KR100977411B1 - Manufacturing method of polyamideimide silica hybrid material for electric wire coating and the material and electric wire coated with the material - Google Patents
Manufacturing method of polyamideimide silica hybrid material for electric wire coating and the material and electric wire coated with the material Download PDFInfo
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- KR100977411B1 KR100977411B1 KR1020080037576A KR20080037576A KR100977411B1 KR 100977411 B1 KR100977411 B1 KR 100977411B1 KR 1020080037576 A KR1020080037576 A KR 1020080037576A KR 20080037576 A KR20080037576 A KR 20080037576A KR 100977411 B1 KR100977411 B1 KR 100977411B1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 229920002312 polyamide-imide Polymers 0.000 title claims abstract description 49
- 239000004962 Polyamide-imide Substances 0.000 title claims abstract description 48
- 239000000463 material Substances 0.000 title claims abstract description 37
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 28
- 239000011248 coating agent Substances 0.000 title claims abstract description 18
- 238000000576 coating method Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000008119 colloidal silica Substances 0.000 claims abstract description 35
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910000077 silane Inorganic materials 0.000 claims abstract description 14
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000000962 organic group Chemical group 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 3
- 150000001282 organosilanes Chemical class 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
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- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
Abstract
본 발명은 전선 피복용 폴리아미드이미드 실리카 하이브리드 재료의 제조방법 및 이에 의한 폴리아미드이미드 실리카 하이브리드 재료 그리고 그 재료를 피복시킨 전선에 관한 것으로, 입자크기가 3~200nm인 수분산 콜로이달실리카(colloidal silica)에 유기실란을 첨가하여 교반시켜 상기 콜로이달실리카 표면에 유기기가 형성된 콜로이달실리카실란졸을 제조시키는 제1단계와; 상기 제1단계에서의 콜로이달실리카실란졸에 폴리아미드이미드(polyamideimide)와 상용성이 있는 유기용매를 첨가하여 상기 콜로이달실리카실란졸을 유기계로 치환시키는 제2단계와; 상기 제2단계에서의 콜로이달실리카실란졸을 폴리아미드이미드(polyamideimide)에 첨가하여 교반시켜 실리카와 폴리아미드이미드를 하이브리드화시키는 제3단계와; 상기 제3단계에서 하이브리드화된 졸용액에 아미노실란을 첨가하여 교반시키는 제4단계;를 포함하여 이루어지는 것을 특징으로 하는 전선 피복용 폴리아미드이미드 실리카 하이브리드 재료의 제조방법 및 이에 의해 제조된 재료를 기술적 요지로 한다. 이에 의해 폴리아미드이미드(polyamideimide)에 콜로이달실리카실란졸을 균일하게 하이브리드화시켜 내아크성, 전기절연특성, 유전특성, 내열특성, 접착특성 및 기계적특성이 우수한 유무기하이브리드 재료를 공급할 수 있고, 이를 전선에 피복하여 고온환경에서 내아크성 및 전기절연특성이 유지되는 전선을 제공할 수 있는 이점이 있다.The present invention relates to a method for producing a polyamideimide silica hybrid material for electric wire coating, and to a polyamideimide silica hybrid material and a wire coated with the material, wherein the colloidal silica has a particle size of 3 to 200 nm. 1) preparing a colloidal silica sol in which an organic group is formed on the surface of the colloidal silica by adding an organosilane to the mixture; A second step of replacing the colloidal silicasilane sol with an organic system by adding an organic solvent compatible with polyamideimide to the colloidal silica silane in the first step; A third step of hybridizing silica and polyamideimide by adding and adding the colloidal silicasilane sol in the second step to polyamideimide; A fourth step of adding and stirring an aminosilane to the sol solution hybridized in the third step; and a process for producing a polyamideimide silica hybrid material for electric wire coating, comprising Make a point. As a result, the colloidal silicasilane sol is uniformly hybridized to polyamideimide to supply organic-inorganic hybrid materials excellent in arc resistance, electrical insulation properties, dielectric properties, heat resistance properties, adhesive properties, and mechanical properties. It is advantageous to provide a wire which is coated with wires to maintain arc resistance and electrical insulation in a high temperature environment.
폴리아미드이미드 실란 콜로이달실리카 유무기 하이브리드 전선 Polyamideimide Silane Colloidal Silica Organic-Inorganic Hybrid Wire
Description
본 발명은 유무기하이브리드 재료의 제조방법 및 유무기하이브리드 재료 그리고 이를 피복한 전선에 관한 것으로, 특히 폴리아미드이미드(polyamideimide)를 콜로이달실리카실란졸에 균일하게 하이브리드화시켜 내아크성, 절연특성, 유전특성, 내열특성, 접착특성 및 기계적특성이 우수한 유무기하이브리드 재료를 공급하고, 이를 전선에 피복하기 위한 전선 피복용 폴리아미드이미드 실리카 하이브리드 재료의 제조방법 및 이에 의해 제조된 폴리아미드이미드 실리카 하이브리드 재료 그리고 그 재료를 피복시킨 전선에 관한 것이다.The present invention relates to a method for producing an organic-inorganic hybrid material, an organic-inorganic hybrid material and an electric wire coated with the same, and in particular, polyamideimide is uniformly hybridized to colloidal silicasilane so that it is resistant to arc resistance, insulation properties, A method for producing a polyamideimide silica hybrid material for electric wire coating and supplying an organic-inorganic hybrid material having excellent dielectric properties, heat resistance, adhesion properties, and mechanical properties, and coating the same on an electric wire, and a polyamideimide silica hybrid material produced thereby And an electric wire coated with the material.
최근 IT, ET, 전력 등의 다양한 산업분야에서 나노복합소재에 대한 관심이 증폭되고 있고, 전기, 전자 통신용 부품의 내열성의 한계가 점차 높아지고 있으며, 고온에서 전기적 유전특성과 접착특성이 우수한 코팅 유전재료의 개발이 필요한 실정이다.Recently, interest in nanocomposite materials in various industries such as IT, ET, and electric power has been amplified, and the heat resistance limit of components for electrical and electronic communication is gradually increasing, and coating dielectric materials having excellent electrical dielectric properties and adhesive properties at high temperatures. The development of the situation is necessary.
그 중 유무기하이브리드(organic-inorganic hybrid) 재료는 기존 유기 고분자의 화학적, 기계적, 물리적 한계를 극복한 것으로서, 유기물과 무기물이 원자 또는 분자수준에서 하이브리드 합성된 것이다.Among them, organic-inorganic hybrid materials overcome the chemical, mechanical, and physical limitations of existing organic polymers, and hybrid organic and inorganic materials at the atomic or molecular level.
상기 유무기하이브리드 재료는 기본수지(matrix resin)로 다양한 고분자가 용도에 따라 사용되고 있지만, 내열성과 내마모성, 낮은 유전율 등에서 뛰어난 특성을 갖는 폴리아미드이미드(polyiamidemide)는 고성능을 요구하는 중요 유전 코팅재료로 선호되고 있다.The organic-inorganic hybrid material is a matrix resin, but various polymers are used according to the purpose, but polyamideimide having excellent properties in heat resistance, abrasion resistance, low dielectric constant, etc. is preferred as an important dielectric coating material requiring high performance. It is becoming.
그러나 폴리아미드이미드는 폴리아미드이미드 필름 표면에 반응성 활성그룹이 적기 때문에 구리, 알루미늄과 같은 금속도체에 접착성이 낮은 단점이 있다.However, polyamideimide has a disadvantage of low adhesion to metal conductors such as copper and aluminum because of less reactive active groups on the polyamideimide film surface.
특히, 종래의 전기, 전자 통신용 부품 그 중에서 전선은 일반적으로 구리선에 에나멜 코팅처리가 되어 있는데, 이는 내열성과 내마모성이 낮으며, 고온환경에서 내아크성 및 전기절연성이 떨어지는 문제점이 있다. 또한 접착성 및 기계적 내구성이 떨어져 코팅 피복이 벗겨지는 문제점이 있다.In particular, among the conventional electrical and electronic communication components, the wire is generally enameled on the copper wire, which is low in heat resistance and abrasion resistance, and has a problem in that arc resistance and electrical insulation are poor in a high temperature environment. In addition, there is a problem that the coating coating is peeled off due to poor adhesion and mechanical durability.
본 발명은 상기 문제점을 해결하기 위해, 폴리아미드이미드(polyamideimide)에 콜로이달실리카실란졸에 균일하게 하이브리드화시켜 내아크성, 유전특성, 내열특성, 접착특성 및 기계적특성이 우수한 유무기하이브리드 재료를 공급하기 위한 전선 피복용 폴리아미드이미드 실리카 하이브리드 재료의 제조방법 및 이에 의한 폴리아미드이미드 실리카 하이브리드 재료 그리고 그 재료를 피복시킨 전선을 그 과제로 한다.In order to solve the above problems, the present invention provides an organic-inorganic hybrid material having excellent arc resistance, dielectric properties, heat resistance, adhesion properties, and mechanical properties by uniformly hybridizing polyamideimide with colloidal silicasilane. The manufacturing method of the polyamide-imide silica hybrid material for electric wire coating for supply, the polyamide-imide silica hybrid material by this, and the electric wire which coat | covered this material are made into the subject.
상기 과제를 해결하기 위해 본 발명은, 입자크기가 3~200nm인 수분산 콜로이달실리카(colloidal silica)에 유기실란을 첨가하여 교반시켜 상기 콜로이달실리카 표면에 유기기가 형성된 콜로이달실리카실란졸을 제조시키는 제1단계와; 상기 제1단계에서의 콜로이달실리카실란졸에 폴리아미드이미드(polyamideimide)와 상용성이 있는 유기용매를 첨가하여 상기 콜로이달실리카실란졸을 유기계로 치환시키는 제2단계와; 상기 제2단계에서의 콜로이달실리카실란졸을 폴리아미드이미드(polyamideimide)에 첨가하여 교반시켜 실리카와 폴리아미드이미드를 하이브리드화시키는 제3단계와; 상기 제3단계에서 하이브리드화된 졸용액에 아미노실란을 첨가하여 교반시키는 제4단계;를 포함하여 이루어지는 것을 특징으로 하는 전선 피복용 폴리아미드이미드 실리카 하이브리드 재료의 제조방법 및 이에 의해 제조된 재료를 기술적 요지로 한다.In order to solve the above problems, the present invention, by adding an organic silane to a water-soluble colloidal silica (particle colloidal silica) having a particle size of 3 ~ 200nm to prepare a colloidal silica sol with an organic group formed on the surface of the colloidal silica Making a first step; A second step of replacing the colloidal silicasilane sol with an organic system by adding an organic solvent compatible with polyamideimide to the colloidal silica silane in the first step; A third step of hybridizing silica and polyamideimide by adding and adding the colloidal silicasilane sol in the second step to polyamideimide; A fourth step of adding and stirring an aminosilane to the sol solution hybridized in the third step; and a process for producing a polyamideimide silica hybrid material for electric wire coating, comprising Make a point.
또한, 상기 제1단계의 유기실란은,메틸트리메톡시실란, 메틸트리에톡시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 페닐트리메톡시실란, 페닐트리에톡시실란, 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필트리에톡시실란 중의 어느 하나 또는 이들이 혼합된 실란인 것이 바람직하다.In addition, the organosilane of the first step, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, 3-gly It is preferable that it is any one of a cidoxy propyl trimethoxysilane, 3-glycidoxy propyl triethoxy silane, or the silane mixed these.
또한, 길이 방향으로 길게 형성되어 단일 또는 복수개가 꼬여서 형성되고, 도전성 재질로 형성된 금속도체와; 상기 금속도체의 표면에 콜로이달실리카(colloidal silica)에 유기실란을 첨가한 콜로이달실리카실란졸에 폴리아미드이미드 및 아미노실란을 첨가하여 유무기하이브리드화한 졸용액을 단일 또는 복수층으로 코팅시켜 형성된 절연층;을 포함하여 구성되는 것을 특징으로 하는 폴리아미드이미드 실리카 하이브리드 재료가 피복된 전선을 또 다른 기술적 요지로 한다.In addition, the metal conductor is formed long in the longitudinal direction and formed by twisting a single or a plurality, and formed of a conductive material; The organic-inorganic hybridized sol solution is formed by adding polyamideimide and aminosilane to a colloidal silica sol in which colloidal silica is added to colloidal silica on the surface of the metal conductor. Another technical subject is an electric wire coated with a polyamide-imide silica hybrid material, comprising an insulating layer.
상기 해결 수단에 의해 본 발명은 폴리아미드이미드(polyamideimide)에 콜로이달실리카실란졸을 균일하게 하이브리드화시켜 내아크성, 전기절연특성, 유전특성, 내열특성, 접착특성 및 기계적특성이 우수한 유무기하이브리드 재료를 공급할 수 있고, 이를 전선에 피복하여 고온환경에서 내아크성 및 전기절연특성이 유지되는 전선을 제공할 수 있는 효과가 있다.By the above solution, the present invention is uniformly hybridized colloidal silica sol to polyamideimide (organic hybrid) excellent in arc resistance, electrical insulation properties, dielectric properties, heat resistance properties, adhesive properties and mechanical properties The material can be supplied, and it can be coated on the wire to provide a wire that maintains arc resistance and electrical insulation properties in a high temperature environment.
본 발명은 고분자 수지인 폴리아미드이미드에 나노 크기의 실란 표면처리된 콜로이달 실리카가 하이브리드되어 있는 전선 피복용 폴리아미드이미드 실리카 하이브리드 재료의 제조방법 및 이에 의해 제조된 재료 그리고, 상기 재료를 코팅시 킨 전선에 관한 것이다.The present invention provides a method for producing a polyamideimide silica hybrid material for electric wire coating in which polyamideimide, a polymer resin, and a nano-sized silane surface-treated colloidal silica are hybridized, and the material prepared thereby, and coated with the material. It's about wires.
본 발명에 따른 전선 피복용 폴리아미드이미드 실리카 하이브리드 재료의 제조방법은, 크게 유기실란을 첨가하여 표면에 유기기가 형성된 콜로이달실리카실란졸을 제조하는 제1단계와, 상기 콜로이달실리카실란졸에 유기용매를 첨가하여 유기계로 치환시키는 제2단계와, 여기에 폴리아미드이미드를 첨가하여 실리카와 균일하게 하이브리드화시키는 제3단계와, 그리고 안정성을 개선하기 위해 여기에 아미노실란을 첨가하여 교반시키는 제4단계로 이루어진다.The method for producing a polyamideimide silica hybrid material for electric wire coating according to the present invention comprises the first step of preparing a colloidal silicasilane sol in which an organic group is formed on the surface by largely adding an organic silane, and organic to the colloidal silica sol. A second step of adding a solvent and replacing with an organic system, a third step of adding polyamideimide to the hybridization homogeneously with silica, and a fourth step of adding and stirring an aminosilane to improve stability Is made of.
먼저, 상기 제1단계는 나노 크기의 수분산 콜로이달실리카에 유기실란을 첨가하여 적정 시간 상온에서 교반시키고, 상기 콜로이달실리카 표면에 가수분해반응을 통한 유기기를 형성시키기 위해 유기실란을 첨가하여 수분산 콜로이달실리카실란졸을 형성시키는 것이다.First, in the first step, the organic silane is added to the nano-sized colloidal silica and stirred at an appropriate temperature at room temperature, and the organic silane is added to form an organic group through a hydrolysis reaction on the surface of the colloidal silica. To form dispersed colloidal silicasilane sol.
여기에서 상기 콜로이달실리카는 사용목적에 따라 적절한 량의 고형분이 포함된 것을 선택하여 사용하고, 입자크기가 3~200nm 정도의 나노실리카가 포함된 것을 사용한다.Here, the colloidal silica is used to select the one containing the appropriate amount of solids according to the purpose of use, and the one containing the nano-silica having a particle size of about 3 ~ 200nm.
이러한 표면에 유기기가 형성된 콜로이달실리카실란졸은 후술할 고분자수지인 폴리아미드이미드(polyeamideimide)에 첨가시 콜로이달실리카실란졸 내부에서 균일한 분산과 반응도를 높이기 위한 것이다.The colloidal silicasilane sol having an organic group formed on such a surface is intended to increase uniform dispersion and reactivity in the colloidal silicasilane sol when added to polyamideimide, which is a polymer resin, which will be described later.
그리고, 상기 제2단계는 수지 즉, 폴리아미드이미드와 상용성이 있는 유기용매를 첨가하여 감압 증류를 통해, 상기 콜로이달실리카실란졸을 수계에서 유기계로 치환하여 유기계 콜로이달실리카실란졸을 제조한다.In the second step, an organic colloidal silicasilane sol is prepared by adding a resin, that is, an organic solvent compatible with polyamideimide, and then substituting the colloidal silica silazole from an aqueous system to an organic system through distillation under reduced pressure. .
그 다음, 상기 제3단계로, 상기 유기용매가 첨가된 콜로이달실리카실란졸을 고분자 수지인 폴리아미드이미드와 하이브리드화시키고, 제4단계로서 일정 양의 아미노실란을 첨가하여 투명성이 뛰어나고 화학적 분산 안정성이 우수한 졸상의 폴리아미드이미드 실리카 하이브리드 재료를 제조하게 된다.Next, in the third step, the colloidal silicasilane sol to which the organic solvent is added is hybridized with polyamideimide, which is a polymer resin, and as a fourth step, a certain amount of aminosilane is added to provide excellent transparency and chemical dispersion stability. This excellent sol-like polyamideimide silica hybrid material is produced.
상기 하이브리드 재료를, 길이 방향으로 길게 형성되어 단일 또는 복수개가 꼬여서 형성되고 도전성 금속재질로 형성된 금속도체 즉, 구리선 등에 코팅하여 고온에서 경화시켜 상기 하이브리드 재료로 이루어진 절연층을 형성시킴으로써, 내열성과 유전특성이 우수하며, 고온환경에서 내아크성 및 전기절연성이 유지되는 전선을 얻을 수 있게 된다. 또한, 필요에 의해 종래의 에나멜 동선의 외피로 상기 하이브리드 재료를 절연층으로서 한 번 더 입힐 수도 있다.The hybrid material is formed long in the longitudinal direction and is formed by twisting a single or a plurality of metal conductors formed of a conductive metal material, that is, a copper wire or the like, and cured at a high temperature to form an insulating layer made of the hybrid material. This makes it possible to obtain a wire having excellent arc resistance and electrical insulation in a high temperature environment. In addition, if necessary, the hybrid material may be coated once more as an insulating layer with an outer shell of a conventional enamelled copper wire.
이하에서는 본 발명의 바람직한 실시예에 대해 상세히 설명하고자 한다.Hereinafter will be described in detail for the preferred embodiment of the present invention.
<실시예 1>≪ Example 1 >
제1단계로서, 메틸트리메톡시실란 30㎖와 에탄올 30㎖를 상온에서 5분간 교반하고, 이를 수분산 콜로이달실리카(colloidal silica) 300㎖에 첨가하여 6시간 동안 교반을 통해 콜로이달실리카 표면을 실란으로 개질시켜, 콜로이달실리카 표면에 유기기가 형성된 콜로이달실리카실란졸을 제조하였다.As a first step, 30 ml of methyltrimethoxysilane and 30 ml of ethanol were stirred at room temperature for 5 minutes, and this was added to 300 ml of water-dispersed colloidal silica, and the surface of the colloidal silica was stirred for 6 hours. Modified with silane to prepare a colloidal silica sol with an organic group formed on the surface of the colloidal silica.
<실시예 2><Example 2>
제2단계로서, 상기 실시예 1에서 수득한 표면개질된 수분산 콜로이달실리카 실란졸을 유기용매인 n-메틸피로리돈(NMP) 315㎖를 첨가하여 5분간 교반하고, 이를 감압증류를 통해 수계에서 유기계로 용매를 치환시킨다. 이에 의해 콜로이달실리카실란졸의 분산 안정성과 폴리아미드이미드와의 상용성이 극대화된 유기용제형 콜로이달실리카실란졸을 얻을 수 있었다.As a second step, 315 ml of the organic-modified colloidal silica silane obtained in Example 1 was added to an organic solvent, n-methylpyrrolidone (NMP), and stirred for 5 minutes, and the aqueous system was distilled under reduced pressure. Substitute the solvent in the organic system at. As a result, it was possible to obtain an organic solvent type colloidal silicasilane sol which maximizes the dispersion stability of colloidal silica silazole and compatibility with polyamideimide.
여기에서 상기 콜로이달실리카실란졸의 고형분은 30wt%였으며, 도 1은 이와 같은 방법으로 제조된 콜로이달실리카의 TEM 이미지로써, 분산이 아주 잘 되었음을 보여주고 있다.Here, the solid content of the colloidal silica Silazole was 30wt%, Figure 1 is a TEM image of the colloidal silica prepared in this way, it shows that the dispersion is very well.
<실시예 3><Example 3>
제3단계로서, 상기 실시예 2에서 수득한 n-메틸피로리돈을 용매로 한 콜로이달실리카실란졸과 고형분 30wt% 폴리아미드이미드를 1:1의 비율로 섞어 교반하여 실리카와 폴리아미드이미드가 하이브리드화된 졸용액을 얻을 수 있었다. 여기에서는 무기물(콜로이달실리카)의 첨가로 인하여 상이 불안정하고 불투명한 폴리아미드이미드 실리카 하이드브리드 졸용액을 얻을 수 있었다.As a third step, a mixture of colloidal silicasilane sol and n-methylpyrrolidone obtained in Example 2 as a solvent and a solid content of 30wt% polyamideimide in a ratio of 1: 1 was stirred, and the silica and polyamideimide were hybridized. A sol solution can be obtained. Here, a polyamideimide silica hybrid sol solution having an unstable and opaque phase was obtained due to the addition of an inorganic substance (colloidal silica).
<실시예 4><Example 4>
제4단계로서, 상기 실시예 3에서 수득한 폴리아미드이미드 실리카 하이브리드 용액 100㎖에 아미노실란으로 3-아미노프로필트리에톡시실란(이하 APTES라 함)을 0.1~4g 첨가하여 교반하였다. 이를 통하여 안정성이 개선된 폴리아미드이미드 실리카 하이브리드 졸용액을 얻을 수 있었으며 그 결과를 표 1에 나타내었다.As a fourth step, 0.1-4 g of 3-aminopropyltriethoxysilane (hereinafter referred to as APTES) was added to 100 ml of the polyamideimide silica hybrid solution obtained in Example 3 with aminosilane and stirred. Through this, a polyamideimide silica hybrid sol solution having improved stability was obtained, and the results are shown in Table 1.
<표 1>TABLE 1
<실시예 5><Example 5>
상기 실시예 4에서 수득한 안정한 폴리아미드이미드 실리카 하이브리드 졸용액의 특성평가를 위하여, 동선, 에나멜이 피복된 동선 또는 동판의 표면에 상기 하이브리드 용액을 소정 두께로 코팅하여 경화를 시켰다. 경화조건을 90℃에서 1시간, 150℃에서 15분, 220℃에서 5분의 3단계를 거쳤다. 다음 표 2는 그에 따른 특성평가 결과를 나타내었다.In order to evaluate the characteristics of the stable polyamideimide silica hybrid sol solution obtained in Example 4, the hybrid solution was coated to a predetermined thickness on the surface of copper wire, enameled copper wire or copper plate, and cured. Curing conditions were 1 hour at 90 ° C, 15 minutes at 150 ° C and 5 minutes at 220 ° C. Table 2 shows the characteristics evaluation results accordingly.
<표 2>TABLE 2
표 2에 나타난 바와 같이 내아크성, 전기절연성, 유전특성 및 내열성이 우수하고, 접착특성이 우수할 뿐만 아니라 기계적 내구성이 향상된 코팅 피복이 형성된 전선을 얻을 수 있었다.As shown in Table 2, it was possible to obtain an electric wire with a coating coating having excellent arc resistance, electrical insulation, dielectric properties, heat resistance, excellent adhesive properties, and improved mechanical durability.
도 1 - 본 발명에 따른 유기용매가 첨가된 콜로이달실리카실란졸에 대한 TEM이미지를 나타낸 도.1-TEM image for the colloidal silica silica sol added an organic solvent according to the present invention.
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| KR101604444B1 (en) * | 2014-09-17 | 2016-03-17 | 한국전기연구원 | Organic-inorganic nano hybrid coating agent and resin containing silica particles surface-modified with oligomer, and manufacturing method thereof |
| KR101597683B1 (en) * | 2014-09-17 | 2016-02-25 | 한국전기연구원 | Ceramic sol nanohybrid materials using modified polyamideimide capped with hydroxyl group or ether group and manufacturing method of thereof |
| FR3037965B1 (en) | 2015-06-24 | 2017-07-14 | Seb Sa | ANTI-ADHESIVE COATING PRIMARY COMPOSITIONS AND METHODS OF PREPARING THE SAME |
| WO2017048070A1 (en) * | 2015-09-16 | 2017-03-23 | 한국전기연구원 | Quadrilateral coil having high ceramic content modified pai insulating varnish coated thereon as multilayer structure, and method for manufacturing same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005075994A (en) * | 2003-09-03 | 2005-03-24 | Suzuka Fuji Xerox Co Ltd | Heat-resistant elastic material and method for producing the same |
| JP2005112908A (en) * | 2003-10-03 | 2005-04-28 | Totoku Electric Co Ltd | Inorganic filler dispersed insulating paint and insulated wire |
| KR20050099849A (en) * | 2004-04-12 | 2005-10-17 | 한국과학기술원 | Inorganic/organic hybrid oligomer, nano hybrid polymer for optical devices and displays, and manufacturing method thereof |
| KR20060112594A (en) * | 2005-04-25 | 2006-11-01 | 히다찌 마그넷또와이야 가부시끼가이샤 | Partial-discharge-resistant insulated varnish, insulated wire and manufacturing method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005075994A (en) * | 2003-09-03 | 2005-03-24 | Suzuka Fuji Xerox Co Ltd | Heat-resistant elastic material and method for producing the same |
| JP2005112908A (en) * | 2003-10-03 | 2005-04-28 | Totoku Electric Co Ltd | Inorganic filler dispersed insulating paint and insulated wire |
| KR20050099849A (en) * | 2004-04-12 | 2005-10-17 | 한국과학기술원 | Inorganic/organic hybrid oligomer, nano hybrid polymer for optical devices and displays, and manufacturing method thereof |
| KR20060112594A (en) * | 2005-04-25 | 2006-11-01 | 히다찌 마그넷또와이야 가부시끼가이샤 | Partial-discharge-resistant insulated varnish, insulated wire and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101104390B1 (en) | 2011-02-18 | 2012-01-16 | 한국전기연구원 | Manufacturing method of organic-inorganic nano fusion insulation varnish and coil coated with organic-inorganic nano fusion insulation varnish |
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