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KR101027021B1 - Heat dissipation structure of LED luminaire with thermal pad - Google Patents

Heat dissipation structure of LED luminaire with thermal pad Download PDF

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Publication number
KR101027021B1
KR101027021B1 KR1020100050792A KR20100050792A KR101027021B1 KR 101027021 B1 KR101027021 B1 KR 101027021B1 KR 1020100050792 A KR1020100050792 A KR 1020100050792A KR 20100050792 A KR20100050792 A KR 20100050792A KR 101027021 B1 KR101027021 B1 KR 101027021B1
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led
heat
heat dissipation
pcb
thermal pad
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Korean (ko)
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신광균
최종침
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주식회사 하나씨엔에스
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Priority to PCT/KR2011/001508 priority patent/WO2011152608A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 메탈 PCB 또는 LED가 부착되는 PCB 상에 LED의 써멀패드 부분을 넓게 확장하여 확장된 써멀패드에 방열성능이 우수한 알루미늄 또는 구리와 같은 방열 소재인 메탈밴드를 부착하고 부착된 방열소재를 등기구의 히트싱크로 연결하여 LED의 써멀패드에서 방출되는 열이 등기구의 히트싱크로 바로 직접 전달되게 하는 써멀패드가 확장된 LED 등기구의 방열구조에 관한 것이다.The present invention is to expand the thermal pad portion of the LED on the metal PCB or PCB to which the LED is attached to the thermal pad extended to the heat dissipation material such as aluminum or copper excellent heat dissipation material attached to the metal band and the attached heat dissipating material It is related to the heat dissipation structure of an LED luminaire in which the thermal pad is expanded so that heat emitted from the LED's thermal pad is directly transferred to the heat sink of the luminaire.

Description

써멀패드가 확장된 ＬＥＤ 등기구의 방열구조{structure of protecting heat in LED road lighter}Heat dissipation structure of LED luminaire with extended thermal pad {structure of protecting heat in LED road lighter}

본 발명은 써멀패드가 확장된 LED 등기구의 방열구조에 관한 것으로서, 더욱상세하게는 메탈 PCB 또는 LED가 부착되는 PCB 상에 LED의 써멀패드 부분을 넓게 확장하여 확장된 써멀패드에 방열성능이 우수한 알루미늄 또는 구리와 같은 방열 소재인 메탈밴드를 부착하고 부착된 방열소재를 등기구의 히트싱크로 연결하여 LED의 써멀패드에서 방출되는 열이 등기구의 히트싱크로 바로 직접 전달되게 하는 써멀패드가 확장된 LED 등기구의 방열구조에 관한 것이다.The present invention relates to a heat dissipation structure of an LED luminaire having an extended thermal pad, and more particularly, an aluminum having excellent heat dissipation performance in a thermal pad extended by expanding a thermal pad portion of an LED on a metal PCB or a PCB to which an LED is attached. Alternatively, heat dissipation of LED pads with extended thermal pads that attach metal bands, such as copper, and attach the attached heat sinks to the heat sink of the luminaire so that heat emitted from the LED's thermal pad can be transferred directly to the heat sink of the luminaire. It's about structure.

엘이디(LED)는 전압을 인가하면 자체 발광하는 소자로써, 수명이 길고 친환경적이고 응답속도가 빠르다는 장점이 있어서 조명용 또는 LCD 백라이트(Back Light)에 장착되어 사용되고 있다. 그런데, 엘이디는 자체 발광소자이기 때문에 열을 방출하므로 엘이디 모듈에는 기본적으로 방열을 위한 냉각 장치를 포함하고 있다. 종래의 LED 모듈은 방열을 위해 기본적으로 전극 패턴이 형성된 메탈 코어 PCB (Metal Core Printed Circuit Board, 이하' MC PCB라고 함)를 이용하여 열 방출을 용이하게 하는 장치를 사용하고 있다. 보다 구체적으로, 히트싱크 상에 LED 패키지의 리드프레임(Lead frame)이 접속되는 솔더 패드(Solder Pad)를 가진 MC PCB가 장착된다. 상기 히트싱크(50)와 MC PCB는 열 전도성 써멀패드(Thermal Pad)를 사용하여 접착한다. LED 패키지는 리드프레임을 구비하고, 원활한 열 방출을 위해 하부에 히트 슬러그(Heat Slug)가 형성된다. 히트 슬러그와 MC PCB는 솔더링(Soldering, 납땜) 또는 써멀 그리스(Thermal Grease)에 의해 접착된다.LED is a device that emits light when voltage is applied. It has a long life, eco-friendliness, and quick response, so it is used for lighting or LCD backlight. However, since the LED emits heat because it is a self-light emitting device, the LED module basically includes a cooling device for heat dissipation. Conventional LED module uses a device that facilitates heat dissipation by using a metal core PCB (Metal Core Printed Circuit Board, hereinafter referred to as 'MC PCB)' is basically formed electrode pattern for heat dissipation. More specifically, an MC PCB having a solder pad to which a lead frame of an LED package is connected is mounted on a heat sink. The heat sink 50 and the MC PCB are bonded using a thermally conductive thermal pad. The LED package has a leadframe, and heat slugs are formed at the bottom for smooth heat dissipation. Heat slugs and MC PCBs are bonded by soldering or thermal grease.

LED는 PN접합 구조를 가지는 반도체의 내부에 주입된 소수 캐리어의 재결합에 의하여 전기에너지를 빛에너지로 변환시키는 소자로서 기존의 형광등이나 백열전구에 비해 전력소비가 적고 에너지효율이 높을 뿐만 아니라 수명이 매우 긴 장점을 가지며, 실내,외 조명장치나 자동차 조명장치를 중심으로 그 사용범위가 급격히 확대되고 있다. LED is a device that converts electric energy into light energy by recombination of minority carriers injected into the semiconductor with PN junction structure. It has less power consumption, higher energy efficiency and longer lifespan than conventional fluorescent lamps or incandescent bulbs. It has a long advantage, and its range of use is expanding rapidly, especially in indoor and outdoor lighting devices or automobile lighting devices.

일반적인 LED 조명장치의 방열구조는 일면에 전극패턴을 구비하는 PCB 기판에 LED광원모듈이 탑재되고 타면에는 히트싱크가 결합된다. PCB 기판은 금속재질(예, 알루미늄)의 모재에 절연층을 도포한 것이 주로 사용되며, 절연층의 상부에 배선용 동박이 형성된다. LED광원모듈은 패키지용 기판에 LED칩을 탑재하고 LED칩과 전극단자를 전기적으로 연결한 후 렌즈커버를 장착한 구조를 가진다. LED칩의 상부에 형광물질(예, YAG)이 도포되는 경우도 있다.In the heat dissipation structure of a general LED lighting device, an LED light source module is mounted on a PCB board having an electrode pattern on one surface thereof, and a heat sink is coupled to the other surface thereof. The PCB substrate is mainly used by applying an insulating layer to a base metal material (eg, aluminum), and a copper foil for wiring is formed on the insulating layer. The LED light source module has a structure in which an LED chip is mounted on a package board, an LED chip and an electrode terminal are electrically connected, and a lens cover is mounted. In some cases, a fluorescent material (eg, YAG) is coated on the LED chip.

LED 등기구는 방열을 위하여 방열을 위한 히트싱크(Heat sink)와 PCB를 부착하게 된다. 이 과정에서 메탈(Metal) PCB의 경우 LED에서 방출되는 열은 PCB 패드를 통하여, PCB의 절연층을 통과하여 메탈면으로 열 전달이 되고, 메탈면의 열이 등기구의 히트싱크로 전달되게 된다.The LED luminaire attaches a heat sink and PCB for heat dissipation. In this process, in the case of a metal PCB, heat emitted from the LED is transferred to the metal surface through the PCB pad and through the insulating layer of the PCB, and the heat of the metal surface is transferred to the heat sink of the luminaire.

상기와 같은 구조의 경우 메탈 PCB 절연층의 열전달계수[Thermal conductivity W/(m·K): Expoxy 약 0.3/Aluminium 약 230/Copper 약 400]가 낮아 LED에서 방출되는 열이 히트싱크(Heat sink)로 제대로 전달되지 않게 된다. 또한 일반 PCB(FR 4))의 경우 관통홀(Via)을 적용하여 열 전달이 수월하게 하지만 절연층의 두께가 두꺼워 원활한 열전달이 이뤄지지 않는다.In the case of the above structure, the heat transfer coefficient [Thermal conductivity W / ( m · K ): Expoxy about 0.3 / Aluminium about 230 / Copper about 400] of the metal PCB insulation layer is low, so that the heat emitted from the LED is a heat sink. Will not be delivered correctly. In addition, in the case of general PCB (FR 4)), through holes (Via) are applied to facilitate heat transfer.

본 발명은 상기 문제점을 해결하기 위한 것으로서, 열전도율이 높은 구리나 알루미늄 구조물을 LED 써멀패드(Thermal pad)에 부착하여, LED 등기구의 방열효율을 획기적으로 향상시킴으로써 LED 등기구의 에너지효율을 개선하고, 수명을 크게 연장시킬 수 있는 방열구조를 제공하는데 그 목적이 있다. 또한 본 발명은 LED 모듈에서 발생한 열을 기판을 경유하지 않고 직접 히트싱크로 전달함으로써 금속재질의 기판을 대신하여 통상의 PCB 기판을 사용할 수 있는 LED 등기구를 제공하는데 그 목적이 있다.The present invention is to solve the above problems, by attaching a high thermal conductivity copper or aluminum structure to the LED thermal pad, to dramatically improve the heat dissipation efficiency of the LED lighting, improve the energy efficiency of the LED lighting, life The purpose is to provide a heat dissipation structure that can be greatly extended. In addition, an object of the present invention is to provide an LED luminaire that can use a conventional PCB substrate in place of the metal substrate by transferring the heat generated from the LED module directly to the heat sink without passing through the substrate.

본 발명은 열을 방열하는 히트싱크(50); 상기 히트싱크(50)의 상부에 장착되며, LED 패키지가 장착되는 관통부(26), 전극패드(27)와 회로패턴이 구비되어 있는 PCB 기판(20); 상기 PCB 기판(20)의 관통부(26) 상부를 횡단하도록 PCB 기판(20)의 일면에 탑재된 다수개의 LED(10) 광원모듈; 일부분이 PCB 기판(20)의 관통부(26)에 삽입되어 있는 상태로 관통부(26)의 상부로 확장되어 LED 광원모듈의 상부로 돌출되고, 관통부(26)의 하부로 확장되어 LED 광원모듈의 하부로 돌출되어 있는 확장된 써멀패드(22-1, 22-2); 및 상기 써멀패드(22-1, 22-2)와 측면에 있는 다른 써멀패드(22-1, 22-2)가 연결될 수 있도록 확장된 써멀패드(22-1, 22-2)의 상단에 장착되고, 메탈밴드(60)의 양쪽 단부에 히트싱크(50)가 고정구로 연결되어 있는 메탈밴드(60)로 이루어져 있는 LED 등기구의 방열구조에 관한 것이다.The present invention provides a heat sink for dissipating heat; A PCB substrate 20 mounted on an upper portion of the heat sink 50 and having a through part 26 on which an LED package is mounted, an electrode pad 27, and a circuit pattern; A plurality of LED light source modules mounted on one surface of the PCB substrate 20 to cross the upper part of the through part 26 of the PCB substrate 20; A part is extended to the upper part of the through part 26 in a state in which a part is inserted into the through part 26 of the PCB substrate 20, protrudes to the upper part of the LED light source module, and extends below the through part 26 to the LED light source. Extended thermal pads 22-1 and 22-2 protruding from the bottom of the module; And mounted on the upper ends of the thermal pads 22-1 and 22-2 extended to be connected to the thermal pads 22-1 and 22-2 and the other thermal pads 22-1 and 22-2 on the side. And, it relates to a heat dissipation structure of the LED luminaire consisting of a metal band 60, the heat sink 50 is connected to both ends of the metal band 60 by a fixture.

본 발명은 LED 광원모듈에서 발생한 열이 직접 방열수단으로 전달되기 때문에 LED 등기구의 방열효율을 크게 개선할 수 있으며, 이를 통해 LED 등기구의 에너지효율을 향상시킬 수 있음은 물론이고 사용 수명을 크게 연장시킬 수 있다. 또한 본 발명은 방열을 위해 고가의 금속 기판을 사용할 필요가 없으므로 종래에 비해 LED 등기구의 생산단가를 크게 낮출 수 있다.The present invention can significantly improve the heat dissipation efficiency of the LED light fixtures because heat generated from the LED light source module is directly transmitted to the heat dissipation means, thereby improving the energy efficiency of the LED light fixtures, as well as significantly extending the service life. Can be. In addition, since the present invention does not need to use an expensive metal substrate for heat dissipation, it is possible to significantly lower the production cost of LED lighting fixtures compared to the prior art.

도 1은 종래의 LED 등기구 방열구조를 나타낸 단면도.
도 2는 종래의 LED 등기구 PCB 기판을 나타낸 단면도.
도 3은 종래의 LED 등기구 LED 광원모듈을 나타낸 평면도.
도 4는 본 발명의 LED 등기구 LED 광원모듈을 나타낸 평면도.
도 5는 본 발명의 LED 등기구 방열구조를 나타낸 단면도.
도 6은 본 발명의 LED 등기구 방열구조를 나타낸 사시도.
도 7은 본 발명의 LED 등기구 방열구조를 나타낸 사시도.
도 8은 본 발명의 LED 등기구 방열구조를 나타낸 분해사시도.
도 9는 본 발명의 LED 등기구 방열구조를 나타낸 사시도.
도 10은 본 발명의 LED 등기구 방열구조를 나타낸 사시도.
도 11은 본 발명의 LED 등기구 방열구조를 나타낸 사시도.
도 12는 본 발명의 LED 등기구 방열구조를 나타낸 사시도.
도 13은 본 발명의 LED 등기구 방열구조를 나타낸 사시도.1 is a cross-sectional view showing a heat dissipation structure of a conventional LED lighting fixture.
Figure 2 is a cross-sectional view showing a conventional LED lamp PCB substrate.
Figure 3 is a plan view showing a conventional LED luminaire LED light source module.
Figure 4 is a plan view showing the LED lamp LED light source module of the present invention.
Figure 5 is a cross-sectional view showing a heat radiation structure of the LED luminaire of the present invention.
Figure 6 is a perspective view showing a heat radiation structure of the LED luminaire of the present invention.
Figure 7 is a perspective view showing a heat radiation structure of the LED luminaire of the present invention.
8 is an exploded perspective view showing a heat dissipation structure of the LED luminaire of the present invention.
Figure 9 is a perspective view showing a heat dissipation structure of the LED lamp of the present invention.
10 is a perspective view showing a heat dissipation structure of the LED luminaire of the present invention.
Figure 11 is a perspective view showing a heat dissipation structure of the LED lamp of the present invention.
12 is a perspective view showing a heat dissipation structure of the LED luminaire of the present invention.
Figure 13 is a perspective view showing a heat radiation structure of the LED luminaire of the present invention.

본 발명은 열을 방열하는 히트싱크(50); 상기 히트싱크(50)의 상부에 장착되며, LED 패키지가 장착되는 관통부(26), 전극패드(27)와 회로패턴이 구비되어 있는 PCB 기판(20); 상기 PCB 기판(20)의 관통부(26) 상부를 횡단하도록 PCB 기판(20)의 일면에 탑재된 다수개의 LED(10) 광원모듈; 일부분이 PCB 기판(20)의 관통부(26)에 삽입되어 있는 상태로 관통부(26)의 상부로 확장되어 LED 광원모듈의 상부로 돌출되고, 관통부(26)의 하부로 확장되어 LED 광원모듈의 하부로 돌출되어 있는 확장된 써멀패드(22-1, 22-2); 및 상기 써멀패드(22-1, 22-2)와 측면에 있는 다른 써멀패드(22-1, 22-2)가 연결될 수 있도록 확장된 써멀패드(22-1, 22-2)의 상단에 장착되고, 메탈밴드(60)의 양쪽 단부에 히트싱크(50)가 고정구로 연결되어 있는 메탈밴드(60)로 이루어져 있는 것을 특징으로 하는 써멀패드가 확장된 LED 등기구의 방열구조에 관한 것이다. 본 발명에 있어서 메탈밴드는 열전도율이 높은 구리 및 알루미늄 중에서 선택되는 어느 하나로 이루어져 있는 것을 특징으로 한다.The present invention provides a heat sink for dissipating heat; A PCB substrate 20 mounted on an upper portion of the heat sink 50 and having a through part 26 on which an LED package is mounted, an electrode pad 27, and a circuit pattern; A plurality of LED light source modules mounted on one surface of the PCB substrate 20 to cross the upper part of the through part 26 of the PCB substrate 20; A part is extended to the upper part of the through part 26 in a state in which a part is inserted into the through part 26 of the PCB substrate 20, protrudes to the upper part of the LED light source module, and extends below the through part 26 to the LED light source. Extended thermal pads 22-1 and 22-2 protruding from the bottom of the module; And mounted on the upper ends of the thermal pads 22-1 and 22-2 extended to be connected to the thermal pads 22-1 and 22-2 and the other thermal pads 22-1 and 22-2 on the side. And, the heat sink 50 to both ends of the metal band 60 relates to a heat dissipation structure of the LED pad, the thermal pad is expanded, characterized in that consisting of a metal band 60 is connected to the fixture. In the present invention, the metal band is made of any one selected from copper and aluminum having high thermal conductivity.

본 발명의 써멀패드가 확장된 LED 등기구는 일면에 회로패턴을 구비하는 한편 일면과 타면을 관통하는 관통부(26)를 가지는 PCB 기판(20), 저면이 PCB 기판(20)의 관통부(26) 상부에 위치하도록 PCB 기판(20)의 일면에 장착되는 LED(10) 광원모듈, 상기 PCB 기판(20)의 하부에 위치하며 일부분이 PCB 기판(20)의 관통부(26)로 삽입되어 있는 상태로 관통부(26)의 상부로 확장되어 LED 광원모듈의 상부로 돌출되고, 관통부(26)의 하부로 확장되어 LED 광원모듈의 하부로 돌출되어 있는 확장된 써멀패드(22-1, 22-2), 상기 써멀패드(22-1, 22-2)와 측면에 있는 다른 써멀패드(22-1, 22-2)가 연결될 수 있도록 확장된 써멀패드(22-1, 22-2)의 상단에 장착되고, 양쪽 단부에 히트싱크(50)가 연결되어 있는 메탈밴드(60)로 이루어져 있는 것을 포함한다.The LED pad having an extended thermal pad according to the present invention has a circuit pattern on one surface and a PCB substrate 20 having a through portion 26 penetrating through one surface and the other surface, and a through portion 26 of the PCB substrate 20 having a bottom surface. LED 10 light source module mounted on one surface of the PCB substrate 20 so as to be located at the top, located at the bottom of the PCB substrate 20, a part of which is inserted into the through part 26 of the PCB substrate 20 Extended thermal pads 22-1 and 22 that are extended to the upper portion of the through-hole 26 to protrude to the upper portion of the LED light source module, and to the lower portion of the through-hole 26 to protrude to the lower portion of the LED light source module. -2) of the thermal pads 22-1 and 22-2 extended so that the thermal pads 22-1 and 22-2 and the other thermal pads 22-1 and 22-2 on the side can be connected. It is mounted to the top, and comprises a metal band 60 is connected to the heat sink 50 at both ends.

본 발명의 써멀패드가 확장된 LED 등기구는 메탈(Metal) PCB 또는 LED가 부착되는 PCB 상에 LED의 써멀패드(Thermal pad) 부분을 넓게 확장하여 확장된 써멀패드(Thermal pad)에 방열성능이 우수한 알루미늄 또는 구리와 같은 방열 소재인 메탈밴드(60)를 부착하고 부착된 방열소재를 등기구의 히트싱크(Heat sink)로 연결하여 LED의 써멀패드(Thermal pad)에서 방출되는 열이 등기구의 히트싱크(Heat sink)로 바로 직접 전달되게 하는 구조이다. 본 발명의 LED 등기구 구조는 LED에서 발생하는 열이 바로 등기구의 히트싱크(Heat sink)로 전달되어 기존의 PCB를 통하여 히트싱크(Heat sink)로 열전달이 이뤄지는 구조보다 방열성능이 훨씬 우수하다.The thermal pad of the present invention is expanded LED luminaire has excellent heat dissipation performance on the thermal pad (Extended thermal pad) by extending the thermal pad portion of the LED on the metal (Metal) PCB or PCB to which the LED is attached Attach the metal band 60, which is a heat dissipation material such as aluminum or copper, and connect the attached heat dissipation material to the heat sink of the luminaire, so that the heat emitted from the thermal pad of the LED is transferred to the heat sink of the luminaire. It is a structure that is directly transmitted to the heat sink. The LED luminaire structure of the present invention has much better heat dissipation performance than the structure in which heat generated from the LED is directly transferred to the heat sink of the luminaire and heat is transferred to the heat sink through the existing PCB.

본 발명에서 PCB 기판(20)은 종래와 같이 금속재질(예, 알루미늄)의 모재에 절연층과 배선용 동박(회로패턴)을 형성한 것일 수 있으나, LED(10) 광원모듈에서 발생한 열이 확장된 써멀패드(22-1, 22-2)와 메탈밴드(60)로 전달되고, 확장된 써멀패드(22-1, 22-2)와 메탈밴드(60)로 전달된 열이 히트싱크(50)로 직접 전달되므로 금속기판이 아닌 일반적인 PCB 기판을 사용할 수 있다.In the present invention, the PCB substrate 20 may be formed of an insulating layer and a wiring copper foil (circuit pattern) on a base metal material (eg, aluminum) as in the prior art, but the heat generated from the LED 10 light source module is expanded. Heat transferred to the thermal pads 22-1 and 22-2 and the metal band 60 and to the extended thermal pads 22-1 and 22-2 and the metal band 60 is heatsink 50. Because it is delivered directly to the PCB, it is possible to use a general PCB substrate instead of a metal substrate.

일반적인 PCB 기판은 에폭시수지, 페놀수지, 테프론수지, 실리콘수지, 폴리에스테르수지, 폴리이미드 수지 등의 절연재질로 제조되므로 금속재 기판에 비해 상대적으로 저렴하다. 따라서 이를 이용하면 LED 등기구의 생산단가를 크게 낮출 수 있다. A general PCB board is made of an insulating material such as epoxy resin, phenol resin, teflon resin, silicone resin, polyester resin, polyimide resin, etc., so it is relatively inexpensive compared to a metal substrate. Therefore, this can greatly reduce the production cost of LED lighting.

본 발명에서 PCB 기판(20)에 형성된 관통부(26)는 하나의 LED 광원모듈에 대응하는 크기로 형성할 수도 있으나, 긴 슬릿 형태로 형성하는 것이 보다 바람직하다. LED 광원모듈은 종래와 같이 패키지용 기판에 LED칩을 탑재하고 LED칩과 전극단자를 전기적으로 연결한 후 렌즈커버를 장착한 구조를 가진다. LED 광원모듈의 전극단자는 (+)단자와 (-)단자를 포함하며, (+)(-)단자는 관통부(26)의 서로 반대쪽에서 PCB 기판(20)의 회로패턴에 각각 결합되는 것이 바람직하지만, 반드In the present invention, the through part 26 formed on the PCB substrate 20 may be formed in a size corresponding to one LED light source module, but it is more preferable to form the long slit. The LED light source module has a structure in which an LED chip is mounted on a package substrate and a lens cover is mounted after electrically connecting the LED chip and the electrode terminal as in the prior art. The electrode terminal of the LED light source module includes a (+) terminal and a (-) terminal, and the (+) (-) terminals are coupled to circuit patterns of the PCB substrate 20 on opposite sides of the through part 26, respectively. Desirable, but

시 이에 한정되는 것은 아니다.City is not limited to this.

본 발명에서 확장된 써멀패드(22-1, 22-2)는 PCB 기판(20)에 형성된 관통부(26)의 내부로 삽입되고 일부분이 절곡되며, LDE 모듈의 저면과 밀착되기 위해서는 적어도 관통부(26)의 내부로 삽입된 부분의 상면이 평탄해야 한다. The thermal pads 22-1 and 22-2 expanded in the present invention are inserted into and partially bent into the through part 26 formed in the PCB substrate 20, and at least the through part is in close contact with the bottom surface of the LDE module. The upper surface of the part inserted into (26) should be flat.

본 발명에서 히트싱크(50)는 알루미늄과 같은 금속재질이며, 메탈밴드(60)가 결합되는 삽입홀을 구비하는 것이 바람직하다. 본 발명에서 LED 광원모듈에서 발생한 열은 확장된 써멀패드(22-1, 22-2)와 메탈밴드(60)로 전달되고, 확장된 써멀패드(22-1, 22-2)와 메탈밴드(60)로 전달된 열이 히트싱크(50)로 직접 전달되므로 히트싱크(50) 내부의 열전달유체의 작용에 의해 외부로 방출된다. In the present invention, the heat sink 50 is made of a metal material such as aluminum, it is preferable to have an insertion hole to which the metal band 60 is coupled. Heat generated in the LED light source module in the present invention is transmitted to the extended thermal pad (22-1, 22-2) and the metal band 60, the extended thermal pad (22-1, 22-2) and the metal band ( Since heat transferred to the heat sink 60 is directly transferred to the heat sink 50, the heat is discharged to the outside by the action of the heat transfer fluid inside the heat sink 50.

본 발명에서 히트싱크(50)는 개수나 형상에 한정되지 않으며 방열효율이나 등기구의 구조에 따라 달라질 수 있다. 히트싱크(50)와 메탈밴드(60)의 경계부분에는 열전도 그리스를 도포하거나 열전도 패드를 설치하여 미세 공극으로 인한 열전도율 하락을 방지하는 것이 바람직하다. 본 발명에서 PCB 기판(20)과 히트싱크(50)는 직사각의 평면형상을 가지는 것이 바람직하며 LED 조명장치의 형태에 따라 구체적인 형상은 얼마든지 달라질 수 있다. In the present invention, the heat sink 50 is not limited to the number or shape and may vary depending on the heat radiation efficiency or the structure of the luminaire. It is preferable to apply thermal grease or install thermally conductive pads at the boundary portions of the heat sink 50 and the metal band 60 to prevent the thermal conductivity from falling due to fine pores. In the present invention, the PCB substrate 20 and the heat sink 50 preferably have a rectangular planar shape, and the specific shape may vary depending on the shape of the LED lighting device.

이상에서는 본 발명의 바람직한 실시예를 설명하였으나, 본 발명은 전술한 실시예에 한정되지 않고 다양한 형태로 변형 또는 수정될 수 있다. 그리고 이와 같이 변형 또는 수정된 실시예도 후술하는 특허청구범위에 포함된 본 발명의 기술적 사상을 포함한다면 본 발명의 권리범위에 포함됨은 당연하다.
Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment and may be modified or modified in various forms. And if such modified or modified embodiment also includes the technical spirit of the present invention included in the claims to be described later it is obvious that the included in the scope of the present invention.

10: LED 20: PCB 기판
22: 써멀패드 22-1: 확장된 상부써멀패드
22-2: 확장된 하부써멀패드 27: 전극패드
30: 절연층 40: 메탈층
50: 히트싱크 60: 메탈밴드
70: 고정구10: LED 20: PCB board
22: Thermal pad 22-1: Extended upper thermal pad
22-2: extended lower thermal pad 27: electrode pad
30: insulating layer 40: metal layer
50: heat sink 60: metal band
70: fixture

Claims (2)

열을 방열하는 히트싱크(50); 상기 히트싱크(50)의 상부에 장착되며, LED 패키지가 장착되는 관통부와 회로패턴이 구비되어 있는 PCB 기판(20); 상기 PCB 기판(20)의 관통부 상부를 횡단하도록 PCB 기판(20)의 일면에 탑재된 다수개의 LED 광원모듈; 및 메탈밴드의 양쪽 단부에 히트싱크(50)가 연결되어 있는 메탈밴드(60)로 이루어져 있으며, 상기 메탈밴드는 열전도율이 높은 구리 및 알루미늄 중에서 선택되는 어느 하나로 이루어져 있는 LED 등기구의 방열구조에 있어서,
상기 LED 등기구의 방열구조는 일부분이 PCB 기판(20)의 관통부(26)에 삽입되어 있는 상태로 관통부의 상부로 확장되어 LED 광원모듈의 상부로 돌출되고, 관통부의 하부로 확장되어 LED 광원모듈의 하부로 돌출되어 있는 확장된 써멀패드(22-1, 22-2); 및 상기 써멀패드와 측면에 있는 다른 써멀패드가 연결될 수 있도록 확장된 써멀패드(22-1, 22-2)의 상단에 메탈밴드(60)가 장착되는 것을 특징으로 하는 써멀패드가 확장된 LED 등기구의 방열구조.




A heat sink 50 for radiating heat; A PCB substrate 20 mounted on the heat sink 50 and provided with a through part and a circuit pattern on which the LED package is mounted; A plurality of LED light source modules mounted on one surface of the PCB substrate 20 to cross the upper portion of the through part of the PCB substrate 20; And a metal band 60 having heat sinks 50 connected to both ends of the metal band, wherein the metal band is made of any one selected from copper and aluminum having high thermal conductivity.
The heat dissipation structure of the LED luminaire extends to the upper part of the through light source module in a state where a part is inserted into the through part 26 of the PCB substrate 20 and protrudes to the upper part of the LED light source module, and extends to the lower part of the through light source module. Extended thermal pads 22-1 and 22-2 protruding to the bottom of the pad; And a metal band 60 mounted on an upper end of the thermal pads 22-1 and 22-2 so that the thermal pad and the other thermal pads on the side can be connected. Heat dissipation structure.




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PCT/KR2011/001508 WO2011152608A1 (en) 2010-05-31 2011-03-04 Heat radiation structure of led lighting device having expanded thermal pad

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Publication number Priority date Publication date Assignee Title
KR20100113419A (en) * 2009-04-13 2010-10-21 주식회사 인성전자 Led package and led radiant heat device, and led socket having the same

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JP3112555B2 (en) * 1992-03-23 2000-11-27 日本電子株式会社 High frequency induction heating device
KR20080002564U (en) * 2007-01-08 2008-07-11 광성전기산업(주) Lighting device with light emitting diode module
KR20080003545U (en) * 2007-02-22 2008-08-27 광성전기산업(주) Air-cooled lighting device with LED module for AC power

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Publication number Priority date Publication date Assignee Title
KR20100113419A (en) * 2009-04-13 2010-10-21 주식회사 인성전자 Led package and led radiant heat device, and led socket having the same

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