KR101103525B1 - Lighting device - Google Patents

Abstract

Embodiments include a heat sink including a guide portion having a receiving portion and a first protrusion; A light source module unit having a substrate disposed on the heat sink and a light emitting element disposed on the substrate; And a cover part connected to the radiator and having a groove coupled to the first protrusion and a locking jaw coupled to the accommodation part, wherein the guide part includes a first member having a first inclination and the first member. Has a second member extending from and having a second inclination different from the first inclination, by which the locking projection and the accommodation portion are coupled, the separation of the radiator and the cover portion is restricted, and the groove of the first protrusion and the cover portion By the combination of the above, it provides a lighting device that the rotation of the cover portion is limited.

Description

LIGHTING DEVICE

Embodiments relate to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace conventional light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors. .

The embodiment provides a lighting device with improved stability of the coupling between the heat sink and the cover.

The lighting apparatus according to the embodiment includes a heat sink including a guide portion having a receiving portion and a first protrusion; A light source module unit having a substrate disposed on the heat sink and a light emitting element disposed on the substrate; And a cover part connected to the radiator and having a groove coupled to the first protrusion and a locking jaw coupled to the accommodation part, wherein the guide part includes a first member having a first inclination and the first member. Has a second member extending from and having a second inclination different from the first inclination, by which the locking projection and the accommodation portion are coupled, the separation of the radiator and the cover portion is restricted, and the groove of the first protrusion and the cover portion By the combination of the rotation of the cover portion is limited.

Another lighting device according to the embodiment, the heat sink including a cylindrical portion having a flat one surface and the receiving groove, a guide portion connected to the cylindrical portion and having an accommodating portion; A light source module unit disposed on the flat one surface; A cover part connected to the radiator and having a groove coupled to the first protrusion and a locking step coupled to the accommodation part; A power control unit disposed in the receiving groove of the heat sink to provide power to the light source module unit; An inner case inserted into an accommodating groove of the heat sink and accommodating the power control unit therein; And a holder coupled to the inner case, wherein the guide part includes a first member inclined outwardly of the central axis of the cylindrical part and a second member inclined inwardly of the central axis of the cylindrical part. The separation of the radiator and the cover part is limited by the engaging projection and the accommodation part, and the rotation of the cover part is limited by the coupling of the groove of the cover part and the first protrusion part.

Embodiments can provide an illumination device that is easy to assemble and to improve the stability of the coupling.

The embodiment can provide an illumination device having improved light emission characteristics.

The embodiment can provide an illumination device with improved heat dissipation characteristics.

1 is a perspective view of a lighting apparatus showing an embodiment according to the present invention.
2 is an exploded perspective view of a lighting apparatus showing an embodiment according to the present invention.
3 is a cross-sectional view of a lighting apparatus showing an embodiment according to the present invention.
Figure 4 is an exploded cross-sectional view of the lighting apparatus showing an embodiment according to the present invention.
5 is a perspective view illustrating a light source module unit according to an embodiment of the present invention.
Figure 6 is an embodiment according to the present invention, the description is a view showing a guide portion structure of the heat sink.
7A to 7H illustrate an assembly process diagram of a lighting apparatus according to an embodiment of the present invention.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

In addition, in the description of the embodiment according to the present invention, when described as being formed on an "on or under" of each substrate, the (top) or (bottom) On or under includes both two same substrates directly contacted with each other or one or more other substrates are formed indirectly between the same substrates. In addition, when expressed as on (up) or down (on) or (under), it may include the meaning of the down direction as well as the up direction based on one substrate.

Hereinafter, a lighting apparatus according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a lighting device showing an embodiment according to the present invention, Figure 2 is an exploded perspective view of a lighting device showing an embodiment according to the present invention, Figure 3 is a lighting device showing an embodiment according to the present invention 4 is an exploded cross-sectional view of a lighting apparatus showing an embodiment according to the present invention, and FIG. 5 is a perspective view for explaining a light source module unit according to an embodiment according to the present invention.

1 to 5, the lighting device 100 includes a cover 110, a light source module 130, a heat radiator 140, a power controller 150, an inner case 160, and a socket 170. ).

The cover 110 is disposed on the radiator 140 while covering and protecting the light source module 130, and at the same time, the light generated from the light source module 130 is reflected or refracted to the front or the rear of the lighting device. To distribute light. The radiator 140 is for dissipating heat generated from the light source module 130 when driving the lighting device, and improves heat radiation efficiency through surface contact with the light source module 130. At this time, the radiator and the light source module may be coupled by an adhesive, but are preferably in surface contact with each other using a structure such as a screw. The inner case 160 includes a power control unit 150 therein and is inserted into the heat sink.

Hereinafter, the lighting device 100 according to the embodiment will be described in detail with reference to each component.

<Cover part>

The cover 110 has a bulb shape having an opening G1, and an inner surface of the cover 110 is coated with a milky white paint. The paint may include a diffusion material such that light when passing through the cover part 110 diffuses from the inner surface of the cover part.

Although the material of the cover part 110 may be glass, it is preferable to use plastic, polypropylene (PP), polyethylene (PE), or the like, because there is a weak problem in weight or external impact. More preferably, light diffusion polycarbonate (PC) or the like having good light resistance, heat resistance, and impact strength properties may be used.

The surface roughness of the inner surface of the cover portion 110 is larger than the surface roughness of the outer surface of the cover portion. That is, when the light emitted from the light source is irradiated to the inner surface of the cover portion is emitted to the outside, the light irradiated to the inner surface of the cover portion is sufficiently scattered and diffused to emit to the outside. Therefore, the light emission characteristic is improved.

In addition, the cover part 110 is preferably formed through blow molding to widen the directing angle of light in the molding method.

On the other hand, the coupling of the cover 110 and the radiator 140, the guide portion 143 of the radiator surrounds the end of the cover portion, the end of the cover 110 is a flat surface of the radiator 140 It is inserted into the groove part 142-1 arrange | positioned along the outer periphery. At this time, the locking jaw 111 formed at the end of the cover 110 is coupled to the receiving portion 143-1 formed on the inner surface of the guide portion 143 of the heat dissipating member to cover the cover 110 and the heat dissipating body ( 140 is combined.

The locking step 111 is to prevent the movement of the cover portion in the vertical direction when the cover portion 110 and the radiator 140 is coupled, and to increase the coupling force between the cover portion 110 and the radiator 140. It also adds ease of coupling.

In addition, the cover 110 may be formed with grooves 110a at both side ends of the locking step 111 formed at the end. The groove 110a allows the end of the cover portion to have an uneven shape at a predetermined portion. At this time, the groove portion 142-1 disposed along the outer circumference of the flat surface of the heat sink is not continuously formed, and has a structure that is blocked at a predetermined portion. The groove of the heat sink is described in more detail later.

<Light source module part>

The light source module unit 130 includes a substrate 131 and a light source unit 133 disposed on the substrate, and the light source unit 133 includes a light emitting element 133-1 and a lens unit 133-3.

The substrate 131 has a rectangular shape, but is not limited thereto. However, as in the embodiment, when the substrate 131 has a rectangular shape, the substrate 131 has a hole 131a in the center region and a via hole 131b in the corner region. When the plurality of substrates 131 are disposed on a specific surface such as one surface of the heat sink 140, the via hole 131b is a connection path of a wire or a connector for electrically connecting to a neighboring substrate.

The substrate 131 may be a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like may be used. It may include. In addition, it is possible to use a Chips On Board (COB) type that can directly bond the LED chip unpacked on the printed circuit board. In addition, the substrate 131 may be formed of a material that reflects light efficiently, or the surface may be formed of a color that reflects light efficiently, for example, white, silver, or the like.

A plurality of light emitting devices 133-1 are disposed on one surface of the substrate 131, and the light emitting devices 133-1 are light emitting diode chips emitting red, green, and blue light, or light emitting diode chips emitting UV. Can be.

The light emitting diode may be a horizontal type or a vertical type, and the light emitting diode may emit blue, red, yellow, or green.

The lens unit 133-3 is disposed on the substrate 131 to cover the light emitting device 133-1. The lens unit 133-3 adjusts the directing angle of the light emitted from the light emitting element 133-1 and the direction of the light. At this time, the lens unit 133-3 is a hemispherical type and is filled with a translucent resin such as a silicone resin or an epoxy resin as a whole without empty space. The translucent resin may comprise phosphors which are wholly or partially dispersed.

When the light emitting device 133-1 is a blue light emitting diode, phosphors included in the light-transmitting resin of the lens unit 133-3 are garnet-based (YAG, TAG), silicate-based, nitride ( Nitride) and oxynitride (oxyxyride) may include at least one or more.

Natural light (white light) may be realized by including only the yellow phosphor in the light-transmissive resin, but may further include a green phosphor or a red phosphor in order to improve the color rendering index and reduce the color temperature.

In addition, when various kinds of phosphors are mixed in the light-transmissive resin, the addition ratio according to the color of the phosphor may use a green phosphor more than a red phosphor and a yellow phosphor more than a green phosphor.

Yellow phosphors include garnet-based YAG, silicate and oxynitrides, green phosphors use silicate and oxynitrides, and red phosphors use nitrides. have.

In addition to mixing various kinds of phosphors in the light-transmissive resin, a layer having a red phosphor, a layer having a green phosphor, and a layer having a yellow phosphor may be separately divided.

<Heat radiator>

The heat sink 140 has an accommodating groove 140a into which the power control unit 150 and the inner case 160 are inserted. In addition, the radiator 140 has a flat portion 142 having a flat circular surface on one side, and includes a guide portion 143 extending in a substantially vertical direction along the outer circumference of the circular surface.

In addition, the lower end of the diameter decreases along the central axis (A) of the circular surface is extended to the upper cylindrical portion 145 and the upper cylindrical portion 145 with respect to the central axis (A) of the flat circular surface It includes a cylindrical portion 147.

The flat portion 142 of the upper cylindrical portion 145 is extended to the protrusion 142a and the protrusion 142a based on the central axis A of the flat circular surface and lower than the protrusion 142a. A bottom portion 142b having a portion is disposed around the protrusion 142a. Both the protruding portion 142a and the bottom portion 142b may have one flat surface. In this case, one surface of the protrusion 142a may extend in a substantially vertical direction with respect to one surface of the bottom portion 142b. Here, the protrusion 142a may be referred to herein as a 'second protrusion'. The second protrusion 142a is distinguished from the first protrusion 142b-1 to be described later.

The bottom portion 142b is formed with a groove portion 142-1 along the outer circumference, where the groove portion is blocked at a predetermined portion. That is, the bottom protrusion 142b-1 is formed such that a part of the bottom 142b is in contact with the surface of the guide 143. Accordingly, the end of the cover 110 having an uneven shape is inserted into the groove 142-1. Here, the bottom protrusion 142b-1 may be referred to herein as a “first protrusion”. The first protrusion 142b-1 is distinguished from the second protrusion 142a described above.

At this time, the groove portion 142-1 is coated with various resins (S) such as an adhesive resin to increase the bonding force between the cover portion 110 and the heat sink 140, and completely seal the cover part to the heat sink. Let's do it. Resin (S), It is preferable to use silicone preferably.

A mounting groove 141-1 through which at least one light source module unit may be mounted may be formed on an upper surface of the protrusion 142a. In addition, the upper cylindrical portion 145 has a first hole 141a, a second hole 141b, and a third hole 141c penetrating the circular surface of the upper cylindrical portion 145.

The first screw 140a is inserted into the first hole 141a, and the first screw 140a passes through the fastening hole 160a disposed on the inner side of the inner case 160 to pass through the heat sink 140. And the inner case 160 are fastened. The second screw 140b is inserted into the second hole 141b through the hole 131a disposed at the center of the light source module 130, and the second screw 140b is inserted into the heat sink 140. And light source module 130 by surface contact. Accordingly, the heat generated from the light source module can be effectively transferred to the heat sink to improve heat dissipation characteristics. The third hole 141c passes through the electrode pin 150a protruding from the power control unit 150 and is inserted into the via hole 131b of the light source module 130.

Meanwhile, the width of the circular surface of the upper cylindrical portion 145 or the height of the upper cylindrical portion 145 may vary depending on the entire width of the light source module 130 or the entire length of the power control unit 150.

The upper cylindrical portion 145 has a plurality of pins (141-2) on the surface in the longitudinal direction of the upper cylindrical portion (145). The plurality of pins 141-2 are disposed radially along the surface of the upper cylindrical portion. The fin of the upper cylindrical portion 145 may increase the surface area to improve the heat dissipation efficiency.

Further, the pin 141-2 may be formed up to the bottom cylindrical surface 147. That is, a plurality of pins formed on the surface of the upper cylindrical portion may extend to the lower cylindrical portion.

The guide part 143 of the heat sink has a receiving part 143-1 on an inner surface thereof, and the locking part 111 formed at the end of the cover part 110 is inserted and coupled to the receiving part.

The radiator 140 may be formed of a metal material or a resin material having excellent heat dissipation efficiency, but is not limited thereto. For example, the material of the heat sink 140 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn).

Although not shown in the drawing, a heat sink may be disposed between the light source module 130 and the heat sink 140. The heat sink may be formed of a heat conductive silicon pad or a heat conductive tape having excellent thermal conductivity, and may effectively transfer heat generated by the light source module 130 to the heat sink 140.

<Power control unit>

The power control unit 150 may include a support substrate 151 and a plurality of components 153 mounted on the support substrate 151, and the plurality of components 153 may be, for example, from an external power source. It includes a DC converter for converting the provided AC power to DC power, a driving chip for controlling the driving of the light source module 130, an electrostatic discharge (ESD) protection element for protecting the light source module 130 It is possible, but not limited to.

In addition, the power control unit 150 includes an electrode pin 150a protruding from a supporting substrate connected to the circuit, and the electrode pin 150a is formed in a third hole 141c formed in the upper cylindrical portion of the heat sink 140. ) Is inserted into the via hole 131b of the light source module 130 to supply power to the light source module 130 from the power controller 150.

<Inner case>

The inner case 160 may include an inserting portion 161 inserted into the receiving groove 140a of the heat sink 140 and a connecting portion 163 connected to the socket 170. The inner case 160 may be formed of a material having excellent insulation and durability. For example, the inner case 160 may be formed of a resin material.

The insertion portion 161 has a hollow cylindrical shape, and a fastening hole 160a into which a screw is inserted is formed at an inner side of the insertion portion. The insertion part 161 is inserted into the accommodating groove 140a of the heat sink to prevent an electric short between the power control unit 150 and the heat sink 140, thereby improving the withstand voltage of the lighting device 100. You can.

<Socket part>

The socket 170 is coupled to the connection 163 of the inner case 160 and electrically connected to an external power source.

<Mechanism and electrical connection structure of power control unit and inner case>

The power control unit 150 may be seated in the receiving groove 140a of the heat sink 140.

The support substrate 151 of the power control unit 150 may be placed upright in a direction perpendicular to one surface of the substrate 131 to smooth air flow in the inner case 160. Therefore, compared to the case in which the support substrate 151 is disposed in a horizontal direction with respect to one surface of the substrate 131, air flow may occur due to convection in up and down directions in the inner case 160. Therefore, the heat radiation efficiency of the lighting device 100 can be improved.

The support substrate 151 may be disposed in the inner case 160 in a direction perpendicular to the length direction of the inner case 160, but is not limited thereto.

The power control unit 150 may be electrically connected to the socket 170 and the light source module 130 by an electrode pin 150a and a first wiring 150b, respectively.

Specifically, the first wire 150b may be connected to the socket 170 and may receive power from an external power source. In addition, the electrode pin 150a may pass through the third hole 141a of the heat sink 140 to electrically connect the power control unit 150 and the light source module 130 to each other.

Figure 6 is an embodiment according to the present invention, a diagram showing the structure of the guide portion of the heat sink.

As shown in the drawing, the guide part 143 extends along the outer circumference of the upper cylindrical part 145 of the heat sink, and the guide part 143 extends from the first member 143a and the first member 143a. The member 143b may be included. The first member 143a and the second member 143b are ring-shaped structures, which may be independently manufactured and adhered to each other, or the first member 143a and the second member 143b may be integrally injection molded. have.

In addition, the first member 143a and the second member 143b may be the same or different materials from those of the heat sink.

The first member 143a is inclined with respect to one surface of the upper cylindrical portion with a first inclination, and the second member 143b has a second inclination different from the first member and extends from the first member. That is, the first member is inclined in the outward direction of the central axis of the upper cylindrical part, and the second member is inclined in the inward direction of the central axis of the upper cylindrical part.

In this case, a portion in which the first member and the second member abut each other is referred to as the reference axis A ', and one surface of the first member and one surface of the second member are inclined or have different angles with respect to the reference axis. Can be tilted with

The guide part having such a structure may be disposed on the radiator to surround the end of the cover part surrounding the light source module part to induce a stable coupling between the cover part and the radiator.

7A to 7H illustrate an assembly process diagram of a lighting apparatus according to an embodiment of the present invention.

First, as shown in FIG. 7A, the power control unit 150 is coupled to the insertion unit 161 of the inner case 160. At this time, although not shown in the drawing, the guide plate 151 of the power control unit 150 may be coupled to the inner side of the inner case 160 in a sliding manner so that a guider groove is provided on the inner side of the inner case. It can be formed in the direction.

Next, as shown in FIG. 7B, the holder pin 155 may be electrically fixed to the electrode pin 150a of the power control unit disposed in the insertion unit 161 of the inner case to be stably fixed. Is located at the end of the inner case 160 to seal the inner case. At this time, the holder 155 is formed with a protrusion 155a having a through hole on one surface to allow the electrode pin 150a to penetrate therein, and when the holder seals the inner case, the radiator 140 and the inner case 160. Auxiliary hole 155b for passing the first screw 140a for fastening the thrust is formed in the holder outer region. Holder is a means for stable fixing and support of the electrode pin can be deleted if necessary.

Next, as shown in Figure 7c, the assembly of the inner case and the power control unit is fastened by the heat sink 140 and the first screw (140a). At this time, the electrode pin 150a of the power control unit protrudes through the third hole 141c of the heat sink.

Next, as shown in FIG. 7D, the socket 170 is press-coupled with the connection part 163 of the inner case. At this time, the power control unit and the socket unit disposed in the inner case are electrically connected.

Next, as shown in FIG. 7E, a heat dissipation grease 135 is coated on the lower surface of the prepared light source module 130. The light source module unit 130 has a plurality of light source units 133 and is disposed on the substrate 131 so as to be symmetrical with respect to the central axis A passing through the hole 131a disposed in the center of the substrate 131. . In detail, the substrate 131 is disposed above the substrate 131 so as to be symmetrical to the left, right, or up and down with respect to the central axis A passing through the hole 131a disposed at the center of the substrate 131. Of course, the light source unit 133 may be disposed in various forms on the substrate, but in order to improve the uniformity characteristic of the light emitted from the light source unit 133, the light source unit 133 may be disposed symmetrically with respect to the central axis.

Next, as shown in FIG. 7F, the assembly including the inner case 160, the power controller 150, and the heat sink 140 and the light source module 130 are fastened by the second screw 140b. At this time, the second screw is coupled to the assembly and the light source module through the hole (131a) formed in the central region of the light source module 130 and the second hole (141b) formed on the upper surface of the heat sink.

Next, as shown in FIG. 7G, the connector 135 is coupled through the via hole of the light source module to be electrically connected between the light source modules. In this case, the electrode pins 150a of the power control unit are soldered to be electrically connected to the substrate 131 of the light source module unit.

Next, as shown in FIG. 7H, the cover 110 is coupled to the radiator 140 through silicon bonding to surround the light source module 130 on the radiator to complete the lighting device.

Since the lighting device 100 is made of a structure that can replace the conventional conventional arrangement bulb structurally, it is possible to use the equipment for the conventional conventional arrangement bulb without improvement of the mechanical connection structure or assembly according to the new lighting device There is an advantage.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (11)

A heat sink comprising a guide portion having a receiving portion and a first protrusion;
A light source module unit having a substrate disposed on the heat sink and a light emitting element disposed on the substrate; And
And a cover part connected to the heat radiator and having a groove coupled to the first protrusion and a engaging jaw coupled to the accommodation part.
The guide portion has a first member having a first slope and a second member extending from the first member and having a second slope different from the first slope,
By the engagement of the locking step and the receiving portion, the separation of the radiator and the cover is limited,
The rotation of the cover portion is limited by the coupling of the groove of the cover portion and the first protrusion. The method of claim 1,
The radiator has a flat upper surface and a lighting device having a mounting groove in which the light source module portion is disposed. The method of claim 2,
The seating groove is spaced apart from the cover portion a predetermined lighting device. A heat dissipating member including a cylindrical part having a flat one surface and a receiving groove, a guide part connected to the cylindrical part and having a receiving part, and a first protrusion;
A light source module unit disposed on the flat one surface;
A cover part connected to the radiator and having a groove coupled to the first protrusion and a locking step coupled to the accommodation part;
A power control unit disposed in the receiving groove of the heat sink to provide power to the light source module unit;
An inner case inserted into an accommodating groove of the heat sink and accommodating the power control unit therein; And
And a holder coupled to the inner case.
The guide portion has a first member inclined outward of the central axis of the cylindrical portion and a second member extending to the first member and inclined inward of the central axis of the cylindrical portion,
By the engagement of the locking step and the receiving portion, the separation of the radiator and the cover is limited,
The rotation of the cover portion is limited by the coupling of the groove of the cover portion and the first protrusion. The method according to claim 1 or 4,
The reference axis is a portion where the first member and the second member abut each other,
And one surface of the first member and one surface of the second member are inclined at the same angle with respect to the reference axis. The method of claim 4, wherein
The cylindrical part includes an upper cylindrical part in which the light source module is disposed on the flat surface and a lower cylindrical part which is reduced in diameter while extending to the upper cylindrical part. The method of claim 4, wherein
And a plurality of pins disposed on an outer circumferential surface of the cylindrical portion. The method according to claim 1 or 4,
And the first member and the second member are integrally formed. The method of claim 2,
And an upper surface of the substrate is coplanar or lower than the flat upper surface. The method according to claim 1 or 4,
The heat sink has a second protrusion in which the light source module part is disposed,
The area of the upper surface of the second protrusion is smaller than the area of the bottom surface of the second protrusion. The method according to claim 1 or 4,
The first protrusion is connected to the guide unit.

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