KR101025263B1 - 테이프 연마기 - Google Patents
테이프 연마기 Download PDFInfo
- Publication number
- KR101025263B1 KR101025263B1 KR1020080119267A KR20080119267A KR101025263B1 KR 101025263 B1 KR101025263 B1 KR 101025263B1 KR 1020080119267 A KR1020080119267 A KR 1020080119267A KR 20080119267 A KR20080119267 A KR 20080119267A KR 101025263 B1 KR101025263 B1 KR 101025263B1
- Authority
- KR
- South Korea
- Prior art keywords
- winder
- sensor
- tape
- driving means
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 claims abstract description 41
- 238000001514 detection method Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 27
- 230000003287 optical effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (5)
- 삭제
- 원판 형상으로 형성되고, 회전 운동 가능하게 설치되며, 외주면에 연마 테이프가 감기는 와인더;상기 와인더가 회전 운동하도록 구동력을 제공하는 구동 수단;상기 와인더의 회전 운동을 감지하는 와인더 감지 센서; 및상기 구동 수단의 운동을 감지하는 구동 수단 감지 센서;를 포함하고,상기 와인더에는 상기 와인더의 양측을 관통하는 관통공이 형성되고,상기 와인더 감지 센서는 상기 와인더를 사이에 두고 서로 마주보게 배치되는 발광센서와 수광센서를 구비하며,상기 발광센서에서 방출되는 광신호는 상기 관통공을 통해 상기 수광센서로 입사되는 것을 특징으로 하는 테이프 연마기.
- 제2항에 있어서,상기 관통공은 상기 와인더의 둘레를 따라 일정 간격으로 복수 개 형성되는 것을 특징으로 하는 테이프 연마기.
- 제2항 내지 제3항 중 어느 한 항에 있어서,상기 와인더 감지 센서와 상기 구동 수단 감지 센서로부터 출력된 감지 신호를 입력받고, 상기 감지 신호를 분석하여, 상기 구동 수단이 제공하는 구동력에 대응되게 상기 와인더가 회전 운동하는지 여부를 판별하는 와인더 동작 판별부를 더 구비하는 것을 특징으로 하는 테이프 연마기.
- 제4항에 있어서,상기 와인더 동작 판별부는 상기 와인더에 상기 구동 수단이 제공하는 구동력이 전달되지 않을 때, 상기 와인더와 상기 구동 수단의 동작을 정지시키는 차단 장치 또는 경고음 발생기를 더 구비하는 것을 특징으로 하는 테이프 연마기.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080119267A KR101025263B1 (ko) | 2008-11-28 | 2008-11-28 | 테이프 연마기 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080119267A KR101025263B1 (ko) | 2008-11-28 | 2008-11-28 | 테이프 연마기 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100060608A KR20100060608A (ko) | 2010-06-07 |
KR101025263B1 true KR101025263B1 (ko) | 2011-03-29 |
Family
ID=42361502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080119267A Active KR101025263B1 (ko) | 2008-11-28 | 2008-11-28 | 테이프 연마기 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101025263B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170032927A (ko) | 2015-09-15 | 2017-03-24 | (주)위시스 | 연마 테이프를 이용하는 연마 헤드 |
KR20170032928A (ko) | 2015-09-15 | 2017-03-24 | (주)위시스 | 박형 커버 글라스의 사이드 에지 연마장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101428529B1 (ko) * | 2012-12-03 | 2014-08-11 | 넬슨(주) | 연마 테이프 재사용 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241434A (ja) * | 2003-02-03 | 2004-08-26 | Ebara Corp | 基板処理装置 |
KR20060121565A (ko) * | 2005-05-24 | 2006-11-29 | 삼성전자주식회사 | 화학기계적연마 시스템에서의 패드 컨디셔너 회전 구동장치 |
-
2008
- 2008-11-28 KR KR1020080119267A patent/KR101025263B1/ko active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241434A (ja) * | 2003-02-03 | 2004-08-26 | Ebara Corp | 基板処理装置 |
KR20060121565A (ko) * | 2005-05-24 | 2006-11-29 | 삼성전자주식회사 | 화학기계적연마 시스템에서의 패드 컨디셔너 회전 구동장치 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170032927A (ko) | 2015-09-15 | 2017-03-24 | (주)위시스 | 연마 테이프를 이용하는 연마 헤드 |
KR20170032928A (ko) | 2015-09-15 | 2017-03-24 | (주)위시스 | 박형 커버 글라스의 사이드 에지 연마장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20100060608A (ko) | 2010-06-07 |
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