KR100943723B1 - Probe card - Google Patents

Abstract

A probe card is provided which improves the contact reliability of the probe with respect to the contact pad.

A probe card including a printed circuit board having a circuit pattern formed thereon includes a probe substrate including a first guide block and a second guide block positioned under the printed circuit board, and a lead portion, an elastic portion, a probe body portion, and a probe alignment. A probe comprising a portion and a probe tip portion.

Probe card, probe board, probe

Description

Probe Card {PROBE CARD}

The present invention relates to a probe card comprising a printed circuit board, and more particularly to a probe card comprising a probe aligned by a probe substrate.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

Between the fabrication process and the assembly process, an inspection process is performed in which an electrical signal is applied to the contact pads formed on the wafer to inspect the electrical properties of the wafer. This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

Hereinafter, a conventional probe card will be described with reference to FIG. 1.

1 is a cross-sectional view showing a conventional probe card.

As shown in FIG. 1, the conventional probe card 10 contacts the contact pad 31 formed on the wafer 30 seated on the wafer chuck 20 to inspect the wafer 30, and a printed circuit. And a substrate 11, a probe 12, and a probe support 13.

A circuit pattern 11a is formed on the upper surface of the printed circuit board 11, and the circuit pattern 11a is connected to the probe 12 perpendicular to the printed circuit board 11 to perform an inspection process on the probe 12. Send electrical signal for

The probe 12 is connected to the circuit pattern 11a and is in contact with the contact pad 31 by the lowering of the probe card 10 or the rise of the wafer chuck 20 to supply an electrical signal supplied from the circuit pattern 11a. Is transmitted to the contact pad 31.

Probe support portion 13 is formed with a through hole (13a) for supporting the probe 12, the through hole (13a) helps the probe 12 to move up and down stably.

Meanwhile, an oxide film 32 may be formed on the surface of the contact pad 31 formed on the wafer 30. During the inspection process, the probe 12 must contact the contact pad 31 through the oxide layer 32.

However, when the first width L 너비 of the through hole 13a and the second width L2 of the probe 12 are substantially the same, the lowering of the probe card 10 or the wafer chuck 20 during the inspection process may occur. As the probe 12 moves upward in a substantially vertical direction, the pressure applied to the probe 12 is concentrated in the vertical direction so that the probe 12 penetrates through the oxide film 32 and then the contact pad 31 This may cause damage to the wafer 30 due to the inspection process.

In order to suppress the defect of the wafer 30 as described above, when the first width L₁ of the through hole 13a is made larger than the second width L2 of the probe 12, the probe 12 during the inspection process Is in contact with the oxide film 32 and the probe 12 slides on the surface of the oxide film 32 due to the difference between the second width L2 of the probe 12 and the first width L 너비 of the through hole 13a. You lose. The pressure applied to the probe 12 is dispersed by the sliding of the probe 12 as described above, and a scrub is generated in the oxide film 32 so that the probe 12 stably contacts the contact pad 31. do.

However, when the first width L 의 of the through hole 13a is formed to be larger than the second width L ₂ of the probe 12 as described above, the position of the probe 12 aligned by the first probe support 13 is determined. In this case, an error of P is increased, whereby an inspection defect may occur due to an error of the position of the first probe 12 during the inspection process.

In recent years, as the demand for high integrated semiconductor chips increases, the semiconductor circuit patterns formed on the wafer 30 by the fabrication process become highly integrated, whereby the intervals, or pitches, between adjacent contact pads 31 are increased. (pitch) is formed very narrowly.

When inspecting the wafer 30 on which the fine pitch contact pads 31 are formed, inspection defects often occur due to the error of the position of the first probe 12 as described above.

One embodiment of the present invention is to solve the above-described problems, the contact of the probe to the contact pad having a fine pitch formed on the wafer by dispersing the pressure applied to the probe while aligning the position of the initial probe It is an object of the present invention to provide a probe card capable of improving reliability.

As a technical means for achieving the above technical problem, a first aspect of the present invention is a probe card comprising a printed circuit board having a circuit pattern, the first guide block and the first guide block located under the printed circuit board A probe substrate comprising a second guide block forming an alignment slit having a first width facing the first guide block, the second guide block comprising a recessed alignment groove of a first height having an inclined surface to be located on the inner surface of the alignment slit, and A lead portion positioned on an upper surface of the first guide block, an elastic portion extending from the lead portion and positioned on the alignment slit, and extending from the elastic portion and positioned inside the alignment slit, the first portion of the alignment slit A probe body portion having a second width smaller than the width, protruding in the direction of the alignment groove from the probe body portion For example, an inclined portion supported on the inclined surface of the alignment groove in correspondence with the inclined surface, the probe alignment portion having a second height smaller than the first height, and extending from the probe main body portion, at least a portion of the inclined surface of the alignment groove extends out of the lower surface of the probe substrate. Provided is a probe card comprising a probe comprising a probe tip exposed.

The inclined portion of the probe alignment portion may be spaced apart from the inclined surface when the probe is raised.

The elastic portion includes a semicircular elastic support portion that is bent from the lead portion onto the alignment slit and a circular elastic movement portion that is bent from the end of the elastic support portion located on the alignment slit to the probe body portion. can do.

The elastic support part may include a fixing part protruding in the direction of the second guide block, and the second guide block may further include a recessed fixing groove to which the fixing part is coupled.

The probe may further include one or more probe protrusions protruding in a horizontal direction from the probe body portion.

The probe tip portion may have a third width that is a size between the first width of the alignment slit and the second width of the probe body portion.

The first guide block may include a fixing slit formed on the upper surface of the first guide block, and at least a part of the lead portion may be mounted in the fixing slit.

The first guide block may further include a coupling groove recessed downward from the fixing slit, and the probe may further include a lead fixing portion protruding from the lead portion and positioned in the coupling groove.

The probe may further include an interface part extending from the lead part toward the printed circuit board.

The interface unit may include a spring structure.

The interface unit may be directly connected to the circuit pattern of the printed circuit board.

The apparatus may further include a first reinforcing plate positioned on the printed circuit board.

The display device may further include a second reinforcing plate positioned between the printed circuit board and the probe substrate and penetrating through the interface unit.

A space converter located between the printed circuit board and the probe substrate and including a space conversion pattern and between the space converter and the printed circuit board and located between the circuit pattern of the printed circuit board and the space converter The apparatus may further include an interposer for connecting the interface unit, and the interface unit may be electrically connected to the spatial transformation pattern.

The space conversion pattern of the space converter may be formed on an upper surface of the space converter facing the printed circuit board, and the interface unit may be connected to a space conversion pattern formed on the upper surface through the space converter.

The space converter may further include a through hole electrically connected to the space conversion pattern, and an upper end of the interface unit may contact the through hole.

The inner surface of the through hole may be coated with a conductive material.

The interface substrate may be disposed between the space converter and the probe substrate and surround the interface unit. The interface substrate may be grounded.

According to one embodiment of the above-described problem solving means of the present invention, by including the probe substrate and the probe structurally mounted and aligned on the probe substrate, by aligning the position of the original probe and at the same time to distribute the pressure applied to the probe There is an effect of improving the contact reliability of the probe with respect to a contact pad having a fine pitch formed on the wafer.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a member is located "on" or "upper" with another member, this includes not only when one member is in contact with another member but also when another member is present between the two members. . In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding other components unless otherwise stated.

Hereinafter, a probe card according to a first embodiment of the present invention will be described with reference to FIGS. 2 to 8.

2 is an exploded perspective view of a probe card according to a first embodiment of the present invention, FIG. 3 is an enlarged view of a probe and a probe substrate of the probe card according to the first embodiment of the present invention, and FIG. FIG. 5 is a perspective view illustrating a probe mounted on a probe substrate in the probe card according to the first embodiment, FIG. 5 is a cross-sectional view taken along the line VV of FIG. 2, and FIG. 6 is an enlarged view of part A of FIG. 5, and FIG. 7. 8 is a view for explaining the vertical movement of the probe with respect to the contact pad formed on the wafer in the probe card according to the first embodiment of the present invention.

As shown in FIG. 2, the probe card 1000 according to the first embodiment of the present invention may include a printed circuit board 100, a first reinforcement plate 200, a second reinforcement plate 300, and a probe substrate 400. ) And probe 500.

The printed circuit board 100 is formed in a substantially disk shape and has an upper surface and a lower surface opposing the upper surface. The probe circuit pattern (not shown) for the inspection process is formed on the upper surface. The printed circuit board 100 may be pitch-transformed through wires from the top surface to the bottom surface of the printed circuit board 100 in the printed circuit board 100 to inspect the high integrated wafer. The printed circuit board 100 may be connected to a tester for an inspection process. The first reinforcement plate 200 is mounted on the printed circuit board 100.

The first reinforcement plate 200 is positioned on the printed circuit board 100, and serves to reinforce the printed circuit board 100 from an external impact or the like. The second reinforcement plate 300 is mounted to face the first reinforcement plate 200 with the printed circuit board 100 interposed therebetween.

The second reinforcement plate 300 is positioned between the printed circuit board 100 and the probe substrate 400 to be described later. An opening 310 through which the probe 500 to be described later penetrates is formed in the center portion of the second reinforcing plate 300. The second reinforcement plate 300 serves to reinforce the probe substrate 400 from external impact. That is, the second reinforcement plate 300 suppresses its own flow of the probe substrate 400 such that the plurality of probes 500 mounted on the probe substrate 400 uniformly contact the contact pads of the wafer.

As shown in FIG. 3, the probe substrate 400 is positioned under the printed circuit board 100 with the probe 500 interposed therebetween, and is formed of an insulating material such as ceramic. The probe substrate 400 includes a first guide block 410 and a second guide block 420 facing the first guide block 410.

The first guide block 410 includes an alignment slit 411, a fixing slit 412, and a coupling groove 413.

The alignment slit 411 is formed in a groove shape on a surface facing the second guide block 420, and the first guide block 410 and the second guide block 420 contact each other to align the slit 411. The open part of) is blocked. The alignment slit 411 has a first width W '(shown in FIG. 7).

The fixing slit 412 is formed in a groove shape on the upper surface of the first guide block 410.

The coupling groove 413 is recessed downward from the fixing slit 412. The coupling groove 413 and the fixed slit 412 form a step with each other.

The second guide block 420 is positioned between the first guide block 410 facing each other.

The second guide block 420 includes an alignment groove 421 and a fixing groove 422.

The alignment groove 421 is positioned corresponding to the alignment slit 411 so as to be located on the inner surface of the alignment slit 411. The alignment groove 421 has an inclined surface 421a and is recessed to have a first height H '(shown in FIG. 7) from the second guide block 420.

The fixing groove 422 is positioned above the second guide block 420 protruding in the upper direction of the upper surface of the first guide block 410 and is recessed from the second guide block 420.

In another embodiment, the alignment slit 411 may be formed on one surface of the second guide block 420 facing the first guide block 410.

As shown in FIG. 4, the probe 500 is mounted to the first guide block 410 by the alignment slit 411, the fixing slit 412, and the fixing groove 422 of the first guide block 410. have.

As shown in FIGS. 5 and 6, the probe 500 includes a lead part 510, a lead fixing part 520, an elastic part 530, a probe body part 540, a probe alignment part 550, and a probe. And a protrusion 560, a probe tip 570, and an interface 580.

The lead part 510 is mounted in the fixed slit 412 formed on the upper surface of the first guide block 410 in a rod shape. The lead unit 510 serves to mount the probe 500 to the first guide block 410.

The lead fixing part 520 protrudes from the lead part 510 in the direction of the coupling groove 413 of the first guide block 410 and is located in the coupling groove 413. The lead fixing part 520 serves to suppress the flow of the lead part 510 mounted in the fixing slit 412.

The elastic part 530 extends from the lead part 510 and is positioned at an end of the lead part 510, and includes an elastic support part 531 and an elastic movement part 532.

The elastic support 531 extends bent in a semicircular shape from the lead portion 510 to the alignment slit 411. The elastic support part 531 supports the elastic motion of the elastic motion part 532 which will be described later. The elastic support part 531 includes a fixing part 531a protruding from the elastic support part 531 in the direction of the fixing groove 422 of the second guide block 420. The fixing part 531a is coupled to the fixing groove 422 of the second guide block 420 and serves to fix the elastic support part 531.

The elastic motion portion 532 extends bent in a circular shape from the end of the elastic support portion 531 located on the alignment slit 411 to the probe body portion 540 to be described later. A portion of the elastic movement portion 532 is located in the fixed slit 412, so that the probe body portion 540 is elastic.

The probe body portion 540 extends from the elastic movement portion 532 and is located inside the alignment slit 411. The probe body 540 has a second width W 2 (shown in FIG. 7) that is smaller than the first width W ′ (shown in FIG. 7) of the alignment slit 411.

The probe alignment unit 550 protrudes from the probe body 540 in the direction of the alignment groove 421 of the second guide block 420. The probe alignment unit 550 has an inclined portion 551 corresponding to the inclined surface 421a of the alignment groove 421, and has a second height smaller than the first height H ′ (shown in FIG. 7) of the alignment groove 421. (H 2, shown in FIG. 7). The probe alignment unit 550 is supported by the alignment groove 421 of the second guide block 420 to determine the alignment position of the probe 500.

The probe protrusion 560 protrudes from the probe body 540 in the direction of the second guide block 420. That is, the probe protrusion 560 protrudes from the probe main body 540 in the horizontal direction. The probe protrusion 560 is guided by the surface of the second guide block 420 to guide the vertical movement of the probe 500.

The probe tip part 570 extends from the probe main body part 540 and a part of the probe tip part 570 is exposed to the outside of the lower surface of the probe substrate 400. The probe tip portion 570 is a third width (W 2, shown in FIG. 7) of the first width W ′ (shown in FIG. 7) of the alignment slit 411 and the second width (W 2, shown in FIG. 7) of the probe body portion 540 ( W 3, shown in FIG. 7). The probe tip portion 570 is in contact with the contact pad formed on the wafer during the inspection process.

The interface part 580 extends from the lead part 510 or the elastic part 530 toward the printed circuit board 100. The interface unit 580 is directly connected to the probe circuit pattern formed on the printed circuit board 100 through the opening 310 of the second reinforcing plate 300 and the printed circuit board 100.

In other embodiments, the probe protrusion 560 may be formed in plural.

Hereinafter, the up and down motion of the probe with respect to the contact pad formed on the wafer in the probe card according to the first embodiment of the present invention will be described with reference to FIGS. 7 and 8.

As shown in FIG. 7, the probe of the probe card 1000 according to the first embodiment of the present invention is formed on a wafer 30 on which a contact pad 31 having an oxide film 32 is formed for an inspection process. 500) is located.

Initially, when aligning the probe 500 on the contact pad 31, the inclined portion 551 of the probe alignment portion 550 formed in the probe 500 is formed in the second guide block 420. Supported by the inclined surface 421a of the alignment groove 421, the third width W₃ of the probe tip 570 (shown in FIG. 7) is the first width W ′ of the alignment slit 411 (shown in FIG. 7). And the probe tip portion 570 is aligned at the correct position to be aligned because it has a size between the second width W 2 and the probe main body portion 540. As a result, the inspection failure due to the error of the position of the first probe 500 during the inspection process can be suppressed. In particular, when inspecting the wafer 30 on which the fine pitch contact pads 31 are formed, inspection defects due to the error of the position of the first probe 500 are suppressed as described above.

Next, as shown in FIG. 8, the probe tip portion 570 contacts the oxide film 32 of the contact pad 31 by the rising of the wafer 30 or the lowering of the probe card 1000. When is raised, the inclined portion 551 of the probe alignment portion 550 supported on the inclined surface 421a of the alignment groove 421 is spaced apart from the inclined surface 421a of the alignment groove 421 to align the groove. Will rise in the upward direction. As a result, the probe tip portion 570 is raised to a position corresponding to the alignment groove 421 so that the probe tip portion 570 is in contact with the surface of the oxide film 32 while moving in the direction of the alignment groove 421. Is slipped on the surface of the oxide film 32. The pressure applied to the probe tip 570 is dispersed by the sliding of the probe tip 570 as described above, and a scrub is generated in the oxide film 32 while the probe tip 570 stably contacts the contact pad 31. Contact with. Thereby, the damage of the contact pad 31 by the pressure concentrated in the probe tip part 570 is suppressed, and the defect of the wafer 30 by an inspection process is suppressed.

In addition, when the vertical movement of the probe 500 as described above, the pressure is applied to the elastic portion 530, the elastic portion 530 of the portion to which the pressure is applied, including the elastic support 531 and the elastic movement portion 532. Since it is widened, deformation of the elastic portion 530 due to the elastic limit that may occur due to the pressure concentrated on the elastic portion 530 is suppressed.

In addition, since the second width W 2 (shown in FIG. 7) of the probe body 540 is smaller than the first width W ′ (shown in FIG. 7) of the alignment slit 411, the probe 500 as described above. During the vertical movement, interference between the alignment slit 411 and the probe 500 is suppressed, so that deformation of the probe substrate 400 or the probe 500 itself is suppressed.

In addition, since the probe protrusion 560 guides the vertical movement of the probe 500 as described above by the surface of the second guide block 420 inside the alignment slit 411 of the probe substrate 400, the probe It is suppressed that the probe 500 moves in an unintended direction during the vertical movement of the 500.

As described above, the probe card 1000 according to the first embodiment of the present invention has improved contact reliability of the probe 500 with respect to the contact pad.

Hereinafter, a probe card according to a second embodiment of the present invention will be described with reference to FIGS. 9 and 10.

9 is an exploded perspective view of a probe card according to a second embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along the line VIII-VIII in FIG. 9.

Hereinafter, only the characteristic parts distinguished from the first embodiment will be described and described, and the descriptions thereof will be omitted according to the first embodiment. In addition, in the second embodiment of the present invention, for the convenience of description, the same components will be described using the same reference numerals.

9 and 10, the probe card 2000 according to the second embodiment of the present invention may include a printed circuit board 100, a first reinforcement plate 200, a second reinforcement plate 300, and a probe. Substrate 400, probe 500, spatial transducer 600, and interposer 700.

The space converter 600 is positioned between the printed circuit board 100 and the second reinforcement plate 300, and has a through hole 610 penetrating through the space conversion pattern (not shown) and the space converter 600 formed for pitch conversion. ) Is included. The space conversion pattern (not shown) is formed on an upper surface of the space converter 600 facing the printed circuit board 100, and the interface portion 580 of the probe 500 may have an opening ( 310 and a through hole 610 of the space converter 600 are directly connected to a space conversion pattern (not shown).

One end of the interposer 700 is connected to a probe circuit pattern (not shown) of the printed circuit board 100, and the other end thereof is connected to a space conversion pattern of the space converter 600. The interposer 700 transmits an electrical signal that passes through a probe circuit pattern (not shown) of the printed circuit board 100 to a space conversion pattern (not shown) of the space converter 600 for the inspection process.

Since the probe card 2000 according to the second embodiment of the present invention includes the space transducer 600 for performing the pitch conversion, the contact with the fine pitch is smaller than the probe card 1000 according to the first embodiment. It is desirable to inspect the pads formed high integration wafer.

Hereinafter, a probe card according to a third embodiment of the present invention will be described with reference to FIGS. 11 and 12.

11 is an exploded perspective view of a probe card according to a third embodiment of the present invention, and FIG. 12 is a cross-sectional view taken along the line II-XIII of FIG.

Hereinafter, only characteristic parts distinguished from the first embodiment and the second embodiment will be described and described, and the descriptions thereof will be omitted according to the first embodiment and the second embodiment. In addition, in the third embodiment of the present invention, for the convenience of description, the same components will be described using the same reference numerals.

As illustrated in FIGS. 11 and 12, the probe card 3000 according to the third embodiment of the present invention may include a printed circuit board 100, a first reinforcement plate 200, a second reinforcement plate 300, and a probe. The substrate 400 includes a probe 500, a space converter 600, an interposer 700, and an interface substrate 800.

A conductive material is coated in the through hole 610 of the space converter 600, and the conductive material is connected to a space conversion pattern (not shown) of the space converter 600.

The interface substrate 800 is positioned between the space converter 600 and the probe substrate 400 and is located in the opening 310 formed in the second reinforcement plate 300. The ground board 810 is formed at a position corresponding to the through hole 610 of the space converter 600 on the interface board 800, and the inner surface of the ground hole 810 performs a function such as electromagnetic shielding or grounding. The conductive material is coated.

The interface unit 580 of the probe 500 includes a spring structure 581 and is inserted into the through hole 610 of the space converter 600 through the ground hole 810 of the interface substrate 800. . The interface unit 580 is connected to a space conversion pattern (not shown) of the space converter 600 through a conductive material coated in the through hole 610 of the space converter 600. The spring structure 581 is a structure having elasticity such as a coiled spring or a plate spring, and an end portion of the interface portion 580 elastically coated on the inner surface of the through hole 610 of the space transducer 600. Make contact.

In the probe card 3000 according to the third embodiment of the present invention as described above, the interface part 580 of the probe 500 elastically contacts the inside of the through hole 610 of the space transducer 600. Since it is connected to the space conversion pattern (not shown) through 610, it is necessary to connect the end of the interface unit 580 to the space conversion pattern of the space converter 600 using a soldering method in manufacturing the probe card 3000. none. As a result, the method of manufacturing the probe card 3000 is simplified, and the interface unit 580 of the probe 500 is moved by the impact that may be applied to the probe card 3000 itself during the inspection process. Disconnection between the probe 500 and the space transducer 600, which are generated while being spaced apart from the space transformation pattern (not shown), is suppressed.

In addition, since the interface unit 580 of the probe 500 penetrates through the ground hole 810 of the interface substrate 800 coated with a conductive material that performs a function such as electromagnetic shielding or grounding, the probe 500 during the inspection process. Interference due to electromagnetic waves generated by electrical signals transmitted to the contact pads through the interface unit 580 of the N-axis is suppressed. Thereby, the inspection error by the electromagnetic wave which generate | occur | produces in the probe 500 of the probe card 3000 at the inspection process is suppressed.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 is a cross-sectional view showing a conventional probe card,

2 is an exploded perspective view of a probe card according to a first embodiment of the present invention;

3 is an enlarged view of a probe and a probe substrate of the probe card according to the first embodiment of the present invention,

4 is a perspective view illustrating a probe mounted on a probe substrate in the probe card according to the first embodiment of the present invention;

5 is a cross-sectional view taken along the line VV of FIG. 2,

6 is an enlarged view of a portion A of FIG. 5,

7 and 8 are views for explaining the vertical movement of the probe with respect to the contact pad formed on the wafer in the probe card according to the first embodiment of the present invention,

9 is an exploded perspective view of a probe card according to a second embodiment of the present invention;

10 is a cross-sectional view taken along the line VIII-VIII in FIG. 9,

11 is an exploded perspective view of a probe card according to a third embodiment of the present invention;

12 is a cross-sectional view taken along the line II-XIII of FIG. 11.

Claims (18)

A probe card comprising a printed circuit board having a circuit pattern formed thereon, A first guide block located under the printed circuit board; A second guide block forming an alignment slit having a first width facing the first guide block, the second guide block including a recessed alignment groove of a first height having an inclined surface to be located on the inner surface of the alignment slit Probe substrate comprising a A lead part positioned on an upper surface of the first guide block, An elastic portion extending from the lead portion and positioned on the alignment slit, A probe body portion extending from the elastic portion and positioned inside the alignment slit and having a second width smaller than the first width of the alignment slit, A probe alignment portion protruding from the probe body in the direction of the alignment groove and having an inclination portion supported on the inclined surface of the alignment groove corresponding to the inclined surface and having a second height smaller than the first height; A probe tip part extending from the probe main body part and at least partially exposed to the outside of the bottom surface of the probe substrate Probe comprising Probe card comprising a. The method of claim 1, The inclined portion of the probe alignment portion, And a probe card spaced apart from the inclined surface when the probe is raised. The method of claim 1, The elastic portion, A semicircular elastic support portion that is bent and extended from the lead portion to the alignment slit; A circular elastic movement portion that is bent and extends from an end of the elastic support portion located on the alignment slit to the probe body portion Probe card comprising a. The method of claim 3, wherein The elastic support portion includes a fixing portion protruding in the direction of the second guide block, The second guide block further comprises a recessed fixing groove to which the fixing portion is coupled. The method of claim 1, The probe, And at least one probe protrusion protruding in a horizontal direction from the probe body. The method of claim 1, And the probe tip portion has a third width that is a size between the first width of the alignment slit and the second width of the probe body portion. The method of claim 1, The first guide block, A fixing slit formed on the upper surface of the first guide block, At least a portion of the lid portion is mounted in the fixing slit. The method of claim 7, wherein The first guide block, Further comprising a coupling groove recessed downward from the fixing slit, The probe, And a lead fixing part protruding from the lead part and positioned in the coupling groove. The method of claim 1, The probe, The probe card further comprises an interface portion extending from the lead portion toward the printed circuit board. The method of claim 9, The interface unit, A probe card comprising a spring structure. The method of claim 9, And the interface portion is directly connected with the circuit pattern of the printed circuit board. The method of claim 9, And a first reinforcement plate positioned on the printed circuit board. The method of claim 9, Located between the printed circuit board and the probe substrate, And a second reinforcing plate penetrating the interface unit. The method of claim 9, A space converter positioned between the printed circuit board and the probe substrate and including a space conversion pattern; Located between the space converter and the printed circuit board, further comprising an interposer connecting the circuit pattern of the printed circuit board and the space conversion pattern of the space converter, And the interface portion is electrically connected to the space conversion pattern. The method of claim 14, The space conversion pattern of the space converter is formed on an upper surface of the space converter facing the printed circuit board, And the interface unit is connected to the space conversion pattern formed on the upper surface through the space converter. The method of claim 14, The space transducer further includes a through hole electrically connected to the space transformation pattern. And the upper end of the interface portion is in contact with the through hole. The method of claim 16. And an inner surface of the through hole is coated with a conductive material. The method of claim 14, An interface substrate positioned between the space transducer and the probe substrate and surrounding the interface unit; And the interface substrate is grounded.

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