KR101207367B1 - Semiconductor cleanroom with local sealing area - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor clean room, and in particular, to a facility in which each semiconductor process installed in a clean area is carried out, respectively, as a local hermetic zone for each semiconductor self-processing facility, and at the same time, a panel and Sealing is distinguished from other areas by using a plurality of covers and the like; A fume (hazardous gas) removal device (chemical filter, web scrubber, dissolution tank) is installed at the lower part of the local enclosed area, and some of the covers inhale fumes generated from the semiconductor processing equipment existing in the local enclosed area. Connected with the fume removing device through a duct or pipe to dilute the fume and discharge it back into the room to prevent harmful gas generated from the equipment of the semiconductor manufacturing process from spreading to the area where other processes are carried out and It provides a semiconductor clean room with a local sealed area, which enables to remove harmful gases generated in the interior as soon as possible, so that the equipment is individually wrapped to prevent the diffusion of fumes, and is often exhausted and diluted. By forming individual lines in the exhaust section and installing each control damper And to adjust the displacement of the individual sections, it is possible to select the hazardous substances (fume) generated region and prevent the spread of local management to focus on the removal fast and generated by applying a regional system accordingly.

Description

Semiconductor cleanroom with local sealing area

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor clean room, and in particular, by assigning a facility where each semiconductor process proceeds individually to a locally sealed area, it is possible to prevent harmful gases generated in the facilities of the semiconductor manufacturing process from spreading to other process areas. The present invention relates to a semiconductor clean room having a local sealed area that prevents and removes harmful gases generated in the local closed area as soon as possible.

In general, in order to manufacture a semiconductor device, a number of unit processes such as a photo process, an etching process, a deposition process, a diffusion process, an ion implantation process, and the like are performed. In order to perform such unit processes, semiconductor substrates are stored in a container and transported to a unit processing apparatus in which the process is performed.

Smaller semiconductor substrates, such as 8-inch wafers in the past, were transported using open containers. However, in recent years, as wafers have been large-sized to 12 inches and highly integrated, the cost of semiconductor substrates has increased, and blocking of pollutants, which has been ignored in the past, has become more important than ever. Accordingly, a closed container has been developed, and a front opening unified pod (FOUP) is widely used as a representative example of the closed container. The semiconductor substrates are housed in a paw and loaded into a semiconductor substrate processing apparatus.

In order to load the pouf into the semiconductor substrate processing apparatus or to unload the poop from the semiconductor substrate processing apparatus, the semiconductor substrate processing apparatus must be opened. In this case, contaminants or gases inside the semiconductor substrate processing apparatus leak into the clean room.

A clean room is a closed space where suspended solids in the air are managed at a prescribed level and environmental conditions such as temperature, humidity, and pressure are kept constant as necessary. To enter the clean room, you must wear a dust-proof suit and go through an air shower. As such, the clean room thoroughly blocks the inflow of contaminants in order to suppress contamination of the semiconductor substrate and damage of the processing equipment. However, as noted above, if contaminants leak from the processing apparatus, efforts to block the entry of external contaminants into the clean room may be returned to blistering.

Contaminants can be fatal to semiconductor substrate processing processes and processing equipment, depending on their type. For example, toxic gases such as hydrogen bromide (HBr), chlorine (Cl2), and the like are used in dry etching processes such as DPSPoly processes. The bromine (Br) is known as the main component that generates the powder. When such toxic gases are diffused inside the clean room, not only the semiconductor substrate and the processing apparatus may be contaminated, but even corrosion may be caused and fatal losses may occur.

At present, contaminants diffused inside clean rooms are removed by an air circulation system. The structure of the clean room, which has been constructed and operated so far, varies according to each country, company, or product, but is generally as shown in FIG. 1.

1 is a cross-sectional view showing a conventional semiconductor clean room, which is generally a pump stage in which a vacuum pump, a scrubber and a power supply are placed, and a duct disposed on the pump stage. Plenum 100 is installed, the clean area 200 is a semiconductor device manufacturing process is in progress, the air duct 300 for circulating air in the clean room, and the central duct shaft 400 for the duct and pipe installation It consists of.

Ducts can be divided into exhaust ducts, supply ducts, main ducts and sub ducts.

The duct provided in the left side of FIG. 2 attached is an air supply duct, and the duct provided in the right side is an exhaust duct. The secondary duct corresponds to the tributary of the main duct and is installed parallel to the main duct (see attached FIG. 2). The airflow in the plenum flows parallel to the arrangement direction of the sub duct and the main duct.

The filter is installed on the upper portion of the clean area 200 to filter the contamination of the air injected into the clean area through the air duct. The fan is responsible for sending air in the plenum to the air duct. Exhaust treatment equipment is installed outside the clean room.

The duct shaft 400 is provided along the central corridor of the clean region 200, and when it is referred to FIG. 3, the duct shaft 400 is separated into a plurality of spaces enough for a person to pass through. The duct shaft is shaped to support the ceiling of the clean area. The air injected into the clean region 200 through the air duct is supplied to the field (marked with diagonal lines) where the semiconductor device manufacturing process is performed after the contaminant is filtered through the filter. The air in the field is discharged to the plenum and then injected back into the air duct using a fan. The devices installed in the plenum are devices used in the semiconductor device manufacturing process.

The clean room is a fan filter unit type or an IFU type.

2 is a plan view showing a part of the plenum of the conventional semiconductor clean room, in which the main duct 10 is arranged in the transverse direction, and the sub duct 20 is arranged in the longitudinal direction. The pump stage 30 is arranged between the sub ducts 20. The pipe 40 is provided along the edge of the pump stage 30. Equipments 50 for manufacturing a semiconductor device are arranged on the pump stage 30, and the air flow (indicated by) in the plenum flows in parallel with the installation direction of the secondary duct. Reference numeral 60 denotes the columns.

3 is a plan view illustrating a clean area of a conventional semiconductor clean room, in which an air duct 70, a duct shaft 80, and pillars 90 for supporting the clean room are disposed throughout the clean area. .

The area in which an oblique line is inside is an area where people are arranged to adjust the devices installed in the clean area, and the other area is an area where facilities for manufacturing a semiconductor device are installed.

However, the above-mentioned clean room alone is not a fundamental method of blocking the pollutant, and the cleanliness of the clean room is not improved by a certain level or more.

Furthermore, in the case of a production manufacturing line consisting of clean rooms, when a long production time passes, the generation rate of pollutants increases due to aging of processes and between processes or production equipment, while the environmental purification ability decreases, and thus harmful substances are introduced into the clean room. There is an example that cumulatively changes the characteristics of each process to affect the productivity.

Accordingly, it is required to improve the environment of the workplace to improve the quality of the product, and in particular, harmful gases (external factors; environmental gases generated from contaminated OUT DOOR AIR, finishing materials, etc .; It is an important task to keep productivity and the environment of the workplace in optimum condition by eliminating harmful substances.

In addition, as semiconductor devices become highly integrated and high performance, the value of semiconductor substrates increases rapidly as the unit process progresses, and the price of the processing apparatus for manufacturing the same increases steadily. However, damage to the semiconductor substrate and the processing apparatus is not reduced due to the problems as described above.

SUMMARY OF THE INVENTION An object of the present invention for solving the above-mentioned problems relates to a semiconductor clean room, and in particular, by assigning a facility where each semiconductor process proceeds individually to a locally sealed area, harmful gases generated in the facility of the semiconductor manufacturing process It is to provide a semiconductor clean room having a local sealed zone to prevent the diffusion of other processes to the progress area and to remove the harmful gas generated in the local closed zone as soon as possible.

A feature of the semiconductor clean room having a locally enclosed area according to the present invention for achieving the above object is a pump stage in which a vacuum pump, a scrubber and a power supply source are placed at the bottom thereof, Plenums in which ducts, such as ducts and sub ducts, are installed; Located in the upper layer of the plenum, a clean area for conducting a semiconductor device manufacturing process in which a duct shaft for duct and pipe installation is disposed along the central corridor, and installed around the clean area to circulate air in the clean area. A semiconductor clean room having an air duct, comprising: a device for each semiconductor process installed in the clean area, assigned to a locally sealed area for each semiconductor-owned process, and a panel for the local sealed area. Using a plurality of lids and the like to separate from the other areas; A removal device including a chemical filter, a web scrubber, and a melting tag is installed at a lower part of the local sealed area, and some of the cover inhales the fumes generated from the semiconductor processing equipment existing in the local sealed area to provide a duct or pipe. By connecting with the fume remover and diluting the fume and discharging it back into the room, it is possible to prevent harmful gas generated in the equipment of the semiconductor manufacturing process from spreading to other process areas and to generate harmful substances in the local closed area. It is characterized in that the gas can be removed as soon as possible.

As expected effects due to the above-described features of the present invention, since the equipment is individually wrapped and installed, it is possible to prevent the diffusion of the fume and to be frequently exhausted and diluted, and to form a mini-environment to expand the concept of the equipment. It is possible to secure space when checking equipment by integrally forming negative pressure inside and exhausting the inside.

In addition, by forming individual lines in the exhaust section and installing each control damper, it is possible to locally control the exhaust volume in individual sections, and by selecting the area where harmful substances (fumes) are generated and applying the system accordingly, local removal is quick and generated. Local focus management will prevent the spread.

1 is a cross-sectional view of a conventional semiconductor clean room
Figure 2 is a plan view of the plenum of the conventional semiconductor clean room
3 is a plan view of a clean area of a conventional semiconductor clean room;
4 illustrates a plan view of a clean area of a semiconductor clean room having a locally enclosed zone in accordance with the present invention.
5 is a plan view according to one example of the local enclosed area shown in FIG.
6 is a front, rear, left and right side view of the local enclosed area shown in FIG.
Figure 7 is an illustration of the coupling structure between the components for forming a local sealed zone according to the present invention

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, in which: FIG.

4 is a plan view illustrating a clean area of a semiconductor clean room having a locally sealed area according to the present invention, and FIG. 5 is a plan view showing an example of the local sealed area shown in FIG. 4, and FIG. 5 is an exemplary view of front, rear, left, and right sides of the local closed area shown in FIG. 5, and FIG.

4 to 6, the semiconductor clean room having a local enclosed area according to the present invention actually has a configuration of a conventional clean room as a basic configuration, and additionally with reference numeral 500 therein. The idea is to install a small number of clean rooms individually.

That is, in order to remove the main harmful gas in consideration of the installation cost, maintaining a constant positive pressure to improve the implementation of the enclosing system to install and remove the device in the room, the configuration of the enclosing system according to the present invention is harmful Create a Mini Envirment (local enclosed area) for the gas generating equipment or area and install a fume (hazardous gas) removal device (chemical filter, scrubber, melting tank) (not shown) at the bottom. By connecting pipes, the fumes are sucked in, diluted and discharged back into the clean room.

Therefore, since the clean operation of the clean room is basically maintained, fumes generated in a specific local enclosed area are first diluted and purified by the enclosing system, and then purified by the basic clean function of the entire clean room. Will be.

In this case, a standard profile is used as a support for forming a local enclosed area, and a PC panel is used as a partition and a cover, and a coupling structure thereof is illustrated in FIG. 7.

Therefore, it is a method of wrapping and installing the equipment individually, so it can prevent the diffusion of fume and exhaust and dilute it at any time.As a mini environment is formed, the negative pressure is always formed inside the unit in the expanded concept of the equipment. In this way, space can be secured when checking equipment.

In addition, by forming individual lines in the exhaust section and installing each control damper, it is possible to control the exhaust volume in the individual section locally. Local focus management will prevent the spread.

While the invention has been shown and described in connection with specific embodiments thereof, it is well known in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as indicated by the claims. Anyone who owns it can easily find out.

Claims (1)

A plenum with a pump stage on which the vacuum pump, a scrubber and a power supply are placed, and the ceiling having ducts such as a main duct and a sub duct; Located in the upper layer of the plenum, a clean area for conducting a semiconductor device manufacturing process in which a duct shaft for duct and pipe installation is disposed along the central corridor, and installed around the clean area to circulate air in the clean area. In a semiconductor clean room having an air duct:
Each of the semiconductor processes installed in the clean area is assigned to a locally sealed area for each semiconductor process, and at the same time, a plurality of panels and covers are used for the local sealed area. Separate the seals;
In the lower portion of the locally sealed area is installed a removal device consisting of a chemical filter, a web scrubber, a melting tag,
Some of the lids inhale fumes generated from the semiconductor processing equipment present in the local sealed area, connect with the fume removing device through ducts or pipes, dilute the fumes, and discharge the fumes back into the room. The semiconductor clean room having a local closed zone, characterized in that to prevent the harmful gas generated in the process to spread to other process areas and to remove the harmful gas generated in the local closed zone as soon as possible.

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