KR101037588B1 - Incandescent type LED lighting device - Google Patents

Abstract

The present invention is to ensure that the driving stability of the control board is secured by blocking foreign substances such as dust generated by the heat and static electricity generated in the lighting unit arranged a plurality of LEDs are applied to the control board to control and control the driving of the LED. It relates to an incandescent LED lighting device.

To this end, the present invention, the plurality of LED is disposed on the printed circuit board and the lighting unit for emitting light; A housing in which the lighting unit is installed at one side, and a control board for intermittently controlling and controlling the driving of the LED is installed at the rear at which the lighting unit is installed, and a terminal is mounted at the other side for supplying power to the lighting unit and the control board; And a heat blocking member mounted between the lighting unit and the control board in the housing to block heat generated from the lighting unit from being applied to the control board.

LED, Incandescent, Lighting

Description

Incandescent type LED lighting device {GLOW LAMP TYPE LIGHTING APPARATUS}

The present invention relates to an LED lamp device having a heat shield and heat dissipation function.

In detail, the present invention prevents foreign substances such as dust generated by heat and static electricity generated from a lighting unit arranged with a plurality of LEDs from being applied to the control board for controlling and controlling the driving of the LED, thereby securing driving stability of the control board. In addition, by forming a heat dissipation layer on the printed circuit board on which the circuit of the lighting unit is mounted, the heat generated from the lighting unit can be quickly dissipated to the outside, and the plastic housing made of the material having excellent mechanical rigidity and heat resistance The present invention relates to an incandescent type LED lighting device capable of realizing a lighter and lower manufacturing cost product.

In addition, the present invention implements a LED driving circuit excluding a separate configuration for stepping down voltage for commercially available AC power supply voltage to implement the product simplification and light weight, the LED driving circuit can be driven more stably In order to ensure that each drive circuit including the LED is divided into block units for a single power source, and the incandescent type LED lighting device to optimize the arrangement of each drive circuit and the elements constituting the drive circuit.

Particularly, the present invention allows a plurality of light emitting chips to be connected in series in a surface mount device (SMD) type to further simplify the configuration of a product, and to provide a series of LED devices or light emitting chips that are connected in series. The present invention relates to an incandescent type LED lighting device that has an excellent power factor and light efficiency by optimizing the number of arrays.

The lighting device applied to the interior space lighting of the building using the LED is mainly applied to the main lamp of the room or the office, the table stand, etc., and can further illustrate the lighting tile using the light guide plate in a more advanced form. Such a lighting device is configured by arranging a plurality of LED modules in which a plurality of LEDs are mounted in a specific arrangement, and installing the LED modules in a ceiling or a wall of a space.

Products are made in the form of incandescent lamps of the above-described lighting devices to implement the lamp in a state coupled to the incandescent lamp socket is becoming common. Such incandescent lamp type LED lighting products are mainly made of aluminum as a housing by a die casting process, the front of the housing is composed of a plurality of LED is arranged in the arrangement. In addition, the control board for controlling or controlling the driving state when the LED is driven behind the lighting unit in the housing is built.

In particular, the LED is accompanied by the A / D converter due to the characteristic that the LED is driven by a DC current of a suitable voltage. The A / D converter as described above includes a transformer coil for stepping down alternating current, and such a transformer coil is disposed at a considerable size in the LED module, which causes a problem in that a product to which it is applied is enlarged.

In order to solve the above problems, a power supply device called a switching mode power supply (SMPS) is recently applied. For reference, the SMPS is used by converting an alternating frequency (50 Hz ~ 60 Hz) into a direct current to a high frequency (tens dozens of hundreds ~ hundreds of kHz), according to the technology of high difficulty.

In addition, the conventional LED lighting device has been proposed to drive the LED according to the voltage drop in each LED for the power source by connecting a plurality of LEDs in a configuration in which SMPS is excluded.

In this case, the LED lighting device is an LED drive circuit by the LED part mounted by mounting a plurality of LEDs on a printed circuit board, and the drive circuit part is installed on a separate printed circuit board several elements for driving the LED. It is configured and applied.

Here, the LED is mainly applied to the device of the SMD type, the device of the SMD type is as is well-known that the two or more light emitting chips are connected in parallel and built in a dense configuration.

Conventional LED lighting device in the form of an incandescent lamp as described above generates a considerable heat when driving the LED, this heat is adversely affected to the control board that is installed behind the circuit, in particular the lighting unit to control and control the driving of the LED. For example, when heat generated from the lighting unit is applied to the control board, malfunctions may occur in components such as ICs and transistors, which are vulnerable to heat, causing a failure of the product.

In order to minimize this, in the related art, a heat sink made of metal is mounted around the lighting unit, and the housing, which is an exterior, is manufactured by die-casting aluminum to maintain the rigidity of the lighting unit.

However, since the heatsink is limitedly installed around the lighting unit or only a specific device, it is difficult to obtain the maximum heat dissipation efficiency, so the operation stability of the control board is still low with respect to the heat of the lighting unit. In addition, a metal material such as aluminum selected to maintain high rigidity with respect to the heat of the lighting unit increases the manufacturing cost by a process such as die casting, and the problem that the weight of the manufactured product itself is rather heavy is exposed.

In addition, leakage current generated when the LED of the lighting unit is driven together with the heat causes static electricity, and foreign substances such as dust flow into the space in which the control board is built in, and such foreign matters further deteriorate the driving stability of the control board. It becomes a factor.

In addition, the conventional LED lighting device as described above, when manufacturing a single product that requires a considerable amount of LED, in this product by connecting a certain number of LEDs in series to form a group, by connecting these series connected LED groups in parallel again LED will be added.

At this time, when a failure occurs in any one group of the LED group connected in parallel, the LED group having a failure can be replaced to perform the LED drive, but the failure occurs in the drive circuit itself for driving these LED groups. In this case, instability occurs because the entire LED group itself is not driven.

In addition, since SMD-type LEDs, which are mainly applied to the LED lighting device, are connected in parallel with light emitting chips inside them, it is very inconvenient to set the voltage drop value generated in each device even when the LEDs are connected in series. In order to prepare a number of LEDs in the series connection, a large amount of LEDs are required regardless of the number of built-in LEDs.

The present invention has been invented to solve the above problems.

Accordingly, the present invention provides a means for blocking foreign substances such as dust and the like from entering the interior space of the control board by the heat generated from the lighting unit and the static electricity between the lighting unit in which the plurality of LEDs are arranged and the control board disposed at the rear thereof. Incandescent type LED lighting device to implement a configuration for heat dissipating heat generated from the lighting unit to the outside more quickly, and the material is limited so that the housing can be manufactured at a lower production cost and a lighter product The purpose is to provide.

The present invention constitutes an LED driving circuit excluding a separate configuration for dropping the voltage, and the LED driving circuit can be driven more stably by allowing the LED driving circuit to be divided into several block units for a single power supply. Another object is to provide an incandescent type LED lighting device.

The present invention implements SMD (Surface Mount Devices) type LEDs in which a plurality of light emitting chips are connected in series, and applies them to LED driving circuits to further simplify the composition of the product and at the same time implement lighting. Another object is to provide an incandescent type LED lighting device that is excellent in power factor and light efficiency required for the city.

In order to achieve the above object, the present invention has the following configuration.

The present invention, a plurality of LED is disposed on the printed circuit board and the lighting unit for emitting light; A housing in which the lighting unit is installed at one side, and a control board for intermittently controlling and controlling the driving of the LED is installed at the rear at which the lighting unit is installed, and a terminal is mounted at the other side for supplying power to the lighting unit and the control board; And a heat blocking member mounted between the lighting unit and the control board in the housing to block heat generated from the lighting unit from being applied to the control board.

Here, the heat blocking member is formed of a material selected from any one of PBT (Polybutylen terephthalate) resin, PPS (Polyhenylene Sulfide) resin, PPA (polyphthal amide) resin. At this time, the heat shield member is formed so that the surface resistance of the resin material is 10 ^-20 ~ 10 ²⁰ (Ω / sq) for the antistatic function.

In addition, the housing is also formed of a material selected from any one of a polybutylen terephthalate (PBT) resin, a polyphenylene sulfide (PPS) resin, a polyphthal amide (PPA) resin.

On the other hand, a plurality of LEDs are arranged and mounted on one side of the printed circuit board, and each element for driving the LEDs is mounted on the back side of the printed circuit board in the form of SMT, and a thermal conductive material layer is formed on the back side on which each element is mounted. .

At this time, the thermally conductive material layer is formed by applying a composition having a thermal conductivity function by adding and mixing any one or more materials of carbon, CNT, graphite to the synthetic resin. In particular, the thermally conductive material layer is configured to maintain a thermal conductivity of 0.01 W / m · k ~ 2000 W / m · k.

In addition, a plurality of heat dissipation holes are formed in the housing to discharge heat transferred by the thermal conductive material layer to the outside.

In order to achieve the above object, the present invention, the lighting unit, LED driving circuit unit for rectifying and supplying the commercial AC power input; And an LED array unit configured to perform a voltage drop on the LEDs connected in series by the number corresponding to the input power rectified by the LED driving circuit unit to drive the LEDs.

Here, the LED driving circuit unit and the LED array unit are connected in a 1: 1 correspondence, and are composed of a single block unit circuit, and a plurality of block unit circuits are connected in parallel to a single commercial power source to constitute a single lighting product. .

At this time, the LED driving circuit unit includes a rectifying unit composed of a bridge diode to rectify the commercial power input from the outside, the LED array unit to perform a voltage drop corresponding to the number of LEDs connected in series with respect to the commercial power input The voltage drop element is configured in series with the LED.

In particular, the driving circuit unit includes a constant voltage circuit for supplying a constant voltage power regardless of the voltage of the commercial power source input, wherein the constant voltage circuit includes a pair of zener diodes or varistors to maintain a constant voltage with respect to the bidirectional voltage. It is configured by applying (varistor) element.

In order to achieve the another object of the present invention, the LED is applied in the form of SMD having a plurality of light emitting chips therein, the light emitting chips are configured in series with each other. Here, the light emitting chip of the LED or SMD-type LED made of a single light emitter of the LED is composed of 30 to 84 in series for the commercial power of 100V ~ 240V.

As described above, in the present invention, heat and foreign substances generated in the lighting unit are blocked from flowing into the control board, and at the same time, heat generated from the lighting unit is radiated to the outside more quickly, thereby improving stability of the LED driving of the control board. The lighting unit itself also has the effect of minimizing the adverse effects of heat. In addition, the present invention is the housing is made of a selected plastic material it is possible to lower the manufacturing cost, it is possible to obtain the effect of making the product more lightweight.

In addition, the present invention, the LED driving circuit is eliminated to separate the configuration for dropping the voltage, the LED driving circuit is divided into a plurality of blocks for a single power source is configured to simplify the circuit and the weight of the product Since the LED driving circuit and the arrangement of the elements constituting the LED driving circuit are optimized, the LED driving circuit is driven more stably, thereby improving the satisfaction of using the product.

In particular, the present invention can further simplify the configuration of the product by the series connection configuration of the light emitting chip embedded in the SMD-type LED, and the power factor and light efficiency required for lighting implementation by optimizing the number of the LED and the light emitting chip The effect is to produce a good product.

Embodiments of the present invention as described above will be described in detail with reference to the accompanying drawings.

1 is a perspective view of the LED lighting device according to the present invention, Figure 2 is a cross-sectional view of the LED lighting device according to the present invention, Figure 3 is a bottom view of the LED lighting device according to the present invention, Figure 4 is a LED lighting device according to the present invention 5 is a perspective view of a printed circuit board of the lighting unit, and FIG. 5 is a cross-sectional view of the printed circuit board of the LED lighting apparatus according to the present invention.

Referring to the drawings, the LED lighting device according to the present invention is a lighting unit 1 for driving the LED (L) to emit light, a housing (2) for accommodating the lighting unit 1, the inside of the housing (2) It consists of a heat shield member (3) installed in.

The lighting unit 1 includes an LED array unit 10 including a plurality of LEDs L disposed on a printed circuit board P, and an LED driving circuit unit 20 in which various elements for driving the LEDs L are mounted. It has a circuit configuration including. Such a circuit configuration will be described later with reference to FIGS. 6 to 10.

In this basic configuration, the lighting unit 1 is installed so that the LED array unit 10 emits light from the lower side of the housing 2 to the lower side, and diffuses the light in front of it or emits light with a constant color. The light transmission cover 7 which is made to transmit is attached and comprised.

The housing 2 is formed in the form of an incandescent lamp, similar to the exterior configuration. That is, the housing (2) is a built-in lighting unit 1 on the inside of the lower assuming that the lighting fixture is installed on the ceiling, the terminal 4 (incandescent lamp socket) for supplying power to the lighting unit (1) at the top Corresponding screw terminals) are mounted.

In particular, the housing 2 intermittently flashes the LED (L) driving of the lighting unit 1 between the terminal 4 and the lighting unit 1 for receiving commercial AC power through a socket or flashes a specific brightness. Or a control board 5 for controlling the LED (L) to light in a specific color is built. At this time, it is known that the control board 5 is a configuration in which various elements are mounted on the printed circuit board P to control and control the driving of the LED L.

In addition, the housing 2 is made of a plastic material, the most ideal resin material may be selected from PBT (Polybutylen terephthalate) resin, PPS (Polyhenylene Sulfide) resin, PPA (polyphthal amide) resin.

The thermal barrier member 3 is mounted to bipartite the space in which the lighting unit 1 is installed in the housing 2 and the space in which the control board 5 is embedded. Such a heat shield member 3 is a configuration for blocking the heat generated from the lighting unit 1 is applied to the control board (5).

At this time, the heat shield member 3 is also made of a plastic material, such as the housing 2, the PBT, PPS, PPA resin is selected and applied as the most ideal resin material.

For reference, PBT, PPS, PPA resin selected as the material of the housing 2 and the heat shield member 3 is a crystalline resin having excellent heat resistance and mechanical rigidity and excellent electrical characteristics among various engineering plastics. Thus, the PBT, PPS, PPA resins are known to be most suitable for replacing aluminum and zinc alloy die casting products.

In particular, since the respective resins have excellent electrical properties, the thermal barrier member 3 can be configured with an antistatic function. To this end, the heat shield member 3 is formed so that the surface resistance of the selected resin material is 10 ^-20 ~ 10 ²⁰ (Ω / sq) to prevent the inflow of foreign matter such as external dust by static electricity.

In the LED lighting device as described above, the lighting unit 1 has a configuration for radiating heat emitted from the LED (L) to the outside.

To this end, the LED driving circuit unit 20 and the LED array unit 10 constituting the lighting unit 1 are mounted on both sides of a single printed circuit board P, in particular, the LED driving circuit unit 20 is each electric The electronic device is mounted on the printed circuit board P in the form of a surface mount technology (SMT). At this time, the thermally conductive material layer 24 is formed on each of the device mounting surface to improve the self-heating efficiency of the LED driving circuit unit 20 to the maximum.

The thermally conductive material layer 24 is formed by coating a composition having a thermal conductivity function by adding and mixing any one or more materials of carbon, carbon nanotube (CNT), and graphite (graphite) to a synthetic resin. At this time, the synthetic resin by selecting a resin such as PMMA (Poly methy methacrylate: polymethyl methacrylate), epoxy, silicone, which can perform the unit operation of the thermal conductivity according to the addition of the carbon, CNT, graphite Apply. Application of the mixed composition of the synthetic resin and carbon, CNT, graphite is appropriately selected in consideration of product specifications.

In this case, the thermally conductive material layer 24 has a thermal conductivity of 0.01 W / g, considering the number of LEDs (L) in the LED array unit 10 and the amount of heat emitted from the corresponding LED driving circuit unit 20. It is preferable to keep it at m * k-2000W / m * k.

In particular, the heat dissipation hole 6 is formed in the housing 2 so as to quickly discharge the heat transferred on the printed circuit board P to the outside by the heat conductive material layer 24 formed as described above. At this time, the heat dissipation hole 6 is formed in a plurality of places over the point where the lighting unit 1 of the housing 2 is installed and the control board 5 is installed.

6 is a circuit block diagram of the LED lighting device according to the present invention, FIG. 7 is a block diagram of the LED circuit configuration of the LED lighting device according to the present invention, FIG. 8 is an actual circuit diagram of the LED lighting device according to the present invention, FIG. Is a LED perspective view of the LED lighting apparatus according to the present invention, Figure 10 is a LED connection diagram of the LED lighting apparatus according to the present invention.

Referring to the drawings, the circuit configuration of the LED lighting device is made by installing the LED array 10 and the LED driving circuit unit 20 for driving the LED (L) on a single printed circuit board (P).

At this time, the LED array unit 10 and the LED driving circuit unit 20 is electrically connected to correspond to each other 1: 1 constitute a unit block circuit (B), the unit block circuit (B) is a single commercial power source It is configured to be implemented in a single product by connecting a plurality of parallel to the. In particular, the unit block circuit (B) is divided on both sides of a single printed circuit board (P) is composed of each element is mounted by the SMT.

By such a configuration, even if a failure occurs in any part of the LED driving circuit unit 20 or the LED array unit 10 in a single lighting device product, the entire lighting device itself is a unit block circuit (B) in which a failure occurs. The remaining unit block circuit (B) except for the normal operation can be performed.

The LED driving circuit unit 20 is composed of a rectifier 23 composed of a power input unit 21 and a bridge diode 22 for rectifying the commercial power input through the power input unit 21. Here, it turns out that the commercial power source is an AC power source of 100V ~ 240V used in general homes and industrial sites.

At this time, the LED circuit driver 20 is configured by further adding a constant voltage circuit (30).

The constant voltage circuit 30 is configured to supply power of a constant voltage regardless of the voltage of the input power. That is, the constant voltage circuit 30 is a configuration for realizing a free volt and a pair of zener diodes or varistors 31 for maintaining a constant voltage with respect to an AC voltage having a voltage in both positive and positive directions. It is configured by applying an element.

The LED array 10 is composed of a plurality of LED (L) is connected in series.

Here, the LED array 10 includes a voltage drop element 25 for performing a voltage drop that is not satisfied in the LED (L). The voltage drop element 25 is mainly configured by applying a resistance. In particular, the voltage drop element 25 is preferably installed in a uniform number of LED (L) arrangement point to ensure a uniform voltage drop rate for each section of the LED (L) connected in series.

In addition, the LED (L) can be applied to a device made of a single light emitter, it is preferable to apply the SMD form as shown in Figure 9 in order to reduce the size and weight of the product according to the dense configuration of the circuit. In this case, the SMD type LEDs L include two or more light emitting chips L '(two, three, four in the figure) as shown in FIGS. 10A, 10B, and 10C. Built-in, these light emitting chips L 'are manufactured in a connected state connected in series.

That is, the light emitting chip (L ') of the LED (L) or SMD type LED (L) made of a single light emitter of the LED (L) is connected in series of 30 to 84 pieces for commercial power of 100V ~ 240V It is composed. More specifically, the number of LEDs L or light emitting chips L 'for each power source is as follows.

-100V: 27 ~ 36 LEDs (LED driving voltage is 3.0V ~ 3.4V)

-110V: 30 ~ 39 LEDs (3.0V ~ 3.4V LED driving voltage)

-120V: 33 ~ 42 LEDs (LED driving voltage is 3.0V ~ 3.4V)

-220V: 63 ~ 78 LEDs (LED driving voltage is 3.0V ~ 3.4V)

-230V: 66 ~ 81 LEDs (LED driving voltage is 3.0V ~ 3.4V)

-240V: 69 ~ 84 LEDs (3.0V ~ 3.4V LED driving voltage)

1 is a perspective view of the LED lamp device according to the present invention.

2 is a cross-sectional view of the LED lamp device according to the present invention.

Figure 3 is a bottom view of the LED lamp device according to the present invention.

Figure 4 is a perspective view of a printed circuit board of the LED lighting device according to the present invention.

5 is a cross-sectional view of the lighting unit printed circuit board of the LED lighting device according to the present invention.

Figure 6 is a circuit block diagram of the LED lamp device according to the present invention.

7 is a block diagram of the LED circuit configuration of the LED lighting device according to the present invention.

8 is an actual circuit diagram of the LED lamp device according to the present invention.

9 is a perspective view of the LED lighting apparatus according to the present invention.

10 is a LED connection diagram of the LED lighting apparatus according to the present invention.

<Explanation of symbols for the main parts of the drawings>

1: lighting unit 2: housing

3: thermal barrier member 4: terminal

5: control board 6: heat dissipation hole

10: LED array 20: LED drive circuit

22: bridge diode 23: rectifier

24: thermally conductive material layer 30: constant voltage circuit

31: Varistor B: unit block circuit

L: LED L ': Light emitting chip

Claims (14)

A plurality of LEDs (L) disposed on the printed circuit board (P) to emit light; The lighting unit 1 is installed at one side, and a control board 5 for intermittently controlling and controlling the driving of the LED L is installed at the rear in which the lighting unit 1 is installed, and the lighting unit 1 and the control board ( A housing 2 equipped with a terminal 4 on the other side for supplying power to 5); A heat shield member 3 mounted between the lighting unit 1 and the control board 5 inside the housing 2 to block heat generated from the lighting unit 1 from being applied to the control board 5. , A plurality of LEDs (L) are arranged and mounted on one surface of the printed circuit board (P), and each element for driving the LED (L) is mounted on the back surface of the printed circuit board (P) in the form of SMT, and the thermal conductivity on the back surface of each device is mounted. Incandescent lamp-type LED lamp device, characterized in that the material layer (24) is formed. The method according to claim 1, wherein the thermal barrier member 3 An incandescent lamp type LED lighting device, characterized in that formed of any one selected from polybutylen terephthalate (PBT) resin, polyphenylene sulfide (PPS) resin, polypropylene amide (PPA) resin. The method according to claim 2, wherein the thermal barrier member 3 An incandescent lamp type LED lighting device, characterized in that the resin is formed to have a surface resistance of 10 ^-20 ~ 10 ²⁰ (Ω / sq) for the antistatic function. The method of claim 1, wherein the housing (2) An incandescent lamp type LED lighting device, characterized in that formed of any one selected from polybutylen terephthalate (PBT) resin, polyphenylene sulfide (PPS) resin, polypropylene amide (PPA) resin. delete The method of claim 1 wherein the layer of thermally conductive material 24 An incandescent lamp-type LED lamp device, characterized in that formed by coating a composition having a thermal conductivity function by adding and mixing any one or more materials of carbon, CNT, graphite to the synthetic resin. The method of claim 6 wherein the layer of thermally conductive material 24 An incandescent lamp type LED lighting device, characterized in that the thermal conductivity is maintained at 0.01 W / m · k ~ 2000 W / m · k. The method of claim 1, Incandescent lamp-type LED lamp device, characterized in that a plurality of heat dissipation holes (6) are formed in the housing (2) to discharge the heat transferred by the heat conductive material layer (24) to the outside. The method of claim 1, wherein the lighting unit (1) An LED driving circuit unit 20 for rectifying and supplying an input commercial AC power; It includes; LED array unit 10 for driving the LED (L) by performing a voltage drop in the LED (L) connected in series in the number corresponding to the input power rectified by the LED driving circuit unit 20; An incandescent lamp type LED lighting device. The method of claim 9, The LED driving circuit unit 20 and the LED array unit 10 are each connected in a one-to-one correspondence and constitute a single block unit circuit B. A plurality of block unit circuits B are provided for a single commercial power supply. Incandescent lamp-type LED lamp device characterized in that consisting of a single lighting product connected in parallel. The method of claim 9, The LED driving circuit unit 20 includes a rectifying unit 23 composed of a bridge diode 22 to rectify the commercial power input from the outside, the LED array unit 10 LED (L) for the commercial power input Incandescent lamp-type LED lamp device characterized in that the voltage drop element 25 for performing the voltage drop corresponding to the number of series connected in series with the LED (L). The method of claim 9 or 10, wherein the drive circuit section 20 It includes a constant voltage circuit 30 for supplying a constant voltage power irrespective of the voltage of the commercial power input, the constant voltage circuit 30 is a pair of zener diodes or varistors to maintain a constant voltage for the bidirectional voltage (varistor) An incandescent lamp type LED lighting device, characterized in that the device is applied. The method of claim 9, wherein the LED (L) is Applied in the form of SMD having a plurality of light emitting chips (L ') therein, the light emitting chip (L') incandescent lamp type LED lighting device, characterized in that configured in series with each other. The method according to claim 9 or 13, Among the LEDs (L), the light emitting chip (L ') of the LED (L) or SMD type LED (L) of a single light emitting device is characterized in that the number of 30 to 84 in series for commercial power of 100V ~ 240V Incandescent bulb type LED lighting device.

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