KR101206756B1 - System for vision testing of LED - Google Patents

Abstract

The present invention relates to a LED vision inspection system, conventionally a vision inspection equipment for inspection of the appearance of the strip state, equipment for marking the test results on the upper surface of the chip, equipment for marking the product information on the back of the strip and the equipment for checking the marking state Are each configured as separate equipment, and the inspection line is configured for each process to inspect the product while moving it manually, requiring a large number of workers, and a problem such as a high incidence of defects due to manual transportation of the product. In order to solve this problem, the present invention provides a loader unit for supplying a product, a vision inspection unit for vision inspection, a vision inspection result stamping unit, a material reversing unit for inverting the product, a laser marking unit for marking product information on the back surface of the strip, and marking results. The marking inspection part and the product accommodating part for vision inspection are composed on one conveying part. It is characterized by its configuration so that it can work in an inn.

Description

LED Vision Inspection System {System for vision testing of LED}

The present invention relates to a post-process inspection facility in the LED manufacturing process, and more specifically, vision inspection and inspection of the appearance and chip position and wire warping of individual chips in the completed strip state of the LED The present invention relates to an LED vision inspection system that enables laser inspection of a result and then a process inspection process in one complex equipment.

In general, the appearance status (liquid flow / liquid / liquid) and the mounted chip position for individual chips in the strip state completed in the equipment applied to the final shipment inspection which is indispensable in the LED manufacturing process Vision equipment for vision inspection of chip position, wire bending, etc., bad stamping equipment for marking good / bad condition according to the result of inspection on the vision equipment, and production lot (on the back of the finished chip) Laser equipment for stamping lot number and product number using laser is separated and inspected and laser engraved at each inspection line.

Nowadays, it is very difficult to hire workers who work on the inspection line in the high manpower era. In addition, there is a fear of material loss due to time loss due to material transfer for each process required for production in each inspection line and damage occurring during transfer.

The present invention manufactures a single facility to implement vision inspection function, good / bad identification stamping function, and laser marking function to reduce production manpower and prevent loss of time and product damage during process transfer. The goal is to provide an LED vision inspection system that can be minimized.

Such a present invention,

A loader unit for sequentially supplying an inspection target product in an LED strip state;

The strip and individual chips of the LED strip products supplied through the loader unit are imaged using a vision camera, and the appearance state (liquid flow / liquid excess / liquid under), chip position and wire mounted A vision inspection unit for inspecting a bending state;

An inspection result marking unit receiving the good / bad result information of the product which has been inspected by the vision inspection unit, and imprinting a good / bad state on the product using a laser;

A material reversal unit that is turned over to back mark the LED strip product discharged from the stamping unit as a result of the inspection;

A laser marking unit for imprinting a product identification number using a laser on a rear surface of the LED strip product inverted by the material reversing unit;

A marking inspection unit which inspects a state of the LED strip in the laser marking unit by using a vision camera;

It characterized in that it comprises a transfer unit for sequentially conveying the product supplied from the loader unit to the vision inspection unit, the inspection result stamping unit, the material reversing unit, the laser marking unit and the marking inspection unit using a conveyor belt. .

The loader part,

Magazine containing strip chips is transferred using a conveyor belt (C / V Belt), and then transferred to the material transfer rail position of the transfer unit using a cylinder clamp device, and one by one using a pusher. It is configured to.

The vision inspection unit is composed of first to third vision inspection units each comprising a pair of vision cameras.

The first vision inspection unit is a zone for inspecting the appearance of the chip. The first vision inspection unit performs vision inspection on the excess and under quantity of epoxy applied to the chip, the liquid flow and bubbles, etc. It is designed to consider the angle of reflection and the lux to make the measurement.

The second vision inspection unit is an area for inspecting the appearance of the chip. The second vision inspection unit inspects foreign matters and cracks of the chip on the surface of the chip, and the applied illumination is configured to inspect the white light at a predetermined angle from four sides.

The third vision inspection unit is configured to inspect a seating position of the chip mounted in the chip, a position of the wire, or a warpage of the wire.

The stamping part of the inspection result,

It is a device that uses laser to mark the mark of defective product on the outer surface of the chip on the strip by receiving the vision data inspected by the vision inspection unit. Is done.

The material reversal unit,

The top of the chip on the strip is a device for rotating the script 180 ° up and down to mark the product information on the back of the completed strip.

The laser marking unit,

It is a device that stamps information on the product by using laser beam on the top and back of the chip on the strip. It is a finished product with narrow space marking on the individual chip on the strip. Characterized in that it further comprises a dust collector for removing foreign matters (Dust).

The marking inspection unit,

It is a device for vision inspection of the state of the product (Device information, foreign object, letter position) by using the laser beam on the upper surface and back surface of the chip on the strip.

The transfer unit

The laser marking the product discharged from the first transfer unit for transferring the strip product from the loader unit to the vision inspection unit, the second transfer unit for transferring the strip product inspected by the vision inspection unit to the material reversal unit after the inspection result marking unit It consists of a third conveying unit for conveying to the marking inspection unit and the product accommodating unit via the unit.

The present invention can perform vision inspection, vision inspection result marking, and product information marking on the back of the product in the state of LED strip by a single system, so that the number of line workers can be reduced, product transfer or work inverting the product, etc. Productivity can be reduced by reducing the number of operations, and the cause of product defects can be eliminated to reduce product defects caused by inspection work.

1 is a perspective view of an LED vision inspection system according to an embodiment of the present invention.
Figure 2 is a block diagram showing the overall configuration of the LED vision inspection system according to an embodiment of the present invention.
3 is a block diagram of a vision inspection unit of the LED vision inspection system according to the present invention.
Figure 4 is a block diagram of the transfer unit of the LED vision inspection system according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of an LED vision inspection system according to an embodiment of the present invention, Figure 2 is a block diagram showing the overall configuration of the LED vision inspection system according to an embodiment of the present invention.

As shown therein,

A loader unit 10 which sequentially supplies LED strip products to be inspected;

The image of the strip and the individual chip of the LED strip product supplied through the loader unit 10 by using a vision camera to take an image appearance (liquid flow / liquid excess / liquid under) and the mounted chip position (Chip Position) and A vision inspection unit 20 for inspecting a wire bending state;

An inspection result marking unit 30 which receives the good / bad result information of the product which has been inspected by the vision inspection unit 20 and stamps a defective state on each chip in which a defect occurs using a laser;

A material reversal unit 40 that is turned upside down for marking the back surface of the LED strip product discharged from the stamping unit 30 as a result of the inspection;

A laser marking unit 50 for imprinting a unique product number on a rear surface of the LED strip product inverted by the material reversing unit 40 using a laser;

A marking inspection unit 60 for inspecting a state of the LED strip in the laser marking unit 50 using a vision camera;

The product supplied from the loader 10 is a conveyor belt using the vision inspection unit 20, the inspection result stamping unit 30, the material reversing unit 40, the laser marking unit 50 and the marking It characterized in that it comprises a transfer unit 70 for sequentially transferring to the inspection unit 60.

In addition, the marking inspection unit 60 is configured to further include a product accommodating unit 80 for receiving and receiving the final finished product.

The loader unit 10,

The magazine containing the strip chips is transferred using a conveyor belt (C / V Belt) and then transferred to the material transfer rail position of the transfer unit 70 using a cylinder clamp device, but using a pusher. It is configured to supply one by one.

3 is a block diagram of a vision inspection unit of the LED vision inspection system according to the present invention. As shown therein,

The vision inspection unit 20 includes first to third vision inspection units 21, 22, and 23 each including a pair of vision cameras.

The first vision inspection unit 21 is a zone for inspecting the appearance of the chip. The first vision inspection unit 21 vision-tests an excessive amount and a small amount of epoxy applied to the chip, and a liquid flow and bubbles. It is designed in consideration of the reflection angle and illuminance (lux) to make an accurate measurement by applying.

The second vision inspection unit 22 is an area for inspecting the appearance of the chip. The second vision inspection unit 22 inspects the foreign material and chip cracking discoloration on the surface of the chip, and the applied illumination is configured to inspect the white light at a given angle from four sides. .

The third vision inspection unit 23 is configured to inspect a seating position and a wire position or a warpage of the chip mounted in the chip.

The inspection result stamping unit 30,

It is a device that receives the vision data inspected by the vision inspection unit 20 and marks the defective product on the outer surface of the chip on the strip by using a laser. Chip marking is done.

The material reversal unit 40,

The top of the chip on the strip is a device for rotating the script 180 ° up and down to mark the product information on the back of the completed strip.

The laser marking unit 50,

It is a device that stamps information on the product by using laser beam on the top and back of the chip on the strip. It is a finished product with narrow space marking on the individual chip on the strip. Characterized in that it further comprises a dust collector for removing foreign matters (Dust).

The marking inspection unit 60,

It is a device for vision inspection of the state of the product (Device information, foreign object, letter position) by using the laser beam on the upper surface and back surface of the chip on the strip.

4 is a configuration diagram of a transfer unit of the LED vision inspection system according to the present invention.

The transfer unit 70

The first transfer unit 71 for transferring the strip product from the loader unit 10 to the vision inspection unit 20, the inspection of the strip product tested in the vision inspection unit 20, the marking result 30 and the material reversing unit 40. The second conveying unit 72 to be supplied to the product, the product inverted and discharged from the material reversing unit 40 is supplied to the marking inspection unit 60 via the laser marking unit 50 and the number of products for which the marking inspection is completed It consists of the 3rd conveying part 73 conveyed to the payment part 80.

The LED vision inspection system according to the present invention configured as described above is characterized by being configured as one facility. Therefore, when the LED strip products are mounted in the magazine in the loader unit 10 and the system operation is started, the LED strip products are supplied to the transfer unit 70 one by one by the loader unit 10. When transferred to the vision inspection unit 20 by the first transfer unit 71 of the transfer unit 70, it is placed on the first vision inspection unit 21 of the vision inspection unit 20 to align the position, and after adjusting the horizontal flatness, the vision Carry out an inspection.

The first vision inspection unit 21 acquires an LED strip product as an image by a pair of vision cameras. In this case, the reflection angle and illuminance (lux) are considered in order to make accurate measurement by applying U / V illumination as an inspection light. Set the default values of the camera installation and analysis program. Based on the acquired image, the first vision inspection unit 21 vision-examines the amount and excess amount of epoxy applied to the chip and the liquid flow and bubbles in the chip appearance.

The first vision inspection unit 21 uses a microwave (U / V light) as a bright field to illuminate the phosphor and detect a liquid-related error (too much or too little), and minimizes lens distortion. To use telecentric lens.

When the inspection of the first vision inspection unit 22 is completed, the inspection is transferred to the second vision inspection unit 22, and the white light is provided at four angles to inspect foreign substances and chipping discoloration on the chip surface. The second vision inspection unit 22 mainly inspects the white light in a bright field state in order to detect foreign matter in all wavelength bands as an area for inspecting foreign matter.

Then, the third vision inspection unit 23 inspects the seating position of the chip and the position of the wire or the warpage of the wire mounted in the chip. The third vision inspection unit 23 mainly inspects the blue light in the bright field state so that the contrast between the wire and the chip can be well seen as an area for inspecting the chip and the wire.

As such, the result information inspected while passing through the first-third vision inspection unit 21-23 by the vision inspection unit 20 is transmitted to the inspection result marking unit 30 as inspection result data, and the inspection result marking unit 30. Receives the vision data inspected by the vision inspection unit 20 and stamps the marking of defective products on the outer surface of the chip on the strip using a laser, and applies alignment vision in a job that requires accurate position stamping. Mark the chip. As a result of the inspection, the defective chip marked by the marking unit 30 is separated and processed later in the chip separation process.

When the stamping of the defective chip is completed in the stamping unit 30 as a result of the inspection, the material reversing unit 40 rotates the script 180 ° up and down to mark information on the product on the back surface of the strip where the chip upper inspection is completed. .

When the back side of the strip is placed upside down and supplied to the laser marking unit 50, the laser beam is imprinted on the upper and back surfaces of the chip on the strip to imprint information on the product. Since the narrow space marking and the pre-inspected finished product on the individual chip on the strip, the alignment by applying the alignment vision, and further comprises a dust collector for removing the dust (Dust) generated during laser engraving. That is, by including the dust collector further comprises to prevent the chip defects by removing the dust or foreign matter generated during laser engraving.

When the laser marking is completed, the marking inspection unit 60 performs a vision inspection on the state of the product (Device information, surface foreign matter, letter position) by using the laser beam on the upper and rear surfaces of the chip on the strip. .

The marking inspection result in the marking inspection unit 60 is stored as inspection result information to use the chip processing information of the process after separating and packaging the chips on the strip, and the marking inspection is completed by the transfer of the transfer unit 70 The product is transferred to the product receiving unit 80 to store the product on the strip in a magazine, and transfers the magazine containing the product to the next process.

As a result, the present invention can perform vision inspection, vision inspection result marking, and backside product information marking on the product in the state of LED strip by a single system, so that the number of line workers can be reduced, product transfer or product inversion. Productivity can be reduced by reducing the number of work lights, and the cause of product defects can be eliminated to reduce product defects caused by inspection work.

10: loader
20: vision inspection unit
21-23: 1st-3rd Vision Inspection Department
30: stamping result
40: material reversal unit
50: laser marking unit
60: marking inspection unit
70: transfer unit
80: product storage

Claims (5)

In the LED vision inspection system for inspecting the product of the LED strip state as a post-process of the LED manufacturing process,
A loader unit 10 which sequentially supplies LED strip products to be inspected;
The image of the strip and the individual chip of the LED strip product supplied through the loader unit 10 by using a vision camera to take an image appearance (liquid flow / liquid excess / liquid under) and the mounted chip position (Chip Position) and A vision inspection unit 20 for inspecting a wire bending state;
An inspection result marking unit 30 which receives the good / bad result information of the product which has been inspected by the vision inspection unit 20 and stamps a defective state on each chip in which a defect occurs using a laser;
A material reversal unit 40 that is turned upside down for marking the back surface of the LED strip product discharged from the stamping unit 30 as a result of the inspection;
A laser marking unit 50 for imprinting a unique product number on a rear surface of the LED strip product inverted by the material reversing unit 40 using a laser;
A marking inspection unit 60 for inspecting a state of the LED strip in the laser marking unit 50 using a vision camera;
The product supplied from the loader 10 is a conveyor belt using the vision inspection unit 20, the inspection result stamping unit 30, the material reversing unit 40, the laser marking unit 50 and the marking LED vision inspection system, characterized in that it comprises a transfer unit 70 for sequentially transferring to the inspection unit (60).
The method of claim 1,
LED vision inspection system, characterized in that it further comprises a product accommodating unit (80) for receiving and receiving the final finished product in the marking inspection unit (60).
According to claim 1, The vision inspection unit 20,
Each of the first to third vision inspection units 21, 22, and 23 is configured to include a pair of vision cameras,
The first vision inspection unit 21 is installed to determine a pair of camera positions and angles in consideration of the reflection angle and illuminance (lux) to apply U / V illumination as an illumination for inspection and to make accurate measurements. Vision checks for excess and underflow, liquid flow and bubbles,
The second vision inspection unit 22 provides a white light at a predetermined angle to vision inspection on foreign matter and chip cracking discoloration on the chip surface.
The third vision inspection unit (23) is a vision inspection system, characterized in that configured to perform a vision inspection for the mounting position of the chip mounted in the chip and the position of the wire or the bending of the wire.
The method of claim 1, wherein the laser marking unit 50,
LED vision inspection system comprising a dust collecting device for imprinting the information on the product using the laser beam on the upper and back of the chip on the strip, to remove the dust (Dust) generated during laser engraving.
The method of claim 1, wherein the transfer unit 70
The first transfer unit 71 for transferring the strip product from the loader unit 10 to the vision inspection unit 20, the inspection of the strip product tested in the vision inspection unit 20, the marking result 30 and the material reversing unit 40. The second conveying unit 72 to be supplied to the product, the product inverted and discharged from the material reversing unit 40 is supplied to the marking inspection unit 60 via the laser marking unit 50 and the number of products for which the marking inspection is completed LED vision inspection system, characterized in that consisting of a third transfer unit (73) for transferring to the payment (80).

Images