KR101055449B1 - 카메라 모듈 - Google Patents
카메라 모듈 Download PDFInfo
- Publication number
- KR101055449B1 KR101055449B1 KR1020090083019A KR20090083019A KR101055449B1 KR 101055449 B1 KR101055449 B1 KR 101055449B1 KR 1020090083019 A KR1020090083019 A KR 1020090083019A KR 20090083019 A KR20090083019 A KR 20090083019A KR 101055449 B1 KR101055449 B1 KR 101055449B1
- Authority
- KR
- South Korea
- Prior art keywords
- image sensor
- holder
- substrate
- camera module
- image
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000012858 packaging process Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920001690 polydopamine Polymers 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (7)
- 일면에 이미지센서 실장부가 형성된 기판;상기 이미지센서 실장부에 실장되는 이미지센서;상기 이미지센서에 접하도록 상기 기판으로부터 돌출되게 형성된 다수의 홀더;외부의 이미지를 받아들여 상기 이미지센서에 결상하는 렌즈배럴; 및상기 기판의 상부에 설치되어 상기 렌즈배럴과 결합된 하우징을 포함하고상기 홀더는 상기 이미지센서 측면의 모서리부에 접하도록 형성된 것을 특징으로 하는 카메라 모듈.
- 삭제
- 청구항 1에 있어서,상기 홀더는 대각선으로 마주보는 상기 모서리부에 각각 접하도록 형성된 것을 특징으로 하는 카메라 모듈.
- 청구항 1에 있어서,상기 홀더는 모든 상기 모서리부에 각각 접하도록 형성된 것을 특징으로 하는 카메라 모듈.
- 삭제
- 청구항 1에 있어서,상기 홀더는 상기 기판과 일체로 형성된 것을 특징으로 하는 카메라 모듈.
- 청구항 1에 있어서,상기 홀더는 상기 기판의 일면에 접착제로 부착된 것을 특징으로 하는 카메라 모듈.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090083019A KR101055449B1 (ko) | 2009-09-03 | 2009-09-03 | 카메라 모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090083019A KR101055449B1 (ko) | 2009-09-03 | 2009-09-03 | 카메라 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110024854A KR20110024854A (ko) | 2011-03-09 |
KR101055449B1 true KR101055449B1 (ko) | 2011-08-08 |
Family
ID=43932627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090083019A KR101055449B1 (ko) | 2009-09-03 | 2009-09-03 | 카메라 모듈 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101055449B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10498937B2 (en) | 2015-06-08 | 2019-12-03 | Lg Innotek Co., Ltd. | Camera module |
KR102415361B1 (ko) * | 2015-07-30 | 2022-07-01 | 엘지이노텍 주식회사 | 기판 유닛과 기판 어셈블리 및 그것을 이용한 카메라 모듈 |
KR102185047B1 (ko) | 2019-05-20 | 2020-12-01 | 삼성전기주식회사 | 카메라 모듈 |
KR102409131B1 (ko) * | 2020-05-21 | 2022-06-15 | 주식회사 지티티 | 관통형 카메라 내장형 슬림 모니터 구조 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030022742A (ko) * | 2001-09-11 | 2003-03-17 | 샤프 가부시키가이샤 | 고체상태 촬상장치, 그 제조방법, 고체상태 촬상유니트,그 제조방법, 및 촬상기기 |
JP2005072456A (ja) | 2003-08-27 | 2005-03-17 | Kyocera Corp | 電気素子モジュール |
KR100835719B1 (ko) * | 2006-11-21 | 2008-06-05 | 삼성전기주식회사 | 센서 내장형 이미지센서 모듈 및 이를 이용한 카메라 모듈패키지 |
KR20090082500A (ko) * | 2006-12-21 | 2009-07-30 | 인텔 코오퍼레이션 | Lga 소켓들을 위한 적재 메카니즘에 대항하는 수평력 |
-
2009
- 2009-09-03 KR KR1020090083019A patent/KR101055449B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030022742A (ko) * | 2001-09-11 | 2003-03-17 | 샤프 가부시키가이샤 | 고체상태 촬상장치, 그 제조방법, 고체상태 촬상유니트,그 제조방법, 및 촬상기기 |
JP2005072456A (ja) | 2003-08-27 | 2005-03-17 | Kyocera Corp | 電気素子モジュール |
KR100835719B1 (ko) * | 2006-11-21 | 2008-06-05 | 삼성전기주식회사 | 센서 내장형 이미지센서 모듈 및 이를 이용한 카메라 모듈패키지 |
KR20090082500A (ko) * | 2006-12-21 | 2009-07-30 | 인텔 코오퍼레이션 | Lga 소켓들을 위한 적재 메카니즘에 대항하는 수평력 |
Also Published As
Publication number | Publication date |
---|---|
KR20110024854A (ko) | 2011-03-09 |
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