KR100989561B1 - Led and wafer inspection apparatus and inspection method of the same - Google Patents

Abstract

PURPOSE: A device and a method for inspecting an LED and a wafer are provided to increase the productivity by rapidly separating the defective LED and wafer. CONSTITUTION: A loading unit horizontally outputs an LED and a wafer one by one. An unloading unit(90) includes a cassette which is lifted by the lifting unit. A surface inspecting unit(30) includes a first vision module and a first defect receiver. An inside inspecting unit(70) includes a second vision module and a second defect receiver. A controller controls the inspection process of the LED and the wafer according to a progressive control programming.

Description

LED and wafer inspection apparatus and inspection method using same {LED and Wafer Inspection Apparatus and Inspection Method of the same}

The present invention relates to an LED and a wafer inspection apparatus, and an LED and a wafer inspection method using the same, and more particularly, a wafer inspection apparatus which can continuously perform the surface inspection and the internal inspection of the LED and wafer in one device and It relates to an LED and a wafer inspection method using the same.

In general, solar cells are devices that convert solar light into electrical energy using semiconductor properties. Recently, it has been used for the production of auxiliary power of portable information devices such as mobile phones and PDAs, driving power of mobile means such as automobiles, power generation and hot water. The solar cell module that generates the miniaturization and high output by connecting to the current situation is being actively researched.

The solar cell (hereinafter referred to as a "wafer") is a surface and internal inspection during the manufacturing process, that is, the essential inspection such as uniformity, hot spots, unevenness of the surface and surface contamination degree sequentially proceeds, such surface and Internal inspections are performed by independent inspection devices. That is, after the surface inspection of the wafer is completed in the surface inspection apparatus, the operator moves the wafer cassette to another inspection apparatus and performs the wafer internal inspection.

In addition, the LED (Light Emitting Diode), which is a light emitting device, has recently been improved in light emitting efficiency, and its application range is that of a back light unit (BLU) or a liquid crystal display (LCD) for mobile phones in the early signal display. For light sources and lighting of large display devices, such as is becoming wider. The reason for this is that the LED consumes less power and has a longer life than the conventional light bulb or fluorescent lamp.

In recent years, the inspection method of LED, which is widely used as a high-brightness light emitting device, is a method of inspecting the LED in advance as a single product, and inspecting the state of the component (LED) by applying a test power supply after the assembly (mounting) is completed on the PCB. There is a way. Here, inspection in a single state means inspection on a wafer, and generally refers to inspection performed before shipment from a semiconductor manufacturer or the like.

However, as described above, a series of operations for inspecting the LEDs and wafers are independently separated from the main production lines, thereby reducing the production efficiency as work links are reduced.

In addition, in order to proceed with the inspection process, a worker has to manually carry and move a wafer cassette loaded with a plurality of wafers in which a plurality of LEDs or a plurality of cells are formed. Due to this, there is a problem that LEDs and wafers are broken or contaminated by particles.

Therefore, it is necessary to minimize the movement of the LED and the wafer during the inspection process in order to reduce the breakage or contamination of the wafer during the inspection of the LED and the wafer.

In addition, the conventional LED and wafer inspection apparatus is relatively large in size, resulting in space constraints in installation and operation. Therefore, miniaturization of inspection apparatus is required to maximize space utilization.

Furthermore, there is a need to separate and recycle a wafer without destroying the wafer determined as defective in the inspection process of the wafer.

The present invention has been made to solve the above-mentioned problems, it is an object of the present invention to provide an LED and a wafer inspection apparatus that can improve the work efficiency by continuously performing the surface inspection and internal inspection of the LED and solar cell in one device It is done.

In addition, an object of the present invention is to provide an LED and a wafer inspection apparatus that can minimize the movement of the LED and the wafer to be inspected to reduce the damage or contamination of the LED and wafer that can occur during the inspection process.

Furthermore, an object of the present invention is to provide a miniaturized LED and wafer inspection apparatus capable of increasing space utilization.

Furthermore, an object of the present invention is to provide a wafer inspection apparatus capable of separating and collecting LEDs and wafers determined as defective in the inspection process.

In order to solve the above problems, the present invention is a cassette loaded with a plurality of wafers are lifted by the lifting means, the loading unit is provided with a push means on one side so as to withdraw the wafer one by one in the horizontal direction; A rotary wafer transfer unit including a rotary table for loading the wafer and transferring the wafer to a subsequent process; A surface inspection unit including a first vision module and a first defective storage unit for surface inspection of the wafer; An internal inspection unit including a second vision module and a second defective storage unit for an internal inspection of the wafer; An unloading unit including a cassette which is lifted and raised by lifting means for sequentially loading the wafer; And a controller for controlling an inspection process of the wafer according to sequential control programming.

In addition, four space portions for loading the wafer are formed in the rotary table, and two wafer supports for supporting the loaded wafer are respectively formed in the space portion, and the two wafer supports drop the wafer. In order to be able to move from side to side, respectively.

The first vision module may include a surface inspection camera positioned on an upper side of the rotating table, and two surface inspection ultraviolet rays disposed on both sides of the surface inspection camera, and the first defective storage unit may Located below the first vision module and the rotary table.

In addition, the second vision module includes an internal inspection camera positioned above the rotary table, and two internal inspection infrared lights disposed below the rotary table so as to face the internal inspection camera. The second defective unit may be positioned below the second vision module and the rotary table.

The two internal inspection infrared lights may be positioned adjacent to each other during the internal inspection of the wafer, and may move left and right to allow the wafer to pass when the wafer falls.

In addition, the wafer support is characterized in that consisting of sapphire material.

The inspection apparatus may further include a display storage unit configured to display and store images acquired by the first vision module and the second vision module; And an input / output unit for inputting / outputting an image stored in the display storage unit. The operator may monitor the image displayed on the display unit in real time.

According to another aspect of the invention, the present invention is a cassette loaded with a plurality of wafers are lifted by the lifting means, the loading unit is provided with a push means on one side so as to withdraw the wafer one by one in the horizontal direction; A rotary wafer transfer unit including a rotary table for loading the wafer and transferring the wafer to a subsequent process; A surface inspection unit including a first vision module and a first defective storage unit for surface inspection of the wafer; An internal inspection unit including a second vision module and a second defective storage unit for an internal inspection of the wafer; An unloading unit including a cassette which is lifted and raised by lifting means for sequentially loading the wafer; And a controller for controlling an inspection process of the wafer according to sequential control programming, comprising: loading the wafer from the loading unit to the rotatable wafer transfer unit; Transferring the loaded wafer to the surface inspection unit and performing surface inspection to separate and discharge the wafer determined to be defective into the first defective storage unit; Transferring the wafer determined to be intact in the surface inspection to the internal inspection unit, performing an internal inspection, and separating and discharging the wafer determined to be defective to the second defective storage unit; Transferring the wafer determined to be intact in the internal inspection to the unloading unit; And it provides a wafer inspection method comprising the step of unloading the wafer transferred to the unloading unit.

According to another aspect of the invention, the present invention is a cassette loaded with a plurality of wafers are lifted by the lifting means, the loading unit is provided with a push means on one side so as to withdraw the wafer one by one in the horizontal direction; A rotary wafer transfer unit including a rotary table for loading the wafer and transferring the wafer to a subsequent process; A surface inspection unit including a first defective module including a first vision module for inspecting the surface of the wafer and a cassette lifted by an elevating unit; An internal inspection unit including a second vision module for internal inspection of the wafer and a second defective storage unit including a cassette lifted by an elevating unit; An unloading unit including a cassette which is lifted and raised by lifting means for sequentially loading the wafer; And a controller for controlling an inspection process of the wafer according to sequential control programming.

In addition, the rotary table is provided with four spaces for loading the wafer, the push means for pushing the loaded wafer in the outward direction of the rotary table corresponding to the four spaces are respectively provided, the space The portion is characterized in that each of the wafer support for supporting the loaded wafer is provided.

The first vision module may include a surface inspection camera positioned on an upper side of the rotating table, and two surface inspection ultraviolet rays disposed on both sides of the surface inspection camera, and the first defective storage unit may It is characterized in that it is located adjacent to the outside of the rotary table.

In addition, the second vision module includes an internal inspection camera positioned above the rotary table, and an internal inspection infrared light disposed below the rotary table so as to face the internal inspection camera. The housing is characterized in that it is located adjacent to the outside of the rotary table.

In addition, the wafer support is characterized in that consisting of sapphire material.

The inspection apparatus may further include a display storage unit configured to display and store images acquired by the first vision module and the second vision module; And an input / output unit for inputting / outputting an image stored in the display storage unit. The operator may monitor the image displayed on the display unit in real time.

According to another aspect of the invention, the present invention is a cassette loaded with a plurality of wafers are lifted by the lifting means, the loading unit is provided with a push means on one side so as to withdraw the wafer one by one in the horizontal direction; A rotary wafer transfer unit including a rotary table for loading the wafer and transferring the wafer to a subsequent process; A surface inspection unit including a first defective module including a first vision module for inspecting the surface of the wafer and a cassette lifted by an elevating unit; An internal inspection unit including a second vision module for internal inspection of the wafer and a second defective storage unit including a cassette lifted by an elevating unit; An unloading unit including a cassette which is lifted and raised by lifting means for sequentially loading the wafer; And a controller for controlling an inspection process of the wafer according to sequential control programming, comprising: loading the wafer from the loading unit to the rotatable wafer transfer unit; Transferring the loaded wafer to the surface inspection unit and performing surface inspection to separate and collect the wafer determined as defective into the first defective storage unit; Transferring the wafer determined to be intact in the surface inspection to the internal inspection unit, performing an internal inspection, and separately collecting the wafer determined to be defective into the second defective storage unit; Transferring the wafer determined to be intact in the internal inspection to the unloading unit; And it provides a wafer inspection method comprising the step of unloading the wafer transferred to the unloading unit.

As described above, in the LED and wafer inspection apparatus according to the present invention, since the surface inspection and the internal inspection of the inspection object are continuously performed in one transfer table, work efficiency and space utilization may be improved. In addition, it is possible to reduce the damage or contamination of the inspection object that can occur during the inspection by reducing the distance that the inspection object is transported in the inspection process.

In addition, there is an advantage that the output can be increased by quickly separating and discharging the LEDs and wafers determined to be defective in the surface inspection and the internal inspection in a simple manner. By separate collection as it is, there is an advantage that the defective LEDs and wafers can be recycled.

1 is a perspective view of an LED and a wafer inspection apparatus according to the present invention,
2 is a plan view of the LED and wafer inspection apparatus shown in FIG.
3 is a schematic diagram showing the configuration of the LED and wafer inspection apparatus shown in FIG.
4 is a perspective view showing a loading unit of the LED and wafer inspection apparatus shown in FIG.
5 is a plan view illustrating push means of the LED and wafer inspection apparatus shown in FIG. 1;
6 is a schematic view showing a first vision module of the LED and wafer inspection apparatus shown in FIG.
FIG. 7 is a perspective view illustrating a defective storage unit of the LED and wafer inspection apparatus illustrated in FIG. 1;
8 is a plan view showing the operation of the wafer support of the LED and wafer inspection apparatus shown in FIG.
9 is a schematic view showing a second vision module of the LED and wafer inspection apparatus shown in FIG.
10 is a perspective view illustrating an unloading part of the LED and wafer inspection apparatus shown in FIG. 1;
11 is a perspective view of an LED and a wafer inspection apparatus according to another embodiment of the present invention,
12 is a plan view of the LED and wafer inspection apparatus shown in Figure 11 of the present invention,
FIG. 13 is a perspective view showing a first defective housing of the LED and wafer inspection apparatus shown in FIG. 11 of the present invention; FIG.
14 is a schematic view showing a second vision module of the LED and wafer inspection apparatus shown in FIG. 11 of the present invention;
FIG. 15 is a perspective view illustrating a second defective storage unit of the LED and wafer inspection apparatus illustrated in FIG. 11 of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the preferred embodiment of the present invention.

In the present specification, it should be noted that the same elements shown in the drawings are denoted by the same reference numerals as much as possible even if they are shown in other drawings.

Hereinafter, for convenience of description, the 'LED and wafer inspection apparatus' will be simply described as 'wafer inspection apparatus'.

Example  One

1 to 3, the wafer inspection apparatus 1 according to the present invention includes a loading unit 10, a surface inspection unit 30, a rotating wafer transfer unit 50, an internal inspection unit 70, and an unloading unit ( 90) and the controller 110.

The loading unit 10 is a portion for sequentially taking out the wafers W loaded in the cassette 11 for inspection, and a plurality of slots are formed in the cassette 11, and the plurality of slots are formed in the cassette 11. The wafer W is loaded in the slot. In addition, the loading unit 10 is fixed to the lifting means 13 for elevating the cassette 11, and one side of the cassette 11 is fixed to be installed in the cassette 11 so as to be moved forward and backward in a horizontal direction. Push means 15 for pushing the wafer (W) one by one to the outside.

The lifting means 13 may be any one as long as the cassette can lift and lower the cassette. In order to load the wafer W loaded in the cassette 11 to the rotary table 51, which will be described later, the elevating means 13 moves the drawing target wafer W to the rotary table 51 and the push means 15. In the same plane).

4 and 5, the push means 15 is coupled to the air cylinder (15a) using the pneumatic, the back and forward of the air cylinder (15a) and the horizontal reciprocating member (15c) at the front end It consists of a combined push rod 15b. In order to take out the wafer W loaded in the cassette 11 to the outside, the horizontal reciprocating member 15c pushes the wafer W horizontally toward the rotary table 51 while moving forward and backward. .

1 and 2, the rotary table 51 is rotatable by a power such as a motor (not shown), and a plurality of spaces 53 on which the wafers W are loaded are centered on the rotary shaft 52. It is formed to be spaced apart by a certain angle. According to a preferred embodiment of the present invention, the number of the space portion 53 is four, the angle of the space portion spaced from each other is 90 °. The four space parts 53 correspond to a loading part, a surface inspection part, an internal inspection part and an unloading part, respectively.

According to the present invention, it is possible to inspect the wafers W of various sizes by adjusting the size of the space portion 53. To this end, it is preferable to configure the rotary table 51 detachably.

In addition, referring to FIG. 8, the four spaces 53 support the wafers at the time of inspection, and if the wafers are determined to be defective, two wafer supports 33 extended to both sides to separate and discharge the wafers. Is formed. The wafer support 33 is preferably made of sapphire material excellent in transmittance and strength. In the space portion 53, a push means 55 is formed to push the wafer W supported by the wafer support 33 to the outside of the space portion 53. The push means 55 is preferably located in the center direction of the rotary table 51.

The two wafer supports 33 are provided with wafer detection sensors 33c, respectively. The wafer detection sensor 33c may use any sensor such as a prism sensor. Information obtained from the wafer detection sensor 33c is sent to the controller 110, and the controller 110 adjusts the height of the cassette 11 of the loading unit 10 based on the detected information. That is, when the wafer is loaded from the wafer sensor 33c, the controller 110 raises the height of the cassette of the loading unit 10 by one slot height to prepare for the next wafer W to be loaded. It is desirable to be programmed.

Referring to FIG. 6, the surface inspection unit 30 is a portion for inspecting the presence or absence of scratches, cracks, and contamination on the surface of the wafer W loaded from the loading unit 10 to the rotary table 51. In addition, when there is an abnormality on the surface of the wafer W, the wafer W may be separated and discharged.

Specifically, the surface inspection unit 30 is a surface inspection camera (35a) fixed to the upper side of the rotary table 51 and the surface inspection illumination (35b) provided on both sides of the surface inspection camera (35a). It comprises a first vision module 35 made. The surface inspection camera 35a is not particularly limited, but it is preferable to use one capable of obtaining a high quality electronic image. As the surface inspection ultraviolet light 35b, it is preferable to use LED lighting. The reason why the ultraviolet light is used is because the wavelength of the ultraviolet light is short, so that the penetration is weak, and the surface has a characteristic of detecting minute cracks.

The controller 110 receives the image photographed by the first vision module 35, and compares the received image with predetermined reference data stored in advance to determine whether the wafer W has a surface defect. In this case, if it is determined that the defect is determined, the control unit 110 separates and discharges the wafer W. When it is determined that there is no abnormality, the controller 110 transfers the wafer W to the next stage internal inspection unit 70.

Referring to FIG. 7, in order to separate and discharge a wafer that is determined to be defective as a result of surface inspection, a first defective storage portion 37 is formed at a lower end of the rotary table 51 on which the first vision module 35 is located. Located. The first defective storage unit 37 extends below the rotary table 51 at a predetermined interval from the rotary table 51.

Specifically, referring to FIGS. 7 and 8, in the space portion 53, the wafer W is supported by two wafer supports 33a that are movable to both sides according to the operation of the air cylinder 33b. Therefore, when the control unit 110 determines that the defect is defective and must discharge the defective wafer to the first defective storage unit 37, the air cylinder 33b operates to move the support 33a from side to side. , The distance between the two support (33a) is expanded. As a result, the wafer W supported by the support falls to the first defective storage part 37.

At this time, since the number of wafers W collected in the first defective storage unit 37 is limited, the number of defective wafers W dropped by the controller 110 to the first defective storage unit 37. It is preferable to stop the operation of the wafer inspection apparatus 1 and to sound an alarm when the predetermined count is reached.

In some cases, the first defective storage portion 37 is disposed on the defective wafer W by using the push means formed on the rotary table 51 without using two wafer supports 33a movable to both sides as described above. Can be dropped. In this case, without pushing the wafer support 33a, the push means pushes the defective wafer W positioned on the wafer support 33a to the outside of the space 53 to the first defective storage unit ( 37) It is possible to drop.

The wafer W whose surface inspection has been completed by the surface inspection unit 30, that is, the wafer W determined to have no abnormality during surface inspection, is transferred to the internal inspection unit 70, which is the next stage, by the rotating wafer transfer unit 50. do. At the same time, the newly loaded wafer from the loading unit 10 is transferred to the surface inspection unit 30.

The internal inspection unit 70 is a portion for inspecting the presence of internal defects such as cracks and voids existing in the wafer W transferred by the rotatable wafer transfer unit 50. In addition, the wafer W may be separated and discharged depending on whether the wafer W is abnormal.

9, the internal inspection unit 70 includes a second vision module 75 including an internal inspection camera 75a and two internal inspection infrared lights 75b. The internal inspection camera 75a is not particularly limited, but it is preferable to use one capable of obtaining a high quality electronic image. It is preferable to use LED lighting as the internal illumination infrared light 75b. The reason for using infrared rays is because the wavelength of infrared rays is long, so the penetration power is excellent.

In addition, the internal inspection camera 75a and the internal inspection infrared light 75b may be installed to face each other by being spaced apart from a predetermined space. According to a preferred embodiment of the present invention, the internal inspection camera 75a is located above the rotary table 51, and the internal inspection infrared light 75b is positioned below the rotary table 51. do.

In addition, in the case of the two internal inspection infrared illumination (75b), the inspection is located adjacent to each other to assist in the image acquisition (see Fig. 9 (a)), and the wafer (W) determined to be defective inspection results In order to make it fall, it moves to the left and right, respectively, and forms the space which the said wafer can pass (refer FIG. 9 (b)).

The controller 110 receives the image photographed by the second vision module 75 and compares the received image with predetermined reference data stored in advance to determine whether the wafer W is defective internally. In this case, if it is determined that the defect is determined, the control unit 110 separates and discharges the wafer W. If it is determined that there is no abnormality, the controller 110 transfers the wafer W to the next unloading unit.

In order to separate and discharge the wafer determined to be defective as a result of the internal inspection, a second defective storage unit (not shown) is positioned at the lower end of the rotary table 51 on which the second vision module 75 is located. Like the aforementioned first defective storage unit, the second defective storage unit extends below the two internal inspection infrared lights 75b at a predetermined interval from the two internal inspection infrared lights 75b.

Specifically, referring to FIG. 9, in the space portion 53, the wafer W is supported by two wafer supports 33a that are movable to both sides according to the operation of the air cylinder 33b. Therefore, when the control unit 110 determines that the defective and the defective wafer (W) to be separated and discharged to the second defective storage unit by operating the air cylinder 33b to move the support 33a to the left and right, respectively , The distance between the two support (33a) is expanded. At this time, since the two internal inspection infrared lights 75b are located below the wafer support 33a in the vertical direction, in order to drop the wafer W which is determined to be defective, the two internal inspection infrared lights ( 75b) should also extend simultaneously with the extension of the support 33a. As a result, the wafer W supported by the support 33a passes through the support and the internal inspection infrared light 75b and is determined to be defective by the controller 110. Fall).

In some cases, it is also possible to drop the defective wafer W into the second defective storage portion 47 by using the push means formed on the rotary table 51 without expanding the support base 33a.

Next, the wafer W, which has been inspected internally by the internal inspection unit, that is, the wafer W that is determined to have no abnormality during the internal inspection, is transferred to the unloading unit 90, which is the next stage, by the rotating wafer transfer unit 50. Transferred. At the same time, the wafer determined to have no abnormality in the surface inspection unit 30 is transferred to the internal inspection unit 70, and the wafer newly loaded in the loading unit 10 is transferred to the surface inspection unit 30, and is loaded. The new wafer is loaded in the section 10.

The unloading unit 90 includes a cassette 91 which is lifted and lifted by lifting means 93 such as an elevator. The wafers W having completed the internal inspection are sequentially loaded into the cassette 91.

Specifically, the push means 55 for pushing the loaded wafer is mounted on the inner surface of the inner surface formed in the space portion 53 of the rotary table 51 toward the center 52 of the rotary table 51. The push means 55 has the same configuration as the push means 15 used in the loading unit 10.

In this case, a wafer detection sensor (not shown) is provided in each of the internal slots of the cassette 91 to detect whether the wafer W is loaded and transmit the detection information to the controller 110. The controller 110 adjusts the height of the cassette 91 by using the lifting means 93 based on the transmitted sensing information.

Referring to FIG. 3, the LED and wafer inspection apparatus 1 according to the present invention includes a display storage unit 130 in which an image obtained by the first vision module 35 and the second vision module 75 is displayed and stored. ; And an input / output unit 150 for inputting / outputting an image stored in the display storage unit 130. Therefore, the operator operating the inspection device 1 can monitor and control the image displayed on the display unit 130 in real time.

Example  2

Example 2 relates to a wafer inspection method using the wafer inspection apparatus of Example 1 described above.

Specifically, the present invention, the cassette is loaded with a plurality of wafers are lifted by the lifting means, the loading unit is provided with a push means on one side so as to withdraw the wafer one by one in the horizontal direction; A rotary wafer transfer unit including a rotary table for loading the wafer and transferring the wafer to a subsequent process; A surface inspection unit including a first vision module and a first defective storage unit for surface inspection of the wafer; An internal inspection unit including a second vision module and a second defective storage unit for an internal inspection of the wafer; An unloading unit including a cassette which is lifted and raised by lifting means for sequentially loading the wafer; And a controller for controlling an inspection process of the wafer according to sequential control programming, comprising: loading the wafer from the loading unit to the rotatable wafer transfer unit; Transferring the loaded wafer to the surface inspection unit and performing surface inspection to separate and discharge the wafer determined to be defective into the first defective storage unit; Transferring the wafer determined to be intact in the surface inspection to the internal inspection unit, performing an internal inspection, and separating and discharging the wafer determined to be defective to the second defective storage unit; Transferring the wafer determined to be intact in the internal inspection to the unloading unit; And it provides a wafer inspection method comprising the step of unloading the wafer transferred to the unloading unit.

Hereinafter, the wafer inspection method according to Example 2 will be described in detail.

First, when the wafer W is loaded from the loading unit 10 into the space portion 53 of one of the plurality of space portions 53 installed on the rotary table 51, the controller 110 receives the wafer from the wafer detection sensor. (W) Detect the loading information and rotate the rotary table 51 by 90 ° counterclockwise.

In this case, the first wafer W loaded in the space 53 is rotated and transferred to the surface inspection unit 30, and the second wafer W is loaded in the space 53 of the loading unit 10. This wafer W loading is performed continuously.

Then, the surface inspection of the wafer W loaded by the first vision module 35 installed in the surface inspection unit 30 is performed.

The wafer W, which is determined to be defective in the surface inspection, is separated and discharged into the first defective storage portion 37 as the wafer support 33a of the space portion extends to both sides. In some cases, it is also possible to drop the defective wafer W into the first defective storage portion 37 using the push means 55 formed on the rotary table 51 without extending the wafer support 33a. Do.

In the case of the wafer W having no abnormality in the surface inspection, the wafer is rotated and transferred to the next inspection point, the internal inspection unit 70, and the internal inspection of the wafer loaded by the second vision module 75 installed in the internal inspection unit 70. Will be made.

The wafer W, which is determined to be defective in the internal inspection, is separated and discharged into the second defective storage portion 47 as the wafer support 33a of the space portion and the infrared illumination 75b for internal inspection are extended to both sides. In some cases, the second defective defect of the defective wafer W is obtained by using the push means 55 formed on the rotating table 51 without expanding the wafer support 33a and the internal inspection infrared light 75b. It is also possible to fall to the storage 47.

In the case of the wafer W having no abnormality in the internal inspection, the wafer W is rotated to the unloading part 90. The wafer transferred to the unloading part 90 is loaded into the cassette 91 by the pushing means 55.

In the above-described wafer inspection process, the controller 110 detects the wafer in the loading unit 10 and lifts the cassette, determines the quality of the surface inspection unit 30 and the internal inspection unit 70, and the unloading unit 90. To control the whole process of wafer loading.

Example  3

11 and 12, the wafer inspection apparatus 1 according to the third exemplary embodiment of the present invention may have a loading unit 10, a rotatable wafer transfer unit 50, and a surface inspection unit 30, similarly to the first embodiment. , An internal inspection unit 70, an unloading unit 90, and a control unit 110.

In addition to the above configuration, the configuration of the elevating means 93, the rotary table 51, the push means 15, and the wafer support 33 is the same as in the above-described first embodiment, and a detailed description thereof will be omitted.

Referring to FIG. 13, in order to separate and collect the wafer W which is determined to be defective as a result of the surface inspection, the first defective storage unit 37 is formed on the outer side of the rotary table on which the first vision module 35 is located. Located. The first defective storage portion 37 is disposed adjacent to the rotary table 33.

The first defective storage unit 37 includes the same cassette as the wafer-loading cassette 11 of the loading unit, and elevating means 93 capable of elevating the cassette. A plurality of slots are formed in the cassette in a vertical direction, and the slots are each provided with a wafer sensor (not shown). When the loading of the wafer W is detected by the wafer detection sensor, the controller 110 adjusts the height of the cassette.

Therefore, according to the present invention, it is possible to separate and collect wafers which have been determined to be defective as a result of surface inspection.

Optionally, when it is not necessary to separate and collect the wafer as it is, it is also possible to provide a separate collection box or the like without installing a cassette in the first defective storage unit 37.

In this case, when the cassette located in the first defective storage unit 37 is filled with a defective wafer, it is preferable that the controller 110 stops the operation of the wafer inspection apparatus 1 and sounds an alarm. To this end, the controller 110 is preferably programmed to count the number of wafers W that have been determined to be defective and loaded again into the first defective storage unit 37.

The wafer W whose surface inspection has been completed by the surface inspection unit 30, that is, the wafer W determined to have no abnormality during surface inspection, is transferred to the internal inspection unit 70, which is the next stage, by the rotating wafer transfer unit 50. do. At the same time, the newly loaded wafer from the loading unit 10 is transferred to the surface inspection unit 30.

The internal inspection unit 70 sequentially inspects the presence of internal defects such as cracks and voids existing in the wafer W transferred by the rotatable wafer transfer unit 50. In addition, the wafer W may be separated and collected depending on whether the wafer W is abnormal.

Referring to FIG. 14, the internal inspection unit 70 includes a second vision module 75 including an internal inspection camera 75a and an internal inspection infrared light 75b. The internal inspection camera 75a is not particularly limited, but it is preferable to use one capable of obtaining a high quality electronic image. It is preferable to use infrared (IR) illumination as the internal illumination infrared light 75b.

In addition, the internal inspection camera 75a and the internal inspection infrared light 75b may be installed to face each other by being spaced apart from a predetermined space. According to a preferred embodiment of the present invention, the internal inspection camera 75a is located above the rotary table 51, and the internal inspection infrared light 75b is positioned below the rotary table 51. do.

In this case, the wafer support 33 is positioned between the internal inspection camera 75a and the internal illumination infrared light 75b. Therefore, the wafer support 33 is preferably made of a material such as sapphire or sapphire crystal excellent in light transmittance and strength.

The controller 110 receives the image photographed by the second vision module 73, and compares the received image with predetermined reference data stored in advance to determine whether the wafer W is defective internally. In this case, if it is determined that the defect is determined, the controller 110 separates and collects the wafer W. When it is determined that there is no abnormality, the controller 110 transfers the wafer W to the next stage unloading unit 90.

Referring to FIG. 9, in order to separate and collect a wafer that is determined to be defective as a result of an internal inspection, a second defective storage unit 47 is formed outside the rotation table 51 on which the second vision module 35 is located. Located. The second defective storage part 47 is disposed adjacent to the rotary table 51.

The second defective storage unit 47 includes the same cassette as the wafer-loading cassette 11 of the loading unit 10 and lifting means for lifting and lowering the cassette. A plurality of slots are formed in the cassette in a vertical direction, and the slots are each provided with a wafer sensor (not shown). When the wafer load is detected by the wafer sensor, the controller 110 adjusts the height of the cassette.

Therefore, according to the present invention, it is possible to separate and collect wafers which have been determined to be defective as a result of surface inspection.

Optionally, when it is not necessary to separate and collect the wafer as it is, it is possible to provide a separate collection box or the like without installing a cassette in the second defective storage unit 47.

As in the surface inspection unit 30 described above, the control unit 110 determines whether the wafer W is good or not after counting the number of wafers W that are determined to be defective. When the maximum number that can be loaded into the defective storage unit 47 is reached, it is preferable to stop the operation of the wafer inspection apparatus 1 and to make an alarm sound.

Next, the wafer W having the internal inspection completed in the internal inspection unit, that is, the wafer W determined to have no abnormality during the internal inspection, is transferred to the unloading unit 90 which is the next stage by the rotation table 51. . At the same time, the wafer W determined to have no abnormality in the surface inspection unit 30 is transferred to the internal inspection unit 70, and the newly loaded wafer W in the loading unit 10 is the surface inspection unit 30. ), And a new wafer W is loaded in the loading unit 10.

Since the following process is the same as the first embodiment described above, a detailed description thereof will be omitted.

Example  4

Example 4 relates to a wafer inspection method using the wafer inspection apparatus of Example 3 described above.

According to the fourth embodiment of the present invention, a cassette loaded with a plurality of wafers is lifted by the lifting means, the loading unit is provided with push means on one side so as to withdraw the wafer one by one in the horizontal direction; A rotary wafer transfer unit including a rotary table for loading the wafer and transferring the wafer to a subsequent process; A surface inspection unit including a first vision module and a first defective storage unit for surface inspection of the wafer; An internal inspection unit including a second vision module and a second defective storage unit for an internal inspection of the wafer; An unloading unit including a cassette which is lifted and raised by lifting means for sequentially loading the wafer; And a controller for controlling an inspection process of the wafer according to sequential control programming, comprising: loading the wafer from the loading unit to the rotatable wafer transfer unit; Transferring the loaded wafer to the surface inspection unit and performing surface inspection to separate and collect the wafer determined as defective into the first defective storage unit; Transferring the wafer determined to be intact in the surface inspection to the internal inspection unit, performing an internal inspection, and separately collecting the wafer determined to be defective into the second defective storage unit; Transferring the wafer determined to be intact in the internal inspection to the unloading unit; And it provides a wafer inspection method comprising the step of unloading the wafer transferred to the unloading unit.

Hereinafter, the wafer inspection method according to Example 4 will be described in detail.

First, when the wafer W is loaded from the loading unit 10 by the pushing means 15 into the space portion 53 of one of the plurality of space portions 53 installed on the rotary table 51, the rotary table ( 51) Rotate 90 ° counterclockwise.

In this case, the first wafer W loaded in the space 53 is rotated and transferred to the surface inspection unit 30, and the second wafer W is loaded in the space 53 of the loading unit 10. This wafer W loading is performed continuously.

Then, the surface inspection of the wafer W loaded by the first vision module 35 installed in the surface inspection unit 30 is performed.

The wafer W, which is determined to be defective in the surface inspection, is separated and recovered by the push means 55 of the rotary table to the first defective storage portion 37.

In the case of the wafer W having no abnormality in the surface inspection, the wafer is rotated and transferred to the next inspection point, the internal inspection unit 70, and the internal inspection of the wafer loaded by the second vision module 75 installed in the internal inspection unit 70. Will be made.

The wafer W, which is determined to be defective in the internal inspection, is separated and recovered to the second defective storage portion 47 by the push means 55 of the rotating table.

In the case of the wafer W having no abnormality in the internal inspection, the wafer W is rotated to the unloading part 90. The wafer transferred to the unloading part 90 is loaded into the cassette 91 by the pushing means 55.

As in the second embodiment, in the wafer inspection process, the controller 110 detects the wafer and lifts the cassette in the loading unit 10, determines the quality of the wafer at the surface inspection unit 30 and the internal inspection unit 70, and unloads it. All the processes in the series, such as whether the wafer is loaded in the unit 90, are controlled.

The wafer inspection apparatus according to the present invention is illustrated and described as being used for the surface and internal inspection of a wafer (solar cell), but the present invention is not limited to the above-described embodiment. The present invention can also be used for the surface and internal inspection of a lens for a mobile phone camera or a digital camera lens, CCTV lens, IR camera lens (artificial fire), jewelry, etc., the present invention within the scope without departing from the spirit of the invention Various changes or modifications can be made by those skilled in the art.

1: wafer inspection apparatus 10: loading unit
30: surface inspection unit 50: rotary table
70: internal inspection unit 90: unloading unit
110: control unit

Claims (15)

A loading unit in which a cassette loaded with a plurality of LEDs and wafers is lifted by an elevating means, and a pushing unit is installed at one side to draw the LEDs and wafers one by one in a horizontal direction;
A rotary LED and a wafer transfer unit including a rotary table for loading the LED and the wafer and transferring the wafer and the wafer to a subsequent process;
A surface inspection unit including a first vision module and a first defective storage unit for surface inspection of the LED and the wafer;
An internal inspection unit including a second vision module and a second defective storage unit for internal inspection of the LED and the wafer;
An unloading unit including a cassette lifted by an elevator unit to sequentially load the LED and the wafer; And
And a controller for controlling the inspection process of the LED and the wafer according to the sequential control programming.
The method of claim 1,
The space table is formed with four spaces for loading the LED and the wafer,
The space portion is formed with two LED and a wafer support for supporting the loaded LED and the wafer, respectively
And the two LEDs and the wafer support can move from side to side to drop the LED and the wafer, respectively.
The method of claim 1,
The first vision module includes a surface inspection camera located above the rotating table, and two surface inspection ultraviolet lights disposed on both sides of the surface inspection camera.
And the first defective storage part is located below the first vision module and the rotary table.
The method of claim 1,
The second vision module includes an internal inspection camera positioned above the rotary table, and two internal inspection infrared lights disposed below the rotary table so as to face the internal inspection camera.
And the second defective storage part is located below the second vision module and the rotary table.
The method of claim 4, wherein
The two internal inspection infrared lights are positioned adjacent to each other during the internal inspection of the LED and the wafer, and when the LED and the wafer fall, they move left and right to pass through the LED and the wafer, respectively. LED and wafer inspection equipment.
The method of claim 2,
The LED and the wafer support is LED and wafer inspection apparatus, characterized in that consisting of sapphire material.
The method of claim 1,
A display storage unit displaying and storing the images acquired by the first vision module and the second vision module; And
And an input / output unit for inputting / outputting an image stored in the display storage unit.
LED and wafer inspection apparatus, characterized in that the operator can monitor the image displayed on the display in real time.
A loading unit in which a cassette loaded with a plurality of LEDs and wafers is lifted by an elevating means, and a pushing unit is installed at one side to draw the LEDs and wafers one by one in a horizontal direction; A rotary LED and a wafer transfer unit including a rotary table for loading the LED and the wafer and transferring the wafer and the wafer to a subsequent process; A surface inspection unit including a first vision module and a first defective storage unit for surface inspection of the LED and the wafer; An internal inspection unit including a second vision module and a second defective storage unit for internal inspection of the LED and the wafer; An unloading unit including a cassette lifted by an elevator unit to sequentially load the LED and the wafer; And a controller for controlling the inspection process of the LED and the wafer according to the sequential control programming.
Loading the LED and wafer from the loading unit into the rotatable LED and wafer transfer unit;
Transferring the loaded LEDs and wafers to the surface inspection unit and performing surface inspection to separate and discharge the LEDs and wafers determined to be defective into the first defective storage unit;
Transferring the LEDs and wafers determined to have no abnormality in the surface inspection to the internal inspection unit and performing internal inspection and separating and discharging the LEDs and wafers determined as defective to the second defective storage unit;
Transferring the LED and the wafer, which are determined to have no abnormality in the internal inspection, to the unloading unit; And
LED and wafer inspection method comprising the step of unloading the LED and the wafer transferred to the unloading unit.
A loading unit in which a cassette loaded with a plurality of LEDs and wafers is lifted by an elevating means, and a pushing unit is installed at one side to draw the LEDs and wafers one by one in a horizontal direction;
A rotating LED and a wafer transfer unit including a rotating table for loading the LED and the wafer and transferring the wafer and the wafer to a subsequent process;
A surface inspection unit including a first defect storage unit including a first vision module for inspecting the surface of the LED and the wafer and a cassette lifted by the lifting unit;
An internal inspection unit including a second vision module for internal inspection of the LED and the wafer, and a second defective storage unit including a cassette lifted by an elevating unit;
An unloading unit including a cassette lifted by an elevator unit to sequentially load the LED and the wafer; And
And a controller for controlling the inspection process of the LED and the wafer according to the sequential control programming.
The method of claim 9,
The rotary table is provided with four space portions for loading the LED and the wafer, the push means for pushing the loaded LED and the wafer in the outward direction of the rotary table corresponding to the four space portion, respectively,
LED and wafer inspection apparatus, characterized in that the space portion is provided with an LED and a wafer support for supporting the loaded LED and wafer, respectively.
The method of claim 9,
The first vision module includes a surface inspection camera located above the rotating table, and two surface inspection ultraviolet lights disposed on both sides of the surface inspection camera.
LED and wafer inspection apparatus, characterized in that the first defective storage portion is located adjacent to the outside of the rotary table.
The method of claim 9,
The second vision module includes an internal inspection camera positioned on an upper side of the rotary table, and an internal inspection infrared light disposed below the rotary table so as to face the internal inspection camera.
LED and wafer inspection apparatus, characterized in that the second defective storage portion is located adjacent to the outside of the rotary table.
The method of claim 10,
The LED and the wafer support is LED and wafer inspection apparatus, characterized in that consisting of sapphire material.
The method of claim 9,
A display storage unit displaying and storing the images acquired by the first vision module and the second vision module; And
And an input / output unit for inputting / outputting an image stored in the display storage unit.
LED and wafer inspection apparatus, characterized in that the operator can monitor the image displayed on the display in real time
A loading unit in which a cassette loaded with a plurality of LEDs and wafers is lifted by an elevating means, and a pushing unit is installed at one side to draw the LEDs and wafers one by one in a horizontal direction; A rotating LED and a wafer transfer unit including a rotating table for loading the LED and the wafer and transferring the wafer and the wafer to a subsequent process; A surface inspection unit including a first defect storage unit including a first vision module for inspecting the surface of the LED and the wafer and a cassette lifted by the lifting unit; An internal inspection unit including a second vision module for internal inspection of the LED and the wafer, and a second defective storage unit including a cassette lifted by an elevating unit; An unloading unit including a cassette lifted by an elevator unit to sequentially load the LED and the wafer; And a controller for controlling the inspection process of the LED and the wafer according to the sequential control programming.
Loading the LED and wafer from the loading unit into the rotatable LED and wafer transfer unit;
Transferring the loaded LEDs and wafers to the surface inspection unit and performing surface inspection to separate and collect LEDs and wafers determined as defective into the first defective storage unit;
Transferring the LEDs and wafers determined to have no abnormality in the surface inspection to the internal inspection unit and performing internal inspection to separate and collect the LEDs and wafers determined as defective into the second defective storage unit;
Transferring the LED and the wafer, which are determined to have no abnormality in the internal inspection, to the unloading unit; And
LED and wafer inspection method comprising the step of unloading the LED and the wafer transferred to the unloading unit.

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