KR100951320B1 - 레이저 조사에 의한 전기전도성 구리 패턴층의 형성방법 - Google Patents
레이저 조사에 의한 전기전도성 구리 패턴층의 형성방법 Download PDFInfo
- Publication number
- KR100951320B1 KR100951320B1 KR1020080022135A KR20080022135A KR100951320B1 KR 100951320 B1 KR100951320 B1 KR 100951320B1 KR 1020080022135 A KR1020080022135 A KR 1020080022135A KR 20080022135 A KR20080022135 A KR 20080022135A KR 100951320 B1 KR100951320 B1 KR 100951320B1
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- Prior art keywords
- copper
- cuprous oxide
- particles
- pattern layer
- dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010949 copper Substances 0.000 title claims abstract description 103
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 98
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims description 35
- 239000002245 particle Substances 0.000 claims abstract description 140
- 239000006185 dispersion Substances 0.000 claims abstract description 23
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 3
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 71
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 71
- 229940112669 cuprous oxide Drugs 0.000 claims description 71
- 239000004094 surface-active agent Substances 0.000 claims description 13
- 239000011882 ultra-fine particle Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 7
- 229920002401 polyacrylamide Polymers 0.000 claims description 6
- 239000002612 dispersion medium Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 230000002776 aggregation Effects 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 238000005054 agglomeration Methods 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 10
- 238000000059 patterning Methods 0.000 abstract description 10
- 239000005751 Copper oxide Substances 0.000 abstract description 9
- 229910000431 copper oxide Inorganic materials 0.000 abstract description 9
- 239000012298 atmosphere Substances 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 description 7
- -1 copper carboxyl compound Chemical class 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000005119 centrifugation Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 229930091371 Fructose Natural products 0.000 description 2
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 2
- 239000005715 Fructose Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 229960005070 ascorbic acid Drugs 0.000 description 2
- 235000010323 ascorbic acid Nutrition 0.000 description 2
- 239000011668 ascorbic acid Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012916 structural analysis Methods 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical class [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- YYOFOVLIOTYHJY-UHFFFAOYSA-N copper sulfur monoxide Chemical class O=S.[Cu] YYOFOVLIOTYHJY-UHFFFAOYSA-N 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical class [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
- Conductive Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (10)
- (스텝. 1) 평균입경이 1 내지 100 nm이고 입경에 대한 표준편차가 0 내지 10%인 다수의 산화제일구리 초미립자들이 서로 응집되어 형성된 구형(球形)의 산화제일구리 응집체 입자들로서, 상기 구형(球形)의 산화제일구리 응집체 입자들의 평균입경이 0.1 내지 10 μm이며 입경에 대한 표준편차가 0 내지 40%인 산화제일구리 응집체 입자들의 분산액을 준비하는 단계;(스텝. 2) 상기 산화제일구리 응집체 입자들의 분산액을 기재에 소정 형상으로 인쇄 또는 충전하여 패턴층을 형성하는 단계; 및(스텝. 3) 공기 중에서 상기 패턴층에 레이저를 소정 출력으로 조사하여, 상기 패턴층에 함유된 산화제일구리 응집체 입자들을 소성하면서 서로 연결시켜 전기전도성 구리 패턴으로 변화시키는 단계를 포함하는 전기전도성 구리 패턴층의 형성방법.
- 삭제
- 삭제
- 삭제
- 삭제
- 제1항에 있어서,상기 산화제일구리 응집체 입자들의 표면이 계면활성제로 피복된 것을 특징으로 하는 전기전도성 구리 패턴층의 형성방법.
- 제6항에 있어서,상기 계면활성제는 -OH, -COOH, -SH 및 -NH로 이루어진 군으로부터 선택된 어느 하나의 기능기 또는 이들 중 2종 이상의 기능기를 갖는 단분자, 폴리아크릴아미드, 폴리비닐피롤리돈 및 폴리비닐알코올로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 혼합물인 것을 특징으로 하는 전기전도성 구리 패턴층의 형성방법.
- 제7항에 있어서,상기 계면활성제는 폴리아크릴아미드인 것을 특징으로 하는 전기전도성 구리 패턴층의 형성방법.
- 제1항에 있어서,상기 산화제일구리 응집체 입자들의 분산액은 상기 산화제일구리 응집체 입자들이 분산매에 분산된 액상의 분산액 또는 상기 산화제일구리 응집체 입자들이 바인더 수지 용액에 분산된 페이스트상의 분산액인 것을 특징으로 하는 전기전도성 구리 패턴층의 형성방법.
- 삭제
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/452,812 US8394465B2 (en) | 2007-07-26 | 2008-07-24 | Preparation method of electroconductive copper patterning layer by laser irradiation |
JP2010518120A JP5449154B2 (ja) | 2007-07-26 | 2008-07-24 | レーザー照射による電気伝導性銅パターン層の形成方法 |
EP08778929A EP2183767B1 (en) | 2007-07-26 | 2008-07-24 | Preparation method of electroconductive copper patterning layer by laser irradiation |
AT08778929T ATE529886T1 (de) | 2007-07-26 | 2008-07-24 | Herstellungsverfahren für eine elektroleitfähige kupferstrukturierungsschicht durch laserbestrahlung |
PCT/KR2008/004340 WO2009014391A2 (en) | 2007-07-26 | 2008-07-24 | Preparation method of electroconductive copper patterning layer by laser irradiation |
CN2008800256237A CN101790777B (zh) | 2007-07-26 | 2008-07-24 | 通过激光照射制备导电铜图形层的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070075340 | 2007-07-26 | ||
KR1020070075340 | 2007-07-26 |
Publications (2)
Publication Number | Publication Date |
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KR20090012029A KR20090012029A (ko) | 2009-02-02 |
KR100951320B1 true KR100951320B1 (ko) | 2010-04-05 |
Family
ID=40683078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080022135A Active KR100951320B1 (ko) | 2007-07-26 | 2008-03-10 | 레이저 조사에 의한 전기전도성 구리 패턴층의 형성방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8394465B2 (ko) |
EP (1) | EP2183767B1 (ko) |
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JP2014067617A (ja) * | 2012-09-26 | 2014-04-17 | Fujifilm Corp | 導電膜の製造方法および導電膜形成用組成物 |
EP2930722B1 (en) * | 2012-12-07 | 2019-03-20 | FUJIFILM Corporation | Process for manufacturing conductive film and printed wiring board |
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JP2016516211A (ja) | 2013-02-18 | 2016-06-02 | オルボテック リミテッド | ツーステップの直接描画レーザ・メタライゼーション |
JP2014199720A (ja) * | 2013-03-29 | 2014-10-23 | 富士フイルム株式会社 | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
CN104185378A (zh) * | 2013-05-21 | 2014-12-03 | 群创光电股份有限公司 | 导电线路的制备方法、以及具有导电线路的装置 |
TWI471071B (zh) * | 2013-05-21 | 2015-01-21 | Innolux Corp | 導電線路之製備方法、以及具有導電線路之裝置 |
US10537027B2 (en) | 2013-08-02 | 2020-01-14 | Orbotech Ltd. | Method producing a conductive path on a substrate |
JP2015050107A (ja) * | 2013-09-03 | 2015-03-16 | 富士フイルム株式会社 | 導電膜の製造方法 |
US20170105287A1 (en) * | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Process of Producing Electronic Component and an Electronic Component |
US10793965B2 (en) | 2016-08-29 | 2020-10-06 | Board Of Trustees Of The University Of Arkansas | Light-directed electrochemical patterning of copper structures |
WO2018212345A1 (ja) * | 2017-05-18 | 2018-11-22 | 学校法人芝浦工業大学 | 導体の製造方法、配線基板の製造方法及び導体形成用組成物 |
TWI681872B (zh) | 2017-07-18 | 2020-01-11 | 日商旭化成股份有限公司 | 具有導電性圖案區域之構造體及其製造方法、積層體及其製造方法 |
EP3922451B1 (en) | 2017-07-27 | 2023-06-28 | Asahi Kasei Kabushiki Kaisha | Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern |
JP7430483B2 (ja) * | 2017-11-10 | 2024-02-13 | 旭化成株式会社 | 導電性パターン領域付構造体及びその製造方法 |
DE102019006709A1 (de) * | 2019-09-25 | 2021-03-25 | Heraeus Deutschland GmbH & Co. KG | Kontaktierung flexibler Elektroden |
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US20100129566A1 (en) | 2010-05-27 |
WO2009014391A2 (en) | 2009-01-29 |
CN101790777A (zh) | 2010-07-28 |
EP2183767A4 (en) | 2011-01-05 |
CN101790777B (zh) | 2012-05-02 |
EP2183767A2 (en) | 2010-05-12 |
JP5449154B2 (ja) | 2014-03-19 |
WO2009014391A3 (en) | 2009-03-19 |
EP2183767B1 (en) | 2011-10-19 |
US8394465B2 (en) | 2013-03-12 |
KR20090012029A (ko) | 2009-02-02 |
JP2010534932A (ja) | 2010-11-11 |
ATE529886T1 (de) | 2011-11-15 |
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