KR100965024B1 - Powder coating method and apparatus - Google Patents

Abstract

The present invention provides a process for supplying a predetermined powder; Injecting gas at room temperature to transfer the supplied powder to a predetermined injection nozzle; And spraying the transported powder on a predetermined substrate using a predetermined spray nozzle at room temperature and in a vacuum state, wherein the predetermined powder is in a range of 0.1 to 10 μm, and the powder is coated on a substrate. The process of spraying on the phase relates to a method for applying powder on a substrate, and a powder coating apparatus for performing the method, characterized in that carried out at a speed of 500 ~ 1200 m / sec,

According to the present invention, a predetermined powder can be smoothly coated on a substrate even at room temperature, and a substrate made of various materials that are weak to heat can be used.

Metal, ceramic, powder, coating

Description

Powder coating method and apparatus {Method and Apparatus for coating powder material on substrate}

The present invention relates to a method of applying a predetermined material on a substrate, and more particularly to a method capable of applying various materials such as metal or ceramic on various substrates made of metal, ceramic, or polymer under low temperature. It is about.

As a method of applying a predetermined material on the substrate, there is a chemical vapor deposition method, a thermal spray method, a gas deposition method, or the like.

The chemical vapor deposition method is a method widely used in a semiconductor manufacturing process, and is a method of coating a predetermined material on the surface of a substrate by chemically reacting a gaseous material on a heated substrate surface. However, such a chemical vapor deposition method does not apply various materials such as metal to the surface of the substrate because the gaseous material is applied to the substrate surface, and the chemical vapor deposition method is performed at a high temperature of 1000 ° C. or higher, There is a limit to applying a predetermined material on a substrate made of the same material.

The thermal spray method is a method of applying a predetermined material to the surface of the substrate by changing the powder material into a molten state by using a high temperature heat source, impinging on the surface of the substrate at high speed, and then rapidly solidifying it, and the gas deposition method is a metal or Materials such as ceramics are vaporized using a high temperature heat source to form ultrafine particles, and then vaporized ultrafine particles are sprayed onto a predetermined surface of the substrate by using a high temperature gas to induce bonding between the ultrafine particles on the substrate surface. How to apply.

However, such a thermal spray method and gas deposition method can apply various materials such as metals or ceramics to the surface of the substrate. If a predetermined material is applied to the substrate, there is a problem that the substrate is deformed by thermal shock.

As a result, the conventional chemical vapor deposition method, thermal spray method, and gas deposition method have a limitation in applying a predetermined material on a substrate made of a material that is heat-sensitive because the process is performed at a high temperature, and thus, the application process is performed at a low temperature. There has been development of a method of applying a predetermined material onto a substrate made of various materials by performing, and as an example, a cold spray method has been developed.

The cold spraying method applies a predetermined material to a substrate by supplying a predetermined powder at a relatively low temperature of 300 to 600 ° C. and then inducing high deformation by colliding the powder with a surface of a predetermined material using a supersonic gas under atmospheric pressure. By way of example, a conventional cold spraying method will be described in more detail with reference to the accompanying drawings.

1 is a schematic diagram of a conventional cold spray apparatus, which includes a gas injection unit 10, a powder supply unit 20, a heating unit 30, a chamber 40, and an injection nozzle 50. .

When gas is injected from the gas injection unit 10, some of the gas moves to the powder supply unit 20 to transfer the powder, and the remaining gas moves to the heating unit 30 to be heated with high temperature gas. Then, after the heated gas and the gas for conveying the powder join, the powder particles are injected through the injection nozzle 50. The sprayed powder particles collide with the surface of the substrate 1 seated in the chamber 40 and then impregnated into the substrate 1 to apply the powder particles to the surface of the substrate 1.

However, such a cold spray method has a limitation of the following applications.

First, the cold spray method can be applied at a relatively low temperature compared to chemical vapor deposition, thermal spray, and gas deposition, but is still sensitive to temperature because it requires a process temperature of 300 to 600 ° C. There is a limit in applying a predetermined material to a substrate made of a material. In particular, in the case of a display device using a flexible substrate that has received a lot of attention as a display device of the future, since a weak organic polymer material should be applied as the flexible substrate, a cold temperature of 300 to 600 ° C. is required. Temperature conditions are not yet met to use the spray method.

In addition, since the cold spray method requires a process temperature of 300 to 600 ° C., as shown in FIG. 1, the heating part 30 is essentially required, and a pipe for gas movement is complicated, which leads to an increase in cost.

Second, since the cold spray method is applied while impregnated into the substrate after the powder particles collide with the substrate, the powder particles do not impregnate into the substrate when the powder particles are smaller than a predetermined size. Therefore, powder particles having a predetermined size or more should be used. In this case, the powder particles may collide with the substrate and adversely affect the substrate surface.

Third, the cold spray method can be applied only to the application process of the metal powder due to its process limitations, and the ceramic powder can not be applied alone, but can be applied only when mixed with the metal powder, the variety of material selection of the application process There is a limit.

The present invention has been devised to solve the problems of the prior art, the present invention provides a coating method and coating apparatus that can be used to a substrate of various materials by allowing a predetermined powder to be smoothly applied on the substrate even at room temperature. The purpose is to do.

Another object of the present invention is to provide a coating method and a coating apparatus which can minimize adverse effects on a substrate by applying a powder of a small size onto the substrate.

It is another object of the present invention to provide a coating method and a coating apparatus which make it possible to use powders of various materials such as metal powder and ceramic powder.

The present invention, in order to achieve the above object, a step of supplying a predetermined powder; Injecting gas at room temperature to transfer the supplied powder to a predetermined injection nozzle; And spraying the transported powder on a predetermined substrate using a predetermined spray nozzle at room temperature and in a vacuum state, wherein the predetermined powder is in a range of 0.1 to 10 μm, and the powder is coated on a substrate. The spraying on the phase provides a method for applying the powder on the substrate, characterized in that performed at a speed of 500 ~ 1200 m / sec.

The present inventors studied a method of applying powder at room temperature in order to use a heat-sensitive organic polymer material as a substrate. As a result, the conditions of the chamber in which the coating process is performed, the size of the powder, and the speed of spraying the powder on the substrate When properly adjusted, it is confirmed that a sufficiently good powder coating process is possible at room temperature without performing a heating process for the powder as in the prior art, thus leading to the present invention. Specifically, when the chamber in which the coating step is performed is set to a vacuum state rather than atmospheric pressure, the size of the powder is in the range of 0.1 to 10 μm, and the speed at which the powder is sprayed onto the substrate is in the range of 500 to 1200 m / sec. It has been found that good powder application is possible without heating the powder.

Here, by maintaining the chamber in which the coating process is carried out in a vacuum state, the fluid resistance received when the powder is moved by the gas is reduced to eliminate the speed reduction factor of the powder, and in addition, the size of the powder is relatively small as in the above range. By forming a relatively large speed of spraying the powder instead of forming as described above, the powder is impinged on the substrate to be smoothly applied.

In addition, the use of the powder having a small size above minimizes adverse effects on the substrate when the powder collides with the substrate, and when the ceramic powder is sprayed onto the substrate within the process range, the ceramic powder collides with the substrate and is broken, thereby causing recombination. As a result, it was confirmed that the ceramic powder was applied onto the substrate, and thus, the coating process could be performed using various powder materials such as metal powder and ceramic powder.

The invention also provides a chamber, in order to implement such a coating method; A vacuum pump connected to the chamber to create a vacuum environment inside the chamber; A substrate support part formed inside the chamber and supporting a predetermined substrate; An injection nozzle formed in the chamber and configured to spray predetermined powder on the substrate; A gas injection unit formed outside the chamber and injecting a predetermined gas; A pipe connected to each of the gas injection unit and the injection nozzle to move the gas injected from the gas injection unit to the injection nozzle; And a powder supply part connected to the pipe and supplying powder to the pipe through which the gas moves.

According to the present invention has the following effects.

First, the present invention sets the chamber in which the coating process is performed in a vacuum environment, the size of the powder in the range of 0.1 ~ 10 ㎛, and the speed of spraying the powder on the substrate in the range of 500 ~ 1200 m / sec, the predetermined powder Can be smoothly applied onto the substrate even at room temperature. Therefore, it is possible to use a substrate of various materials that are weak to heat, thereby enabling the coating process for the insulating layer or the metal wiring layer on the flexible substrate.

Second, since the present invention applies a small size powder in the range of 0.1 ~ 10 ㎛ on the substrate, the adverse effect on the substrate is minimized.

Third, the present invention can use powders of various materials such as metal powders and ceramic powders, thereby increasing the choice of materials to be applied.

In addition to the effects described above, the present invention has individual effects obtained by modifying the present invention in various embodiments, which will be described in detail in Examples described later.

<Powder coating device>

Hereinafter, a powder coating apparatus according to a preferred embodiment of the present invention will be described with reference to the drawings.

2 is a schematic diagram of a powder coating apparatus according to an embodiment of the present invention.

As can be seen in Figure 2, the powder coating apparatus according to an embodiment of the present invention, the chamber 100, the vacuum pump 200, the substrate support 300, the injection nozzle 400, the gas supply unit 500, piping ( 600) and a powder supply unit 700.

The chamber 100 accommodates the substrate support part 300 and the injection nozzle 400, and the chamber 100 is connected to a vacuum pump 200 so that the chamber is operated by the operation of the vacuum pump 200. The interior of 100 creates a vacuum environment.

The substrate support part 300 is formed inside the chamber 100 and serves to support a predetermined substrate S. The substrate support part 300 is formed on the X axis and the Y axis by a predetermined driving device 310. It is configured to be movable on the axis. As such, since the substrate support part 300 is configured to be movable along the X-axis and the Y-axis, the substrate S fixed to the substrate support part 300 is also movable, so that the powder may form a predetermined pattern on the substrate S. It can be applied to have. As the substrate S, a metal, a ceramic, or a polymer may be used.

The injection nozzle 400 is formed in the chamber 100 so that the powder can be applied to the substrate (S) by spraying a predetermined powder on the substrate (S), the injection nozzle 400 Is formed with a first opening 410, a second opening 420, and a nozzle neck 430. The first opening 410 is connected to the pipe 600 to receive the powder from the pipe 600, the second opening 420 sprays the received powder to the substrate (S), the nozzle neck 430 is formed between the first opening 410 and the second opening 420. Here, the nozzle neck 430 is formed to have a diameter of 100 ㎛ ~ 3mm, the diameter from the first opening 410 to the nozzle neck 430 is gradually reduced, the second in the nozzle neck 430 The aperture 420 is formed to gradually increase in diameter, so that the powder injected through the injection nozzle 400 has an injection speed of 500 to 1200 m / sec, preferably 600 to 1200 m / sec. .

The injection nozzle 400 may be formed to be inclined with respect to the surface of the substrate (S) It is configured so that the powder to be sprayed inclined with respect to the surface of the substrate (S). When the powder is sprayed perpendicularly to the surface of the substrate (S), since the gas injected with the powder is reflected from the surface of the substrate (S), the spraying speed of the powder may be changed, so that the desired coating characteristics may not be realized. Therefore, the powder is preferably sprayed inclined at a predetermined angle with respect to the surface of the substrate (S), it is preferable to form the spray nozzle 400 inclined with respect to the surface of the substrate (S) for that purpose. However, the injection nozzle 400 may be formed perpendicular to the horizontal plane, and instead, the substrate S may be disposed to be inclined at a predetermined angle.

The gas injection unit 500 is formed outside the chamber 100 and serves to inject gas to transport the powder. By appropriately adjusting the gas pressure injected from the gas injection unit 500 and by using the injection nozzle 400 of the above-described configuration, it is possible to appropriately control the injection speed of the powder injected through the injection nozzle 400. As the gas injected from the gas injection part 500, helium, nitrogen, oxygen, or air may be used.

The pipe 600 is connected to the gas injection unit 500 and the injection nozzle 400, respectively, so that the gas supplied from the gas injection unit 500 can move to the injection nozzle 400.

The powder supply unit 700 is connected to the pipe 600 serves to supply powder to the pipe 600. The powder to be supplied may be metal or ceramic, the size of which is in the range of 0.1 to 10 μm.

On the other hand, by additionally configuring a heating unit (not shown) between the injection nozzle 400 and the powder supply unit 700, it is possible to heat the conveyed powder in the room temperature ~ 300 ℃ range. As such, when the powder is heated in a predetermined temperature range by additionally configuring the heating unit, the spraying speed of the powder may be set to be somewhat slow, so that the spraying speed range of the powder may be set to 300 to 1200 m / sec. That is, since the heated powder can move at a higher speed than the unheated powder, when the powder is heated to a predetermined temperature range, the desired speed can be obtained when the powder finally collides with the substrate even if the spraying speed range of the powder is set slightly slower. It becomes possible. In addition, when the powder is heated to a predetermined temperature range, when the powder collides with the substrate, the particle is smoothly deformed and the lamination efficiency on the substrate may be improved.

In addition, by additionally configuring a filter unit (not shown) in the pipe 600 between the injection nozzle 400 and the powder supply unit 700, the conveyed powder is suspended in a gas to filter the powder of a predetermined size or more. It may be.

3 is a schematic view of a powder coating apparatus according to another embodiment of the present invention, which is the same as the powder coating apparatus according to FIG. 2 except that the configuration of the powder supply unit, the pipe, and the spray nozzle is changed. Therefore, like reference numerals refer to like elements, and detailed descriptions of the same elements will be omitted.

As can be seen in Figure 3, according to another embodiment of the present invention, the powder supply unit is composed of a first powder supply unit 710 for supplying the first powder and the second powder supply unit 730 for supplying the second powder, The pipe is composed of a first pipe 610 connected to the first powder supply unit 710 and a second pipe 630 connected to the second powder supply unit 730, and the injection nozzle is the first pipe 610. The first spray nozzle 410 is connected to the second and the second spray nozzle 430 is connected to the second pipe 630.

Accordingly, the first powder and the second powder are simultaneously applied onto the substrate S by spraying the first powder from the first spray nozzle 410 and spraying the second powder from the second spray nozzle 430. can do. Further, after spraying the first powder from the first spray nozzle 410, and then spraying the first powder and the second powder alternately, such as spraying the second powder from the second spray nozzle 430 (substrate) ( It is also possible to successively stack different powders on S). As a result, a plurality of powder materials can be applied in various forms.

Although the first spray nozzle 410 and the second spray nozzle 430 are arranged to be perpendicular to the surface of the substrate S for convenience, they are arranged to be inclined at a predetermined angle to the surface of the substrate S as in FIG. 2. Can be.

4 is a schematic view of a powder coating apparatus according to another embodiment of the present invention, which is the same as the powder coating apparatus according to FIG. 2 except for changing the configuration of the powder supply unit, the pipe, and the injection nozzle. Therefore, like reference numerals refer to like elements, and detailed descriptions of the same elements will be omitted.

As can be seen in Figure 4, according to another embodiment of the present invention, the powder supply unit is composed of a first powder supply unit 710 for supplying the first powder and the second powder supply unit 730 for supplying the second powder The first pipe 610 is connected to the first powder supply part 710, the second pipe 630 is connected to the second powder supply part 730, and the first pipe 610 and the second pipe are connected to each other. The pipe 630 is composed of a third pipe 650 is integrated, the injection nozzle is made of one injection nozzle 400 connected to the third pipe (650).

Therefore, the first powder and the first powder is injected from the injection nozzle 400 by changing the amount of the first powder supplied from the first powder supply unit 710 and the amount of the second powder supplied from the second powder supply unit 730. By changing the content of the two powders it is possible to easily apply a mixed powder having a desired content ratio on the substrate (S). In particular, in the case of continuously changing the ratio between the amount of the first powder supplied from the first powder supply unit 710 and the amount of the second powder supplied from the second powder supply unit 730, finally the substrate (S) The mixed powder applied to can be laminated with a continuous rate change.

Although the injection nozzle 400 is shown to be arranged perpendicular to the surface of the substrate (S) for convenience, it may be arranged to be inclined at a predetermined angle on the surface of the substrate (S) as in FIG.

<Powder coating method>

Hereinafter, the powder coating method according to the present invention will be described with reference to the powder coating apparatus according to FIGS. 2 to 4. However, the powder coating method according to the present invention is not necessarily limited to using only the powder coating apparatus according to FIGS. 2 to 4.

First, a predetermined powder is supplied.

The powder may be a metal or ceramic powder having a size in the range of 0.1 ~ 10 ㎛, such powder may be supplied to the pipe 600 from the powder supply unit 700 as shown in Figure 2, in Figures 3 and 4 As described above, the first powder may be supplied from the first powder supply unit 710 to the first pipe 610 and the second powder may be supplied from the second powder supply unit 730 to the second pipe 630. The first powder and the second powder may use different materials from each other, and the amount supplied may be variously changed.

Next, gas is injected at room temperature to transport the supplied powder to a predetermined injection nozzle.

The gas is injected into the pipe 600 by the gas injection unit 500 as shown in Figures 2 to 4, the injected gas pressure is appropriately adjusted in consideration of the injection speed of the powder injected through the injection nozzle.

The injected gas may carry the powder in one route, or may deliver the powder in two or more routes. That is, the injected gas as shown in FIG. 2 may transport the powder to the injection nozzle 400 while moving along the pipe 600, and as shown in FIG. 3, the first powder moves along the first pipe 610. It may be carried to the first spray nozzle 410 and to move the second powder to the second spray nozzle 430 while moving along the second pipe 630, the first pipe 610 as shown in FIG. Third pipe 650 carrying the first powder and moving along the second pipe 630 while moving along the first pipe 610 and the second pipe 630 after transporting the second powder. While moving along, the mixed powder of the first powder and the second powder may be transported to the injection nozzle 400.

On the other hand, during the transport of the powder may be heated to a range of room temperature ~ 300 ℃, in this case, the spray rate of the powder sprayed through the injection nozzle can be set somewhat slow, the specific powder spray rate is 300 ~ 1200 Can be set in m / sec range.

In addition, the powder may be suspended in the gas during transport of the powder to filter the powder of a predetermined size or more.

Next, the transported powder is sprayed onto a predetermined substrate using a predetermined spray nozzle at room temperature and in a vacuum state.

2 to 4, the process may be performed in the chamber 100 formed in a vacuum state using the vacuum pump 200.

The process of spraying the powder on a substrate is performed at a speed of 500 to 1200 m / sec, preferably at a speed of 600 to 1200 m / sec, and the substrate may be a metal, ceramic or polymer substrate.

When the powder is sprayed on the substrate, the spraying of the powder at an inclined angle with respect to the substrate surface is easy to control the spray rate of the powder as described above. In addition, by spraying the powder on the substrate and moving the substrate at the same time, the powder can be applied to the substrate in a predetermined pattern.

In the process of spraying the powder on the substrate, as shown in FIG. 2, the powder may be sprayed onto the substrate S in one spray nozzle 400, and in the first spray nozzle 410 as in FIG. 3. In addition to spraying the first powder on the substrate (S), the second spray nozzle 430 may also spray the second powder on the substrate (S), as shown in Figure 4 in one spray nozzle 400 The mixed powder of the first powder and the second powder may be sprayed onto the substrate S.

In this case, in the case of FIG. 3, the process of spraying the first powder from the first spray nozzle 410 and the process of spraying the second powder from the second spray nozzle 430 may be performed simultaneously or alternately. have.

Experimental Example

A stainless steel (SUS), a copper (Cu) alloy, and an aluminum (Al) alloy are prepared as a metal substrate, polyethylene terephthalate (PET), and polymethyl methacrylate (PMMA) are prepared as a polymer substrate, and ceramic powder TiO ₂ (Sigma-Aldrich, St Louis, MO, USA) with a size of 5 μm or less, and Sn (Sigma-Aldrich, St.) with a size of 5 μm or less Louis, MO, USA).

In the state in which the process conditions were set as shown in Table 1 below, the ceramic powder or the metal powder was sprayed onto the respective substrates by using compressed air, and the ceramic powder was applied onto each substrate by an area of 5 mm x 5 mm.

TABLE 1

Fair factor value Gas pressure (MPa) 0.7 Nozzle Neck Diameter (㎛) 590 Injection speed (m / sec) 600 to 800 Chamber pressure (MPa) 0.02 to 0.04 Chamber temperature (℃) 15 ℃ Gas flow rate (L / min) 6 to 12 Distance between substrate and spray nozzle (mm) 1.5

Optical or SEM (Scanning Electron Microscope) images were taken to confirm the results of the application, and energy dispersive X-ray (EDX) analysis or X-ray photoelectron spectroscopy to confirm the chemical composition of the coating layer. Spectroscopy (XPS) analysis was performed.

5A is an optical image when TiO ₂ powder is coated on a stainless steel (SUS) substrate, and FIG. 5B is an SEM image when TiO ₂ powder is coated on a stainless steel (SUS) substrate, and FIG. 5C is a stainless steel ( SUS) is an EDX analysis of the graph in the case of applying the TiO ₂ powder to the substrate.

As can be seen in Figure 5a, it can be seen that the TiO ₂ powder is smoothly applied to the stainless steel (SUS) substrate, as can be seen in Figure 5b, the size of the TiO ₂ powder applied is less than 1㎛, before being applied It can be seen that it is much smaller than the size of the powder. The size of the powder is smaller than before the powder is sprayed because the particles are broken and laminated when colliding with the stainless steel (SUS) substrate. In addition, as can be seen in Figure 5c, the coating layer can be seen that the composition of the stainless steel and Ti material is bonded, from which it can be seen that the TiO ₂ powder is completely bonded to the stainless steel substrate is applied.

6A is an optical image when TiO ₂ powder is coated on an aluminum alloy substrate, and FIG. 6B is an EDX analysis graph when TiO ₂ powder is coated on an aluminum alloy substrate.

As can be seen in Figure 6a, it can be seen that the TiO ₂ powder is smoothly applied to the aluminum alloy substrate, and as shown in Figure 6b, the coating layer can be seen that the composition of the aluminum alloy substrate and Ti material is bonded. From this, it can be seen that the TiO ₂ powder is completely bonded and applied to the aluminum alloy substrate.

7A is an optical image when TiO ₂ powder is coated on a copper alloy substrate, and FIG. 7B is an EDX analysis graph when TiO ₂ powder is coated on a copper alloy substrate.

As can be seen in Figure 7a, it can be seen that the TiO ₂ powder is smoothly applied to the copper alloy substrate, and as shown in Figure 7b, the coating layer can be seen that the composition of the copper alloy substrate and Ti material is bonded. From this, it can be seen that the TiO ₂ powder is completely bonded to the copper alloy substrate and applied.

8A is an optical image when TiO ₂ powder is coated on a PET substrate, and FIG. 8B is an XPS analysis graph when TiO ₂ powder is coated on a PET substrate.

As can be seen in Figure 8a, it can be seen that the TiO ₂ powder is smoothly applied to the PET substrate, it can be seen that the TiO ₂ powder is applied to the PET substrate from the Ti peak in Figure 8b.

9A is an optical image when TiO ₂ powder is coated on a PMMA substrate, and FIG. 9B is an XPS analysis graph when TiO ₂ powder is coated on a PMMA substrate.

As can be seen in Figure 9a, it can be seen that the TiO ₂ powder is smoothly applied to the PMMA substrate, it can be seen that the TiO ₂ powder is applied to the PMMA substrate from the Ti peak in Figure 9b.

10A is an optical image when Sn powder is coated on a stainless steel substrate, and FIG. 10B is an XPS analysis graph when Sn powder is coated on a stainless steel substrate.

As can be seen in Figure 10a, it can be seen that the Sn powder is smoothly applied to the stainless steel substrate, the Sn peak is shown in Figure 10b it can be seen that the Sn powder is applied to the stainless steel substrate.

Comparative Example

Stainless steel (SUS) was prepared as a metal substrate, and TiO ₂ (Sigma-Aldrich, St Louis, MO, USA) of a size of 5 μm or less was prepared from ceramic powder. Table 1 described above. The application process was performed under the same conditions as the above-described experimental example except that the nozzle was changed from the supersonic nozzle to the subsonic nozzle (inlet 10mm X 0.4mm) and the spraying speed was set to 340 m / sec or less.

Optical images were taken to confirm the coating results, and energy dispersive X-ray (EDX) analysis was performed to confirm the chemical composition of the coating layer.

FIG. 11A is an optical image, and FIG. 11B is an EDX analysis graph. It is not clear that TiO ₂ powder is applied to a substrate as in FIG. 11A, which can be seen in FIG. 11B. That is, as can be seen in Figure 11b, the Ti material was not detected in the coating layer, from which it can be seen that TiO ₂ powder was not applied to the substrate.

1 is a schematic diagram of a conventional cold spray apparatus.

2 is a schematic diagram of a powder coating apparatus according to an embodiment of the present invention.

3 is a schematic view of a powder coating apparatus according to another embodiment of the present invention.

4 is a schematic view of a powder coating apparatus according to another embodiment of the present invention.

5A is an optical image when TiO ₂ powder is coated on a stainless steel (SUS) substrate, and FIG. 5B is an SEM image when TiO ₂ powder is coated on a stainless steel (SUS) substrate, and FIG. 5C is a stainless steel ( SUS) is an EDX analysis of the graph in the case of applying the TiO ₂ powder to the substrate.

6A is an optical image when TiO ₂ powder is coated on an aluminum substrate, and FIG. 6B is an EDX analysis graph when TiO ₂ powder is coated on an aluminum substrate.

7A is an optical image when TiO ₂ powder is coated on a copper substrate, and FIG. 7B is an EDX analysis graph when TiO ₂ powder is coated on a copper substrate.

8A is an optical image when TiO ₂ powder is coated on a PET substrate, and FIG. 8B is an XPS analysis graph when TiO ₂ powder is coated on a PET substrate.

9A is an optical image when TiO ₂ powder is coated on a PMMA substrate, and FIG. 9B is an XPS analysis graph when TiO ₂ powder is coated on a PMMA substrate.

10A is an optical image when Sn powder is coated on a stainless steel substrate, and FIG. 10B is an XPS analysis graph when Sn powder is coated on a stainless steel substrate.

FIG. 11A is an optical image according to a comparative example, and FIG. 11B is an EDX analysis graph according to a comparative example.

<Description of Signs of Major Parts of Drawing>

100: chamber 200: vacuum pump

300: substrate support 400: injection nozzle

500: gas injection unit 600: piping

700: powder supply

Claims (16)

Supplying a predetermined powder to a pipe; Injecting gas into the pipe at a room temperature to transport the powder supplied to the pipe to a predetermined injection nozzle; And And spraying the transported powder on a predetermined substrate using a predetermined spray nozzle at room temperature and in a vacuum state. At this time, the predetermined powder is in the range of 0.1 ~ 10 ㎛, the process of spraying the powder on the substrate is a method of applying the powder on a substrate, characterized in that performed at a speed of 500 ~ 1200 m / sec. The method of claim 1, The predetermined powder is made of metal or ceramic and the substrate is made of metal, ceramic, or polymer. The method of claim 1, Further comprising the step of heating the conveying powder in a room temperature ~ 300 ℃ range, wherein the process of spraying the powder on a substrate is characterized in that performed at a speed of 300 ~ 1200 m / sec. The method of claim 1, The step of transporting the powder further comprises the step of suspending the powder in a gas to filter the powder of a predetermined size or more. The method of claim 1, And spraying the powder onto a substrate comprises spraying the powder at an angle inclined with respect to the substrate surface. The method of claim 1, And spraying the substrate simultaneously with spraying the powder onto the substrate, wherein the powder is applied onto the substrate in a predetermined pattern. The method of claim 1, The process of supplying the powder consists of a process of supplying a first powder and a process of supplying a second powder, The process of conveying the powder comprises a process of conveying the first powder in a first path and a process of conveying the second powder in a second path, The step of spraying the powder on a substrate is a step of spraying the first powder transported in the first path using a first spray nozzle and a second powder nozzle is sprayed on the second powder transported in the second path. Made by spraying, In this case, the process of spraying the first powder using the first spray nozzle and the process of spraying the second powder using the second spray nozzle are performed simultaneously or alternately. The method of claim 1, The process of supplying the powder consists of a process of supplying a first powder and a process of supplying a second powder, The process of conveying the powder comprises a process of conveying the first powder in a first path, a process of conveying the second powder in a second path, and a process of mixing the first powder and the second powder, The step of spraying the powder on a substrate is made of a step of spraying the mixed first powder and the second powder using a single spray nozzle, At this time, by changing the amount of the first powder and the second powder to be supplied by changing the amount of the first powder and the second powder supplied in the process of supplying the first powder and the second powder is applied, A method characterized by varying the amount of the first powder and the second powder or continuously changing the ratio. chamber; A vacuum pump connected to the chamber to create a vacuum environment inside the chamber; A substrate support part formed in the chamber and supporting a predetermined substrate; An injection nozzle formed in the chamber and configured to spray predetermined powder on the substrate; A gas injection unit formed outside the chamber and injecting a predetermined gas; A pipe connected to each of the gas injection unit and the injection nozzle to move the gas injected from the gas injection unit to the injection nozzle; A powder supply unit connected to the pipe and supplying powder to a pipe through which the gas moves; And It is formed between the injection nozzle and the powder supply unit, the powder applying apparatus comprising a heating unit for heating the conveyed powder in the room temperature ~ 300 ℃ range. 10. The method of claim 9, The injection nozzle includes a first opening connected to the pipe, a second opening for injecting powder onto the substrate, and a nozzle neck formed between the first opening and the second opening and having a diameter of 100 μm to 3 mm. And the diameter gradually decreases from the first opening to the nozzle neck, and the diameter gradually increases from the nozzle neck to the second opening, so that powder is injected at a speed of 500 to 1200 m / sec through the injection nozzle. Powder coating device, characterized in that configured to. delete chamber; A vacuum pump connected to the chamber to create a vacuum environment inside the chamber; A substrate support part formed in the chamber and supporting a predetermined substrate; An injection nozzle formed in the chamber and configured to spray predetermined powder on the substrate; A gas injection unit formed outside the chamber and injecting a predetermined gas; A pipe connected to each of the gas injection unit and the injection nozzle to move the gas injected from the gas injection unit to the injection nozzle; A powder supply unit connected to the pipe and supplying powder to a pipe through which the gas moves; And And a filter unit formed in a pipe between the injection nozzle and the powder supply unit to filter the powder having a predetermined size or more by floating the transported powder in a gas. chamber; A vacuum pump connected to the chamber to create a vacuum environment inside the chamber; A substrate support part formed in the chamber and supporting a predetermined substrate; An injection nozzle formed in the chamber and configured to spray predetermined powder on the substrate; A gas injection unit formed outside the chamber and injecting a predetermined gas; A pipe connected to each of the gas injection unit and the injection nozzle to move the gas injected from the gas injection unit to the injection nozzle; And Is connected to the pipe, and comprises a powder supply unit for supplying powder to the pipe to which the gas moves, The spray nozzle may be configured to be inclined with respect to the substrate surface. 10. The method of claim 9, The substrate support is powder applying apparatus, characterized in that formed to be movable in the X-axis and Y-axis. chamber; A vacuum pump connected to the chamber to create a vacuum environment inside the chamber; A substrate support part formed in the chamber and supporting a predetermined substrate; An injection nozzle formed in the chamber and configured to spray predetermined powder on the substrate; A gas injection unit formed outside the chamber and injecting a predetermined gas; A pipe connected to each of the gas injection unit and the injection nozzle to move the gas injected from the gas injection unit to the injection nozzle; And Is connected to the pipe, and comprises a powder supply unit for supplying powder to the pipe to which the gas moves, The powder supply part comprises a first powder supply part for supplying a first powder and a second powder supply part for supplying a second powder, The pipe is composed of a first pipe connected to the first powder supply unit and a second pipe connected to the second powder supply unit, The spray nozzle comprises a first spray nozzle connected to the first pipe and a second spray nozzle connected to the second pipe. chamber; A vacuum pump connected to the chamber to create a vacuum environment inside the chamber; A substrate support part formed in the chamber and supporting a predetermined substrate; An injection nozzle formed in the chamber and configured to spray predetermined powder on the substrate; A gas injection unit formed outside the chamber and injecting a predetermined gas; A pipe connected to each of the gas injection unit and the injection nozzle to move the gas injected from the gas injection unit to the injection nozzle; And Is connected to the pipe, and comprises a powder supply unit for supplying powder to the pipe to which the gas moves, The powder supply part comprises a first powder supply part for supplying a first powder and a second powder supply part for supplying a second powder, The pipe may include a first pipe connected to the first powder supply part, a second pipe connected to the second powder supply part, and a third pipe integrated with the first pipe and the second pipe, The spray nozzle is a powder coating device, characterized in that connected to the third pipe.

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