KR101092367B1 - Organic light emitting diode and method for fabricating the same - Google Patents

Abstract

An organic light emitting diode display device according to the present invention includes an organic light emitting diode panel on which organic light emitting diodes are formed, and at least one first electrode pad is formed to apply a signal to negative electrodes and positive electrodes of organic light emitting diodes; It has a peripheral region other than the organic light emitting diode panel region, the second electrode pads corresponding to the first electrode pad is formed, and a driving IC for providing a signal to the peripheral region is mounted, the output terminal of the driving IC and the second An encapsulation cover glass substrate having a wiring pattern for electrically connecting the electrode pads to each other is formed. The encapsulation cover glass substrate is bonded to the first and second electrode pads of the organic light emitting diode panel.

As described above, the present invention can reduce manufacturing cost by greatly reducing the amount of COF or TCP, which is commonly used to connect the driving IC to the pad, and also reduces the distance of the wiring pattern from the driving IC to the organic light emitting diode. Since it is possible to prevent the luminance imbalance or the deterioration of the reliability of the organic light emitting diode display during light emission.

Description

Organic light emitting diode display device and method of manufacturing the same {ORGANIC LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME}

1 is a cross-sectional view for explaining the operation of a general organic light emitting diode,

2 is a top view illustrating a bonding state of a panel including an organic light emitting diode and a panel including a driving IC according to the related art.

3A to 3C are views for explaining a method of fabricating an organic light emitting diode display device according to an exemplary embodiment of the present invention.

4 is a top view of an organic light emitting diode panel applied to a preferred embodiment of the present invention.

5 is a top view of a sealing cover glass substrate applied to a preferred embodiment of the present invention.

Description of the Related Art

300: substrate 302, 308: anisotropic conductive film

304: first electrode pad 306: second electrode pad

310: driver IC 312: cover glass substrate for encapsulation

314: organic light emitting diode 316: surrounding area                 

318: wiring pattern

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode display device, and more particularly, to an organic light emitting diode display device using a sealing cover glass substrate having a wiring pattern capable of electrical signal transmission, and a method of manufacturing the same.

As is well known, with the recent increase in the size of display devices, there is an increasing demand for flat display devices having low space occupancy.In order to meet these demands, an organic light emitting diode (OLED) display device is one of the flat panel displays. It is attracting attention. These organic light emitting diode display devices have excellent characteristics such as wide viewing angle, fast response, and high contrast, so that they can be used as pixels of graphic displays, television image displays or surface light sources, and are thin, light and have good color. This makes it a suitable device for next-generation flat panel displays.

The organic light emitting diode display device using the organic light emitting diode is configured to implement a desired image by an electrical signal input from the outside, similar to a conventional video display device. In particular, in the organic EL display used in a portable wireless communication terminal, According to the trend of digestion, compaction is achieved by bonding a chip on film (COF) or tape carrier package (TCP) with a driving IC to a panel including an organic light emitting diode that outputs an image.

In the panel including the organic light emitting diode, the driving IC and the terminals are electrically bonded to receive a data signal and a scan signal applied from the driving IC to be displayed.

Hereinafter, a conventional organic light emitting diode and a display device will be described with reference to the accompanying drawings.

1 is a cross-sectional view illustrating the operation of a general organic light emitting diode, and includes a positive electrode 2 formed on the substrate 1, an organic layer 3 formed on the positive electrode 2, and an organic layer 3. It is composed of a negative electrode (4) formed on the upper side, and a power supply unit (5) connected to the positive electrode (2) and the negative electrode (4) to supply power.

The organic layer 3 of the organic light emitting diode configured as described above should include a light emitting layer, and includes an electron transport layer, an electron injection layer, a hole transport layer, and a hole injection layer in order to improve luminous efficiency. The positive electrode 2 is connected to the power supply unit 5 so as to apply a positive voltage and the negative electrode 4 to apply a negative voltage.

When a positive voltage is applied to the positive electrode 2 and a negative voltage is applied to the negative electrode 4 by the power supply 5, holes are supplied to the organic layer 3 through the positive electrode 2, and the organic layer The light emitting layer is reached through the hole injection layer and the hole transport layer present in (3). Then, electrons are supplied from the negative electrode 4 to the organic layer 3 and reach the light emitting layer through the electron injection layer and the electron transport layer present in the organic layer 3. In the emission layer of the organic layer 3, the organic material emits light by energy generated by recombination of the injected holes and electrons, and the light is externally transmitted through the substrate 1.

A process of bonding the panel including the organic light emitting diode configured as described above and the panel including the driving IC will be described with reference to FIG. 2.

FIG. 2 is a top view illustrating a bonding state of a panel including an organic light emitting diode according to the related art and a panel including a driving IC, and includes an organic light emitting diode panel 20 having an organic light emitting diode formed thereon, and FIG. The cap 21 is formed on the top to protect the organic light emitting diodes from the outside. The cathode terminals 22 of the organic light emitting diodes are formed on the right side of the organic light emitting diode panel 20 and the anode terminals 23 are formed on the lower side of the organic light emitting diode panel 20, and the PCB including the driving IC 24 driving the organic light emitting diodes is mounted. Printed Circuit Board (PCB) 25 has terminals of two regions in which output terminals of the driving IC 24 are connected to the wiring line of the PCB 25 and drawn out to the outside, and cathode terminals of organic light emitting diodes ( 22) is formed, and an anisotropic conductive film (ACF) is inserted and connected between one side drawing terminals of the first flexible printed circuit (FPC) 26 and an external drawing terminal of the PCB 25 And an ACF is inserted and connected between the other outgoing terminals of the first FPC 26 and an ACF is inserted between the anode terminals 23 of the organic light emitting diodes and one outgoing terminal of the second FPC 27. Connected, blood The ACF is interposed between the external lead-out terminals of the ratio (25) and the other end drawn out of the FPC 2 (27), the terminal is composed of modules to be electrically energized.

However, as described above, when the size of the organic light emitting diode display element is small or the number of pixels to be driven is small, the number of pads to be bonded is small, so that the panel including the organic light emitting diode and the COF or TCP are straight or L-shaped. Although bonding to two surfaces is sufficient, as the size of the organic light emitting diode panel increases and the number of pixels to be driven increases, the number of pads to be bonded increases. To this end, recently, TCP or COF, which is bonded to an organic light emitting diode panel in a "c" shape, has appeared.

However, the structure in which the organic light emitting diode panel having three or more pads and the TCP or COF are bonded to each other does not utilize the internal space of the organic light emitting diode panel, so as much as the internal space, the TCP or COF is incorporated. There is a problem of raising the unit price.

In addition, when the organic light emitting diode panel having three or more pads and TCP or COF are mounted on the board, the COF or TCP is folded. In this case, the thickness of the organic light emitting diode display increases and the inside of the folded part is increased. Due to parasitic capacitance or cracks generated in the semiconductor light emitting diode, there is a risk of malfunction and damage of the organic light emitting diode display.

An object of the present invention is to solve the problems of the prior art, it is possible to significantly reduce the manufacturing cost of COF or TCP, which is commonly used to connect the drive IC to the pad, and to reduce the manufacturing cost as well as in the drive IC Since the distance of the wiring pattern to the organic light emitting diode is shortened, the present invention provides an organic light emitting diode display device and a method of manufacturing the same, which can prevent the luminance imbalance or deterioration of the reliability of the organic light emitting diode display.

In order to achieve the above object, the present invention provides an organic light emitting diode having organic light emitting diodes formed thereon and at least one first electrode pad for applying driving signals to the negative and positive electrodes of the organic light emitting diodes, respectively. Providing a panel, a driving IC providing the driving signal, a second electrode pad corresponding to the first electrode pad, and an output terminal of the driving IC and the second electrode pad Providing a cover glass substrate for encapsulation having a wiring pattern for electrically connecting the electrodes to each other, and bonding the second electrode pads of the encapsulation cover glass substrate to the first electrode pads of the organic light emitting diode panel. do.

In addition, the present invention, the organic light emitting diode panel is formed, the organic light emitting diode panel formed with at least one first electrode pad for applying a driving signal to the negative electrode and the positive electrode of the organic light emitting diode, respectively, and the organic light emitting A second electrode pad is formed in a region corresponding to the electrode pads of the diode panel, has a peripheral region other than the region of the organic light emitting diode panel, and a driving IC is mounted to provide the driving signal in the peripheral region. An encapsulation cover glass substrate having a wiring pattern for electrically connecting the output terminals of the driving IC and the second electrode pads, the second electrode pads of the encapsulation cover glass substrate, and the organic light emitting diode panel. The first electrode pads are characterized in that they are bonded.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings.

3A to 3C are views for explaining a method of manufacturing an organic light emitting diode display device according to an exemplary embodiment of the present invention, and FIG. 4 is a top view of the organic light emitting diode panel applied to the preferred embodiment of the present invention. 5 is a top view of a sealing cover glass substrate applied to a preferred embodiment of the present invention.

Referring to FIGS. 3A and 4, an anisotropic conductive film (ACF) 302 is coated on the substrate 300. The substrate 300 is divided into an organic light emitting diode region 300a in which an organic light emitting diode is mounted and a pad region 300b in which electrode pads are to be formed.

As shown in FIG. 3B, the organic light emitting diodes 314 including the positive electrode, the hole injection layer, the hole transport layer, the organic light emitting layer, the electron injection and transport layer, and the negative electrode are arranged and formed in the organic light emitting diode region 300a. After that, the first electrode pad 304 is formed in the pad region 300b to provide the data signal and the scan signal to the positive electrode and the negative electrode, respectively.

As such, the organic light emitting diode panel is formed by forming organic light emitting diodes 314 that emit light according to a signal input through the first electrode pad 304 for providing data signals and scan signals to the positive electrode and the negative electrode. Is formed.

Here, the first electrode pad 304 is formed in at least one or more regions among the pad regions 300b of four surfaces. In a preferred embodiment of the present invention, as shown in FIG. It will be described taking an example formed on three surfaces of 300b).

Then, as shown in FIG. 5, an encapsulation cover glass substrate 312 having an area corresponding to the substrate 100 region and a peripheral region 316 is formed, wherein the encapsulation cover glass substrate 312 is formed. In the peripheral region 316, a driving IC 310 is mounted and a second electrode pad 306 connected to the first electrode pad 304 of the organic light emitting diode panel is formed, and the second electrode pad 306 is formed. The first electrode pad 304 and the anisotropic conductive film 308 are bonded and electrically conductive. In addition, a wiring pattern 318 is formed on the encapsulation cover glass substrate 312 to electrically connect the output terminals of the driving IC 310 to the second electrode pads 306. After forming the encapsulation cover glass substrate 312, as shown in FIG. 3C, the organic light emitting diode panel is formed of the second electrode pad 306 of the encapsulation cover glass substrate 312 using the anisotropic conductive film 308. By bonding to the first electrode pad 304, the electrical signal output from the driving IC 310 may be transmitted to the first electrode pad 304 of the organic light emitting diode panel. That is, the electrical signal output from the driving IC 310 is transferred to the second electrode pad 306 through the wiring pattern 318 and then electrically connected to the second electrode pad 306 and the anisotropic conductive film 308. It is delivered to the first electrode pad 304.

The method of bonding the second electrode pad 306 of the encapsulation cover glass substrate 312 and the first electrode pad 304 of the organic light emitting diode panel is performed by the first electrode pad 304 of the organic light emitting diode panel or the cover glass for encapsulation. The anisotropic conductive film 308 may be applied to the second electrode pad 306 of the substrate 312 and then bonded.

The peripheral area 316 of the cover glass substrate 312 for encapsulation is an area longer than an arbitrary surface of the organic light emitting diode panel, and the driving IC 310 is encapsulated by, for example, a chip on glass (COG) method. It is mounted on the cover glass substrate 312. At this time, the peripheral region 316 is an extension region of the surface of the encapsulation cover glass substrate 312 on which the second electrode pad 306 is not formed or an extension region of any one of the surfaces on which the second electrode pad 306 is formed. This can be

Thereafter, the FPC is attached to the peripheral area 316 on which the driving IC 310 is mounted, and then mounted on the driving board, thereby manufacturing an organic light emitting diode display device.

According to the present invention, by using the encapsulation cover glass substrate 312 in which the driving IC 310 is mounted and the wiring pattern 318 connecting the second electrode pad 306 and the output terminal of the driving IC 310 is formed. By manufacturing the organic light emitting diode display device, not only the amount of COF or TCP can be greatly reduced, but also the distance of each pad can be shortened in the driving IC 310 to prevent uneven luminance or deterioration of reliability of the organic light emitting diode display. Can be.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should not be limited by the described embodiments but should be defined by the appended claims.

As described above, the present invention can reduce manufacturing cost by greatly reducing the amount of COF or TCP, which is commonly used to connect the driving IC to the pad, and also reduce the manufacturing cost of the wiring pattern from the driving IC to the respective pads. Since the distance is shortened, there is an effect of preventing unbalance of luminance or deterioration of reliability of the organic light emitting diode display during light emission.

Claims (14)

An organic light emitting diode panel having organic light emitting diodes formed thereon, and at least one first electrode pads for applying driving signals to the negative and positive electrodes of the organic light emitting diodes; A driving IC having a second electrode pad formed in a region corresponding to the first electrode pads of the organic light emitting diode panel, having a peripheral region other than the region of the organic light emitting diode panel, and providing the driving signal to the peripheral region. And a cover glass substrate for encapsulation in which a wiring pattern for electrically connecting the output terminals of the driving IC and the second electrode pads is formed. And second electrode pads of the encapsulation cover glass substrate and the first electrode pads of the organic light emitting diode panel are bonded to each other. The method of claim 1, The peripheral area is an organic light emitting diode display, characterized in that the region formed longer than any surface of the organic light emitting diode panel. The method of claim 2, The long surface is an organic light emitting diode display device, characterized in that the region extending from any one of the surfaces of the sealing cover glass substrate, the second electrode pad is not formed. The method of claim 2, And the elongated surface is a surface extending from one of the surfaces of the encapsulating cover glass substrate on which the second electrode pad is formed. The method of claim 2, The drive IC is mounted on the encapsulation cover glass substrate by a COG method. Providing an organic light emitting diode panel in which organic light emitting diodes are formed, and at least one first electrode pads for applying driving signals to the negative and positive electrodes of the organic light emitting diodes, respectively; A driving IC for providing the driving signal is mounted, a second electrode pad corresponding to the first electrode pad is formed, and wirings for electrically connecting the output terminals of the driving IC to the second electrode pads. Providing a cover glass substrate for sealing with a pattern formed thereon; Bonding second electrode pads of the encapsulation cover glass substrate to first electrode pads of the organic light emitting diode panel; Method for manufacturing an organic light emitting diode display device comprising a. The method of claim 6, The bonding step may include applying an anisotropic conductive film to one of the first and second electrode pads of the organic light emitting diode panel and the encapsulating cover glass substrate, and then attaching the second electrode pads of the encapsulating cover glass substrate to the organic light emitting diode. A method of manufacturing an organic light emitting diode display element, which is bonded to first electrode pads of a diode panel. The method of claim 6, The bonding step may include applying an anisotropic conductive film to the first and second electrode pads of the organic light emitting diode panel and the encapsulation cover glass substrates, respectively, and then attaching the second electrode pads of the encapsulation cover glass substrate to the organic light emitting diode panel. A method of manufacturing an organic light emitting diode display element, which is bonded to the first electrode pads. delete The method of claim 6, The encapsulation cover glass substrate has a peripheral region other than the organic light emitting diode panel region, and a driving IC is mounted in the peripheral region. 11. The method of claim 10, The peripheral area is a region formed longer than any surface of the organic light emitting diode panel manufacturing method of an organic light emitting diode display. The method of claim 11, The long surface is a manufacturing method of the organic light emitting diode display device, characterized in that the region extending from any one surface of the sealing cover glass substrate is not formed with the second electrode pad. The method of claim 11, The long surface is a manufacturing method of the organic light emitting diode display device, characterized in that the surface extending from one of the surfaces on which the second electrode pad is formed in the cover glass substrate for sealing. 11. The method of claim 10, The drive IC is mounted on the encapsulation cover glass substrate by a COG method.

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