KR101217518B1 - 증착 원료 공급 장치 및 이를 구비하는 박막 증착 장치 - Google Patents
증착 원료 공급 장치 및 이를 구비하는 박막 증착 장치 Download PDFInfo
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- KR101217518B1 KR101217518B1 KR1020080028353A KR20080028353A KR101217518B1 KR 101217518 B1 KR101217518 B1 KR 101217518B1 KR 1020080028353 A KR1020080028353 A KR 1020080028353A KR 20080028353 A KR20080028353 A KR 20080028353A KR 101217518 B1 KR101217518 B1 KR 101217518B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2812/00—Indexing codes relating to the kind or type of conveyors
- B65G2812/02—Belt or chain conveyors
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- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
Claims (17)
- 회전공간을 갖는 몸체부;상기 회전공간 내에서 회전 가능하도록 배치된 회전몸체와, 상기 회전몸체에 위치하여 각기 일정거리 이격되어 형성된 복수의 홈을 구비하는 원료 유량 조절부;상기 원료 유량 조절부의 상부에 위치하며 원료 물질이 저장된 원료 저장부;상기 원료 저장부에 마련되어 상기 원료 유량 조절부의 적어도 하나의 홈에 원료 물질을 충진시키는 원료 입력부;상기 원료 유량 조절부의 하부에 위치하여 상기 홈에 충진된 원료 물질을 공급받는 원료 출력부;상기 원료 출력부와 연통되어 상기 원료 출력부에 노출된 홈에 캐리어 가스를 분사하는 가스 공급관;상기 캐리어 가스를 상기 가스 공급관에 공급하는 캐리어 가스 공급부를 포함하는 증착 원료 공급 장치.
- 삭제
- 청구항 1에 있어서,상기 원료 유량 조절부는 상기 회전몸체의 상면으로 돌출되어 위치하며 각기 일정거리 이격되어 형성된 복수의 톱니와, 상기 복수의 톱니 사이에 마련된 홈을 구비하는 증착 원료 공급 장치.
- 청구항 1에 있어서,상기 원료 유량 조절부는 상기 회전몸체의 내측으로 형성되며 각기 일정거리 이격되어 배치된 복수의 홈을 구비하는 증착 원료 공급 장치.
- 청구항 1에 있어서,상기 원료 유량 조절부는 상기 회전몸체에 연결된 회전축;상기 회전축을 회전시키는 회전부재를 구비하는 구동부를 더 포함하는 증착 원료 공급 장치.
- 청구항 5에 있어서,상기 구동부를 이용하여 회전몸체가 회전하는 회전속도를 제어하여 상기 회전몸체에 형성된 홈이 원료 입력부에 노출되는 시간을 조절함으로써 상기 홈에 충진되는 원료 물질의 양을 조절하는 증착 원료 공급 장치.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 박막을 증착하는 증착 장치;상기 증착 장치에 원료 물질을 제공하는 증착 원료 공급 장치를 포함하고,상기 증착 원료 공급 장치는 회전공간을 갖는 몸체부와, 상기 회전공간 내에 위치하여 회전하며, 각기 일정거리 이격되어 형성된 복수의 홈을 구비하는 원료 유량 조절부와, 상기 원료 유랑 조절부의 상부에 위치하며 원료 물질이 저장된 원료 저장부와, 상기 원료 저장부에 마련되어 상기 원료 유량 조절부의 적어도 하나의 홈에 원료 물질을 충진시키는 원료 입력부와, 상기 원료 유량 조절부의 하부에 위치하여 상기 홈에 충진된 원료 물질을 공급받는 원료 출력부와, 상기 원료 출력부와 연통되어 상기 원료 출력부에 노출된 홈에 캐리어 가스를 분사하는 가스 공급관을 포함하는 박막 증착 장치.
- 청구항 16에 있어서,상기 캐리어 가스를 분사하는 가스 공급관은 상기 가스 공급관에 설치된 제1밸브로 캐리어 가스를 조절하여 상기 원료 출력부 상측으로 분사될 수 있도록 배치되는 박막 증착 장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080028353A KR101217518B1 (ko) | 2008-03-27 | 2008-03-27 | 증착 원료 공급 장치 및 이를 구비하는 박막 증착 장치 |
TW097147522A TW200942639A (en) | 2007-12-07 | 2008-12-05 | Deposition material supplying module and thin film deposition system having the same |
US12/329,577 US20090145358A1 (en) | 2007-12-07 | 2008-12-06 | Deposition material supplying module and thin film deposition system having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080028353A KR101217518B1 (ko) | 2008-03-27 | 2008-03-27 | 증착 원료 공급 장치 및 이를 구비하는 박막 증착 장치 |
Related Child Applications (1)
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KR1020120075868A Division KR101351437B1 (ko) | 2012-07-12 | 2012-07-12 | 증착 원료 공급 장치 및 이를 구비하는 박막 증착 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20090103024A KR20090103024A (ko) | 2009-10-01 |
KR101217518B1 true KR101217518B1 (ko) | 2013-01-02 |
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KR1020080028353A Expired - Fee Related KR101217518B1 (ko) | 2007-12-07 | 2008-03-27 | 증착 원료 공급 장치 및 이를 구비하는 박막 증착 장치 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311446A (ja) * | 1992-05-06 | 1993-11-22 | Matsushita Electric Ind Co Ltd | 有機金属化合物の粉末供給装置および気化供給装置 |
JP2000199066A (ja) * | 1998-12-30 | 2000-07-18 | Hyundai Electronics Ind Co Ltd | 液体運送装置 |
KR20070075767A (ko) * | 2006-01-16 | 2007-07-24 | 주식회사 테라세미콘 | 화학기상증착장치의 소스파우더 공급장치 |
KR20090072438A (ko) * | 2007-12-28 | 2009-07-02 | 주성엔지니어링(주) | 증착 원료 공급 장치 및 이를 구비하는 박막 증착 시스템 |
-
2008
- 2008-03-27 KR KR1020080028353A patent/KR101217518B1/ko not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311446A (ja) * | 1992-05-06 | 1993-11-22 | Matsushita Electric Ind Co Ltd | 有機金属化合物の粉末供給装置および気化供給装置 |
JP2000199066A (ja) * | 1998-12-30 | 2000-07-18 | Hyundai Electronics Ind Co Ltd | 液体運送装置 |
KR20070075767A (ko) * | 2006-01-16 | 2007-07-24 | 주식회사 테라세미콘 | 화학기상증착장치의 소스파우더 공급장치 |
KR20090072438A (ko) * | 2007-12-28 | 2009-07-02 | 주성엔지니어링(주) | 증착 원료 공급 장치 및 이를 구비하는 박막 증착 시스템 |
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