KR101044011B1 - Slit nozzle and substrate processing apparatus and method using the slit nozzle - Google Patents

Abstract

Provided are a slit nozzle and a substrate processing apparatus and method using the slit nozzle. According to the present invention, the buffer area of the slit nozzle can be divided into a plurality of sections by the blocking member, and the length of the processing liquid can be varied. The blocking member is movable or detachable in the first direction. The treatment liquid is supplied to the slit nozzle through the treatment liquid supply line and maintained at an appropriate process temperature by the temperature control fluid flowing through the fluid supply pipe. In the slit nozzle, the slit nozzle is connected in the second direction so as to discharge another kind of processing liquid.

Description

SLIT NOZZLE AND APPARATUS AND METHOD FOR PROVIDING CHEMICAL LIQUID}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus and a method using a slit nozzle.

In general, a semiconductor device is manufactured by repeating a process of sequentially stacking thin films to form a predetermined circuit pattern on a silicon substrate, and for forming and stacking thin films, a plurality of processes such as a deposition process, a photo process, an etching process, and a cleaning process are performed. Unit processes must be repeated.

Among the plurality of unit processes, a photo process is a process for forming a pattern on a substrate, and includes a photoresist coating process, an exposure process, and a developing process.

 The developing process is a process of selectively developing a lighted portion or a non-lighted portion of the photoresist on the surface of the substrate through an exposure process using a developer.

 Korean Patent Laid-Open Publication No. 10-2007-7262 discloses a technique in which a nozzle having a length shorter than the radius of a substrate moves from the outside of the substrate to the central portion, discharging a strip-shaped developer, and simultaneously rotating the substrate to perform a developing process. have.

Korean Patent Laid-Open Publication No. 10-2007-69942 discloses a technology in which a slit nozzle having the same length as the diameter of the substrate W moves the substrate horizontally from one side to the other side in a scanning manner and supplies a developer to perform a developing process.

However, the above-described developing processes require a different kind of nozzle depending on the form in which the developer is discharged onto the substrate, so the utilization of the nozzle is low. In addition, the developing process is provided with a developer discharge nozzle and an ultrapure water (DIW) supply nozzle, respectively, and many driving means are required to drive these nozzles separately, which requires a high cost for the device configuration. In addition, since the individual nozzles must be moved when configuring the process recipe, the process recipe becomes complicated.

An object of the present invention is to provide a slit nozzle which can be used for all kinds of developing processes.

Another object of the present invention is to provide a substrate processing apparatus with simplified device configuration.

The present invention provides a slit nozzle. The slit nozzle includes a body having a processing region discharge port for discharging the processing liquid to a substrate and having a buffer region therein that temporarily stays before the processing liquid is discharged; And a blocking member dividing the buffer area into a plurality of sections.

In one embodiment, the blocking member moves in the first direction, the longitudinal direction of the slit nozzle, and includes a blocking member driver to move the blocking member in the first direction.

In another embodiment, the blocking member is removable.

In another embodiment, a plurality of the slit nozzles are provided, and the slit nozzles engage in a second direction perpendicular to the longitudinal direction of the slit nozzle.

In addition, the present invention provides a substrate processing apparatus. The substrate processing apparatus includes a substrate support unit; A slit nozzle positioned above the substrate support unit and discharging a processing liquid to the substrate support unit; A processing liquid supply line connected to the slit nozzle and supplying a processing liquid to the slit nozzle; A processing liquid storage unit connected to the processing liquid supply line and storing the processing liquid; And a nozzle arm on which the slit nozzle is mounted and through which the processing liquid passage passes, wherein the slit nozzle forms a processing liquid discharge port for discharging the processing liquid to a substrate and temporarily stays before the processing liquid is discharged. A body having a buffer area therein; And a blocking member dividing the buffer area into a plurality of sections.

In one embodiment, the substrate processing apparatus is formed in the body, the processing liquid passage for providing the processing liquid supplied to the body through the processing liquid supply line to the buffer area; A processing liquid control valve installed on the processing liquid passage and adjusting a flow rate of the processing liquid provided through the processing liquid passage; And a valve controller for controlling opening and closing of the treatment liquid control valve.

In another embodiment, the blocking member is provided to be movable in the first direction, which is the longitudinal direction of the slit nozzle.

       In another embodiment, the blocking member is removable.

In another embodiment, a plurality of the slit nozzles are provided, and the slit nozzles engage in a second direction perpendicular to the longitudinal direction of the slit nozzle.

In still another embodiment, the substrate processing apparatus includes a fluid supply pipe disposed inside the nozzle arm and provided to surround the processing liquid passage; A fluid supply line connected to the fluid supply pipe and supplying the temperature control fluid; And a fluid discharge line connected to the fluid supply pipe and configured to discharge the temperature control fluid.

The present invention also provides a treatment liquid supply method. The processing liquid supplying method includes: a body having a processing region discharge port for discharging the processing liquid to a substrate and having a buffer region therein that temporarily stays before the processing liquid is discharged; And a slit nozzle on the substrate, the slit nozzle including a blocking member dividing the buffer area into a plurality of sections. A second step of selecting one of a first method of discharging the processing liquid into a section corresponding to a diameter of the substrate and a second method of discharging the processing liquid into a section smaller than a radius of the substrate; And a third step of discharging the processing liquid by any of the methods selected in the second step.

In one embodiment, the first method is characterized in that the spacing between the blocking members is farther apart than the spacing between the blocking members in the second method.

In another embodiment, the first method may include removing the blocking member from the buffer area, and the second method may include attaching the blocking member to the buffer area.

According to the present invention, the buffer area of the slit nozzle can be divided into a plurality of sections.

Further, according to the present invention, the processing liquid can be discharged by varying the length of the partitioned section.

In addition, according to the present invention, it is possible to discharge different kinds of processing liquids from the respective slit nozzles.

In addition, according to the present invention, the manufacturing cost due to the individual nozzle configuration can be reduced.

In addition, according to the present invention, it is possible to thermostat several fluids with one nozzle.

In addition, according to the present invention, the recipe time can be reduced by reducing the nozzle movement time.

 Hereinafter, embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 7D. Embodiment of the present invention can be modified in various forms, the scope of the invention should not be construed as being limited to the following embodiments. This example is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a more clear description.

1 is a cross-sectional view showing the configuration of a substrate processing apparatus according to the present invention, and FIG. 2 is a plan view of the configuration of the substrate processing apparatus of FIG. 1.

1 and 2, the substrate processing apparatus includes a substrate support unit 2 and a processing liquid supply unit 3. Specifically, the substrate support unit 2 has a vacuum chuck 50 which adsorbs and holds a substrate, and a vacuum chuck driver 70 which drives and lifts up the vacuum chuck at the same time. The vacuum chuck 50 includes a body 52, a vacuum tube 61, a suction member (not shown), and a rotating shaft 62. The body 52 rotates the board | substrate W in the state which hold | maintained the board | substrate in disk shape. In the body 52, a vacuum line 51 penetrating the body is formed. The vacuum line 51 is connected to the vacuum tube 61, the vacuum tube 61 is coupled to a suction member (not shown) that sucks air. The suction member is a pump capable of sucking air and sucks air through the vacuum line 51 and the vacuum tube 61. In addition, the vacuum tube 61 may be combined with a sense (not shown) that can detect whether the inside of the vacuum. The rotating shaft 62 has an inner space and is coupled to the lower end of the body 52 in a cylindrical shape with the upper and lower portions open. The vacuum tube 61 passes through the internal space of the rotating shaft 62. The vacuum chuck driving unit 70 is installed below the rotating shaft, and rotates and lifts the vacuum chuck 50 with electric power supplied from the outside.

The substrate support unit 2 further includes a container 80. The container 80 is installed to surround the vacuum chuck 50 to prevent the processing liquid and the like from flying out from the substrate W due to the rotation of the vacuum chuck 50. An opening 82 is formed at the top of the vessel 80 to allow the substrate to enter and exit. The bottom surface of the container 80 is formed with a drain line 81 through which the processing liquid scattered from the substrate W is drained by the centrifugal force of the rotating substrate W.

The processing liquid supply unit 3 is disposed above the substrate support unit 2. The treatment liquid supply unit 3 has a nozzle arm 20, a slit nozzle 10, a treatment liquid supply part 40, and a temperature adjusting member 30.

The nozzle arm 20 has a rod-shaped body that is long in one direction. The nozzle arm support member 21 is coupled to one end of the nozzle arm 20, and a slit nozzle 10 for discharging the processing liquid onto the substrate W is mounted in the longitudinal direction of the nozzle arm 20. The processing liquid supply line 41 and the fluid supply pipe 31 are embedded inside the body of the nozzle arm 20. The processing liquid supply line 41 and the fluid supply pipe 31 are disposed along the longitudinal direction of the body inside the nozzle arm 20 body. The nozzle arm support member 21 supports the nozzle arm 20 and includes a first driver 27 at a lower end thereof. The first driver 27 may lift and lower the nozzle arm support member 21 and expand and contract the nozzle arm 20 in the longitudinal direction. The guide member 26 is disposed below the first driver 27. The guide member 26 may be provided in a guide rail shape, and the nozzle arm support member 21 may be disposed to linearly move along the guide member 26 to both ends of the side surface of the substrate support unit 1. The second driver 28 is installed at one side of the guide member 26, and the nozzle arm support member 21 linearly moves along the guide member 26 by the second driver 28.

3A is a perspective view of a slit nozzle according to the present invention, FIG. 3B is a sectional view taken along the line AA ′ of FIG. 3A, and FIG. 3C is a sectional view of the slit nozzle of FIG. 3A.

3A to 3C, the slit nozzle 10 includes a body 10 and a blocking member 17. The body 10 forms a processing liquid discharge port 11, a buffer region 12 in the body, and provides a blocking member 17. The body 10 includes an upper portion 10a having a rectangular parallelepiped shape, and a lower portion 10b having a length corresponding to the upper portion, and the width of the second direction gradually narrowing downward. The upper portion 10a of the slit nozzle engages with the nozzle arm 20. The processing liquid discharge port 11 is formed on the lower bottom surface in the form of an elongated slit, and discharges the processing liquid staying in the buffer region 12 to the substrate W in a band shape. The buffer region 12 is formed in the upper portion 10a or the upper portion 10a and the lower portion 10b of the body in a space corresponding in length to the processing liquid discharge port. The buffer area 12 provides a place where the discharged processing liquid temporarily stays. The blocking plate 17 may be a blocking plate or the like as a means for dividing the buffer area 12 into a plurality of sections. According to one embodiment of the invention, two blocking plates 17 are provided in the buffer region 12. Each of the blocking plates 17 may be moved closer to or farther from each other by the blocking member driver 19 along the first direction, which is the longitudinal direction of the slit nozzle 10. When the blocking plate 17 is located on both sides of the buffer region 12 by being separated from each other in the first direction by the blocking member driver 19, the buffer region 12 forms a single integrated space, thereby providing a substrate W. As shown in FIG. The processing liquid can be discharged to a region corresponding to the diameter of the diaphragm. In addition, when the blocking plate 17 is moved by the blocking member driver 19 to be closer to each other along the first direction on both sides of the buffer area 12, the buffer area 12 is partitioned into a plurality of spaces. The processing liquid can be discharged to the area.

In addition, the blocking plate 17 is detached from the body. When the blocking plate 17 is attached to the body 10 at random intervals, the buffer area 12 may be divided into a plurality of sections, and the processing liquid may be discharged into the partitioned sections. However, when the blocking plate 17 is removed, the buffer region 12 may form a single integrated space to discharge the processing liquid into a region corresponding to the diameter of the substrate W. FIG.

4A is a cross-sectional view taken along the line BB ′ of FIG. 2, and FIG. 4B is an enlarged view of portion “C” of FIG. 2.

2, 3C to 4B, the treatment liquid supply part 40 includes a treatment liquid storage part 47, a treatment liquid supply line 41, a treatment liquid passage 45, a treatment liquid control valve 42, And a valve control section 43.

The processing liquid storage unit 47 stores and supplies the processing liquid provided to the slit nozzle 10 through the processing liquid supply line 41, and is connected to the processing liquid supply line 41. The treatment liquid supply line 41 is a passage for providing the treatment liquid stored in the treatment liquid storage 47 to the slit nozzle 10, and connects the treatment liquid storage 47 and the slit nozzle 10 to each other. 20) Pass inside the body. In addition, the treatment liquid supply line 41 is provided wrapped in the fluid supply line 31 to maintain an appropriate process temperature while the treatment liquid is provided. The treatment liquid passage 45 is formed inside the upper portion 10a of the slit nozzle and connects the treatment liquid supply line 41 and the buffer region 12. The processing liquid supplied through the processing liquid supply line 41 is provided to the buffer region 12 via the processing liquid passage 45. According to one embodiment, the treatment liquid passage 45 may be formed such that the treatment liquid is provided in a section between the blocking plate 17 and the blocking plate 17. According to another embodiment, the treatment liquid passage 45 may be formed such that all of the blocking plates 17 are located at one side of the section in which the treatment liquid is provided. According to yet another embodiment, the treatment liquid passage 45 may be formed in each section which is branched from the treatment liquid supply line 41 and partitioned by the blocking plate 17. The treatment liquid control valve 42 is provided on the treatment liquid passage 45. The treatment liquid control valve 42 adjusts the flow rate of the treatment liquid provided to the buffer region 12 through the treatment liquid passage 45. The valve control unit 43 is connected to the treatment liquid control valve 42 and controls the treatment liquid control valve 42.

The temperature regulating member 30 includes a fluid supply pipe 31, a fluid supply line 35, and a fluid discharge line 36. The fluid supply pipe 31 is provided inside the body of the nozzle arm 20, and discharges the fluid supply line 35 and the fluid so that the thermostatic fluid provided through the fluid supply line 35 can be discharged to the fluid discharge line 36. Connect line 36. The fluid supply pipe 31 is provided to surround the treatment liquid supply line 41, and the temperature control fluid flowing through the fluid supply tube 31 maintains the treatment liquid flowing through the treatment liquid supply line 41 at an appropriate process temperature. The fluid supply line 35 supplies the thermostatic fluid provided from the fluid reservoir 37 to the fluid supply pipe 31, and the fluid discharge line 36 supplies the thermostatic fluid discharged from the fluid supply pipe 31 to the fluid reservoir. Return to (37).

 The method of supplying the processing liquid using the slit nozzle and the substrate processing apparatus according to the present invention having the above-described configuration will be described below.

5A to 6B are views showing a treatment liquid supply method according to an embodiment of the present invention.

 5A to 6B, the substrate W is loaded into the container 80, placed on the substrate support member 2, and held by the suction member (not shown) to the vacuum chuck 50. Thereafter, the nozzle arm 20 to which the slit nozzle 10 is coupled is driven by a driving unit (not shown) and moved to the upper portion of the substrate (W).

The slit nozzle 10 moved above the substrate W may be any one of a first method for discharging to a section corresponding to the diameter of the substrate W and a second method for discharging to a section smaller than the radius of the substrate W. FIG. It selects and discharges a process liquid.

5A and 5B, an embodiment in which the section discharged from the slit nozzle 10 corresponds to the diameter of the substrate W corresponds to the first method. In this case, the blocking plate 17 partitioning the buffer region 12 of the slit nozzle 10 moves in the longitudinal direction of the slit nozzle 10 and is located on the side of the buffer region.

 Alternatively, all of the blocking plates 17 that partition the buffer region 12 of the slit nozzle 10 are removed.

6A and 6B, an embodiment in which the section discharged from the slit nozzle 10 is smaller than the radius of the substrate W corresponds to the second method. In this case, the buffer region 12 of the slit nozzle 10 is divided into a plurality of sections by the blocking plate 17.

When the discharge section is selected, the slit nozzle 10 discharges the processing liquid to the substrate W. In the case where the first method is selected, the processing liquid is supplied to the entire buffer region 12, and the supplied processing liquid stays in the buffer region 12 for a while and then rotates through the processing liquid discharge port 11. It is discharged to the area corresponding to the diameter. This corresponds to a technique in which Korean Patent Laid-Open Publication No. 10-2007-69942 discharges a developer using a slit nozzle having the same length as the diameter of the substrate W and performs a developing process.

When the second method is selected, the processing liquid is supplied only to the buffer region 12 corresponding to the blocking plates 17, and the supplied processing liquid stays in the buffer region 12 for a while, and then the processing liquid discharge port 11 is opened. It discharges to the partial area | region of the board | substrate W which rotates through. In the case of the second method, the slit nozzle 10 discharges the processing liquid and may move from the edge region to the center region or from the center region to the edge region of the substrate W. FIG. This is because the Korean Patent Application Publication No. 10-2007-7262 moves from the outside of the rotating substrate W to the center portion using a nozzle having a length shorter than the radius of the substrate W, discharging a strip-shaped developer and performing a developing process. Corresponds to the technology.

Hereinafter, a slit nozzle and a substrate processing apparatus according to another embodiment of the present invention will be described.

7A to 7D are views illustrating a slit nozzle and a substrate processing apparatus according to another embodiment of the present invention.

FIG. 7A is a perspective view of a slit nozzle combining the slit nozzle described in FIG. 3A in two directions, FIG. 7B is a plan view of FIG. 7A, FIG. 7C is a view along the line BB ′ of FIG. 7B, and FIG. 7D is a view of FIG. 7B. C "is an enlarged view.

7A and 7D, the slit nozzle 10 is in contact with one side of the upper side 10a of the slit nozzle 10-1 in the first direction and one side of the upper side 10a of the other slit nozzle 10-2. Fastened by a fastening part (not shown) so as to be arranged side by side in a second direction. The number of the slit nozzles 10 to be fastened is determined according to the number of processing liquids discharged onto the substrate W. FIG. Each slit nozzle upper portion 10a is coupled to one end of the nozzle arm 20 body and connected to the treatment liquid supply lines 41a and 41b, respectively. The treatment liquid supply lines 41a and 41b are disposed along the longitudinal direction of the body inside the nozzle arm 20, and the treatment liquid supply lines 41a and 41b are provided according to the number of the treatment liquids to be supplied, respectively. The fluid supply pipe 31 is provided to surround the treatment liquid supply lines 41a and 41b, and is disposed along the longitudinal direction of the body inside the body of the nozzle arm 20. Each slit nozzle 10 receives the processing liquid from the corresponding processing liquid supply lines 41a and 41b and discharges it onto the substrate W. FIG.

The processing liquid storage units 47a and 47b are provided according to the number of processing liquids to be supplied, respectively, and are connected to the processing liquid supply lines 41a and 41b. The processing liquid supply lines 41a and 41b connect the processing liquid storage parts 47a and 47b and the slit nozzle upper portion 10a, and process the processing liquid stored in the processing liquid storage parts 47a and 47b to the slit nozzle 10. Supply. The treatment liquid supply lines 41a and 41b are provided wrapped in the fluid supply pipe 31. A plurality of treatment liquid supply lines 41a and 41b may be wrapped in one fluid supply 31 line, or a separate fluid supply line 31 may be provided for each treatment liquid supply line.

The temperature regulating member 30 includes a fluid supply pipe 31, a fluid supply line 35, and a fluid discharge line 36. The fluid supply pipe 31 is located inside the body of the nozzle arm 20 and discharges the fluid supply line 35 and the fluid so that the temperature control fluid provided through the fluid supply line 35 can be discharged to the fluid discharge line 36. Connected to line 36. The fluid supply pipe 31 is provided to surround the treatment liquid supply lines 41a and 41b. The fluid supply line 35 supplies the temperature control fluid provided from the fluid reservoir 37 to the fluid supply pipe 31, and the fluid discharge line 36 supplies the temperature control fluid discharged from the fluid supply pipe 31 to the fluid reservoir. Return to (37).

The foregoing detailed description illustrates the present invention. In addition, the above-mentioned contents show preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications can be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the scope of the art or knowledge in the art. The described embodiments illustrate the best state for implementing the technical idea of the present invention, and various modifications required in the specific application field and use of the present invention are possible. Thus, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

1 is a cross-sectional view showing a substrate processing apparatus according to the present invention.

FIG. 2 is a plan view of the substrate processing apparatus shown in FIG. 1. FIG.

3A is a perspective view illustrating a slit nozzle according to the present invention.

3B is a cross-sectional view taken along the line AA ′ of FIG. 3A.

3C is a cross-sectional view of the slit nozzle of FIG. 3A.

4A is a cross-sectional view taken along the line BB ′ of FIG. 2.

FIG. 4B is an enlarged view of portion “C” of FIG. 2.

5A and 5B illustrate a processing liquid supplying method according to an embodiment of the present invention.

6A and 6B illustrate a processing liquid supplying method according to another exemplary embodiment of the present invention.

7A is a perspective view of a slit nozzle according to another embodiment of the present invention.

7B is a plan view illustrating a substrate processing apparatus according to another embodiment of the present invention.

FIG. 7C is a cross-sectional view taken along the line BB ′ of FIG. 7B.

FIG. 7D is an enlarged view of “C” in FIG. 7B.

Claims (14)

delete delete delete delete delete A substrate support unit; A slit nozzle positioned above the substrate support unit and discharging a processing liquid to the substrate support unit; A processing liquid supply line connected to the slit nozzle and supplying a processing liquid to the slit nozzle; A processing liquid storage unit connected to the processing liquid supply line and storing the processing liquid; The slit nozzle is mounted, and includes a nozzle arm through which the processing liquid passage passes, The slit nozzle A body having a processing liquid discharge port for discharging the processing liquid to the substrate at a bottom thereof, and having a buffer region therein that temporarily stays before the processing liquid is discharged; And And a blocking member dividing the buffer area into a plurality of sections. The method of claim 6, A processing liquid passage formed in the body and providing the processing liquid supplied to the body to the buffer area through the processing liquid supply line; A processing liquid control valve installed on the processing liquid passage and adjusting a flow rate of the processing liquid provided through the processing liquid passage; And And a valve controller for controlling opening and closing of the processing liquid control valve. The method of claim 6, And the blocking member is provided to be movable in a first direction that is a longitudinal direction of the slit nozzle. The method of claim 6, The blocking member is a substrate processing apparatus, characterized in that detachable. The method according to any one of claims 6 to 9, A plurality of slit nozzles are provided, and the slit nozzles are coupled in a second direction perpendicular to the longitudinal direction of the slit nozzles. The method according to any one of claims 6 to 9, A fluid supply pipe located inside the nozzle arm and provided to surround the processing liquid passage; A fluid supply line connected to the fluid supply pipe and supplying a temperature control fluid; And And a fluid discharge line connected to the fluid supply pipe and configured to discharge the temperature control fluid. In the substrate processing method using the substrate processing apparatus of Claim 6, Positioning the slit nozzle on a substrate; A second step of selecting one of a first method of discharging the processing liquid into a section corresponding to a diameter of the substrate and a second method of discharging the processing liquid into a section smaller than a radius of the substrate; And And a third step of adjusting a region in which the processing liquid is discharged from the slit nozzle to correspond to any one method selected in the second step. 13. The method of claim 12, The blocking member is provided a plurality of spaced apart from each other, And the first method is spaced apart from the gap between the blocking members in the second method. 13. The method of claim 12, And wherein the blocking member is removed from the buffer region, and the blocking method is attached to the buffer region.

Images