KR101139000B1 - Setting Device of Infrared ray for Heating - Google Patents

Abstract

The present invention relates to a mounting apparatus that can easily and easily and stably mount the infrared heater on the wall or ceiling surface, and more particularly, it is easy and simple by configuring to accommodate the infrared heater in the mounting apparatus having the first frame and the binding portion. It can stably accommodate the infrared heater as well as form a protective film by external impact or breakage of the infrared heater, the first projection surface formed on the outer surface of the infrared heater and the second projection surface formed inside the housing and slidingly coupled therewith The infrared heater and the mounting device are easily and reliably combined through the bonding frame, and the adhesive contained in the internal communication path of the bonding frame is configured to leak and cure on the mating surface by the pressurizing means after sliding, thereby increasing the bonding force and externally. Vibration generated by shock or external pressurization It relates to a mounting apparatus for an infrared heater that can be buffered.
To this end, the present invention provides a mounting apparatus for attaching an infrared heater to a ceiling surface or a wall surface, the mounting apparatus comprising: a square housing having an upper and a lower opening; A first frame having a stick shape coupled to both inner sides of the upper part of the housing to stably support the upper protrusion of the infrared heater when accommodating the infrared heater; Is coupled to the inner wall surface on both sides of the lower housing to support the lower surface of the infrared heater when receiving the infrared heater or a binding portion to form a through surface through which the fixing means so that the housing can be fixed to the ceiling surface or wall surface on which the housing is mounted Wherein, the binding portion is a second frame of the stick shape is coupled to the inner wall surface on both sides of the lower housing, and the binding frame is formed of a metal material of the 'b' shape is coupled to the inner surface of the second frame by the fixing means In the lower side of the housing, the wiring of the infrared heater is discharged to the outside of the mounting apparatus, and a plurality of communication holes are formed to allow air inside the housing to circulate with the outside.

Description

Mounting device for infrared heaters {Setting Device of Infrared ray for Heating}

The present invention relates to a mounting apparatus that can easily and easily and stably mount the infrared heater on the wall or ceiling surface, and more particularly, it is easy and simple by configuring to accommodate the infrared heater in the mounting apparatus having the first frame and the binding portion. It can stably accommodate the infrared heater as well as form a protective film by external impact or breakage of the infrared heater, the first projection surface formed on the outer surface of the infrared heater and the second projection surface formed inside the housing and slidingly coupled therewith The infrared heater and the mounting device are easily and reliably combined through the bonding frame, and the adhesive contained in the internal communication path of the bonding frame is configured to leak and cure on the mating surface by the pressurizing means after sliding, thereby increasing the bonding force and externally. Vibration generated by shock or external pressurization It relates to a mounting apparatus for an infrared heater that can be buffered.

In general, indoor heating is performed in cold weather, such as winter, there are centralized heating and individual heating depending on the heating structure. In the case of central heating, offices and apartments.

However, when centralized heating is difficult in a large space, such as inside a factory, individual heating should be performed, where an infrared heater has been disclosed that emits heat by being fixed to a floor or a wall.

In order to fix the infrared heater on the wall or ceiling surface, the body and the wall of the infrared heater are fixed by fixing means such as screws and bolts, or a separate fixing device is provided to install the fixing device on the wall first. It was fixed in the form of installing.

However, such an infrared heater installation structure may cause damage to the body by fixing a part of the body of the infrared heater with a screw or bolt, etc., there is a problem in safety because the fixed coupling force is dropped when installing the wall through the fixing device.

The present invention has been made to solve the above problems and is configured to accommodate an infrared heater in a mounting apparatus having a first frame and a binding portion, and easily and stably accommodates an infrared heater, as well as external impact or damage of the infrared heater. The purpose is to provide a mounting device for infrared heaters that can form a protective film.

In addition, the second object of the present invention is easily and stably coupled to the infrared heater and the mounting device through the bonding frame is slidingly coupled with the first projection surface formed on the outer surface of the infrared heater and the second projection surface formed inside the housing, The adhesive contained in the internal communication path of the bonding frame is configured to leak and harden on the mating surface by the pressurizing means after sliding engagement, thereby increasing the bonding force and absorbing vibration generated by external shock or external pressurization. The purpose is to provide a mounting device for the instrument.

The present invention has the following features to achieve the above object.

The present invention provides a mounting apparatus for attaching an infrared heater to a ceiling surface or a wall surface, the mounting apparatus comprising: a square-shaped housing having an upper and a lower opening; A first frame having a stick shape coupled to both inner sides of the upper part of the housing to stably support the upper protrusion of the infrared heater when accommodating the infrared heater; It is coupled to the inner wall surface on both sides of the lower housing to support the lower surface of the infrared heater when receiving the infrared heater or a binding portion to form a through surface through which the fixing means so that the housing can be fixed to the ceiling surface or wall surface on which the housing is mounted Wherein, the binding portion is a second frame of the stick shape is coupled to the inner wall surface on both sides of the lower housing, and the binding frame is formed of a metal material of the 'b' shape is coupled to the inner surface of the second frame by the fixing means In the lower side of the housing, the wiring of the infrared heater is discharged to the outside of the mounting apparatus, and a plurality of communication holes are formed to allow air inside the housing to circulate with the outside.

Here, the mounting apparatus is formed in at least one horizontally on the lower wall surface of the first frame, in a horizontal position with the first projection surface formed in the horizontal direction on the outer wall surface of the infrared heater accommodated when receiving the infrared heater. It has a 2nd protrusion surface formed in the space | interval corresponding position.

In addition, the mounting apparatus is coupled to the H-beam-shaped bonding frame is formed in a shape corresponding to the sliding and coupled to the first projection surface of the infrared heater and the second projection surface of the mounting apparatus to be fixedly coupled to the infrared heater. Are combined by.

In addition, the housing has a vertical cross section of the bonding frame such that the bonding frame penetrates from the outer side of the housing to the inner side wall and the side wall adjacent to the side wall on which the second protrusion surface is formed so as to be slidably coupled to the second protrusion surface and the first protrusion surface. Sliding holes of the shape corresponding to the shape is formed, the position of the sliding hole is formed on the longitudinal extension line of the second projection surface and the first projection surface.

In addition, the bonding frame is formed in the form of the H-beam rotated 90 °, the upper and lower surfaces having a predetermined thickness and a vertical plane connecting them, the vertical surface has a communication path so that the outside of both sides of the central portion is in communication with each other. The furnace extends to the bottom of the top face and to the top of the bottom face and communicates with the outside.

In addition, an adhesive is accommodated in the communication path so that the bonding frame is slid to the first projection surface and the second projection surface of the mounting apparatus so that the first projection surface and the second projection surface of the mounting apparatus are connected by external pressing means. The adhesive leaks on the contact surface and cures.

According to the present invention is configured to accommodate the infrared heater in the mounting apparatus provided with the first frame and the binding portion, it is easy and simple and stable to receive the infrared heater, there is an effect that can form a protective film by external impact or damage.

In addition, the infrared heater and the mounting device are easily and reliably coupled through the bonding frame to be slidably coupled, and the adhesive contained in the internal communication path of the bonding frame is configured to be leaked onto the mating surface by the pressing means and then hardened by sliding means. This increases and has the effect of buffering vibration generated by external impact or external pressurization.

1 is a perspective view of a mounting apparatus according to an embodiment of the present invention.
Figure 2 is an assembled perspective view showing the combination of the infrared heater and the mounting apparatus according to an embodiment of the present invention.
Figure 3 is an assembled perspective view showing the combination of the infrared heater and the mounting apparatus according to another embodiment of the present invention.
Figure 4 is a cross-sectional view showing the infrared heater and the mounting device in accordance with another embodiment of the present invention.
5 is a perspective view of a bonding frame according to the present invention.
6 is a cross-sectional view of the bonding frame according to the present invention.

Hereinafter will be described in detail with the accompanying drawings for the mounting apparatus according to an embodiment of the present invention.

≪ Example 1 >

1 is a perspective view of a mounting apparatus according to an embodiment of the present invention, Figure 2 is an assembled perspective view showing a combination of the infrared heater and the mounting apparatus according to an embodiment of the present invention.

Referring to the drawings, the mounting apparatus 100 according to the present invention is coupled to the inner housing surface of the square 10, the upper and lower openings, both sides of the housing 10, the infrared heater 200 when receiving the infrared heater. The first frame 20 in the form of a stick for stably supporting the upper side protrusion 110 of the) and the inner side of the lower surface of the housing 10 is coupled to the inner wall surface infrared heater 200 when receiving the infrared heater 200 It consists of a binding portion 30 to form a through surface through which the fixing means so as to support the lower surface of the housing 10 is fixed to the ceiling surface or wall surface on which the housing 10 is mounted.

Here, the housing 10 has a predetermined accommodation space to accommodate the mounting apparatus 100, the upper, the lower is opened and the infrared heater 200 is mounted on the upper side by the protrusion 110, which will be described later Through the binding frame 32 of the binding portion 30 is mounted on the wall or ceiling (W) by fixing means such as screws, nails.

1 and 2 are shown in contrast to the case where the mounting apparatus 100 is installed on the actual wall or ceiling (W), when the projection 110 of the infrared heater 200 is most Located in the lower portion of the mounting apparatus 100 is to be located at the top by engaging with the ceiling portion.

In addition, the housing 10 may be configured by any one or a combination of synthetic resin materials including wood, metal, plastic, the lower side of the housing 10 to allow the air inside to communicate with the outside and the power line of the infrared heater A plurality of communication holes 11 are formed to be discharged to the outside when the same wiring is received, the communication holes 11 can be formed in the upper or center portion in addition to the lower side of the housing 10, the strength of the housing 10 It may be formed in a large amount within a range that does not seriously degrade.

Meanwhile, the first frame 20 is coupled to both inner wall surfaces of the upper portion of the housing 10 so as to stably support the upper protrusion 110 of the infrared heater 200 when the infrared heater 200 is accommodated. Even though the rectangular frame, which is the upper surface of the housing 10, can support the upper protrusion 110 of the infrared heater 200, but the impact area can be reduced by increasing the impact area of the protrusion 110 by increasing the support area. To do this.

In addition, the first frame 20 is formed in the shape of a stick having a long hexahedral shape, and is coupled to the housing 10 by fixing means such as screws and nails, and is formed in pairs on both sidewalls of the housing 10. For example, the two pairs may be combined on the edge to increase the support area.

In addition, the binding unit 30 is coupled to the inner wall surface on both sides of the lower housing 10, the second frame 31 for supporting the lower surface of the infrared heater 200 when receiving the infrared heater 200, and the housing 10 It is composed of a binding frame 32 for providing a through surface through which the fixing means 70 passes so that the housing 10 can be fixed to the ceiling surface W or wall surface.

Here, the second frame 31 is coupled to both inner wall surfaces of the lower portion of the housing 10 and has the same stick shape as the first frame 20 described above, and the binding frame 32 is formed of the second frame 31. It is coupled to the inner side by fixing means and is formed of a metal material.

Here, the binding frame 32 is formed in a 'b' shape, the vertical portion of the binding frame 32 is coupled to the side wall and the fixing means such as screws, nails of the second frame 31, the horizontal portion of the wall surface Or it is coupled to the ceiling surface and the fixing means.

Of course, the binding frame 32 is preferably made of a steel material in order to increase the bonding force with the wall surface or the ceiling surface, the thickness is also preferably formed of more than 2mm.

In this embodiment, in order to couple between the mounting apparatus 100 and the infrared heater 200 can be fixed by inserting a fixing means penetrating through the side wall of the infrared heater 200 from the side wall of the mounting apparatus 100, It is preferable to install three or more fixing means on each side wall so as to be coupled to each other.

<Example 2>

Figure 3 is an assembled perspective view showing the combination of the infrared heater and the mounting apparatus according to another embodiment of the present invention, Figure 4 is a cross-sectional view showing the installation of the infrared heater and the mounting apparatus according to another embodiment of the present invention, 5 is a perspective view of a bonding frame according to the present invention, Figure 6 is a cross-sectional view of the bonding frame according to the present invention.

Referring to the drawings, the present embodiment has a different coupling structure between the above-described embodiment and the mounting apparatus 100 and the infrared heater 200. In this embodiment, the first protruding surface 110 is disposed on the infrared heater 200. Forming and forming a second projection surface 40 on the mounting apparatus 100 is fixed to the bonding frame 50 to be coupled together is installed sliding.

In detail, first, the mounting apparatus 100 is formed at least one horizontally on the lower wall surface of the first frame 20, but the outside of the infrared heater 200 accommodated when the infrared heater 200 is accommodated. The first projection surface 120 formed in the horizontal direction on the wall surface and the second projection surface 40 formed at a position corresponding to the spaced apart on the horizontal position.

In addition, the bonding frame 50 is formed in the form of an H-beam is slid inwardly from the outside of the housing 10 to be coupled in a form that accommodates the first projection surface 110 and the second projection surface 40, such bonding Frame 50 is the bonding frame 50 is formed of a H-beam is rotated 90 ° is formed of the upper, lower surfaces (51, 52) having a predetermined thickness and a vertical surface 53 connecting them.

In addition, the bonding frame 50 according to the present invention has a communication path 54 so that both sides of the center portion of the vertical surface is in communication with each other, the communication path 54 is extended to the upper side of the bottom and the lower surface of the upper surface. It is formed to communicate with the outside.

An adhesive is accommodated in the communication path 54 as described above. The adhesive 55 has a bonding frame 50 sliding on the first protrusion surface 120 and the second protrusion surface 40 of the mounting apparatus 100. To be leaked on the contact surface between the first projection surface 120 and the second projection surface 40 of the mounting apparatus 100 by an external pressing means 60 at the time of coupling.

Accordingly, when the leaked adhesive 55 is hardened, the first protruding surface 120, the second protruding surface 40, and the bonding frame 50 are bound to each other, and thus the mounting apparatus 100 and the infrared heater 200 are attached to each other. Is to be fixedly coupled.

The adhesive 55 is most preferably a sealant, which is a material that fills the joints or joints between various members so as to increase the bonding strength and cushion the impact according to the curing. In addition, the bonding material having excellent adhesive strength is also used as the adhesive of the present invention. Of course, it can be adopted as (55).

In addition, the housing 10 has a sliding hole 12 is formed in a shape corresponding to the vertical section of the bonding frame 50 in order for the bonding frame 50 to slide from the outside to the inside.

The position at which the sliding hole 12 is formed is formed on a lengthwise extension line of the second protruding surface 40 and the first protruding surface 120.

Of course, the sliding hole 12 is preferably formed to be slightly larger than the cross-section of the bonding frame 50 to be embedded with a certain clearance when the bonding frame 50 is easy to insert the bonding frame 50.

Accordingly, according to the present embodiment, sliding bonding is performed between the infrared heater 200 and the mounting apparatus 100, rather than a coupling method such as screws and nails, so that no external damage is achieved, so durability is excellent and sliding coupling of the bonding frame 50 is performed. After the adhesive 55 leaks outward and hardens, the bonding force can be greatly increased and the external shock can be buffered to further increase the service life of the product.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to those precise embodiments, and many alternatives, modifications, and variations will be apparent to those skilled in the art. I will understand.

Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10 housing 11 communication hole
12: sliding hole 20: the first frame
30: binding part 31: the second frame
32: binding frame 40: the second projection surface
50: bonding frame 51: upper surface
52: lower surface 53: vertical surface
54: communication path 55: adhesive
60: pressing means 70: fixing means
100: mounting device 110: protrusion
120: first projection surface 200: infrared heater

Claims (6)

In the mounting apparatus for attaching the infrared heater 200 to the ceiling surface or wall surface,
The mounting device 100
An upper and lower housing 10 having a square shape;
A first frame 20 coupled to both inner side surfaces of the upper portion of the housing 10 to stably support the upper protrusion 110 of the infrared heater 200 when the infrared heater is accommodated;
The housing 10 may be fixed to a ceiling surface or a wall surface on which the lower surface of the infrared heater 200 is supported when the infrared heater 200 is accommodated or coupled to the inner wall surfaces at both sides of the housing 10. It includes a binding portion 30 to form a through surface through which the fixing means is to be made,
The binding part 30 is a stick-shaped second frame 31 coupled to both inner wall surfaces of the lower portion of the housing 10, and the 'b' shape is coupled to the inner surface of the second frame 31 by fixing means. Consists of a binding frame 32 formed of a metal material,
In the lower side of the housing 10, the wiring of the infrared heater 200 is discharged to the outside of the mounting apparatus 100, and a plurality of communication holes 11 are formed to allow air inside the housing 10 to circulate with the outside. Mounting device for an infrared heater, characterized in that.
The method of claim 1,
The mounting device
At least one first projection surface formed on the lower wall surface of the first frame 20 in the horizontal direction, and formed in the horizontal direction on the outer wall surface of the infrared heater 200 accommodated when the infrared heater 200 is received ( Mounting device for an infrared heater, characterized in that it has a second projection surface (40) formed in a position corresponding to the spaced apart from the horizontal position 120.
The method of claim 2,
The mounting apparatus is slidably coupled to the first protruding surface 120 of the infrared heater 200 and the second protruding surface 40 of the mounting apparatus 100 to be fixedly coupled to the infrared heater 200. Mounting device for infrared heaters, characterized in that coupled by the bonding frame 50 of the H-beam shape formed correspondingly.
The method of claim 3, wherein
In the housing, the bonding frame 50 penetrates from the outer side of the housing to the inner side of the side wall where the second protruding surface 40 is formed, and the second protruding surface 40 and the first protruding surface 120. Sliding hole 12 is formed in the shape corresponding to the vertical cross-section of the bonding frame 50 so that it can be coupled to the sliding frame, the position of the sliding hole 12 is formed with the second protrusion surface 40 Mounting device for the infrared heater, characterized in that formed on the longitudinal extension of the first projection surface (120).
The method of claim 3, wherein
The bonding frame 50 has an upper and lower surfaces 51 and 52 having a predetermined thickness, formed in a form in which the H beam is rotated by 90 °, and a vertical surface 53 connecting the upper and lower surfaces thereof. Having a communication path (54) so as to communicate with each other, the communication path extends to the upper side of the bottom and the lower surface of the upper surface, the mounting apparatus for infrared heaters, characterized in that communicating with the outside.
6. The method of claim 5,
The adhesive path 55 is accommodated in the communication path so that the bonding frame 50 is slid to the first protrusion surface 120 and the second protrusion surface 40 of the mounting apparatus 100 by an external pressurizing means. Mounting device for an infrared heater, characterized in that the adhesive is configured to leak and harden on the contact surface of the first projection surface 120 and the second projection surface (40) of the mounting device (100).

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