KR100980588B1 - Led lamp - Google Patents

Abstract

The present invention provides an LED bulb. The LED bulb is a heat sink having a heat sink having a hollow shape, the outer surface of the wings having a plurality of bends along the upper and lower sides; A substrate installed at a lower end of the heat sink and mounted with a plurality of LEDs; And a hemispherical diffusion cap connected to a lower end of the heat sink and configured to receive light emitted from the LEDs and diffuse outwardly at different diffusion amounts according to the received position. Therefore, the present invention is provided with a heat dissipation portion to maximize the surface area with air can be easily induced to spread the convection flow due to heat to the outside and can be easily released to the outside heat generated by the light emission of the LEDs.

Description

LED Bulb {LED LAMP}

The present invention relates to an LED bulb, and more particularly, having a heat dissipation portion that maximizes the surface area with air, and easily induces the flow of convection due to heat to the outside and facilitates heat generated by the light emission of the LEDs to the outside. It is about an LED bulb which can be discharged easily.

In general, an incandescent lamp is a light source that receives light by temperature radiation while the filament wire is heated to a high temperature when the filament wire is put in a glass sphere of vacuum. In such an incandescent lamp, the filament becomes thinner and evaporates in a high-temperature atmosphere. Therefore, a mixed gas of argon and nitrogen is put in the glass sphere to suppress the evaporation effect and extend the life.

Ordinary incandescent lamps, which emit light close to natural light, can reduce eye fatigue and are easily removable in the socket. Since invented by Edison, it is one of the most widely used lighting lamps for a long time since the invention of Edison. It has the disadvantage of low thermal efficiency because it is emitted as heat and only part of it is used as light.

In addition, there is a problem that the high temperature heat generated during the lighting for a certain time is not easily radiated to the outside, in addition, the high temperature air generated inside the bulb body such as the socket connected to the incandescent lamp is not radiated inside. There is a problem in that eventually damage the bulb itself.

In order to solve this problem, conventionally, a means having a heat dissipation fin, which is generally used in an electronic device, is applied to a light bulb, but the contact area with air due to the heat dissipation fin does not increase more than a certain amount, and heat inside the light bulb body is still maintained. There is a problem that can not radiate heat.

On the other hand, the light emitting diode (LED) is a light source using the light emitting phenomenon generated when a voltage is applied to the semiconductor, the brightness has been improved enough to be used for lighting due to the development of technology over the last several years, compared to the conventional incandescent lamp It is expected to spread its use for general light bulbs because of its low consumption, long life, bright and clear life.

Accordingly, in recent years, development of a light bulb using an LED as a light source is in progress, but it is simply a level at which the LEDs are mounted on the substrate, and when heat is generated in the substrate while the LEDs are operated, this heat flows to facilitate heat dissipation. There is no problem.

In addition, the bulb using the conventional LED is not only able to easily fix the substrates mounted therein, but also has a problem vulnerable to external shocks.

In addition, the conventional light bulb using the LED has a problem that can not be uniformly emitted to the outside of the light bulb the amount of light emitted from the LED. Therefore, the amount of light is increased only to the center portion of the bulb, so that the light passing through the center portion is brighter than the edge portion.

The present invention has been made to solve the above-mentioned problems, an object of the present invention is to provide a heat dissipation portion to maximize the surface area with air to easily induce the flow of convection due to heat to the outside and occurs due to the light emission of the LEDs It is to provide an LED bulb that can easily release the heat to the outside.

Another object of the present invention to provide an LED bulb that can uniformly transmit the light emitted from the LEDs to the outside.

Another object of the present invention is to provide an LED bulb that is mounted on the substrate so that the LEDs do not protrude to the outside, and can easily adjust the color temperature of the mounted LED.

Still another object of the present invention is to provide an LED light bulb that can prevent users from easily disassembling the light bulbs and thus prevents damage to the light bulbs due to a user's mistake.

The present invention provides an LED bulb for solving the above problems.

The LED bulb has a heat sink and a heat sink having a heat dissipation portion of the heat dissipation blades having a plurality of bends along the top and bottom on the outer surface; A substrate installed at a lower end of the heat sink and mounted with a plurality of LEDs; And a hemispherical diffusion cap connected to a lower end of the heat sink and configured to receive light emitted from the LEDs and diffuse outwardly in different diffusion amounts according to the received position.

Here, a hollow base plate having a socket formed at an upper end thereof is screwed to an upper end of the heat sink, and an SMPS substrate electrically connected to the socket is installed inside the base plate.

In addition, the upper surface of the substrate is further provided with a silicon support in which a straight support groove is formed, the lower end of the SMPS substrate is preferably inserted into the support groove is supported.

In addition, the substrate is screwed to the lower end of the heat sink, it is preferable that a star-shaped groove is formed in the head of the screw.

In addition, it is preferable that a plurality of annular protrusions are formed radially from the center of the substrate and formed of the same material as the material of the substrate.

In addition, the substrate is preferably made of one of a clad metal, a metal, and FR4.

In addition, it is preferable that a plurality of annular protrusions formed radially from the center of the substrate and formed of a clad metal are further formed on the upper surface of the substrate.

The heat sink may further include a hollow heat sink body in which the SMPS substrate is positioned, and the plurality of heat dissipating parts formed on an outer circumference of the heat sink body and having a shape having one or more curvatures along the upper and lower sides. It is desirable to.

In addition, each of the plurality of heat dissipation parts may be formed by sequentially overlapping heat dissipation wings having one or more curvatures, and protrusions protruding in a semicircular shape may be formed at one or more positions facing each other. It is preferable to achieve the bending.

In addition, the heat dissipation wings are preferably made of any one form of a straight form and one side curved.

In addition, it is preferable that a plurality of heat dissipation protrusions protrudingly formed on an outer surface of each of the plurality of heat dissipation parts.

In addition, each of the plurality of heat dissipation protrusions may include one or a plurality of hot spots formed on outer surfaces of each of the heat dissipation parts, and a straight protrusion protruding in a straight line along a length direction of the heat dissipation part from the outer surfaces of each of the heat dissipation parts. It is desirable to.

In addition, the inner circumference of the heat sink body is preferably formed with a plurality of auxiliary heat dissipation portion is formed in a shape that is bent to one side along the vertical direction of the heat sink body at regular intervals.

In addition, it is preferable that auxiliary protrusions protruding in a semicircular shape are formed at one or more positions facing each other in each of the plurality of auxiliary heat radiating portions.

In addition, the plurality of heat dissipating parts and the plurality of auxiliary heat dissipating parts may be sanded on an outer surface thereof.

In addition, the heat sink is preferably made of foamed aluminum.

The substrate may include an LED mounting groove formed with a substrate body and electrodes formed at a plurality of positions of the substrate body and having electrodes mounted thereon and electrically connecting the LEDs to a bottom thereof. It is preferable to have a filler that transmits light emitted from the outside to fill the LED mounting groove.

In the filler, it is preferable that a predetermined amount of silicon and the phosphor are mixed with each other.

In addition, the LED is preferably connected to any one of the ball grid array and wire bonding to the electrodes.

In addition, it is preferable that the diffusion cap further includes diffusion protrusions that gradually increase in size along an edge from the center portion of the diffusion cap.

In addition, the diffusion protrusions are preferably formed on at least one of the outer surface and the inner surface of the diffusion cap.

In addition, the socket of the base plate is screw-coupled with the socket fitting body, and the lower end of the base plate is screw-coupled with the heat sink, the socket fitting body and the heat sink are respectively opposite to each other to screw the base plate and screw coupling It is preferable to be.

In addition, the substrate preferably further includes a reflector that can cover the LEDs.

In addition, it is preferable that the color filter selectively cover the LEDs.

In addition, it is preferable that ring-shaped first protrusion lines protruding from the inner circumference of the socket are further formed, and ring-shaped second protrusion lines are further formed on the inner circumference of the base plate.

In addition, it is preferable that a plurality of hot spots protruding from the outer surfaces of the plurality of auxiliary heat radiating parts are further formed.

The present invention has an effect that can be easily induced to spread the convection flow due to heat to the outside by providing a heat dissipation portion to maximize the surface area with air and can easily release the heat generated by the light emission of the LEDs to the outside.

In addition, the present invention has the effect of uniformly emitting light emitted from the LEDs to the outside.

In addition, the present invention has the effect of mounting the LEDs on the substrate so as not to protrude to the outside, it is easy to adjust the color temperature of the mounted LEDs.

In addition, the present invention has an effect that can prevent users from easily disassemble the bulb to prevent damage to the bulb due to the user's mistake.

In addition, the present invention has the effect of reducing the number of parts during the manufacture of the bulb and the number of assembly process to reduce the manufacturing cost, reduce the weight to increase the stability.

Hereinafter, with reference to the accompanying drawings to describe the LED bulb of the present invention.

1 is a perspective view showing the LED bulb of the present invention. Figure 2 is an exploded perspective view showing the LED bulb of the present invention. 3 is a front view showing the LED bulb of the present invention. 4 is a plan view showing the LED bulb of the present invention. 5 is a view illustrating heat dissipation parts formed on an outer circumference of the heat sink body of FIG. 1. 6 is a plan view showing another embodiment of the LED bulb of the present invention. FIG. 7 is a diagram illustrating an example of auxiliary heat dissipation parts formed on an inner circumference of the heat sink body of FIG. 1. FIG. 8 is a view illustrating another example of auxiliary heat dissipation parts formed on an inner circumference of the heat sink body of FIG. 1. 9 is a perspective view illustrating that the SMPS substrate of FIG. 2 is supported by the fixing member and the support. 10 is a perspective view showing a substrate on which annular protrusions are formed according to the present invention. FIG. 11 is a perspective view illustrating a screw that secures the substrate of FIG. 2 to the bottom of the heat sink. FIG. FIG. 12 is a perspective view illustrating diffusion protrusions formed on an outer surface of the diffusion cap of FIG. 2. FIG. 13 is a perspective view illustrating diffusion protrusions formed on an outer surface and an inner surface of the diffusion cap of FIG. 2. 14A to 14E are partial cross-sectional views illustrating the substrate of FIG. 2, and show cross-sectional views illustrating an LED mounting process. 15 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding. 16 is a cross-sectional view showing that the substrate of FIG. 2 further includes a color filter.

1 and 2, the LED bulb of the present invention includes a socket fitting body 100 that is largely supplied with external power, a base plate 200 coupled to the socket fitting body 100, and the base plate. The heat sink 300 is coupled to the 200, and the diffusion cap 500 is coupled to the heat sink 300. In addition, a substrate 400 is installed at a lower end of the heat sink 300, and an SMPS substrate 10 is supported on an upper surface of the substrate 400 in the base plate 200. The substrate 400 has a plurality of LEDs 40 exposed below.

The configuration thereof will be described in detail.

First, the heat sink 300 will be described with reference to FIGS. 2 to 8.

The heat sink 300 has a heat dissipation part 320 forming a hollow shape and forming heat dissipation vanes 321 having a plurality of bends along the upper and lower surfaces thereof.

The heat sink 300 is formed on the outer circumference of the heat sink body 310 and the hollow heat sink body 310 is located inside the SMPS substrate 10 is fastened to the base plate 200 The plurality of heat dissipating parts 320 may have a shape having one or more curvatures along the upper and lower sides.

In this case, each of the plurality of heat dissipating parts 320 is formed by sequentially overlapping the heat dissipation wings 321 having one or more curvatures. Therefore, since the heat dissipation parts 320 are formed to form a wave pattern, the flow of heat generated from the SMPS substrate 10, the substrate 400, and the like can be easily flowed from the upper side of the heat sink 300 to the lower side. In addition, by forming a wave pattern, the contact area with the air of the heat dissipation vanes 321 may be increased to heat or easily radiate heat.

4 and 5, the heat dissipation vanes 321 may be formed in a straight shape, and as shown in FIG. 6, the heat dissipation vanes 321 may be bent to one side. . In the former and the latter case, the limitation on the shape of the heat dissipation vanes 321 may be a major factor in determining the path of heat transfer.

Here, protrusions 323 and 324 are formed at both sides of each of the heat dissipation vanes 321 to protrude in a semicircle at one or more positions facing each other, thereby forming the bending. In addition, the protrusions 323 and 324 may be formed to gradually increase along the top and bottom of the heat dissipation blade 321. Here, the protrusions 323 and 324 are divided into an upper protrusion 323 and a lower protrusion 324, and the size of the protrusions 323 and 324 is larger than that of the upper protrusion 323. Is formed.

In addition, a plurality of heat dissipation protrusions 322 may be further formed on the outer surface of each of the plurality of heat dissipation parts 320.

Here, each of the plurality of heat dissipation protrusions 322 is one or a plurality of hot spots 322a formed on an outer surface of each of the heat dissipation parts 320, preferably the heat dissipation wings 321, and the heat dissipation parts 320. Each of the outer surface is formed of a protruding protrusion (322b) protruding in a straight line along the longitudinal direction of the heat dissipation unit (320). Here, the date protrusion 322b is not necessarily limited to a straight shape, but may be formed to have various shapes and bends in order to increase the contact area with air.

The hot spot 322a is formed in the shape of a point so as to protrude outward from a plurality of locations on the outer surface of the heat dissipating part 320, and heats the heat from the outer surfaces of the heat dissipating part 320 locally to the outside It can play a role. The shape of the point may be a shape in which the volume is narrowed as it protrudes outward.

In addition, the date protrusions 322b formed on the outer surfaces of the heat dissipating parts 320 are straight or bar-shaped protrusions and are formed along the length direction of the heat dissipating parts 320. That is, the date protrusions 322b formed on the outer surfaces of the heat dissipating parts 320 are radially formed based on the center of the heat sink body 310.

Therefore, the date protrusions 322b easily flows the external heat to the bottom of the heat sink 300, and further increases the contact area with air to further dissipate the heat.

In addition, the heat dissipation protrusion 322 composed of the hot spots 322a and the straight protrusions 322b provides an increase in the contact area with air in addition to the contact area with air due to the wavy heat dissipation portions 320. Therefore, the contact area with the optimum air for dissipating heat can be maximized.

On the other hand, the inner circumference of the heat sink body 310 may be further formed a plurality of auxiliary heat dissipation unit 330 is formed along the vertical direction of the heat sink body 310 and formed at a predetermined interval.

As shown in FIG. 7, the plurality of auxiliary heat radiating units 330 may have a straight shape along the upper and lower sides, or as shown in FIG. 8.

Here, the auxiliary heat dissipation unit 330 is formed of protrusions, and since the auxiliary heat dissipation unit 330 is disposed radially with respect to the center of the heat sink body 310, the inside and the base plate 200 of the heat sink body 310 are formed. The flow of heat formed in the interior of the vessel flows downward, providing an increase in the contact area with air. Therefore, the auxiliary heat dissipation units 330 may quickly lower the hot air generated from the SMPS substrate 10 and the substrate 400 downward.

In addition, the outer surfaces of the plurality of heat dissipating parts 320, the auxiliary heat dissipating parts 330, and the heat sink body 310 are sanded (or etched).

Accordingly, the heat dissipating parts 320 and the auxiliary heat dissipating parts 330 are sanded or etched to form a roughness or more on the surface, and the heat dissipating parts 320 and the auxiliary heat dissipating parts 330 are separated from the air. The contact area can be further increased beyond a certain amount.

In addition, the heat sink 30 is preferably made of foamed aluminum. That is, the heat sink body 310, the heat dissipating parts 320, and the auxiliary heat dissipating parts 330 are made of foamed aluminum in which a plurality of holes are drilled, thereby providing a contact area with air. That is, even if the heat dissipation unit 320 and the auxiliary heat dissipation unit 330 are excluded, the heat sink 300 may have a self-heat dissipation function.

In addition, auxiliary protrusions 330a protruding in a semicircular shape may be formed at one or more positions facing each other in each of the plurality of auxiliary heat radiating units 330. In addition, each of the auxiliary radiator 330 is formed in the shape of a protruding wing, the hot spot 322a mentioned above may be further formed. Here, the width of each of the auxiliary radiator 330 may be formed to gradually narrow along the up and down.

Next, the base plate 200 will be described with reference to FIGS. 2 and 3.

The base plate 200 is screw-coupled with the upper end of the heat sink 30 and has a hollow shape. Inside the base plate 200, the SMPS substrate 10 connected to the socket 220 is placed upright. The SMPS substrate 10 serves to apply power to the LEDs 40 installed on the substrate 400, and generates a predetermined heat or more when power is applied from the outside. In addition, the SMSP substrate 10 is fixed through a separate support 20 in the base plate 200. Here, the base plate 200 has a fixing member 210 in which both sides of the SMPS substrate 10 are fitted and supported. The fixing member 210 is provided with fitting grooves 211 into which both sides of the SMPS substrate 10 are fitted.

Here, protrusion lines for improving heat dissipation may be formed on an inner circumference of the socket 220 and an inner circumference of the base plate 200.

That is, ring-shaped first protrusion lines 221 protruding from the inner circumference of the socket 220 may be further formed. In addition, ring-shaped second protrusion lines 201 may be further formed on an inner circumference of the base plate 200.

Of course, the first protrusion line 221 and the second protrusion line 201 may be protrusion lines forming spiral-shaped lines.

In addition, the upper surface of the substrate 400 is further provided with a silicon support 20 to form a straight support groove 21. Therefore, since the lower end of the SMPS substrate 10 is inserted into the support groove 21 and supported, it can maintain a standing state. In addition, since the silicon support 20 has a predetermined elasticity or more, when an external force is applied to the outside of the base plate 200, the impact caused by the external force is easily absorbed by the silicon support 20 and thus SMPS. It may not be transferred to the substrate 10. Therefore, the SMPS substrate 10 may not be easily damaged due to external impact by the silicon support 20.

In addition, a groove 22 having a curved surface is formed at the center of the bottom surface of the silicon support 20. Therefore, the bottom surface of the silicon support 20 is installed while the remaining surface except for the groove 22 is supported on the upper surface of the substrate 400. Here, the groove 22 serves to absorb the external shock secondary.

Next, the substrate 400 will be described with reference to FIGS. 2, 9 to 10, 11, and 14A to 14E and 15.

The substrate 400 is screwed to the lower end of the heat sink body 310.

Here, the substrate 400 has one or more screws 50 for fastening to the lower end of the heat sink body 310 shown in FIG. 11, wherein the head 51 of the screws 50 Star-shaped grooves 51a are formed. The reason why the groove 51a is formed in the star shape is to prevent the user from arbitrarily separating the substrate 400 from the heat sink body 310 by using a driver that is commonly used. Therefore, the groove 51a formed in the head 51 of the screw 50 may be formed in various shapes except for the polygonal shape and the date or cross used for the general screw in addition to the star shape.

In addition, a plurality of annular protrusions 411 formed radially from the center of the substrate 400 and made of the same material as the substrate 400 may be further formed on an upper surface of the substrate 400. .

The substrate 400 may be formed of a clad metal, any one of metal and FR4.

In particular, in the present invention, the substrate is preferably made of a clad metal.

The above-mentioned clad metal will be described as follows.

The clad metal refers to a material in which two or more layers of metals or nonmetals are bonded together, that is, a heterojunction metal. This has the advantage that it can be adapted to the special needs by supplementing various properties not obtainable with a single metal.

For example, the example which carried out heterojunction with copper-aluminum-copper or copper-stainless-copper etc. is mentioned.

 Accordingly, the upper surface of the substrate 400 that generates heat during operation increases the air contact area with the outside due to the annular protrusions 411. Therefore, the heat of the substrate 400 itself may be rapidly moved to radiate heat to the outside.

In addition, the annular protrusions 411 may radiate hot heat in the heat sink 300 and the base plate 200.

On the other hand, the configuration of the substrate 400 is as follows.

The substrate 400 includes a substrate body 410 and a plurality of LED mounting grooves 420 formed on the bottom surface of the substrate body 410, and the LEDs 40 mounted on the LED mounting grooves 420. ), And the filler 430 to be filled in the LED mounting grooves 420.

Here, each of the LED mounting grooves 420 is formed by digging to a predetermined depth at a plurality of positions of the substrate body 410, the LED 40 is seated and electrically connects the LEDs 40 to the bottom surface Has electrodes 30.

Here, both side walls 421 of each of the LED mounting grooves 420 are formed to gradually narrow from the top of the substrate body 410 along the bottom, the bottom surface connecting the lower ends of the side walls 421 to each other 422 is formed to be parallel to the substrate body 410.

The substrate body 410 may be made of any one of metal, clad metal, and FR4. Here, in the present invention, it is preferable that the substrate body is made of a clad metal, and an example thereof will be omitted because it is the same as described above.

The filler 430 may transmit the light emitted from the LEDs 40 to the outside and fill the LED mounting groove 420. Here, the filler 430 is preferably made of a predetermined amount of silicon and the phosphor is mixed with each other.

In addition, the LED 40 may be connected to the electrodes 30 through any one of a ball grid array 42 and a wire bonding 43.

Meanwhile, color filters 450 for selectively adjusting color temperatures of the LEDs 40, that is, R, G, and B temperatures may be selectively installed at the lower end of the substrate 400.

Here, referring to FIG. 16, the color filters 450 may be screwed to the lower end of the substrate body 410, thereby selectively selecting the color filters 450 from the substrate body 410. Can be replaced.

In addition, a dimming circuit may be further provided on the substrate 400, and the dimming circuit may adjust the amount of light emitted from the LEDs 40 to a predetermined value.

In addition, the substrate 400 may further include the reflective plate 440 of FIG. 2. The reflective plate 440 may be coupled to the lower end of the substrate 400. Thus, the reflective plate 440 may be coupled to or removed from the substrate 400 according to a user's selection.

Next, referring to FIGS. 2, 12 and 13, the diffusion cap 500 coupled to the lower end of the heat sink 300 to diffuse light emitted from the LEDs 40 to the outside will be described. do.

The diffusion cap 500 is connected to the lower end of the heat sink 300 and receives the light emitted from the LEDs 40 and diffuses to the outside in different diffusion amounts according to the received position, in a hemispherical shape Is done.

In particular, the diffusion cap 500 is further provided with diffusion protrusions 510 having a pattern that gradually increases in size along the edge from the central portion of the diffusion cap 500. The diffusion protrusions 510 have an embossed shape.

Therefore, the diffusion protrusion 510 has the largest central portion at the lower end of the diffusion cap 500, and the edge portion thereof is formed to have the smallest edge upward. That is, light emitted from the LEDs 40 in the substrate 400 diffuses less at the center portion of the diffusion cap 500 and diffuses more at the edge portion. Many and few of the amount of light here is a concept of relative contrast, not an exact numerical limitation.

In addition, the diffusion protrusions 510 may be formed on at least one of an outer surface and an inner surface of the diffusion cap 500.

That is, the diffusion protrusions 510 are preferably formed on the inner surface of the diffusion cap, and may be formed on both the outer surface and the inner surface of the diffusion cap. Here, although not shown in the drawings, when the diffusion protrusions 510 are formed on both the outer surface and the inner surface of the diffusion cap, their arrangement positions may be the same as or different from each other.

Accordingly, the light emitted from the LEDs 40 by the diffusion cap 500 having the diffusion protrusions 510 in the present invention may be emitted while forming a uniform amount of light to the outside of the diffusion cap 500. .

Next, the coupling relationship between the base plate 200, the socket fitting body 100, the base plate 200, and the heat sink 300 will be described with reference to FIGS. 2, 9, and 10.

The socket 220 of the base plate 200 is screwed with the lower end of the socket fitting body 100. The lower end of the base plate 200 is screwed to the upper end of the heat sink 300.

In particular, referring to Figure 2, in the present invention, the socket fitting body 100 and the heat sink 300 are screwed with the base plate 200 in a reverse direction to each other.

For example, the socket fitting body 100 is coupled along the forward direction at the top of the base plate 200, and the heat sink 300 is coupled along the reverse direction at the bottom of the base plate 200. Accordingly, the socket fitting body 100 and the heat sink 300 may be opposite to each other in the opposite direction. That is, they have a reverse screwing structure.

That is, the coupling relationship thereof is to prevent the base plate 200 from being separated from the socket fitting body 100 when the diffusion cap 500 and the heat sink 300 are separated by the user.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Of course.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by the equivalents of the claims.

1 is a perspective view showing the LED bulb of the present invention.

Figure 2 is an exploded perspective view showing the LED bulb of the present invention.

3 is a front view showing the LED bulb of the present invention.

4 is a plan view showing the LED bulb of the present invention.

5 is a view illustrating heat dissipation parts formed on an outer circumference of the heat sink body of FIG. 1.

6 is a plan view showing another embodiment of the LED bulb of the present invention.

FIG. 7 is a diagram illustrating an example of auxiliary heat dissipation parts formed on an inner circumference of the heat sink body of FIG. 1.

FIG. 8 is a view illustrating another example of auxiliary heat dissipation parts formed on an inner circumference of the heat sink body of FIG. 1.

9 is a perspective view illustrating that the SMPS substrate of FIG. 2 is supported by the fixing member and the support.

10 is a perspective view showing a substrate on which annular protrusions are formed according to the present invention.

FIG. 11 is a perspective view illustrating a screw that secures the substrate of FIG. 2 to the bottom of the heat sink. FIG.

FIG. 12 is a perspective view illustrating diffusion protrusions formed on an outer surface of the diffusion cap of FIG. 2.

FIG. 13 is a perspective view illustrating diffusion protrusions formed on an outer surface and an inner surface of the diffusion cap of FIG. 2.

14A to 14E are partial cross-sectional views illustrating the substrate of FIG. 2, and show cross-sectional views illustrating an LED mounting process.

15 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding.

16 is a cross-sectional view showing that the substrate of FIG. 2 further includes a color filter.

* Description of main parts *

100: socket fitting

200: base plate

210: fixed member

220: socket

300: heat sink

310: heat sink body

320: heat dissipation unit

321: heat dissipation wing

322: heat dissipation protrusion

330: auxiliary radiator

400: substrate

410: substrate body
411a: through hole

420: LED mounting home

430: Filler

440: reflector

450: color filter

500: Diffusion Cap

Claims (24)

A heat sink formed in a hollow shape and having heat dissipation parts forming heat dissipation wings having a plurality of bends along the upper and lower sides thereof; A substrate installed at a lower end of the heat sink and mounted with a plurality of LEDs; And It is connected to the lower end of the heat sink and includes a hemispherical diffusion cap that receives the light emitted from the LEDs and diffuses to the outside in different diffusion amounts according to the received position, The thickness of the diffusion cap is formed to increase gradually from the edge portion along the center portion, and includes the diffusion cap hemispherical diffusion protrusions, wherein the diffusion protrusions extend from the edge portion of the diffusion cap to an inner surface of the diffusion cap. Is formed to gradually increase in size to be proportional to the thickness of the diffusion cap along, Wherein: Dip from a top surface to a certain depth, and a plurality of LED mounting grooves are formed in a continuous surface with both side walls are opened upwards, the disc is formed on the bottom surface of the LED mounting grooves the electrodes exposed to the LED mounting grooves A substrate body in shape; LEDs inserted into the LED mounting grooves to be electrically connected to and mounted with the electrodes; And It includes a filling material which transmits the light emitted from the LEDs to the outside and is filled in the LED mounting groove, the silicon and the phosphor is mixed in a predetermined amount, The LED mounting grooves are formed by physically digging into the substrate body using a router (router) at a plurality of positions of the substrate body, The upper surface of the substrate body is formed with a plurality of annular projections made of the same material and the material of the substrate body to be radially formed at a predetermined interval from the center of the substrate body, At a plurality of positions along any one of the plurality of annular protrusions, the plurality of positions penetrating the upper and lower portions of the substrate body near the one protrusion including one of the plurality of annular protrusions. LED bulb, characterized in that the through-holes are formed. The method of claim 1, The top of the heat sink is screwed to the base plate of the hollow shape that the socket is formed on the top, LED bulb, characterized in that the inside of the base plate is installed standing SMPS substrate electrically connected to the socket. 3. The method of claim 2, The upper surface of the substrate is further provided with a silicon support is formed a straight support groove, LED bulb, characterized in that the lower end of the SMPS substrate is inserted into the support groove. The method of claim 1, The substrate is screwed to the bottom of the heat sink, LED head, characterized in that the head of the screw is formed with a star-shaped groove. The method of claim 1, LED bulb, characterized in that the upper surface of the substrate is formed radially from the center of the substrate and a plurality of annular projections made of the same material as the material of the substrate is further formed. The method of claim 1, LED substrate, characterized in that the substrate is made of any one of a metal, FR4 and metal. 3. The method of claim 2, The heat sink is, LED bulb characterized in that it comprises a hollow heat sink body in which the SMPS substrate is located therein and the plurality of heat dissipating parts formed on the outer circumference of the heat sink body and having a shape having one or more curvatures along the top and bottom . The method of claim 7, wherein Each of the plurality of heat dissipating parts is formed by sequentially overlapping the heat dissipation blades having one or more curvatures, LED bulbs, characterized in that the protrusions are formed on both sides of each of the heat dissipation vanes protruding in a semicircular shape at one or more positions facing each other to form the curve. The method of claim 8, LED bulbs characterized in that the heat dissipation wings are made of any one of a straight form and one side curved. The method of claim 7, wherein LED bulbs, characterized in that a plurality of heat dissipation projections are formed on the outer surface of each of the plurality of heat dissipation portion is formed protruding more. The method of claim 10, Each of the plurality of heat dissipation protrusions, One or more hot spots are formed on the outer surface of each of the heat dissipating portion, LED bulbs characterized in that it has a straight projection protruding in a straight line along the longitudinal direction of the heat dissipating portion on the outer surface of each of the heat dissipating portion. The method of claim 7, wherein The inner circumference of the heat sink body is further formed with a plurality of auxiliary heat dissipation portion is formed in a shape that is bent to one side along the vertical direction of the heat sink body at a predetermined interval, LED bulbs, characterized in that the auxiliary projections are formed on both sides of each of the plurality of auxiliary heat dissipating portions protruding in a semicircular shape at one or more positions facing each other. The method of claim 12, LED bulbs, characterized in that the outer surface of the plurality of heat dissipating portion and the plurality of auxiliary heat dissipating parts are sanded. The method of claim 7, wherein The heat sink is an LED bulb, characterized in that made of foamed aluminum. delete delete The method of claim 1, And the LED is connected to the electrodes through one of a ball grid array and wire bonding. delete delete 3. The method of claim 2, The socket of the base plate is screwed with the socket fitting body, the lower end of the base plate is screwed with the heat sink, LED sockets, characterized in that the socket fitting body and the heat sink are each screwed to the base plate in a reverse direction to each other. The method of claim 1, And the substrate further includes a reflector to cover the LEDs. The method of claim 1, LED bulb, characterized in that the substrate is optionally further provided with a color filter to cover the LEDs. 3. The method of claim 2, Ring inner first projection lines are further formed on the inner circumference of the socket, LED bulb, characterized in that the ring-shaped second projection line is further formed on the inner circumference of the base plate. The method of claim 12, LED bulbs, characterized in that a plurality of hot spots are further formed on the outer surface of the plurality of auxiliary radiator.

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