KR100914745B1 - Valve and apparatus for treating substrate with the valve - Google Patents

Abstract

The present invention relates to a valve and an apparatus for treating the substrate having the same. The valve according to the present invention is to open and close the line through which the processing liquid flows using an electrically driven motor, the plate for opening and closing the passage through which the processing liquid flows in the valve at a high speed due to the pressing pressure by the pressure member such as a spring Open and close the passage. The valve according to the present invention performs a more stable and precise flow rate control of the processing liquid than the air driven valve.

Description

VALVE AND APPARATUS FOR TREATING SUBSTRATE WITH THE VALVE}

The present invention relates to a valve and an apparatus for treating the substrate having the same.

Typical substrate processing apparatuses are apparatuses for processing substrates such as wafers for semiconductor integrated circuit chip manufacturing and glass substrates for flat panel display manufacturing. Among the substrate processing apparatuses, the apparatus for processing the substrate using the processing liquid is provided with a valve for adjusting the flow rate of the processing liquid in the line through which the processing liquid flows. For example, the coating apparatus for applying a photoresist on a substrate is provided on a line through which the photoresist flows and is provided with a valve for adjusting the flow rate of the photoresist. In the coating process apparatus for applying the photosensitive liquid to the semiconductor substrate surface, a predetermined amount of the photosensitive liquid must be applied to the substrate surface during the process. Therefore, the valve must perform stable opening and closing of the photosensitive liquid supply line and precisely adjusting the flow rate of the photosensitive liquid so that the photosensitive liquid supply line can stably supply a certain amount of the photosensitive liquid during the process.

However, a general valve is difficult to precisely control the discharge amount of the photosensitive liquid. For example, a valve operated in an air driven manner has a high frequency of valve malfunction due to an error in air supply. In addition, as the valve operated by the air driving method is changed in the speed of opening and closing the line as the opening and closing operation is repeated, the phenomenon that the supply amount of the photosensitive liquid is changed.

The present invention provides a valve and a substrate processing apparatus having the same for precisely controlling the flow rate of the processing liquid.

The present invention provides a valve for stably adjusting the flow rate and a substrate processing apparatus having the same.

The valve according to the present invention for achieving the above object includes a valve body in which a fluid flow passage is formed therein and an opening and closing member provided in the valve body to open and close the passage, wherein the opening and closing member moves up and down. A first plate, one surface of which is opposite to the first plate, the second plate of which the other surface is provided to open and close the passage, one end of which is coupled to the first plate, and the other end of which is coupled to the second plate, And a spring provided to pressurize the second plate from the first plate, and a first driving unit driving the first plate up and down.

According to an embodiment of the present invention, the first driving unit is an electrically driven motor.

According to an embodiment of the present invention, the valve further comprises a suction member for applying a suction force to the processing liquid in the passage on the basis of the point, the suction member for sucking a predetermined amount of the processing liquid, the suction member is provided in the passage The diaphragm is installed in the second driving unit for moving the diaphragm along the suction port.

According to an embodiment of the invention, the valve further comprises a cooling member for cooling the first drive and the second drive.

A substrate processing apparatus according to the present invention for achieving the above object is a chuck supporting a substrate, a nozzle for injecting the photosensitive liquid to the processing surface of the substrate placed on the chuck, a processing liquid supply line for supplying the photosensitive liquid to the nozzle, and the It is provided on the processing liquid supply line, including a valve for adjusting the flow rate of the photosensitive liquid in the processing liquid supply line, the valve is provided in the valve body and the valve body in which a fluid flow passage is formed inside the passage And an opening and closing member for opening and closing the first and second members, wherein the opening and closing member includes a first plate which is moved up and down, one side of which faces the first plate, and a second plate of which the other side is provided to open and close the passage. And a second end coupled with the second plate and provided to press the second plate from the first plate. A pring and a first drive unit for driving the first plate up and down.

According to an embodiment of the present invention, the first driving unit is an electrically driven motor.

According to an embodiment of the invention, the valve further comprises a suction member for applying a suction force to the processing liquid in the second passage on the basis of the point, the suction member to suck a predetermined amount of the processing liquid, the suction member is provided in the passage And a second driving part for moving the diaphragm along the suction port.

According to an embodiment of the invention, the valve further comprises a cooling member for cooling the first drive and the second drive.

According to an exemplary embodiment of the present disclosure, the substrate processing apparatus further includes a controller configured to determine operating states of the first and second drive motors, and a display configured to display a result determined by the controller.

The present invention improves the opening and closing speed of the line through which the treatment liquid flows, thereby precisely controlling the flow rate of the treatment liquid.

The present invention performs a flow rate control stably by performing the opening and closing of the line through which the processing liquid flows using an electrically driven motor.

1 is a view showing a substrate processing apparatus according to the present invention.

2 is a view showing the valve shown in FIG.

FIG. 3 is an enlarged view of region A shown in FIG. 2.

4 is a flowchart showing a substrate processing method according to the present invention.

5a to 5d are views for explaining the opening and closing process of the valve according to the present invention.

* Description of symbols on the main parts of the drawings *

1: substrate processing apparatus 100: valve

10: process unit 110: valve body

12 container 120 opening member

14: spin chuck 122, 124: first and second plate

16 driver 126 pressure member

20: processing liquid supply unit 128: plate driver

22: treatment liquid supply line 130: suction member

24: treatment liquid supply source 140: cooling member

26: nozzle

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the present invention to those skilled in the art will fully convey. Portions denoted by like reference numerals denote like elements throughout the specification.

In addition, the present embodiment has been described with an apparatus for performing a coating process for applying a photosensitive liquid to the surface of the semiconductor substrate as an example, the invention can be applied to any apparatus having a process to perform a process.

(Example)

1 is a view showing a substrate processing apparatus according to the present invention, Figure 2 is a view showing a valve shown in FIG. 3 is an enlarged view of region A illustrated in FIG. 2.

Referring to FIG. 1, an apparatus for treating substrate 1 according to the present invention includes a process unit 10, a treating-liquid supply unit 20, and a controller. 30, and a display member 40.

The process unit 10 performs a process of processing a semiconductor substrate (hereinafter referred to as "wafer") W with a predetermined treatment liquid, and the treatment liquid supply unit 20 supplies the treatment liquid to the process unit 10. . Here, the substrate treatment process may be a coat process for applying a photoresist to the surface of the wafer (W).

The process unit 10 includes a bowl 12, a spin chuck 14, and a driving part 16. The container 12 provides a space therein for performing an application process. The container 12 has a cup shape with an open top. The open upper part of the container 12 is used as a passage for the wafer W to enter and exit the interior of the container 12 during the process.

The spin chuck 14 supports the wafer W inside the container 12 during the application process. The spin chuck 14 is lifted up and down to adjust the height of the wafer W in the container 12. In addition, the spin chuck 14 may be provided with vacuum fixing means for adsorbing the surface to be processed of the wafer W by vacuum.

The driver 16 drives the spin chuck 14 so that the spin chuck 14 rotates and lifts. That is, the driver 16 rotates the spin chuck 14 to rotate the wafer W placed on the spin chuck 14 at a predetermined rotational speed during the process. In addition, the driver 16 moves the spin chuck 14 up and down to adjust the height of the wafer W placed on the spin chuck 14 during the process.

The treatment liquid supply unit 20 includes a treatment liquid supply line 22, a treatment liquid supply source 24, a nozzle 26, and a valve 100. ). The treatment liquid supply line 22 supplies the treatment liquid from the treatment liquid supply source 24 to the nozzle 26. In this case, the treatment liquid may be a photoresist. The treatment liquid supply source 24 stores the treatment liquid. The nozzle 26 receives the processing liquid from the processing liquid supply line 22 during the process and injects the processing liquid to the processing surface of the wafer W placed on the spin chuck 14. The valve 100 is installed on the treatment liquid supply line 22 to adjust the flow rate of the treatment liquid in the treatment liquid supply line 22.

The controller 30 controls the actuator 16 and the valve 100. That is, the control part 30 controls the driver 16 and controls the application | coating process of the wafer W. FIG. In addition, the controller 30 controls the flow rate control of the valve 100. In addition, the display unit 40 displays the control process and malfunction of the valve 100 to the outside so that an operator can recognize it.

Subsequently, the configurations of the valve 100 according to the present invention will be described in detail.

Referring to FIG. 2, the valve 100 opens and closes the processing liquid supply line 22 and sucks a predetermined amount of the processing liquid into the processing liquid supply line 22. For example, the valve 100 may be a suction valve.

The valve 100 includes a valve body 110, an open / close member 120, a suction member 130, and a cooling member 140. .

The valve body 110 provides a space for providing the components of the valve therein. The valve body 110 is installed on the treatment liquid supply line 22. The valve body 110 is provided with a passage 112 through which a processing liquid flows. One end of the passage 112 is provided with an inlet 112a through which the treatment liquid flows from the treatment liquid supply line 22, and the other end of the passage 112 has an outlet through which the treatment liquid flows out into the treatment liquid supply line 22. 112b) is provided. In addition, between the inlet 112a and the outlet 112b of the passage 112, the opening 112c for opening / closing the passage 112 and the suction port 112d for suction of the treatment liquid in the passage 112. ) Is provided. The opening and closing port 112c is provided closer to the inlet 112a than the outlet 112b, and the inlet 112d is provided between the opening and closing port 112c and the outlet 112b.

The opening and closing member 120 opens and closes the passage 112. The opening and closing member 120 may include a first plate 122, a second plate 124, a pressurization member 126, and a plate driving part 128. Include.

The first and second plates 122 and 124 are arranged to be spaced apart from each other within the housing 110. The first and second plates 122 and 124 are disposed up and down. The first plate 122 is coupled to the plate driver 128, and the second plate 124 is installed to be movable up and down from the first plate 122 on the first plate 122.

The pressing member 126 presses the second plate 124 so that pressure is applied in a direction away from the first plate 122. For example, the pressing member 126 is provided as a spring installed between the first plate 122 and the second plate 124. In this embodiment, the case in which the spring is used as the pressing member 126 has been described as an example, but various configurations may be used as the pressing member 126.

The plate driver 128 drives the first and second plates 122 and 124 so that the first and second plates 122 and 124 are operated up and down. The plate driver 128 includes a first driving member 128a and a first shaft 128b. The first driver 128a is an electrically driven motor. One end of the first shaft 128b is coupled to the first driving unit (hereinafter, 'first drive motor') 128a, and the other end of the first shaft 128b is coupled to the first plate 122. Therefore, the first plate 122 is directly driven by the first drive motor 128, the second plate 124 is moved away from or close to the first plate 122 in accordance with the operation of the first plate 122. It is operated to lose.

The suction member 130 sucks a predetermined amount of the processing liquid in the passage 112. The suction member 130 has a diaphragm 132 and a diaphragm driving part 134. The diaphragm 132 is provided at the inlet 112d of the passage 112. The diaphragm 132 is installed to be in close contact with the suction port 112d and to be movable up and down. Therefore, when the diaphragm 132 is raised along the passage 112, the processing liquid in the passage 112 is applied to the suction force, so that a predetermined amount of the processing liquid in the passage 112 is sucked along the suction port 112d. Let's go in.

The diaphragm driver 134 causes the diaphragm 132 to be raised so that a predetermined amount of processing liquid in the passage 112 is sucked into or discharged from the inlet 112d. The diaphragm driver 134 includes a second driving member 134a and a shaft 134b. The second driving unit (hereinafter referred to as 'second driving motor') 134a is an electrically driven motor. One end of the shaft 134b is coupled to the driving motor 134a, and the other end of the shaft 134b is coupled to the diaphragm 132. In the present exemplary embodiment, the diaphragm driver 134 including the electrically operated second driving motor 134a is driven to drive the diaphragm 132 as an example. However, the diaphragm driver is air. The diaphragm 132 may be driven by a driving method by supplying of.

The cooling member 140 cools the first and second drive motors 128a and 134a. The cooling member 140 has a cooling fluid circulation line. The cooling fluid circulation line includes a supply line 142 and a recovery line 144. The cooling fluid circulation line allows the cooling fluid to flow in an area adjacent to the first and second driving motors 128a and 134a so that the temperature of the first and second driving motors 128a and 134a maintains a constant temperature. . Cooling gas may be used as the cooling fluid. Alternatively, a cooling liquid may be used as the cooling fluid.

Hereinafter, the process of the substrate processing apparatus according to the present invention described above with reference to FIG. 4 will be described in detail. 4 is a flowchart showing a substrate processing method according to the present invention. 5A to 5D are views for explaining the opening and closing process of the valve according to the present invention.

When the process is started, the wafer W is loaded on the spin chuck 14 (S110). When the wafer W is loaded on the spin chuck 14, the driver 16 drives the spin chuck 14 to rotate the wafer W at a predetermined rotational speed. Then, the valve 100 opens the processing liquid supply line 22, and the processing liquid supply line 22 supplies the processing liquid from the processing liquid supply source 24 to the nozzle 26 (S120). When a predetermined amount of processing liquid is discharged through the nozzle 26 to the center region of the processing surface of the wafer W, the valve 100 sucks a predetermined amount of processing liquid in the processing liquid supply line 22 (S130). When a predetermined amount of the processing liquid in the passage 112 is sucked, the processing liquid remaining around the discharge port of the nozzle 126 is sucked into the nozzle 126 to prevent the processing liquid from remaining around the discharge port of the nozzle 126. .

Meanwhile, the processing liquid supplied to the center region of the wafer W is moved evenly from the center region to the edge region by the centrifugal force of the wafer W, and is evenly applied to the wafer W processing surface (S140). When the application of the processing liquid is completed, the driver 16 stops the rotation of the spin chuck 14, and the robot arm (not shown) unloads the wafer W from the spin chuck 14 ( S150).

The process of closing the processing liquid supply line 22 by the valve 100 in the process of performing the substrate processing described above is as follows. When the supply of the treatment liquid is started, as shown in FIG. 5A, the valve 100 opens the treatment liquid supply line 22 and supplies a predetermined amount of the treatment liquid to the nozzle 126. After the supply of the treatment liquid is completed, the valve 100 seals the treatment liquid supply line 22. When the sealing of the processing liquid supply line 22 is started, the first driving motor 128a drives the first plate 122 to move downward. When the first plate 122 is momentarily driven downward, the plate 124 is moved downward at a speed faster than the moving speed of the first plate 122 to close the opening 112c. That is, when the first drive motor 128a drives the first plate 122 downward, as shown in FIGS. 5B and 5C, the pressure member 126 presses the second plate 124. As a result, the second plate 124 protrudes from the first plate 122 to close the opening and closing port 112c. Thereafter, referring to FIG. 5D, the first plate 122 moves downward, and the pressing member 126 presses the second plate 124 so that the second plate 124 more effectively opens and closes ( Seal 112c).

When the sealing of the processing liquid supply line 22 is completed, the second driving motor 134a moves the diaphragm 132 upward, and sucks a predetermined amount of the processing liquid in the passage 112 through the suction port 112d. Let's do it. The driving state of the first and second driving motors 128a and 134a for the opening and closing operation of the valve 100 and the suction of the processing liquid is detected by the controller 30 and then displayed by the display unit 40 so that an operator can recognize them. Is displayed.

The valve 100 according to the present invention described above effectively regulates the flow rate of the processing liquid in the line for supplying the processing liquid during the process. In particular, when the valve 100 opens and closes a line through which the processing liquid flows using an electrically driven motor, the opening and closing speed of the second plate 124 opening and closing the opening and closing port 112c by the pressing member 126 is opened. It can be improved, to compensate for the disadvantage that the opening and closing speed of the opening and closing port (112c) is slow compared to the air-driven valve, reducing the frequency of malfunction of the valve of the air-driven valve.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

Claims (9)

A valve body in which a fluid flow passage is formed, Includes an opening and closing member provided in the valve body for opening and closing the passage, The opening and closing member, A first plate moved up and down, A second plate having one surface facing the first plate and the other surface provided to open and close the passage; A spring having one end coupled with the first plate and the other end coupled with the second plate and provided to press the second plate from the first plate, and And a first drive unit for driving the first plate up and down. The method of claim 1, The first driving unit, A valve, characterized in that the motor is electrically driven. The method of claim 2, The valve, Further comprising a suction member for applying a suction force to the processing liquid in the passage, the suction member for sucking a predetermined amount of the processing liquid, The suction member, A diaphragm installed at a suction port provided in the passage; And a second drive unit for moving the diaphragm along the suction port. The method of claim 3, wherein The valve, The valve further comprises a cooling member for cooling the first drive and the second drive. In the apparatus for processing a substrate, A chuck supporting the substrate, A nozzle for injecting a photosensitive liquid into the processing surface of the substrate placed on the chuck; A processing liquid supply line for supplying a photosensitive liquid to the nozzle, and Is installed on the processing liquid supply line, including a valve for adjusting the flow rate of the photosensitive liquid in the processing liquid supply line, The valve, A valve body in which a fluid flow passage is formed, It is provided inside the valve body and includes an opening and closing member for opening and closing the passage, The opening and closing member, A first plate moved up and down, A second plate having one surface facing the first plate and the other surface provided to open and close the passage; A spring having one end coupled with the first plate and the other end coupled with the second plate and provided to press the second plate from the first plate, and And a first driving part for driving the first plate up and down. The method of claim 5, wherein The first driving unit, A substrate processing apparatus, characterized in that the motor is electrically driven. The method of claim 6, The valve, Further comprising a suction member for applying a suction force to the processing liquid in the second passage, the suction member for sucking a predetermined amount of the processing liquid, The suction member, A diaphragm installed at a suction port provided in the passage; And a second driver for moving the diaphragm along the suction port. The method of claim 7, wherein The valve, And a cooling member for cooling the first driving unit and the second driving unit. The method of claim 7, wherein The substrate processing apparatus, A controller for determining an operation state of the first driver and the second driver; And a display unit for displaying a result determined by the controller.