KR100939933B1 - Lift pin assembly and substrate processing apparatus having the same - Google Patents

Abstract

The substrate processing apparatus of the present invention comprises a process chamber; First and second susceptors spaced apart from each other in the process chamber and having a plurality of pin holes; A first pin support member having a plurality of lift pins respectively corresponding to the pin holes of the first susceptor; A second pin support member having a plurality of lift pins respectively corresponding to the pin holes of the second susceptor; A driving member for raising or lowering the first and second pin supporting members in a vertical direction; And first and second guide members for guiding vertical movement of the first and second pin support members. According to the present invention, the substrate can be loaded and unloaded from the first and second susceptors simultaneously and stably.

Description

Lift pin assembly and substrate processing apparatus having the same {APPARATUS FOR TREATING SUBSTRATES}

1 is an external view of a substrate processing apparatus according to a preferred embodiment of the present invention.

2 is a front sectional view of a substrate processing apparatus according to a preferred embodiment of the present invention.

3 is a plan view illustrating an interior of a process chamber in a substrate processing apparatus according to a preferred embodiment of the present invention.

4 is a plan view illustrating first and second pin support members of a lift pin assembly positioned inside a process chamber in a substrate processing apparatus according to a preferred embodiment of the present invention.

5 is an exploded perspective view of the lift pin assembly.

<Description of Symbols for Major Parts of Drawings>

100: process chamber

130: gas supply member

140: plasma generating member

150: exhaust member

160: partition member

200: lift pin assembly

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a lift pin assembly used for loading / unloading a substrate into a susceptor and a substrate processing apparatus having the same.

Generally, a semiconductor device is manufactured by repeatedly performing a plurality of processes on a substrate. For example, a process of depositing a material film such as an insulating film or a conductor film on a substrate, a process of patterning the deposited material film into a shape necessary for device formation, and a process of removing residues formed on the substrate through the entire process, and the substrate However, there is a step of injecting predetermined impurities into the material film.

In order to proceed with these processes, a substrate is loaded into a substrate susceptor installed in a process chamber that performs each process to perform a necessary process, and when the process is completed, the substrate is unloaded to the outside to move for the next process. Repeat as necessary.

In order to smoothly manufacture the semiconductor device, it is important not to damage the substrate on which the process is performed. To this end, in each process chamber, the substrate must be reliably seated on the substrate susceptor. For this purpose, a robot arm for transferring the substrate onto the substrate susceptor and a lift pin assembly for seating the substrate on the substrate susceptor are used.

The lift pin assembly lifts the lift pins by the driving unit, and when the vibration occurs, the positional deviation of the substrate may occur.

The present invention provides a lift pin assembly and a substrate processing apparatus having the same that can provide smooth vertical movement of lift pins.

The present invention is to provide a lift pin assembly and a substrate processing apparatus having the same that can prevent the vibration generated during vertical movement of the lift pins.

SUMMARY OF THE INVENTION The present invention provides a lift pin assembly capable of simultaneously and stably loading and unloading a substrate from a plurality of susceptors disposed in the same chamber, and a substrate processing apparatus having the same.

According to a feature of the present invention for achieving the above object, the lift pin assembly comprises a drive member; A horizontal bar that rises and falls in a vertical direction by the driving member; At least one pin support member provided with lift pins and moving in a vertical direction according to the rising / falling of the horizontal bar; And guide member for guiding the movement of the pin support member.

According to an embodiment of the present invention, the lift pin assembly mutually crosses the pin support member and the horizontal bar to allow an angle difference between the moving direction of the pin support member moved by the guide member and the moving direction of the horizontal band. It further comprises a floating joint for connecting.

According to an embodiment of the present invention, the pin support member includes a first pin support member and a second pin support member which are symmetrically supported at both ends of the horizontal bar.

According to an embodiment of the present invention, the pin support member has the lift pins vertically installed, one end of the horseshoe-shaped lift hoop open; A shaft connected to the lift hoop; And a bracket to which the shaft is fixed and connected to the guide member.

A substrate processing apparatus for achieving the above object includes a process chamber; First and second susceptors spaced apart from each other in the process chamber and having a plurality of pin holes; A first pin support member having a plurality of lift pins respectively corresponding to the pin holes of the first susceptor; A second pin support member having a plurality of lift pins respectively corresponding to the pin holes of the second susceptor; A driving member for raising or lowering the first and second pin supporting members in a vertical direction; And first and second guide members for guiding vertical movement of the first and second pin support members.

According to an embodiment of the present invention, the substrate processing apparatus has the first pin support member is supported at one end, the second pin support member is supported at the other end, the center is connected to the drive member in the horizontal rising or falling Includes more units.

According to an embodiment of the present invention, the first and second pins for moving the first and second pin support member moving by, and the first and second pins to allow the angle difference between the moving direction of the horizontal band The support member and the horizontal stand are interconnected by floating joints, respectively.

According to an exemplary embodiment of the present invention, each of the first and second pin supporting members may include a horseshoe-shaped lift hoop having vertically installed lift pins inserted into the pin holes and an open end thereof; A shaft connected to the lift hoop and installed through the process chamber; And a bracket connected to the first and second guide members fixed to a lower end of the shaft exposed outward from the process chamber and fixed to an outer bottom surface of the process chamber.

A substrate processing apparatus for achieving the above object includes a process chamber; First and second susceptors spaced apart from each other in the process chamber and having a plurality of pin holes; A lift pin assembly for loading / unloading a substrate into / from said first and second susceptors; The lift pin assembly may include a driving member installed at an outer bottom surface of the process chamber; A horizontal bar that rises and falls in a vertical direction by the driving member; A lift hoop in which the lift pins positioned in the pin holes are vertically installed, a shaft supporting the lift hoop and installed through the outer bottom of the process chamber, and a bracket to which the shaft is fixed, on both ends of the horizontal stand. First and second pin support members respectively supported; And first and second guide members installed on an outer bottom surface of the process chamber and configured to guide the lifting and lowering of the first and second pin supporting members.

According to an embodiment of the present invention, the lift pin assembly is installed between the bracket of the first and second pin support members and the horizontal bar to support the first and second pins moved by the first and second guide members. And a floating joint for allowing an angle difference between the moving direction of the member and the moving direction of the horizontal band.

According to an embodiment of the present invention, the process chamber partitions the inside of the process chamber such that the first space in which the first susceptor is located and the second space in which the second susceptor is located are symmetrical. It further comprises a partition wall.

According to an embodiment of the present invention, the substrate processing apparatus is provided in an upper portion of the first space of the process chamber, the first supply member for supplying a plasma (plasma) and the process gas to the first space, and It is installed in the upper portion of the second space of the process chamber, and further comprises a second supply member for injecting the plasma (plasma) and the process gas to the second space.

Hereinafter, a substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

The invention is not limited to the embodiments described herein but may be embodied in other forms. The embodiments introduced herein are provided to make the disclosed contents thorough and complete, and to fully convey the spirit and features of the present invention to those skilled in the art. In the drawings, each device is schematically shown for clarity of the invention. Each device may also be equipped with a variety of additional devices not described in detail herein. Like reference numerals denote like elements throughout the specification.

(Example)

In the present embodiment, a plasma ashing apparatus for removing unnecessary photoresist remaining on a substrate after a photographic process using plasma is described as an example. However, the technical idea of the present invention is not limited thereto, and the present invention may be applied to other types of devices for processing semiconductor substrates using plasma or other types of devices for processing semiconductor substrates using process gases.

In addition, in the present exemplary embodiment, microwaves are described as an energy source for generating plasma, but various energy sources such as a high frequency power source may be used.

1 to 5, a substrate processing apparatus 100 according to an embodiment of the present invention uses a radical generated in a plasma source unit to semiconductor a surface of a semiconductor device manufacturing substrate (hereinafter referred to as a substrate). It is a manufacturing apparatus.

1 to 4, the substrate processing apparatus 10 may include a process chamber 100, a first and second susceptors 110a and 110b, and an exhaust member 150 that provide a predetermined closed atmosphere. ), A partition member 160, a plasma generating member 140, a gas supply member 130 having first and second gas distribution plates 170a and 170b, and a lift pin assembly 200.

The process chamber 100 provides a process space therein for performing an ashing process. The process chamber 100 has a structure capable of simultaneously processing two substrates. That is, the process space of the process chamber 100 is partitioned into a first space a and a second space b. Each of the first space (a) and the second space (b) is a space in which an ashing process is performed on a single substrate accommodated in the process. One side wall of the process chamber 100 is formed with a substrate entrance and exit 102 through which substrates enter and exit from the first space a and the second space b, respectively. The substrate entrance 102 is opened and closed by an opening / closing door 104 such as a gate valve.

2 and 3, the lower wall (bottom) of the process chamber 100 is provided with a central exhaust port 116 and a side exhaust port 117 through which gas in the process chamber 100 is exhausted. The central exhaust port 116 is located between the first space a and the second space b to exhaust gas in the first and second spaces a and b, and the side exhaust port 117 is the susceptor 110a. One center is positioned in each of the first and second spaces a and b which are symmetrical with respect to the central exhaust port 116. In the present embodiment, the process chamber 110 having two spaces a and b has been described as an example, but three or more partition spaces in the process chamber 100 may be provided.

The first and second susceptors 110a and 110b supporting the substrate during the process are respectively installed in the first space a and the second space b of the process chamber 100. Electrode chucks may be used as the first and second susceptors 110a and 110b. In addition, the first and second susceptors 110a and 110b seat the substrate W during the process and heat the substrate to a predetermined process temperature. The first and second susceptors 110a and 110b are maintained at an appropriate temperature (200-400 ° C.) at which the photoresist on the substrate w can be removed. The first and second susceptors 110a and 110b have pin holes 112 in which lift pins are located. Power applicators (not shown) are connected to the first and second susceptors 110a and 110b. The power applicator applies preset bias power to the first and second susceptors 110a and 110b.

The exhaust member 150 is to form the inside of the process chamber 100 in a vacuum state, and to discharge reaction by-products and the like generated during the ashing process.

The exhaust member 150 includes a central exhaust pipe 152, a side exhaust pipe 154, and a pressure reducing member (not shown). The central exhaust pipe 152 exhausts the gas inside the process chamber 110 to the outside. The central exhaust pipe 152 is connected to the central exhaust port 116 of the process chamber 100 to exhaust all the gases in the first and second spaces a and b. The side exhaust pipes 154 are connected to the side exhaust ports 117, respectively, and the side exhaust pipes 154 are connected to the central exhaust pipes 152. The pressure reducing member (not shown) is installed in the central exhaust pipe 154. The pressure reducing member forcibly sucks gas in the first and second spaces a and b to reduce the pressure inside the process chamber 100. A vacuum pump may be used as the pressure reducing member.

The partition member 160 includes a partition wall 162 partitioning the inside of the process chamber 110 to have a space structure in which the first space a and the second space b are symmetrical. The partition wall 162 is vertically installed vertically in the center of the process chamber 110. In this case, the partition wall 162 partitions the inside of the process chamber 110 such that each of the first space a and the second space b is symmetrical. The partition member 160 is provided for separate exhaust of the first space a and the second space b. In addition, in the partition member 160, the power applied to the first susceptor 110a in the first space a and the power applied to the second susceptor 110b in the second space b are not affected by each other. The first space (a) and the second space (b) are partitioned so as not to. Therefore, the material of the partition member 160 is preferably an insulator.

In this embodiment, the partition member 160 is provided with an integral partition wall 162 to partition the process chamber 100 as an example, but the structure, shape, and installation of the partition member are variously changed and modified. Can be. For example, the partition member 160 may have a structure in which the partition walls 162 may be separated from each other, and the partition walls 162 may be formed in plural. Alternatively, the partition wall 162 of the partition member 160 may be fixedly installed in the process chamber 110.

The plasma generating member 140 generates plasma during the process and supplies the plasma to the process chamber 100. A remote plasma generating apparatus is used as the plasma generating member 140. The plasma generating member 140 includes a first generating member 142 and a second generating member 144. The first generating member 142 supplies the plasma to the first supply member 132 during the process, and the second generating member 144 supplies the plasma to the second supply member 134 during the process. Each of the first and second generating members 142 and 144 may include a magnetron 142a and 144a, a wave guide line 142b and 144b, and a gas supply line 142c and 144c. Include. The magnetrons 142a and 144a generate microwaves for plasma generation during the process. The waveguide 142b guides the microwaves generated in the magnetron 142a to the gas supply pipe 142c, and the waveguide 144b guides the microwaves generated in the magnetron 144a to each gas supply pipe 144c. The gas supply pipes 142c and 144c supply reaction gases during the process. At this time, plasma is generated from the reaction gas supplied through the gas supply pipes 142c and 144c by the microwaves generated by the magnetrons 142a and 144b. The plasma generated by the plasma generating member 140 is supplied to the gas supply member 130 during the ashing process.

The first supply member 132 and the second supply member 134 of the gas supply member 130 are connected to the first space a and the second space b of the process chamber 110 during the process. Inject process gas. The first supply member 132 is installed in the upper portion of the first space (a) of the process chamber 100, the cover 136a for providing a funnel-shaped flow path connected to the first generating member 142, and the cover ( 136a) has a first gas distribution plate (GDP) 170a installed to face the substrate w. The second supply member 134 is installed in an upper portion of the second space b of the process chamber 100, and includes a cover 136b that provides a funnel-shaped flow path connected to the second generating member 144, and a cover ( 136b) has first and second gas distribution plates 170a and 170b disposed to face the substrate w.

The first supply member 132 injects plasma and process gas toward the substrate W seated on the first susceptor 110a in the first space a during the process, and the second supply member 134 processes the process. Plasma and process gas are sprayed toward the substrate W mounted on the second susceptors 110a and 110b in the second space b.

In particular, the first and second gas distribution plates 170a and 170b may be formed in an asymmetrical manner so that the density of the process gas and the plasma provided to the first and second spaces a and b is uniformly formed. It may have (172a, 172b). Specifically, the first and second gas distribution plates 170a and 170b may include a first edge portion in which gas injection passages 172a having the same size are formed, and a gas injection adjacent to the substrate entrance 112 and formed at the first edge portion. Gas injection passages 172b that are relatively larger than the flow passages 172a have asymmetric gas injection passages 172a and 172b that can be divided into second edge portions formed.

5 is an exploded perspective view of the lift pin assembly.

5 and 2, the lift pin assembly 200 has a configuration for stably raising / lowering a substrate from the first susceptor 110a and the second susceptor 110b. The lift pin assembly 200 includes a drive member 210, a horizontal stand 220, and first and second pin support members 230a and 230b. The first and second guide members 240a and 240b and the floating joint 250 are included. Lift pin assembly 200 of the present invention is a device that can up / down the substrate from two susceptors with one drive member.

The driving member 210 is installed on the outer bottom surface of the process chamber 100. The driving member 210 may be an actuator such as a linear motor or a cylinder. The horizontal stand 220 is connected to the driving member 210, and is moved up and down in the vertical direction by the driving member 210. The horizontal stage 220 is formed in an elongated rod shape. The first pin support member 230a and the second pin support member 230b are respectively installed at both ends of the horizontal bar 220. The first and second pin support members 230a and 230b are connected to and supported by the horizontal arm 220 by the floating joint 250.

The first pin support member 230a is responsible for substrate loading / unloading in the first susceptor 110a, and the second pin support member 230b is substrate loading / unloading in the second susceptor 110b. In charge of. The first and second pin support members 230a and 230b support a lift hoop 234 in which three lift pins 232 positioned in the pin holes 112 are vertically installed, and a lift hoop 234. And a shaft 236 installed through the outer bottom surface of the chamber 100, a bellows 238 installed at the bottom of the shaft 236, and a bracket 239 to which the shaft 236 is fixed. The bracket 239 is connected to the floating joint 250 at the bottom and one side thereof is connected to the first and second guide members 240. The lift hoop 234 is formed in a horseshoe shape of which one end is open, but the shape may be variously changed.

The floating joint 250 is installed between the bracket 239 and the horizontal stand 220 of the first and second pin support members 230a and 230b to be moved by the first and second guide members 240. The angle difference between the moving direction of the pin support members 230a and 230b and the moving direction of the horizontal arm 220 is allowed to provide stable vertical movement of the first and second pin support members 230a and 230b. In particular, the floating joint 250 removes the linear motion disturbances of the first and second pin support members 230a and 230b caused by the horizontal plate 220 being displaced or the position error due to a machining error. . In other words, the lift pin assembly 200 is mechanically connected such that the driving member 210 disposed at the center and the first and second guide members 240 disposed at both sides simultaneously perform linear movement. Therefore, the moving direction of the horizontal stage 220 moved by the driving member 210, the horizontal state of the horizontal stage 220, the first and second pin support members guided by the first and second guide members 240 ( Although the moving direction of the 230a and 230b is not set correctly during the assembling process, the floating joint 250 guides the movement direction of the first and second pin supporting members 230a and 230b in a vertical straight direction to generate an angular shift. Vibration can be prevented.

The first and second guide members 240 guide the movement of the first and second pin support members 230a and 230b and are installed on the outer bottom surface of the process chamber 100.

The lift pin assembly 200 is driven by the drive member 210 in a state in which the lift pins 232 support the bottom surface of the substrate w which is placed by the robot (not shown) in accordance with the opening of the substrate entrance 102. It is lowered (down-positioned) to stably place the substrate on the first and second susceptors 110a and 110b.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described in detail above, the present invention enables smooth vertical movement of the lift pins. In addition, the present invention can prevent the vibration generated when the vertical movement of the lift pins. In addition, the present invention can simultaneously and stably load and unload a substrate from a plurality of susceptors disposed in the same chamber.

Claims (12)

delete delete delete delete delete delete delete delete In the substrate processing apparatus: Process chambers; First and second susceptors spaced apart from each other in the process chamber and having a plurality of pin holes; A lift pin assembly for loading / unloading a substrate into / from said first and second susceptors; The lift pin assembly A drive member installed on an outer bottom surface of the process chamber; A horizontal bar that rises and falls in a vertical direction by the driving member; A lift hoop in which the lift pins positioned in the pin holes are vertically installed, a shaft supporting the lift hoop and installed through the outer bottom of the process chamber, and a bracket to which the shaft is fixed, on both ends of the horizontal stand. First and second pin support members respectively supported; First and second guide members installed on an outer bottom surface of the process chamber and configured to guide the lifting / lowering of the first and second pin supporting members; And An angle between a moving direction of the first and second pin supporting members which is installed between the bracket of the first and second pin supporting members and the horizontal stand and moved by the first and second guide members, and an angle between the moving directions of the horizontal pins Substrate processing apparatus comprising a floating joint for allowing a difference. delete The method of claim 9, The process chamber And a partition wall partitioning the inside of the process chamber so that the first space in which the first susceptor is located and the second space in which the second susceptor is located are symmetrical. Device. The method of claim 11, The substrate processing apparatus A first supply member installed in an upper portion of a first space of the process chamber and injecting a plasma and a process gas into the first space; And a second supply member disposed above the second space of the process chamber and configured to spray plasma and process gas into the second space.

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