KR101213094B1 - 증착 장치 - Google Patents
증착 장치 Download PDFInfo
- Publication number
- KR101213094B1 KR101213094B1 KR1020050062099A KR20050062099A KR101213094B1 KR 101213094 B1 KR101213094 B1 KR 101213094B1 KR 1020050062099 A KR1020050062099 A KR 1020050062099A KR 20050062099 A KR20050062099 A KR 20050062099A KR 101213094 B1 KR101213094 B1 KR 101213094B1
- Authority
- KR
- South Korea
- Prior art keywords
- deposition
- opening
- adjustment means
- vapor
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (2)
- 기판 표면으로의 증착막 형성 공정이 진행되는 챔버 및 챔버 내부에 설치된 증착원을 포함하는 증착 장치에 있어서,상기 증착원을 구성하는 셀 캡의 개구 하부에 설치되고, 개구 조절 수단 구동용 구동부의 가동에 따라 원주 방향 및 반경 방향으로 이동 가능한 단위 부재들을 포함하여 자신의 중앙부의 개방 정도를 조절하는 개구 조절 수단;상기 증착원의 일측에 설치된 증착막 두께 감지 센서; 및상기 증착막 두께 감지 센서로부터의 신호에 따라 증착막의 증착 속도를 판단하고, 상기 증착 속도에 따라 상기 개구 조절 수단 구동용 구동부를 제어하는 제어부를 구비하고;상기 제어부는 상기 증착막 두께 감지 센서의 표면에 형성되는 증착막의 질량에 따라 상기 증착막 두께 감지 센서의 진동 주파수를 계산하고, 상기 계산된 진동 주파수를 기반으로 상기 증착 속도를 판단하는 증착 장치.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050062099A KR101213094B1 (ko) | 2005-07-11 | 2005-07-11 | 증착 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050062099A KR101213094B1 (ko) | 2005-07-11 | 2005-07-11 | 증착 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070007463A KR20070007463A (ko) | 2007-01-16 |
KR101213094B1 true KR101213094B1 (ko) | 2012-12-18 |
Family
ID=38010046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050062099A Expired - Lifetime KR101213094B1 (ko) | 2005-07-11 | 2005-07-11 | 증착 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101213094B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101942471B1 (ko) | 2012-06-15 | 2019-01-28 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법 |
CN110551980B (zh) * | 2019-10-18 | 2024-05-28 | 东莞市能特自动化科技有限公司 | 可变孔径坩埚和oled成膜系统 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000107128A (ja) | 1998-10-08 | 2000-04-18 | Koonan:Kk | 眼科装置およびその開口開閉手段 |
-
2005
- 2005-07-11 KR KR1020050062099A patent/KR101213094B1/ko not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000107128A (ja) | 1998-10-08 | 2000-04-18 | Koonan:Kk | 眼科装置およびその開口開閉手段 |
Also Published As
Publication number | Publication date |
---|---|
KR20070007463A (ko) | 2007-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3924751B2 (ja) | 有機電界発光膜蒸着用蒸着源 | |
JP2008261056A (ja) | 有機電界発光層の蒸着源 | |
JP4001296B2 (ja) | 有機材料の真空蒸着方法およびその装置 | |
KR100656845B1 (ko) | 유기 전계 발광층 증착용 증착원 | |
JP2014012892A (ja) | 真空蒸着装置のための蒸発デバイス及びこのような蒸発デバイスを備える真空蒸着装置 | |
KR100974041B1 (ko) | 막 증착 장치와 막 두께 측정 방법 | |
KR101213094B1 (ko) | 증착 장치 | |
JP6291696B2 (ja) | 蒸着装置および蒸発源 | |
KR20110024223A (ko) | 증발 장치 및 이를 포함하는 진공 증착 장치 | |
JP5180469B2 (ja) | 真空蒸着装置 | |
JP2014065958A (ja) | 成膜装置 | |
KR100656820B1 (ko) | 유기 전계 발광층 증착용 증착원 | |
JP2006111961A (ja) | 蒸着源装置 | |
KR100637191B1 (ko) | 증착 장치 | |
JP4902123B2 (ja) | 有機材料用蒸発源及び有機蒸着装置 | |
KR100656851B1 (ko) | 유기 전계 발광층 증착용 증착원 | |
KR100777723B1 (ko) | 유기박막 형성장치의 가열용기 | |
TWI720651B (zh) | 成膜裝置 | |
KR101194851B1 (ko) | 증착원 | |
KR100653372B1 (ko) | 유기 전계 발광층 증착용 증착원 | |
KR100596131B1 (ko) | 유기 전계 발광층 증착용 증착원 | |
KR100623374B1 (ko) | 유기 전계 발광층 증착용 증착원 | |
KR20060118848A (ko) | 증착 장치 | |
KR20060060126A (ko) | 증착 장치 | |
KR20070020909A (ko) | 증착 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20050711 |
|
PG1501 | Laying open of application | ||
N231 | Notification of change of applicant | ||
PN2301 | Change of applicant |
Patent event date: 20080225 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20100706 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20050711 Comment text: Patent Application |
|
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110809 Patent event code: PE09021S01D |
|
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20120320 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20120927 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20121211 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20121212 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20151130 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20161118 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20161118 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20171116 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20171116 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20181114 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20181114 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20191113 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20191113 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20201119 Start annual number: 9 End annual number: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20211116 Start annual number: 10 End annual number: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20221115 Start annual number: 11 End annual number: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20231115 Start annual number: 12 End annual number: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20241118 Start annual number: 13 End annual number: 13 |