type semiconductor rod 25 and the etched P-type semiconductor rod (step 13). The metal wires connect adjacent light emitting cells 26a in series, thereby forming a series light emitting cell array. The metal wires connect the N-type semiconductor rod 25 and the electrode 33. In addition, before forming the metal wires 35, an electrode for forming an ohmic contact may be additionally formed on the exposed N-type semiconductor bar.

Meanwhile, when the metal wires form an ohmic contact with the P-type semiconductor bar 29a, the electrode 33 may be omitted.

The metal wires 35 may be formed by an air bridge or a step-coverage method. Meanwhile, the N-type semiconductor rod 25 and the P-type semiconductor rod 29a in the same light emitting cell 26a, and the N-type semiconductor rod 25 and the active layer 27a are directly and electrically connected by the metal wiring 35. Spacers (not shown) may be formed on sidewalls of the P-type semiconductor rod 29a and the active layer 27a to prevent them from being connected.

At least two series of light emitting cell arrays may be formed on the substrate 21 by the metal wires 35, and the arrays are connected to a power source to be driven by currents flowing in opposite directions. Accordingly, a light emitting device capable of driving by directly connecting to an AC power source can be manufactured. In addition, according to the embodiment of the present invention, since the stacked bars 26 are spaced apart from each other, an etching process for electrically separating the light emitting cells may be omitted.

Hereinafter, the structure of a light emitting device according to an aspect of the present invention will be described in detail.

Referring back to FIG. 5, the light emitting device includes a substrate 21. The substrate 21 may be a sapphire substrate. The buffer layer 23 is positioned on the substrate. The buffer layer 23 may be GaN formed using MOCVD.

A plurality of light emitting cells 26a spaced apart from each other are disposed on the buffer layer 21. Each of the light emitting cells includes an N-type semiconductor bar 25, an etched P-type semiconductor bar 29a, and an etched active layer 27a interposed between the N-type semiconductor bar and the P-type semiconductor bar.

The N-type semiconductor rods may be N-type impurities such as GaN doped with Si, and the P-type semiconductor rods 29a may be P-type impurities such as GaN doped with Mg. In addition, the etched active layer 27a may have a multilayer structure in which a quantum well layer and a barrier layer are repeatedly formed. The quantum well layer and the barrier layer may be formed using an Al _x In _y Ga _{1 −x− y} N (0 ≦ x, y ≦ 1, 0 ≦ x + y ≦ 1) compound, and may be N-type or P-type. Impurities may be injected.

The active layer 27a and the P-type semiconductor rod 29a have a smaller area than the N-type semiconductor rod 25. Thus, a portion of the N-type semiconductor rod 25 is exposed. Metal wires 35 connect the exposed N-type semiconductor bars 25 and P-type semiconductor bars 29a, respectively, to form light emitting cell arrays connected in series.

As shown, the light emitting cells 26a may be connected in series in a straight line, but are not limited thereto and may be connected in a zigzag manner on the substrate 21.

Meanwhile, an electrode 33 may be interposed between the metal wires 35 and the P-type semiconductor bar 29a. The electrode 33 forms an ohmic contact with the P-type semiconductor rod 29a to reduce the junction resistance.

In addition, an insulating layer 31 may be interposed between the light emitting cells 26a and the metal wires 35. The insulating layer 31 may be a silicon oxide layer. In addition, a spacer (not shown) may be interposed between the metal wires 35, the etched P-type semiconductor rod 29a, and the etched active layer 27a. The spacer may be adopted to separate the metal wiring from the P-type semiconductor rod 29a and the active layer 27a.

21: substrate, 23: buffer layer,
25: N-type semiconductor rod, 26a: light emitting cell,
27a: etched active layer, 29a: etched P-type semiconductor rod,
31: insulating film, 33: electrode,
35: metal wiring

Claims (14)

A buffer layer formed on the substrate;
A plurality of light emitting cells formed on the buffer layer so as to be spaced apart from each other, each having an N layer, an active layer, and a P layer;
Wires that connect the spaced light emitting cells in series to form a first series array of light emitting cells;
At least one of the N layer and the P layer is a cylindrical rod shape,
Each of the active layer and the P layer includes a side extending in a direction away from the buffer layer, the side of the active layer and the side of the P layer is an etched surface,
At least a portion of the surface of the N layer extending in a direction away from the buffer layer is an unetched surface. The method according to claim 1,
The buffer layer is a light emitting device, characterized in that the III-N-based material. The method according to claim 1,
Wherein the rod-shaped light emitting cells are formed of a gallium nitride compound. The method according to claim 1,
The light emitting device further comprises an insulating film filling the empty space between the light emitting cells. The light emitting device of claim 4, wherein an upper surface of the P layer is coplanar with an upper surface of the insulating layer. The method according to claim 1,
A plurality of second light emitting cells formed on the buffer layer so as to be spaced apart from each other, each having an N layer, an active layer, and a P layer; And
Wires that connect the spaced light emitting cells in series to form a second series array of the second light emitting cells;
Wherein the first series array of light emitting cells is driven by a positive phase of AC power, and the second series array of second light emitting cells is arranged to be driven by a negative phase of AC power. . Forming a buffer layer on the substrate,
Forming a plurality of stacked rod-shaped light emitting cells on the buffer layer, each of the light emitting cells has an N layer, an active layer and a P layer from the buffer layer,
Etching the P layers and the active layers until the N layers are partially exposed,
Connecting each of the exposed portions of the N layers to the P layer of an adjacent light emitting cell via wires,
At least one of the N layer and the P layer is a cylindrical rod shape,
Each of the active layer and the P layer includes a side extending in a direction away from the buffer layer, the side of the active layer and the side of the P layer is an etched surface,
At least a portion of the surface of the N layer extending in a direction away from the buffer layer is a non-etched surface. delete delete The method of claim 7,
Further comprising forming an insulating film,
The upper surface of the buffer layer includes first regions and a second region surrounding the first regions, and the light emitting cells are respectively formed on the upper surface of the buffer layer directly in the first regions, and the insulating layer is The light emitting device manufacturing method is formed on the upper surface of the buffer layer directly in the second region. The method of claim 10,
Expose some of the light emitting cells,
Forming an electrode layer on the exposed part of the light emitting cells,
And forming an electrode on the light emitting cells by patterning the electrode layer. The method of claim 10,
Expose some of the light emitting cells,
Forming an electrode layer on the exposed part of the light emitting cells,
Further comprising the step of patterning the electrode layer and the P layer and the active layer of the plurality of light emitting cells in sequence,
A method of manufacturing a light emitting device in which an electrode is formed on each of the light emitting cells by patterning the electrode layer. The method of claim 12,
The wires are metal wires,
The insulating layer is a light emitting device manufacturing method interposed between the metal wiring and the side of each of the light emitting cells. The method according to claim 13,
By connecting the N and P layers of adjacent light emitting cells to form a series array of at least two light emitting cells,
Anti-parallel coupling the at least two series arrays,
The light emitting device is a light emitting device manufacturing method that is driven using an AC power source.

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