KR100989125B1 - 원장기판 절단 장치 및 이에 의하여 절단된 유기발광표시장치 - Google Patents
원장기판 절단 장치 및 이에 의하여 절단된 유기발광표시장치 Download PDFInfo
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- KR100989125B1 KR100989125B1 KR1020080069174A KR20080069174A KR100989125B1 KR 100989125 B1 KR100989125 B1 KR 100989125B1 KR 1020080069174 A KR1020080069174 A KR 1020080069174A KR 20080069174 A KR20080069174 A KR 20080069174A KR 100989125 B1 KR100989125 B1 KR 100989125B1
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- Prior art keywords
- mother substrate
- moving
- stage
- cutting device
- cutting
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 150
- 238000005520 cutting process Methods 0.000 title claims abstract description 75
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000010408 film Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000005281 excited state Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
- B26D1/15—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/06—Grooving involving removal of material from the surface of the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/18—Cutting work characterised by the nature of the cut made; Apparatus therefor to obtain cubes or the like
- B26D3/22—Cutting work characterised by the nature of the cut made; Apparatus therefor to obtain cubes or the like using rotating knives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/141—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter for thin material, e.g. for sheets, strips or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/02—Means for moving the cutting member into its operative position for cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0605—Cut advances across work surface
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/647—With means to convey work relative to tool station
- Y10T83/6584—Cut made parallel to direction of and during work movement
- Y10T83/6608—By rectilinearly moving work carriage
- Y10T83/6622—Having means to actuate carriage
- Y10T83/6625—Gear or pulley
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7684—With means to support work relative to tool[s]
- Y10T83/7709—Unidirectionally movable work support
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (15)
- 고정 스테이지;상기 고정 스테이지 상에서 제1 방향으로 이동하는 이동 스테이지;상기 고정 스테이지에 형성된 기둥에 설치되어 상기 이동 스테이지 상에서 상기 제1 방향과 교차하는 제2 방향으로 가로질러 배치되는 가이드 바아;상기 가이드 바아에서 상기 제2 방향으로 이동하는 이동부;상기 이동부에서 상기 제1 방향과 상기 제2 방향의 평면에 교차하는 제3 방향으로 이동하는 승강부; 및상기 승강부에 장착되어 회전하여, 상기 이동 스테이지에 놓인 원장기판을 절단하는 블레이드를 포함하고,상기 블레이드는 다이싱 소(dicing saw)를 포함하는 원장기판 절단 장치.
- 제1 항에 있어서,상기 고정 스테이지는 상기 제1 방향으로 신장 형성되는 가이드를 포함하고,상기 이동 스테이지는 상기 가이드에 결합되는 가이드홈을 형성하는 원장기판 절단 장치.
- 제2 항에 있어서,상기 고정 스테이지는 상기 이동 스테이지 측에서 상기 제1 방향으로 신장 배치되어 회전 작동하는 리드 스크류를 포함하며,상기 이동 스테이지는 상기 리드 스크류에 결합되는 스크류 홈을 형성하는 원장기판 절단 장치.
- 제1 항에 있어서,상기 이동부는 상기 가이드 바아를 따라 직선 이동하는 리니어 모터로 형성되는 원장기판 절단 장치.
- 제4 항에 있어서,상기 승강부는 상기 리니어 모터에 장착되는 실린더로 형성되는 원장기판 절단 장치.
- 제5 항에 있어서,상기 블레이드는 상기 실린더의 상기 리니어 모터의 반대측에 장착되는 모터에 연결되는 원장기판 절단 장치.
- 삭제
- 제1 항에 있어서,상기 원장기판은 양면에 각각 부착되는 제1 보호 필름 및 제2 보호 필름을 포함하는 원장기판 절단 장치.
- 제1 항에 있어서,상기 이동 스테이지는 상기 원장기판을 흡착하여 지지하며, 절단 위치에 대응하여 상기 블레이드가 삽입되는 홈을 형성하는 흡착 지그를 포함하는 원장기판 절단 장치.
- 제1 항에 있어서,상기 원장기판은 복수의 스틱으로 절단되고,상기 스틱은 복수의 셀로 절단되는 원장기판 절단 장치.
- 제10 항에 있어서,상기 셀의 절단면은 상기 블레이드의 회전 절단에 의하여 형성되는 줄무늬를 포함하는 원장기판 절단 장치.
- 제11 항에 있어서,상기 셀은 유기발광 표시장치를 형성하는 원장기판 절단 장치.
- 제1 항에 있어서,상기 원장기판에서 서로 부착되는 배면기판 및 전면기판은 각각 두께 0.125- 0.3mm로 형성되는 원장기판 절단 장치.
- 삭제
- 삭제
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080069174A KR100989125B1 (ko) | 2008-07-16 | 2008-07-16 | 원장기판 절단 장치 및 이에 의하여 절단된 유기발광표시장치 |
US12/458,527 US20100011925A1 (en) | 2008-07-16 | 2009-07-15 | Mother substrate cutting apparatus, method of cutting a mother substrate using the same and organic light emitting diode display cut thereby |
US13/661,487 US20130042735A1 (en) | 2008-07-16 | 2012-10-26 | METHOD OF CUTTING A MOTHER SUBSTRATE [as amended] |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080069174A KR100989125B1 (ko) | 2008-07-16 | 2008-07-16 | 원장기판 절단 장치 및 이에 의하여 절단된 유기발광표시장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100008609A KR20100008609A (ko) | 2010-01-26 |
KR100989125B1 true KR100989125B1 (ko) | 2010-10-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020080069174A Active KR100989125B1 (ko) | 2008-07-16 | 2008-07-16 | 원장기판 절단 장치 및 이에 의하여 절단된 유기발광표시장치 |
Country Status (2)
Country | Link |
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US (2) | US20100011925A1 (ko) |
KR (1) | KR100989125B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9931757B2 (en) | 2012-07-23 | 2018-04-03 | Samsung Display Co., Ltd. | Cell cutting device for display devices and method of manufacturing the display device |
CN109291099A (zh) * | 2018-09-25 | 2019-02-01 | 芜湖优能自动化设备有限公司 | 一种压力阀生产用便于调节的切割设备 |
Families Citing this family (12)
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KR101927055B1 (ko) * | 2012-05-09 | 2018-12-11 | 삼성디스플레이 주식회사 | 광학 시트의 제조 방법, 광학 시트를 구비하는 유기 발광 표시 장치 및 광학 시트를 구비하는 유기 발광 표시 장치의 제조 방법 |
US9673014B2 (en) * | 2012-07-13 | 2017-06-06 | Samsung Display Co., Ltd. | Method of manufacturing display panel |
KR102060541B1 (ko) * | 2012-07-13 | 2019-12-31 | 삼성디스플레이 주식회사 | 표시 패널 제조 방법 |
JP6433644B2 (ja) * | 2013-06-07 | 2018-12-05 | シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft | 半導体ウェハのダイシング方法 |
CN104029235B (zh) * | 2014-05-27 | 2016-03-09 | 常州市武进区半导体照明应用技术研究院 | 用于切割柔性基板led光源装置的切割机构及方法 |
KR102307693B1 (ko) * | 2014-12-12 | 2021-10-06 | 삼성디스플레이 주식회사 | 표시패널 및 이의 제조방법 |
CN107825553A (zh) * | 2017-10-31 | 2018-03-23 | 马鞍山师范高等专科学校 | 一种室内外装修用板材或瓷砖的切割装置 |
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CN108673593A (zh) * | 2018-06-27 | 2018-10-19 | 芜湖杰汇环保科技有限公司 | 一种电子科技产品生产用包装纸切割设备 |
KR102680249B1 (ko) * | 2018-09-28 | 2024-07-01 | 엘지디스플레이 주식회사 | 봉지 기판을 포함하는 디스플레이 장치 및 이의 제조 방법 |
JP2019081252A (ja) * | 2019-01-10 | 2019-05-30 | 三星ダイヤモンド工業株式会社 | 樹脂シートの分断システム |
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US20100011925A1 (en) | 2010-01-21 |
US20130042735A1 (en) | 2013-02-21 |
KR20100008609A (ko) | 2010-01-26 |
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