KR101160849B1 - Led lamp and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an LED lamp and a method for manufacturing the same, the frame portion; A printed circuit board unit disposed on one side of the frame unit; At least one light emitting diode (LED) unit mounted on one surface of the printed circuit board unit; A housing part coupled to the frame part to cover the printed circuit board part and the LED part; And a connection terminal part connected to the printed circuit board to supply power and coupled to both ends of the frame part, wherein the housing part includes at least one first plating part for reflecting light emitted from the LED part to an inner surface thereof. Including, but the first plating portion is formed in the form of one or more lines spaced apart from each other on the inner surface of the housing portion.

As a result, it is possible to efficiently disperse and diffuse the light source of the LED having a linear nature, and by dispersing and diffusing the light irradiated from the lamp, to increase the illumination range of the lamp, and to realize illumination with equal illumination and luminance. Can be.

In addition, by forming a plurality of plating portions for reflecting light, while implementing a strong adhesion strength of the plating portion, it is possible to efficiently reflect the LED light source by forming a precise plating portion.

 LED, Reflection, Plating

Description

LED lighting lamp and manufacturing method thereof {LED LAMP AND MANUFACTURING METHOD THEREOF}

The present invention relates to an LED lamp and a manufacturing method thereof, and more particularly, by forming a plurality of plating parts for reflecting the light emitted from the LED inside the lamp, to diffuse the light irradiated from the lamp to increase the illumination range of the lamp. It relates to an LED lamp and a method for manufacturing the same.

In general, what the consumer uses as a light source for lighting a dark place has been progressed from an incandescent lamp to a fluorescent lamp and a three-wavelength bulb.

Recently, lighting lamps using LEDs (Light Emitting Diodes) which consume less power and have a longer lifespan than incandescent lamps, fluorescent lamps, and three-wavelength bulbs mentioned above have been developed.

The LED is a diode which emits light by flowing a current through a pn junction of a semiconductor. When a current flows through a pn junction of a diode, electrons of an n-type semiconductor are p-type semiconductor regions, and holes of p-type semiconductor are n. Diffusion into shape semiconductor region.

These electrons and holes recombine with holes and electrons in their respective regions, emitting light of a wavelength corresponding to the energy corresponding to the forbidden bandwidth of the semiconductor.

This phenomenon is called injection type electro luminescence, and in 1907, H.J. Round observed the phenomenon of light emission when a needle was placed on silicon carbide and an electric current was applied thereto.

Following the Soviet O.V. Rosef's rediscovery has led to a great deal of research into different materials.

Such LEDs have a long lifespan and have a merit of being able to maintain a light emission state for a long time at a very low power, and thus are developing technologies that can increase their utilization.

However, the LED has a high luminance (Luminance), and since the light has a linear property that the light is not dispersed and diffused, it can be used as a light source element for display, which is extremely limited in electric and electronic devices, and can be used for general lighting. There was no problem.

For example, when the LED is used for lighting, the light source itself has a linear quality and the brightness is high, so it is only reflected in a very limited area, so that the range of light emission is narrow, and it is dazzled by low illumination and high brightness. There was a problem in that it does not exhibit the function of lighting, increasing the eye fatigue.

The present invention has been made to solve the above problems, an object of the present invention, by forming a plurality of plating parts for reflecting the light emitted from the LED inside the lamp, to disperse, diffuse the light source of the LED having a straight nature It is to provide LED lighting that can be made.

Still another object of the present invention is to provide an LED lamp that can realize illumination with an equal illuminance and brightness while increasing the illumination range of the lamp by dispersing and diffusing light irradiated from the lamp.

It is still another object of the present invention to provide an LED lamp that can reflect the LED light source efficiently by forming a plurality of plating portions for reflecting light, thereby realizing a strong adhesion strength of the plating portion, and forming a precise plating portion. There is.

The object is, according to the present invention, the frame portion; A printed circuit board unit disposed on one side of the frame unit; At least one light emitting diode (LED) unit mounted on one surface of the printed circuit board unit; A housing part coupled to the frame part to cover the printed circuit board part and the LED part; And a connection terminal part connected to the printed circuit board to supply power and coupled to both ends of the frame part, wherein the housing part includes at least one first plating part for reflecting light emitted from the LED part to an inner surface thereof. Including, the first plating portion may be achieved by an LED lamp formed of one or more spaced apart from each other on the inner surface of the housing portion.

Here, the first plating portion is extended in the longitudinal direction of the housing portion, it may be formed spaced apart from each other.

Alternatively, the first plating part may extend in the width direction of the housing part and be spaced apart from each other.

Here, the printed circuit board portion includes at least one second plating portion for re-reflecting the light reflected from the first plating portion on the mounting surface of the LED portion, wherein the second plating portion is spaced apart from each other in the printed circuit board portion It may be formed of one or more.

Here, the second plating portion may extend in the longitudinal direction of the printed circuit board portion from the mounting surface of the LED portion, it may be formed spaced apart from each other.

Alternatively, the second plating part may extend in the width direction of the printed circuit board part from the mounting surface of the LED part, and may be spaced apart from each other.

Here, an insulating member may be formed between the circuit pattern for supplying power to the LED and formed on the printed circuit board, and the circuit pattern and the second plating may be insulated from each other.

On the other hand, the frame portion includes at least one third plating portion for re-reflecting the light reflected from the first plating portion or the second plating portion on the inner surface, wherein the third plating portion is spaced apart from each other in the frame portion It may be formed as above.

Here, the third plating portion may extend in the longitudinal direction of the frame portion, and may be spaced apart from each other.

Alternatively, the third plating portion may extend in the width direction of the frame portion, and may be spaced apart from each other.

The object is, according to the present invention, the frame portion; A printed circuit board unit disposed on one side of the frame unit; At least one light emitting diode (LED) unit mounted on one surface of the printed circuit board unit; A housing part coupled to the frame part to cover the printed circuit board part and the LED part; And a connection terminal unit coupled to the printed circuit board to supply power and coupled to both ends of the frame unit. The method of manufacturing an LED lighting lamp comprising: reflecting light emitted from the LED unit to an inner surface of the housing unit; At least one first plating part is formed, wherein the first plating part is formed at least one spaced apart from each other on an inner surface of the housing part, and the housing part comprises: forming a base forming a body of the housing part; Coupling a masking member to a portion of the base that is not to be plated; Forming a first plating part by performing a plating process on a base to which the masking member is coupled; Removing the masking member from the base is completed plating may be achieved by a method of manufacturing an LED lamp formed by a method comprising a.

Here, the forming of the base may be a step of injection molding the base in a mold.

In addition, etching the surface of the base may be additionally included between forming the base and engaging the masking member.

Here, the step of coupling the masking member may be a step of injecting the base material into the masking mold mold and injecting the raw material constituting the material of the masking member into the masking mold mold in a molten state.

In addition, the removing of the masking member may be a step of dissolving the masking member by immersing the base to which the masking member is attached to a removal liquid chemically reacted with the masking member.

Meanwhile, at least one second plating part is formed on the mounting surface of the printed circuit board to reflect back light reflected from the first plating part, and the second plating parts are spaced apart from the mounting surface of the LED part. Forming at least one substrate, wherein the printed circuit board comprises: forming a substrate base forming a body of the printed circuit board; Coupling a masking member to a portion of the substrate base that is not to be plated; Forming a second plating part by performing a plating process on the substrate base to which the masking member is coupled; Removing the masking member from the substrate base on which the plating is completed.

Here, the forming of the substrate base may be a step of injection molding the substrate base in a mold.

In addition, etching the surface of the substrate base may be further included between forming the substrate base and coupling the masking member.

The coupling of the masking member may include inserting a substrate base into a masking mold and injecting raw materials constituting the material of the masking member into the masking mold in a molten state.

In addition, the removing of the masking member may be a step of dissolving the masking member by immersing the substrate base to which the masking member is attached to a removal liquid chemically reacted with the masking member.

Here, the coupling between the masking member and the forming of the second plating part may further include disposing an insulating member between the circuit pattern formed on the printed circuit board part and the second plating part.

On the other hand, the frame portion is formed on the inner surface of the at least one third plating portion for re-reflecting the light reflected from the first plating portion or the second plating portion, the third plating portion is spaced apart from each other on the inner surface of the frame portion It is formed in one or more, wherein the frame portion, forming a frame base constituting the body of the frame portion; Coupling a masking member to a portion of the frame base which should not be plated; Forming a third plating part by performing a plating process on the frame base to which the masking member is coupled; It may be formed by a method comprising a; removing the masking member from the frame base is completed plating.

Here, the forming of the frame base may be a step of injection molding the frame base in a mold.

In addition, etching the surface of the frame base may be additionally included between forming the frame base and engaging the masking member.

Here, the step of coupling the masking member may be a step of putting the frame base in the masking mold mold and injecting the raw material constituting the material of the masking member into the masking mold mold in a molten state.

In addition, the removing of the masking member may be a step of dissolving the masking member by immersing the frame base to which the masking member is attached to a removal liquid chemically reacted with the masking member.

By this invention, the light source of LED which has a linear property can be disperse | distributed and diffused efficiently.

In addition, by dispersing and diffusing the light irradiated from the lamp, it is possible to increase the illumination range of the lamp and implement lighting with equal illumination and luminance.

In addition, by forming a plurality of plating portions for reflecting light, while implementing a strong adhesion strength of the plating portion, it is possible to efficiently reflect the LED light source by forming a precise plating portion.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

Therefore, the configuration shown in the embodiments and drawings described herein are only preferred embodiments of the present invention, and do not represent all of the technical spirit of the present invention, it is possible to replace them at the time of the present application It should be understood that various equivalents and variations may exist.

1 is an exploded perspective view of an LED lighting lamp according to the present invention, Figure 2 is an installation perspective view of the LED lighting lamp according to the present invention, Figure 3 schematically shows an increase in the illumination range according to the diffusion of light of the LED lighting lamp according to the present invention. It is sectional drawing.

1 to 3, the LED lamp according to the present invention, the frame portion 10 is formed with a receiving space along the longitudinal direction; A printed circuit board unit 20 disposed in a receiving space of the frame unit 10; At least one light emitting diode (LED) unit 30 mounted on one surface of the printed circuit board unit 20; A housing part 40 coupled to the frame part 10 in a form covering the printed circuit board part 20 and the LED part 30; And a connection terminal part 50 connected to the printed circuit board part 20 to supply power, and coupled to both ends of the frame part 10, wherein the housing part 40 has the LED part on an inner side thereof. One or more first plating portions 42 for reflecting light emitted from 30.

In the LED lighting lamp according to the present invention, a printed circuit board unit 20 having a plurality of LED units 30 mounted therein is disposed inside the frame unit 10, and the housing unit 40 covers the frame unit 20. It is coupled to the portion 10, consisting of a connection terminal portion 40 coupled to both ends of the frame portion 10 is coupled to the illumination frame (F).

Here, the frame portion 10 is a component that accommodates the printed circuit board portion 20 on which the LED portion 30 is mounted and is coupled to the housing portion 40, as shown in FIGS. It may be provided as a frame of the 'u' shape on the cross section extending along the direction.

In addition, the printed circuit board 20 is a component including a circuit pattern (not shown) for mounting the LED unit 30, and emits the LED unit 30 by the supplied power, the frame It may be disposed in the receiving space of the portion (10).

Here, the printed circuit board 20 may be disposed in close contact with the inner surface of the frame 10, but is not limited thereto, and may smoothly dissipate heat generated by light emission of the LED unit 30. In order to use the spacer (not shown), the bottom surface of the printed circuit board 20 may be spaced apart by a certain height.

In addition, the LED unit 30 is a component that irradiates light by receiving power, LED unit that can emit light of various colors, such as white, green, blue, yellow, depending on the installation location, installation location of the lamp, etc. 30 may be provided.

Here, the light source of the LED unit 30 has almost no ultraviolet rays as compared to the conventional fluorescent lamps or incandescent lamps, which is advantageous to the user's health and has the advantage of low power consumption.

In addition, as shown in FIG. 1, the LED unit 30 may be selectively mounted in a plurality of configurations along the width direction or the length direction of the printed circuit board unit 20.

Here, the housing part 40 may be coupled to the frame part 10 and may be provided to cover the printed circuit board part 20 and the LED part 30 disposed on the frame part 10. .

As a result, the printed circuit board 20 and the LED unit 30 are not directly exposed to the outside, and the printed circuit board unit 20 and the LED unit 30 may be prevented from being damaged by an external impact. have.

In addition, the housing part 40 is a component provided with a translucent synthetic resin material to prevent the light emitted from the LED unit 30 is directly transmitted to the user.

Here, the housing portion 40, as shown in Figure 1, may be provided as a hemispherical housing, but is not limited to such a shape, may be provided in a variety of shapes, such as plate shape and coupled to the frame portion 10. have.

In addition, the housing part 40 may be formed with a first plating part 42 on the inner surface in order to diffuse and disperse the light source of the LED unit 30 efficiently.

Here, the first plating part 42 is a characteristic component for increasing the emission range of the LED lighting according to the present invention by diffusely reflecting the light source of the LED unit 30 having the straightness.

That is, the light source irradiated from the LED unit 30 is reflected by the first plating unit 42, and is reflected back to the second plating unit 22 and the third plating unit 42, which will be described later. It is diffusely reflected according to the reflection angle of the light source so that the linear LED light source can be dispersed and diffused.

Here, as shown in FIG. 1, the first plating part 42 is formed in the form of one or more lines spaced apart from each other on the inner surface of the housing part 40, and extends in the longitudinal direction of the housing part 40. It may be formed spaced apart from each other.

Alternatively, the first plating part 42 may extend in the width direction of the housing part 40, but may be spaced apart from each other.

In addition, the formation position and formation form of the first plating portion 42, the second plating portion 22 and the third plating portion 12 which will be described later are formed of the line provided in the longitudinal direction or the width direction as shown in FIG. It is not limited to the shape, it can be formed of a plate of various shapes provided in the selected forming position, of course.

Hereinafter, a method of manufacturing the first plating part 42 and the housing part 40 formed on the inner surface of the housing part 40 will be described in more detail.

First, the base is manufactured in a mold for injection molding the base forming the body of the housing part 40.

Here, the base may use various inorganic materials such as ceramics, glass, liquid crystal polymer (LCP), polyphenylene sulfide (PPS), etc., in addition to synthetic resins such as thermoplastic resins and thermosetting resins.

Next, an etching process for etching the surface of the prepared base is performed.

Here, the base etching step is a step of uniformly etching the entire outer surface of the base, the etching portion is formed on the entire surface of the base, the etching portion is a microscopic bending formed on the surface area of the base, which will be described later. It is a bend to improve the bonding force between the plating layer to be plated on the first plating portion 42 and the masking member adhered to the non-plating portion which should not be plated.

Next, a process of coupling the masking member to the non-plating portion that does not require plating on the base is performed.

Here, the step of coupling the masking member is a step of molding by injecting the raw material constituting the material of the masking member in a molten state by putting the base in the masking die.

That is, the masking mold is formed by forming a molding groove of the shape that the masking member is to be seated in the molding groove of the shape corresponding to the base, whereby, when the base is seated in the molding groove of the masking mold mold masking In the portion where the member is to be molded, a space for introducing the raw material of the masking member is provided.

In addition, the space into which the raw material is to be introduced is connected to the injection hole formed in the masking mold, the raw material of the masking member is injected into the molten state through the injection hole is injection molded and coupled to the base at the same time.

Subsequently, the raw material of the injected masking member is formed while the masking member is hardened on the surface of the non-plating part of the base when a predetermined time elapses.

Next, a process of plating the base to which the masking member is attached is performed.

Here, the plating process is preferably made by an electroless plating method, but is not limited thereto, and the plating process may be performed by various plating methods.

Finally, a housing in which the first plating portion 42 is formed on the base on which the plating process is completed, that is, the pre-selected inner surface of the housing portion 40 is performed by performing a process of removing the masking member from the plating base. Produces a portion 40.

The removing of the masking member may be performed by removing the masking member bonded to the base by immersing and melting the base in a removal liquid chemically reacted with the masking member.

At least one first plating part spaced apart from each other in the longitudinal direction or the width direction inside the housing part 40 through the manufacturing process of the first plating part 42 and the housing part 40 described above ( 42) can be formed.

Meanwhile, the printed circuit board part 20 may include one or more second plating parts 22 for re-reflecting light reflected from the first plating part 42 on the mounting surface of the LED part 30. Can be.

In addition, the second plating part 22 is formed in the form of one or more lines that are spaced apart from each other on one surface (LED mounting surface) of the printed circuit board unit 20, as shown in Figure 1, the printed circuit board Extending in the longitudinal direction of the portion 20, it may be formed spaced apart from each other.

Alternatively, the second plating part 22 may extend in the width direction of the printed circuit board part 20 and be spaced apart from each other.

That is, the light source irradiated from the LED unit 30 is diffusely reflected by the first plating unit 42 of the housing unit 40, and thus the diffusely reflected light source is diffusely reflected by the second plating unit 22 to illuminate the lamp. The lighting range of can be dispersed and diffused.

Here, an insulating member (not shown) is formed between the circuit pattern formed on the printed circuit board 20 to supply power to the LED unit 30 and the second plating 22. The pattern and the second plating part 22 may be insulated from each other.

In addition, the manufacturing method of the printed circuit board 20 is the method of forming the first plating portion 42 described above except for the step of adding an insulating member disposed between the circuit pattern and the second plating portion 22. Since it is the same as, it is noted that detailed description is omitted in order to avoid duplication of description.

Meanwhile, the frame part 10 may include one or more third plating parts 12 on the inner surface to re-reflect the light reflected from the first plating part 42 or the second plating part 22. have.

Here, as shown in FIG. 1, the third plating part 12 is formed in the form of one or more lines spaced apart from each other on the inner surface of the frame part 10, and extends in the longitudinal direction of the frame part 10. It may be formed spaced apart from each other.

Alternatively, the third plating part 12 may extend in the width direction of the frame part 10 and be spaced apart from each other.

In addition, the manufacturing method of the frame portion 10 and the third plating portion 12 is the same as the forming method of the housing portion 40 and the first plating portion 42 described above, so that the detailed description in order to avoid duplication of description. Note that the description is omitted.

In conclusion, the LED lamp according to the present invention, as shown in Figure 3, the light source irradiated from the LED unit 30 is diffusely reflected by the first plating portion 42 of the housing portion 40, so The light source is diffusely reflected back to the second plating part 22 or diffusely reflected to the third plating part 12, and the light reflection range of the lamp is dispersed and diffused by repeating the diffuse reflection process several times, and the illumination with the uniform illumination and luminance This can be implemented.

Here, the formation positions and formation directions of the first, second, and third plating parts 42, 22, and 12 are not limited to those shown in FIG. 1, and are set by a bar which is selectively designed in consideration of an illumination range and illumination. Of course it can be.

As described above, the LED lighting lamp according to the present invention can efficiently disperse and diffuse the light source of the LED having a straight property, and by dispersing and diffusing the light irradiated from the lamp, thereby increasing the lighting range of the lamp, Lighting can be realized with equal illumination and luminance.

In addition, by forming a plurality of plating portions for reflecting light, while implementing a strong adhesion strength of the plating portion, it is possible to efficiently reflect the LED light source by forming a precise plating portion.

As mentioned above, although the present invention has been described by way of limited embodiments and drawings, the technical idea of the present invention is not limited thereto, and it should be understood by those skilled in the art to which the present invention pertains. Various modifications and variations may be made without departing from the scope of the appended claims.

Since the accompanying drawings are for understanding the technical spirit of the present invention together with the detailed description of the above-described invention, the present invention should not be construed as limited to the matters shown in the following drawings.

1 is an exploded perspective view of an LED lamp according to the present invention,

Figure 2 is a perspective view of the installation of the LED lamp according to the invention,

3 is a cross-sectional view schematically showing an increase in the illumination range according to the diffusion of light of the LED lamp according to the present invention.

* Description of the symbols for the main parts of the drawings *

10 frame portion 12 third plating portion

20: printed circuit board portion 22: second plating portion

30: LED part 40: housing part

42: first plating part 50: connection terminal part

Claims (26)

A frame portion; A printed circuit board unit disposed on one side of the frame unit; At least one light emitting diode (LED) unit mounted on one surface of the printed circuit board unit; A housing part coupled to the frame part to cover the printed circuit board part and the LED part; And a connection terminal part connected to the printed circuit board part to supply power and coupled to both ends of the frame part. The housing portion includes at least one first plating portion for reflecting light emitted from the LED portion on the inner side, The first plating portion is formed of one or more spaced apart from each other on the inner surface of the housing portion, The first plating portion is extended in the longitudinal direction of the housing portion, LED lighting, characterized in that formed to be spaced apart from each other. delete The method of claim 1, The first plating portion is extended in the width direction of the housing portion, LED lighting, characterized in that formed to be spaced apart from each other. The method of claim 1, The printed circuit board portion includes at least one second plating portion for re-reflecting the light reflected from the first plating portion on the mounting surface of the LED portion, wherein the second plating portion is spaced apart from each other in the printed circuit board portion LED lighting, characterized in that formed above. The method of claim 4, wherein And the second plating part extends in the longitudinal direction of the printed circuit board part from the mounting surface of the LED part, and is formed to be spaced apart from each other. The method of claim 4, wherein And the second plating part extends in a width direction of the printed circuit board part from a mounting surface of the LED part, and is formed to be spaced apart from each other. The method of claim 4, wherein LED lighting, characterized in that formed in the printed circuit board portion is an insulating member disposed between the circuit pattern for supplying power to the LED portion and the second plating portion and the circuit pattern and the second plating portion mutually insulated. . The method of claim 4, wherein The frame part may include at least one third plating part on the inner surface of the first plating part or the second plating part to reflect back the light, wherein the third plating part may be spaced apart from each other in the frame part. LED lighting, characterized in that formed. The method of claim 8, The third plating portion is extended in the longitudinal direction of the frame portion, LED lighting, characterized in that formed to be spaced apart from each other. The method of claim 8, The third plating portion is extended in the width direction of the frame portion, LED lighting, characterized in that formed to be spaced apart from each other. A frame portion; A printed circuit board unit disposed on one side of the frame unit; At least one light emitting diode (LED) unit mounted on one surface of the printed circuit board unit; A housing part coupled to the frame part to cover the printed circuit board part and the LED part; A method of manufacturing an LED lighting device comprising: a connection terminal part connected to the printed circuit board part to supply power and coupled to both ends of the frame part. One or more first plating parts are formed on the inner side of the housing part to reflect light emitted from the LED part, The first plating portion is formed of one or more spaced apart from each other on the inner surface of the housing portion, The housing part, Shaping a base constituting the body of the housing part; Coupling a masking member to a portion of the base that is not to be plated; Forming a first plating part by performing a plating process on a base to which the masking member is coupled; Removing the masking member from the base where the plating is completed; Method of manufacturing an LED lamp, characterized in that formed by a method comprising a. The method of claim 11, wherein Forming the base is a method of manufacturing an LED lamp, characterized in that for injection molding the base in the mold. The method of claim 11, wherein And etching the surface of the base between the step of forming the base and the step of engaging the masking member. The method of claim 11, wherein The step of coupling the masking member is a method of manufacturing an LED lamp, characterized in that the base material is put into a masking mold and the raw material constituting the material of the masking member is injected into the masking mold in a molten state. The method of claim 11, wherein The removing of the masking member is a method of manufacturing an LED lamp, characterized in that the masking member is immersed in a removal liquid chemically reacted with the masking member to the base to melt the masking member. The method of claim 11, wherein At least one second plating part is formed on the printed circuit board part to re-reflect the light reflected from the first plating part on the mounting surface of the LED part. The second plating part is formed of one or more spaced apart from each other on the mounting surface of the LED, The printed circuit board unit, Forming a substrate base constituting the body of the printed circuit board; Coupling a masking member to a portion of the substrate base that is not to be plated; Forming a second plating part by performing a plating process on the substrate base to which the masking member is coupled; Removing the masking member from the substrate base on which the plating is completed; Method of manufacturing an LED lamp, characterized in that formed by a method comprising a. 17. The method of claim 16, Forming the substrate base is a method of manufacturing an LED lamp, characterized in that for injection molding the substrate base in a mold. 17. The method of claim 16, And etching the surface of the substrate base between the forming of the substrate base and the step of coupling the masking member. 17. The method of claim 16, The step of coupling the masking member is a method of manufacturing an LED lamp, characterized in that the step of putting the substrate base in the masking mold mold and the raw material constituting the material of the masking member in the molten state into the masking mold mold. 17. The method of claim 16, The removing of the masking member is a method of manufacturing an LED lamp, characterized in that the masking member is immersed in a removal liquid chemically reacted with the substrate base to which the masking member is bonded to melt the masking member. 17. The method of claim 16, LED lighting, characterized in that further comprising the step of arranging the insulating member between the second plating portion and the circuit pattern formed on the printed circuit board between the step of coupling the masking member and forming the second plating portion. Manufacturing method. 17. The method of claim 16, At least one third plating part is formed on the inner surface of the frame part to re-reflect the light reflected from the first plating part or the second plating part. The third plating portion is formed with one or more spaced apart from each other on the inner surface of the frame portion, The frame portion, Forming a frame base constituting the body of the frame part; Coupling a masking member to a portion of the frame base which should not be plated; Forming a third plating part by performing a plating process on the frame base to which the masking member is coupled; Removing the masking member from the frame base of the plating is completed; Method of manufacturing an LED lamp, characterized in that formed by a method comprising a. The method of claim 22, Forming the frame base is a method of manufacturing an LED lamp, characterized in that the injection molding the frame base in a mold. The method of claim 22, And etching the surface of the frame base between the step of molding the frame base and the step of coupling the masking member. The method of claim 22, The step of coupling the masking member is a method of manufacturing an LED lamp, characterized in that the frame base is put into a masking mold frame and the raw material constituting the material of the masking member is injected into the masking mold mold in a molten state. The method of claim 22, The removing of the masking member is a method for manufacturing an LED lamp, characterized in that the masking member is immersed in the removal liquid chemically reacts with the masking member is bonded to the masking member to melt the masking member.

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