KR100910667B1 - Method For Making A Water Block For Water Cooling System - Google Patents

Abstract

The present invention relates to a water block manufacturing method for a water-cooled device that can be produced at a low cost through a simple manufacturing process of the fine channel water block.

The present invention comprises the steps of sheet metal cutting a copper plate or an aluminum plate to produce a plurality of pins; Stacking the plurality of pins to have a constant stacking shape by a predetermined height; Brazing the stacked plurality of pins to produce a pin assembly having a microchannel plate and a junction plate; Manufacturing a cover by press molding and manufacturing a cover part by connecting an inlet port to the cover; Milling the microchannel plate and junction plate of the pin assembly into a desired shape that fits into the interior space of the cover; And inserting the microchannel plate of the fin assembly into the cover, and manufacturing the water block having the microchannel therein by brazing the bonding plate of the cover and the pin assembly to produce a water block. Provide a method.

According to the present invention, the process is simple, can be mass-produced, can be manufactured at low cost, and can have a competitive price compared to other products. Lose.

Description

Method for making microchannel water block for computer water cooling {Method For Making A Water Block For Water Cooling System}

The present invention relates to a method of manufacturing a water block used in a water-cooled system of a computer, and more particularly, it is mounted on a heat source of an electronic device such as a computer to exhibit excellent heat transfer performance, thereby greatly improving the cooling efficiency of the electronic device. The present invention relates to a method for manufacturing a micro-channel water block for water-cooling cooling, which can produce a water channel of a fine channel capable of improving electronic device performance at a low cost through a simple manufacturing process.

Computers typically used for home or industrial use are made up of a combination of numerous semiconductors and other peripherals, and a cooling system that uses a conventional circulation system such as a fan to dissipate heat generated by the operation of these components to the outside. This is being applied.

In particular, components that generate relatively high heat, such as CPUs, graphics cards, and power supplies, have a cooling device that is a combination of a heat sink and a fan. Other parts may be equipped with a cooling device such as a heat sink.

In such a conventional computer cooling system, in order to remove heat generated from the CPU of the computer, it is common to attach a fin to a heat pipe to remove heat of the CPU with a fan. However, as the computer's high performance increases, CPU heat is greatly increased, and accordingly, there is a limit to removing heat of the CPU by only a heat pipe. In order to solve this problem, recently, water-cooled computer cooling systems using water have been developed and marketed.

The water-cooled computer cooling system 200 currently marketed includes a water block 210, a pump 215, and a reservoir tank that contact the heat source 205, as shown in FIG. 1. Reservoir tank 220, a radiator (225), a fan (Fan) 230 and the pipe 235 and the like.

In particular, the water block 210 has the greatest impact on performance in the conventional water-cooled computer cooling system 200. The conventional water block 210 is manufactured by forging or machining, and a coolant flows therein, and the outer surface of the water block 210 contacts the heat source 205, for example, a CPU, so that the high heat of the heat source 205 is obtained. Most of the structure that absorbs the cooling water.

Such a conventional water block 210 is manufactured using a forging or casting process in terms of low production cost. However, the forging or casting process is difficult to precisely dimension, so there is a limit in improving performance. In order to solve this problem, a fine channel water block has recently emerged as an alternative, and the manufacturing method of the fine channel water block includes a process such as micro milling and micro EDM (Electrodischarge Machining). However, these processes cannot be mass-produced, have limitations in increasing the width and height of the microchannels, and are very expensive.

The present invention is to solve the conventional problems as described above, the object is to provide a water block manufacturing method for a water-cooled device that can be mass-produced, can be manufactured at a low cost and have a competitive price.

And another object of the present invention is to be mounted on the heat source of an electronic device such as a computer due to the internal micro-channels to exhibit excellent heat transfer performance can greatly improve the cooling efficiency of the water-cooled system, thereby improving the performance of the electronic device It is an advantage to provide a water block manufacturing method for a water-cooled device that can greatly increase the market share of the water-cooled system.

In order to achieve the above object, the present invention, in the manufacturing method of the water block used in the water-cooled system,

Manufacturing a plurality of pins by cutting the copper sheet or the aluminum sheet;

Stacking the plurality of pins to have a constant stacking shape by a predetermined height;

Brazing the stacked plurality of pins to produce a pin assembly having a microchannel plate and a junction plate;

Manufacturing a cover by press molding and manufacturing a cover part by connecting an inlet port to the cover;

Milling the microchannel plate and junction plate of the pin assembly into a desired shape that fits into the interior space of the cover; And

Inserting the microchannel plate of the fin assembly into the inside of the cover, and brazing the bonding plate of the cover and the pin assembly to produce a water block having a microchannel therein; Provides a water block manufacturing method.

And the present invention preferably provides a method for manufacturing a water block for a water-cooled device, characterized in that the fin is made of a thick channel plate and a thickness of the microchannel plate of a predetermined thickness on the lower side of the microchannel plate.

In addition, the present invention preferably has a pin on the lower side of the square pin-fin plate and the square pin-fin plate having a plurality of square pin-fin protrusions. Provided is a water block manufacturing method for a water-cooled device, characterized in that it is made of a thick laminated plate.

And the present invention preferably provides a water block manufacturing method for a water-cooled device, characterized in that the fin is formed by press punching processing or etching to form a matrix arranged side by side in two rows.

In another aspect, the present invention preferably provides a method of manufacturing a water block for a water-cooled device, characterized in that the pins are laminated while maintaining the alignment state of each corner coinciding with each other using a jig.

And the present invention preferably provides a water block manufacturing method for a water-cooled device, characterized in that the pin is laminated while maintaining the alignment state each corner is arranged in a zigzag using a jig.

In another aspect, the present invention preferably provides a method for producing a water block for a water-cooled device, characterized in that the pin is made of brazing bonding in the bonding plate while securing the flow path of the fine channel plate using a jig.

In another aspect, the present invention preferably provides a method for producing a water block for a water-cooled device, characterized in that the fin is joined to the microchannel plate side by side to form a flow path between the microchannel plate.

And the present invention preferably the pin is a square pin-pin (Pin-Pin) plate side by side bonding between the square pin-Pin (Pin-Fin) plate, and are arranged parallel to each other -Fin) Provides a water block manufacturing method for a water-cooled device, characterized in that the flow path is formed between the projections.

In addition, the present invention is preferably the pin is a square pin-fin (Pin) disposed between the square pin-fin plate by zigzag bonded to a square pin-fin plate, and zigzag with each other -Fin) Provides a water block manufacturing method for a water-cooled device, characterized in that the flow path is formed between the projections.

And the present invention is preferably the fine channel is formed between the channel width of 0.1mm ~ 2.0mm, the aspect ratio (channel depth / channel width) is water for water-cooled device, characterized in that it has a range of 1.0 to 100.0. Provides a block manufacturing method.

According to the water block manufacturing method of the water-cooled apparatus of the present invention, the copper sheet or aluminum sheet is cut into a sheet metal, laminated and brazed, and a water block having a fine channel is formed by enclosing the lid and the process is simple. It is possible to manufacture at low cost, and thus, the effect of having a price competitiveness over other products is obtained.

Further, according to the present invention, since the fine channel formed inside the water block has excellent heat transfer capability from the heat source, the cooling efficiency of the water-cooled system is greatly improved, and thus, the performance of the electronic device can be improved.

In this case, the efficiency of the water-cooled system applied to an electronic device such as a computer is greatly improved, and thus, a useful effect of greatly increasing the market share can be obtained.

1 is a block diagram showing a water cooling device for a computer according to a conventional structure;

Figure 2a) is an explanatory diagram showing a process of manufacturing the fin of the microchannel plate using a copper plate or an aluminum plate according to the present invention, b) is a process of producing a fin of the microchannel plate in the form of a matrix of two rows Explanatory diagram shown;

Figure 3a is a side view showing the process of laminating the pins of the microchannel plate according to the present invention, b) is a perspective view showing the process of laminating the pins of the microchannel plate according to the present invention;

Figure 4 a) is a side view showing a process of manufacturing a pin assembly by brazing bonding the pins of the microchannel plate according to the present invention, b) is a pin assembly by brazing bonding the pins of the microchannel plate according to the present invention A perspective view showing a process of making;

Figure 5a is a perspective view showing a structure having an inlet port and an outlet port in the center of both sides of the cover according to the present invention, b) is a structure having an inlet port and an outlet port at both corners of the cover according to the present invention A perspective view of the;

Figure 6a) is a perspective view showing the pin assembly of the microchannel plate made in accordance with the present invention, b) is a plan view showing various shapes of the pin assembly of the microchannel plate made in accordance with the present invention;

7 is a perspective view showing a water block for a water-cooled device manufactured according to the present invention;

8A is an explanatory diagram showing a process of manufacturing a pin of a square pin-fin plate using a copper plate or an aluminum plate according to the present invention, and b) a square pin- in a matrix form of two rows. Explanatory drawing which shows the process of manufacturing the pin of a pin-fin board;

Fig. 9A is a side view showing a process of laminating pins of a square pin-fin plate according to the present invention, and b) is a pin of a square pin-fin plate according to the present invention. A perspective view illustrating a process of laminating a film;

FIG. 10A is a side view illustrating a process of manufacturing a pin assembly by brazing a pin of a square pin-fin plate according to the present invention, and b) is a square pin-pin according to the present invention. -Fin) a perspective view illustrating a process of manufacturing a pin assembly by brazing a pin of a plate;

Figure 11 a) is a perspective view showing the pin assembly of the square pin-fin plate made in accordance with the present invention, b) is a perspective view of the square pin-fin plate made in accordance with the present invention. A plan view showing various shapes of the pin assembly;

Fig. 12A is a side view showing a process of laminating a pin of a square Pin-Fin plate in a zigzag shape according to the present invention, and b) is a Square Pin-Fin according to the present invention. A perspective view showing a step of laminating a pin of a plate in a zigzag shape;

Figure 13 a) is a side view showing a process of fabricating a pin assembly by zigzag brazing the pins of the square pin-fin plate in accordance with the present invention, b) is a square pin- in accordance with the present invention A perspective view showing a process of fabricating a pin assembly by brazing a pin of a pin-pin plate in a zigzag shape;

Figure 14 a) is a perspective view showing the pin assembly of the square pin-fin plate made in a zigzag form according to the present invention, b) is a square pin-pin (zig) made in a zigzag form according to the present invention Pin-Fin) This is a plan view showing various shapes of the pin assembly of the plate.

<Description of Symbols for Major Parts of Drawings>

1 ..... Water blocks made according to the invention

10,50 .... pin 12 .... fine channel plate

14 .... bonding plate 16 .... copper plate or aluminum plate

18a, 18b ... press member 20 .... connecting member

30,70 .... pin assembly 32,60 .... fine channel

40 .... cover part 42 .... cover

44a, 44b .... inlet port 46 .... lower edge

52 .... Square Pin-Fin Protrusion 54 .... Square Pin-Fin Plate

56 .... Junction 200 .... Conventional Water-cooled Computer Cooling System

205 ... heat source 210 ... Water Block

215 .... Pump 220 .... Reservoir tank

225 .... Radiator 230 .... Fan

235 .... Plumbing

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

The water block 1 manufactured by the method for manufacturing a water block for a water-cooled device according to the present invention uses a material of copper or aluminum, and has a rectangular micro channel, a square or zig-zag pin- 핀 micro channel therein. -fin micro channel).

In the method for manufacturing a water block for a water-cooled device according to the present invention, as shown in FIG. 2, a step of manufacturing a plurality of fins 10 is performed by cutting a copper plate or an aluminum plate 16.

The pin 10 is made to have a predetermined thickness of the fine channel plate 12 and a thick bonding plate 14 on the lower side of the fine channel plate 12, which is fixed to the copper plate or aluminum plate 16 After cutting the sheet metal to size, as shown in Fig. 2a), the pins 10 are placed side by side in two rows as shown in Fig. 2b by placing them between the upper and lower press members 18a and 18b and pressing them at high pressure. It is processed to form the placed matrix.

The pin 10 is formed such that the thickness and length of the junction plate 14 is greater than the thickness and length of the fine channel plate 12, the junction plate 14 is subsequently laminated through such a structure When brazed, the shape deformation of the pins 10 due to high heat is effectively prevented.

The plurality of pins 10 manufactured in a matrix form arranged side by side in two rows are each manufactured in a single plate shape through the connecting members 20, and the pins 30 are cut and stacked to assemble the pin assembly 30. .

As described above, when the pins 10 are arranged in two rows in a matrix form, that is, a structure of 2 x X (number of sheets), it is easy to handle the work and can process several pins 10 at once. It can increase.

Meanwhile, the present invention may be manufactured through an etching process using a chemical corrosion solution instead of a press punching operation in the fin 10 processing as described above.

The pin fabrication process through etching may be performed in a similar manner as used in the process of fabricating a PCB substrate, and thus a detailed description thereof will be omitted.

In the present invention, as shown in FIG. 3, as shown in FIG. 3, the plurality of pins 10 are stacked to have a predetermined height by a predetermined height. As described above, the stacking of the pins 10 is performed by using a jig (not shown) to keep the edges aligned with each other.

That is, when the fine channel plate 12 and the bonding plate 14 of the plurality of fins 10 are stacked in a row, a fine channel 32 flow path is formed between the fine channel plates 12.

As described above, in the lamination process, the jig (not shown) is positioned inside the flow path of the microchannel 32 formed between the fins 10, and the outer jig is wrapped around the fins 10 and fixed from the outside. (Not shown) can be used to align accurately.

In the present invention, a step of manufacturing the fin assembly 30 having the fine channel plate 12 and the bonding plate 14 is performed by brazing the plurality of stacked pins 10.

In this case, the stacked plurality of fins 10 are brazed at the bonding plate 14, in which case, the fins 10 are formed using a jig (not shown) to form the fine channel plate 12. ) To secure a flow path, and to fix the outside of the pin with a jig (not shown) to prevent heat deformation as much as possible, the brazing bonding is performed on the joining plate 14, and thus is manufactured as shown in FIG. 6.

Thus, the plurality of fins 10 brazed integrally with each other through the bonding plate 14 form a microchannel 32 having a rectangular flow path between the microchannel plates 12 and into the pin assembly 30. Is produced.

In the above, the fine channel 32 has a channel width of 0.1 mm to 2.0 mm, and an aspect ratio (channel depth / channel width) is in the range of 1.0 to 100.0.

The fine channel 32 is difficult to produce when the width is less than 0.1mm, the width is more than 2.0mm is difficult to achieve the desired performance in the present invention, the width of the fine channel 32 is preferably between 0.1mm ~ 2.0mm The aspect ratio (channel depth / channel width) is also practically convenient to manufacture in the range of 1.0 to 100.0, and the desired heat transfer performance can be obtained.

Next, in the present invention, the cover 42 is manufactured by press die processing, and the inlet port 44a and 44b are connected to the cover 42 to produce the cover part 40.

The manufacturing of the cover part 40 is made separately from the pin assembly 30, as shown in FIG. 5, wherein the cover part 40 is bent by pressing die processing of a copper plate or an aluminum plate to cover the cover 42. ), The joints are brazed, and the inlet and outlet ports 44a and 44b are connected to each other to complete the joints. Therefore, the cover part 40 has a space formed therein, and as the space, as described later, the microchannel 32 of the pin assembly 30 is located.

In the present invention, the microchannel plate 12 and the bonding plate 14 of the pin assembly 30 are milled into a desired shape to fit the inner space of the cover 42.

In this case, the fine channel plate 12 of the pin assembly 30 is processed to a size that is inserted into the inner space of the cover portion 40, the bonding plate 14 is the lower edge ( 46) is sized to abut.

As shown in FIG. 6, the microchannel 32 inserted into the cover part 40 is variously formed toward the inlet port 44a and the outlet port 44b of the water block. The water block 1 of the microchannel 32 fabricated in accordance with the present invention has a high heat transfer performance, but may increase the internal pressure of the coolant flow pressure, thereby imparting pressure on the pump 215. Therefore, in order to solve the problem that the load in the pump 215 is increased, it may have the shape of the fine channel plate 12 and the fine channel 32 in various forms such as rectangular, parallel slope type, milling processing in such a form Can be.

The present invention inserts the microchannel plate 12 of the pin assembly 30 into the inside of the cover 42, and brazes the junction plate 14 of the cover 42 and the pin assembly 30 to the inside. Producing a water block 1 having a fine channel 32. As shown in FIG. 7, the bottom edge 46 of the cover 42 and the bonding plate 14 of the pin assembly 30 are brazed to form the water block 1.

The water block 1 of the microchannel 32 manufactured through the above process is mounted on a heat source of an electronic device such as a computer, and when cooling water is supplied from the pump 215, between the microchannel plates 12 formed therein. Cooling water flows through the rectangular flow paths.

In this process, the water block 1 transfers the heat of the heat source to the coolant, and the microchannel 32 formed of the rectangular flow path has a high heat transfer area, thereby realizing a heat transfer performance with high heat transfer capability to the coolant. .

Meanwhile, the present invention may have a structure of a square pin-fin instead of the fine channel plate 12 of the fin 10.

That is, as shown in FIG. 8, the pin 50 has a square pin-fin plate 54 and the square pin- having a plurality of square pin-fin protrusions 52. It may be a structure that is made of a thick bonding plate 56 on the lower side of the (Pin-Fin) plate 54.

In such a case, the square Pin-Fin plate 54 and the joining plate 56 of the pin 50 may be formed by press punching or etching to form a matrix arranged side by side in two rows. . Since the process of the fin 50 may be manufactured through a press punching process or an etching process as described with reference to FIGS. 2a) and b), a detailed description thereof will be omitted.

In addition, each of the pins manufactured as described above is aligned as shown in FIG. 9 such that the corners of the square pin-fin plate 54 and the bonding plate 56 are stacked while keeping the same state.

As shown in FIG. 10 using a jig (not shown), the pin 50 is formed in the joining plate 56 in a state in which a flow path of the square pin-fin plate 54 is secured. A brazing joint is made, and as shown in FIG. 11, a microchannel made of a pin assembly 70 and then made of a square pin-fin plate 54 in various shapes such as rectangular, parallelepiped, and the like. 60 is milled to have a shape.

Since the pin assembly 70 milled as described above is a structure in which the square pin-fin plate 54 of the pin 50 is joined side by side, the square pin-fin plate 54 is formed. ) And the fine channel 60 is formed between the square pin-fin protrusions 52 arranged in parallel with each other. In this case, the fine channel 60 has a channel width of 0.1 mm to 2.0 mm, as described in relation to the fine channel plate 12, and an aspect ratio (channel depth / channel width) is 1.0 to 100.0. It is to have a range.

The structure of the microchannel 60 of the square pin-fin plate 54 is more turbulent in the cooling water flowing through the inside of the microchannel 32 in the rectangular flow path between the microchannel plates 12. The flow is applied to further improve the cooling performance from the heat source 205 of the electronic device.

In the pin assembly 70 as described above, a square pin-fin plate 54 is inserted into the cover 42 of the cover part 40 manufactured through the process as shown in FIG. 5. A water block having a fine channel 60 of a square pin-fin plate 54 by brazing the bottom edge 46 of the lid 42 and the junction plate 56 of the pin assembly 70. (1) is to produce.

The water block 1 is also mounted on a heat source 205 of an electronic device such as a computer, and when cooling water is supplied from the pump 215, parallel to the square pin-fin plate 54 formed therein. Cooling water flows through the microchannels 60 between the aligned protrusions 52.

In this process, the water block 1 may transfer heat from the heat source 205 to the coolant, and the microchannel 60 may have a high heat transfer area, thereby realizing a heat transfer performance with high heat transfer capability to the coolant.

And the present invention is a pin 50 is made of a square pin-pin (Pin-Fin) structure, using a jig (not shown) may have a structure consisting of an alignment state in which each corner is arranged in a zigzag. have.

That is, as shown in FIG. 8, the pin 50 has a square pin-fin plate 54 and the square pin- having a plurality of square pin-fin protrusions 52. After being made of thick bonded plate 56 on the lower side of the Pin-Fin plate 54, each of these fins 50 is bonded with a square Pin-Fin plate 54. The corners of the plate 56 are aligned as shown in FIG. 12 so that the edges of the plate 56 are stacked while being staggered from each other.

The pin 10 also has a square pin-fin having a plurality of square pin-fin protrusions 52 as shown in FIG. 13 using a jig (not shown). Brazing bonding is made in the joining plate 56 while securing the flow path of the plate 54, and is made of the pin assembly 70, and then, as shown in Figure 14, in various forms such as rectangular, parallel slope type It is milled to have the shape of a square pin-fin plate 54 and a fine channel 60.

Since the pin assembly 70 milled as described above is a structure in which the protrusions 52 of the square pin-fin plate 54 of the pin 50 are arranged in a zigzag manner and joined together, the square pin-pin ( The flow path is formed between the Pin-Fin plate 54 and between the square Pin-Fin protrusions 52 which are arranged in a staggered manner with each other.

The fine channel 60 also has a channel width between 0.1 mm and 2.0 mm, as described in relation to the fine channel plate 12, and the aspect ratio (channel depth / channel width) is in the range of 1.0 to 100.0. To have.

Such a structure of the flow path is such that turbulent flow is further given to the cooling water flowing through the inside thereof, thereby improving the cooling performance from the heat source 205 of the electronic device.

In the pin assembly 70 as described above, a square pin-fin plate 54 is inserted into the cover 42 of the cover part 40 manufactured through the process as shown in FIG. 5. Brazing the bottom edge 46 of the lid 42 and the joining plate 56 of the pin assembly 70 to form a square pin-fin plate 54 in which the protrusions 52 are zigzag-shifted. Is to produce a water block (1) having a fine channel (60).

The water block 1 is also mounted on a heat source 205 of an electronic device such as a computer, and when cooling water is supplied from the pump 215, the water block 1 is displaced from the square pin-fin plate 54 formed therein. Cooling water flows through the flow path between the aligned protrusions 52.

In this process, the water block 1 may transfer heat from the heat source 205 to the coolant, and the microchannel 32 may have a high heat transfer area, thereby realizing a heat transfer performance with high heat transfer capability to the coolant.

According to the water block manufacturing method for a water-cooled device of the present invention as described above, a water block 1 having a fine channel by cutting a sheet metal, laminating them by brazing, and enclosing the cover 40 with a fine channel 1 ), So the process is very simple.

Therefore, according to the method for manufacturing a water block for a water-cooled device of the present invention, the mass production of the water block 1 is possible, and the production of the water block can be performed at a low cost, and thus, it may have an excellent price competitiveness compared to other products.

In addition, according to the present invention, since the fine channel formed inside the water block 1 has excellent heat transfer capability from the heat source 205, the cooling efficiency of the water-cooled system can be greatly improved, and thus the performance of the electronic device can be improved. have. Therefore, the efficiency of the water-cooled system applied to electronic devices such as computers is greatly improved, and thus a useful effect of greatly increasing the market share can be obtained.

Although the present invention has been described in detail with reference to the accompanying drawings, the present invention is not limited to such a specific structure. Those skilled in the art will be able to variously modify or change the embodiments of the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. Nevertheless, it will be apparent that all such modifications or design modifications to such simple embodiments will clearly fall within the scope of the present invention.

Claims (11)

In the manufacturing method of the water block used in the water-cooled system, Manufacturing a plurality of pins by cutting the copper sheet or the aluminum sheet; Stacking the plurality of pins to have a constant stacking shape by a predetermined height; Brazing the stacked plurality of pins to produce a pin assembly having a microchannel plate and a junction plate; Manufacturing a cover by press molding and manufacturing a cover part by connecting an inlet port to the cover; Milling the microchannel plate and junction plate of the pin assembly into a desired shape that fits into the interior space of the cover; And Inserting the microchannel plate of the fin assembly into the inside of the cover, and brazing the bonding plate of the cover and the pin assembly to produce a water block having a microchannel therein; How to make a water block. The method of claim 1, wherein the fin is formed of a microchannel plate having a predetermined thickness and a bonded plate having a thick thickness on a lower side of the microchannel plate. The pin of claim 1, wherein the pin has a thickness on a lower side of the square pin-fin plate and the square pin-fin plate with a plurality of square pin-fin protrusions. Method for producing a water block for a water-cooled device, characterized in that is made of a thick laminated plate. 3. The method of claim 1 or 2, wherein the fins are formed by press punching or etching to form matrices arranged side by side in two rows. The method of claim 2 or 3, wherein the fins are laminated using a jig while keeping the corners aligned with each other. The method of claim 3, wherein the fins are stacked by using a jig while maintaining the alignment of the corners arranged in a zigzag. The method of claim 5, wherein the fin is brazed by the bonding plate while securing a flow path of the microchannel plate using a jig. The method of claim 2, wherein the fins are formed by joining the microchannel plates side by side to form a flow path between the microchannel plates. The pin-fin of claim 3, wherein the pins are connected side by side to a square pin-fin plate and are disposed between the square pin-fin plates and parallel to each other. Fin) A water block manufacturing method for a water-cooled device, characterized in that the flow path is formed between the projections. The pin-fin of claim 6, wherein the pins are zigzag bonded to a square pin-fin plate, and between the square pin-fin plates and zigzag-shaped square pin-fin plates. Fin) A water block manufacturing method for a water-cooled device, characterized in that the flow path is formed between the projections. The water block according to claim 1, wherein the fine channel has a channel width of 0.1 mm to 2.0 mm, and an aspect ratio (channel depth / channel width) has a range of 1.0 to 100.0. How to make.