KR100908241B1 - Opto-bus module and its manufacturing method - Google Patents

Abstract

The optical bus module and the method of manufacturing the same according to the present invention have at least one optical waveguide inserted into the dielectric and have a through hole structure from the lower portion of the dielectric to the portion where the optical waveguide meets the optical waveguide. An optical bus unit including a plurality of exposed first coupling units; And a plurality of receptacle portions having a second coupling portion formed in a through hole structure to be connected to the first coupling portion of the photoelectric bus portion and the conductive guide pin. The optical bus module according to the present invention provides automatic, efficient, high speed, highly integrated multichip to multichip optical communication and telecommunication, and precise and efficient optical coupling.

Description

Opto-electric-bus module and Manufacturing Method of the Same

1 is a view for explaining the configuration of an optical bus module according to an embodiment of the present invention.

2A and 2B are diagrams for showing a cross-sectional view and a plan view, respectively, in which the photobus module illustrated in FIG. 1 is coupled.

FIG. 3 is a view illustrating the flow of optical signals and electrical signals in the photoelectric bus module illustrated in FIG. 1.

4 is a view for explaining the configuration of an optical bus module according to another embodiment of the present invention.

5A and 5B are cross-sectional views of the state in which the photoelectric bus module illustrated in FIG. 4 is coupled, and a view for showing the flow of an optical signal and an electrical signal.

6a to 6e are diagrams for explaining the configuration of the optical coupling used in the present invention.

FIG. 7 is a diagram illustrating a communication module for optical communication and telecommunication between a plurality of semiconductor chips using an optical bus module according to an exemplary embodiment of the present invention.

8A to 8C are views for explaining the configuration and optical transmission principle of the optical waveguide used in the optical waveguide portion of the optical bus module according to an embodiment of the present invention.

The present invention relates to an optical bus module and a method for manufacturing the same, and more particularly, to an optical bus module for simultaneously providing optical communication and telecommunication.

In order to overcome the limitations of the conventional electrical wiring, information processing technology using optical wiring is in the spotlight. In addition, in recent years, opto-electric hybrid wiring modules have been developed that provide optical communication and electric communication together instead of only optical wiring.

The opto-electric hybrid wiring module uses optical signals for short-range information communication between semiconductor chips on the same substrate or between semiconductor chips on another substrate. For example, an optical waveguide or an optical fiber is inserted into a conventional multilayer PCB substrate, and optical communication between semiconductor chips uses an inserted optical waveguide, and electrical communication uses an electrical wiring formed on a PCB.

However, such an optical waveguide insertion type opto-electronic hybrid wiring module has a limitation of using a fixed optical waveguide and an electrical wiring, so that the design and manufacture of the optical waveguide must be changed every time for various information communication between various semiconductor chips.

The present invention is to provide an optical bus module capable of automatic and efficient, high-speed, highly integrated multi-chip to multi-chip optical communication and electrical communication.

An embodiment of the optical bus module according to the present invention for achieving the technical problem is at least one optical waveguide is inserted into the dielectric, the first through-hole (through hole) structure from the lower portion of the dielectric to the upper portion An optical bus unit including a plurality of coupling units; And a plurality of receptacle portions having a second coupling portion formed in a through-hole structure to be connected to the first coupling portion and the conductive guide pin of the photoelectric bus portion.

More preferably, in the opto-bus module according to the present invention for achieving the above technical problem, an embodiment of the opto-bus unit has a first electric wiring for transmitting an electric signal under the dielectric.

In addition, in the optical bus module according to the present invention for achieving the above technical problem, the second coupling portion of the through-hole structure is formed with a second electrical wiring for transmitting an electrical signal inside the through-hole.

According to an embodiment of the present invention, there is provided a method for fabricating an optical bus module according to the present invention, wherein at least one optical waveguide is inserted into a dielectric, and a through hole structure is formed from a lower portion of the dielectric to an upper portion thereof. Optoelectronic bus configuration step comprising a plurality of coupling portions; A receptacle forming step of forming a second coupling portion on a substrate on which a semiconductor chip is mounted in a through hole structure so as to be connected to the first coupling portion and a conductive guide pin; And a connecting step of connecting the first coupling part and the second coupling part to the conductive guide pins such that the optical waveguide is vertically and horizontally aligned with the optoelectronic device.

More preferably, in the method for manufacturing the photoelectric bus module according to the present invention for achieving the technical problem, the forming of the photoelectric bus comprises: forming a first electrical wiring for transmitting an electrical signal under the dielectric; Has more;

In addition, in the method for manufacturing the photovoltaic bus module according to the present invention for achieving the technical problem, the receptacle forming step is a second electrical wiring to form a second electrical wiring for transmitting an electrical signal inside the through hole of the second coupling portion; It further has a forming step.

As described above, the optical bus module and the method of manufacturing the optical waveguide according to the present invention can be optically coupled to the optoelectronic device precisely and efficiently by the combination of the first coupling part and the second coupling part. to provide.

In addition, in the present invention, the optical waveguide may be a metal optical waveguide, and may be flexible. The optical transmission of the metal optical waveguide used in the present invention can be explained by the long-range surface plasmon polaritone (LR-SPP) theory.

Surface Plasmon (SP) is an oscillation wave of charge density that travels along a boundary where the real terms of the dielectric constants are opposite to each other, and the surface charge density oscillation forms a longitudinal surface constraint wave.

The longitudinal surface restraint wave is a component in which the electric field component of the incident wave is perpendicular to the interface. Only the TM mode (Transverse Magnetic Mode) can excite and guide the long-range surface plasmon polaritone.

The optical waveguide according to the present invention may include a metal optical waveguide through which an optical signal is transmitted and a polymer optical material surrounding the metal optical waveguide, and the metal optical waveguide may have a thickness of 5 to 200 nm and a width of 2 to 100 μm. have. The polymer optical material may be formed of a polymer optical material containing a halogen element or deuterium.

In addition, in the present invention, a 45 degree reflector may be formed at the end of the optical bus portion, the 45 degree reflector may be integral with the optical bus portion, or may be detachably separated and combined.

Under the 45 degree reflector, a polarizer for polarizing the light source generated in the photoelectric device to a specific light mode of the TM mode or the TE mode may be detached.

The optoelectronic device may be a light emitting device or a light receiving device, and the light emitting device may be configured of a TM mode laser diode, a TE mode diode, a surface emitting laser (VCSEL), and the like according to light emission characteristics.

The present invention is formed on the upper surface of the PCB substrate, and through the coupling portion of the through-hole structure and the photoelectric coupling with the substrate on which the semiconductor chip is mounted, the optical alignment and electrical wiring connection is easy, and the integration degree can be improved by using the optical waveguide of fine size have.

In addition, the present invention includes an electrical wiring for transferring an electrical signal between the semiconductor chip, it is possible to implement an optical communication module that can efficiently perform optical communication and electrical communication between the semiconductor chip at the same time.

Hereinafter, the photoelectric bus module of the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

1 is a view for explaining the configuration of an optical bus module according to an embodiment of the present invention.

Referring to FIG. 1, an optical bus module according to the present invention may include an optical bus unit 101, a substrate 109, and receptacle units 112 and 113.

The optical bus unit 101 includes an optical waveguide 104 inserted into the dielectric 103, a 45 degree reflector 105 formed at both ends of the optical waveguide 104, and a first coupling portion 106 having a through hole structure. It consists of

A polarizer 107 may be formed below the 45 degree reflector 105, and a first electric wiring 108 may be formed below the photoelectric bus unit 101. The first electrical wiring 108 may extend to the inner wall surface of the first coupling portion 106 formed at both ends of the optical waveguide 104.

A transmission semiconductor chip 110, a reception semiconductor chip 111, a transmission receptacle unit 112, and a reception receptacle unit 113 may be formed on the substrate 109 to which the photoelectric bus unit 101 is coupled. The receptacle parts 112 and 113 have a second coupling part 116 having a through hole structure for coupling with the photoelectric bus part 101.

The receptacle units 112 and 113 may mount an optoelectronic device, that is, a light emitting device 114 or a light receiving device 115, on the top of the receptacle unit 112 and 113, for connecting the optoelectronic devices 114 and 115 to the semiconductor chips 110 and 111. The third electric wiring may further have a bench portion 102 formed by extension.

On the inner wall surface of the second coupling part 116, a second electric wiring 117 through which electric signals generated from the semiconductor chips 110 and 111 are transmitted is formed to extend. In addition, a third electrical wiring 118 is formed between the semiconductor chips 110 and 111 and the receptacle portions 116 and 117 to transmit and receive electrical signals required for driving the photoelectric elements 114 and 115. The first coupling portion 106 of the through hole structure of the photoelectric bus portion 101 and the second coupling portion 116 of the receptacle portions 112 and 113 are coupled by the conductive guide pin 119.

2A and 2B are diagrams for showing a cross-sectional view and a plan view, respectively, in which the photobus module illustrated in FIG. 1 is coupled.

2A and 2B, the photoelectric bus unit 101 and the receptacle units 112 and 113 are physically and firmly coupled by the conductive guide pin 119.

Accordingly, the first electrical wiring of the photoelectric bus unit 101 and the second electrical wiring of the receptacle units 112 and 113 are electrically coupled. In addition, the light emitting device, the polarizer, and the 45 degree reflector are optically optically coupled, and the light receiving element and the 45 degree reflector are also automatically optically coupled.

FIG. 3 is a view illustrating the flow of optical signals and electrical signals in the photoelectric bus module illustrated in FIG. 1.

Referring to FIG. 3, the photoelectric bus unit 101 is fixed to the receptacle units 112 and 113 of the PCB substrate to mediate optical communication and electric communication between semiconductor chips. The electrical signal generated from the semiconductor chip is transmitted to the light emitting device 114 of the transmission receptacle unit 112 along the third electric wiring 118 and the light emitting device 114 generates an optical signal.

The optical signal generated from the light emitting element 114 is changed by 90 degrees through the 45 degree reflector and waveguided through the optical waveguide 104 to change the 90 degrees from the 45 degree reflector on the opposite side again. Is transferred to the light receiving element 115. The received optical signal is finally transmitted to the receiving semiconductor chip via the receiving receptacle 113.

In the case of an electrical signal, the electrical signal generated from the semiconductor chip is transmitted to the second electrical wiring 117 formed at the second coupling portion of the receptacle portion 112, and the electrical signal is transmitted through the photoelectric bus through the conductive guide pin 119. It is transmitted to the first electrical wiring 108 of the part 101.

The electrical signal transmitted along the first electrical wiring 108 is again transmitted to the receiving semiconductor chip through the receiving receptacle 113 through the conductive guide pin of the light receiving receptacle 113. Thus, according to the present invention, optical communication and electric communication are possible at the same time.

4 is a view for explaining the configuration of an optical bus module according to another embodiment of the present invention.

The optical bus unit 101 may include an optical waveguide 104 embedded in the dielectric 103, a 45 degree reflector 105 formed at both ends, and a connector pin 120 attached to a lower portion thereof.

A polarizer 107 may be formed at a lower end of the 45 degree reflector 105, and a first electric wiring 108 is formed at the lower end of the photoelectric bus unit 101. The first electrical wiring 108 is connected through a connector pin 120 formed at both ends of the optical waveguide.

Other components such as the receptacle parts 112 and 113 are similar to those of FIG. 1, and thus detailed descriptions thereof will be omitted.

5A and 5B are cross-sectional views of the state in which the photoelectric bus module illustrated in FIG. 4 is coupled, and a view for showing the flow of an optical signal and an electrical signal.

FIG. 5A illustrates a second electrical connection of the photoelectric bus module 101 and the second coupling part of the receptacle parts 112 and 113 as the optical bus module is physically and firmly coupled by the connector pin 120. The electrical wiring is electrically coupled, and the light emitting device, the polarizer, and the 45 degree reflector are also optically coupled.

5B shows optical and electrical communication between semiconductor chips. In the case of electrical communication between the semiconductor chips, the electrical signal generated from the semiconductor chip is transferred to the first electrical circuit of the photoelectric bus unit 101 through the connector pin 120 along the second electrical wiring 117 of the transmission receptacle unit 112. It is delivered to the wiring 108.

In addition, the electrical signal transmitted along the first electrical wiring 108 is finally received along the second electrical wiring of the receiving receptacle 113 through the connector pin 120 connected to the receiving receptacle 113. Is passed to (111).

6a to 6e are diagrams for explaining the configuration of the optical coupling used in the present invention.

6A illustrates an example in which only 45 degree reflectors 105 are provided at both ends of the photoelectric bus unit 101. The optical signal generated by the light emitting element 114 is changed by 90 degrees through the 45 degree reflector 105 formed at the end of the photoelectric bus unit 101, and is guided through the optical waveguide 104 to be 45 The optical signal is transmitted to the light-receiving element 115 by changing the 90-degree moving direction again through the degree reflector.

At this time, the height of the receptacle parts 112 and 113 can be adjusted to maximize the optical coupling efficiency between the light emitting element 114 and the optical waveguide. In addition, the light generated by the light emitting device 114 may be applied to the device for generating the TM mode light for the surface plasmon polariton excitation of the metal line used as the optical waveguide. If the light generated by the light emitting device 114 is TM mode light, the light emitting device may be rotated by 90 degrees and attached.

6B shows that the reflector module 121 is provided at both ends of the photoelectric bus unit 101. The reflector module 121 may be configured by vertically forming the end of the fabricated photoelectric bus unit 101 and attaching the reflector module 121 to its vertical surface.

6C and 6D show that the polarizer 107 is attached to the lower portion of the 45 degree reflector formed at both ends of the photoelectric bus unit 101.

Surface plasmon polariton excitation of the metal line used as the optical waveguide will require incidence of TM mode light.

If the light generated by the light emitting device does not include the TM mode or generates only the TE mode, the polarizer 107 is provided as shown in FIGS. 6C and 6D to inject the TM mode light required for the surface plasmon polariton excitation of the metal line. You may be able to.

FIG. 6E shows an embodiment in which a lens 122 for condensing is provided in addition to the polarizer 107 under the 45 degree reflector formed at both ends of the optical bus unit 101.

6E shows that the efficiency of optical coupling to the metal line used as the optical waveguide decreases when light generated from the light emitting device is spread, thereby increasing the optical coupling efficiency between the light emitting element and the metal line optical waveguide through condensing through the lens 122. An example is shown.

FIG. 7 is a diagram illustrating a communication module for optical communication and telecommunication between a plurality of semiconductor chips using an optical bus module according to an exemplary embodiment of the present invention.

FIG. 7 shows the semiconductor chip A 201, the semiconductor chip B 203, and the semiconductor chip C 221 by the optical bus units 207, 220, and 223 including the optical waveguide 210 and the first electric wiring 226. ) And an optical communication between the semiconductor chip D 225 and the semiconductor chip D 225 are completed simultaneously.

The second coupling portion formed in the receptacle portions 202, 204, 222, 219 and 227 of each semiconductor chip and the first coupling portion formed in each of the photoelectric bus portions 207, 220 and 223 are automatically driven by the conductive guide pins 216. The optical coupling and the electrical coupling are completed.

When the signal applied to the semiconductor chip A 201 from the outside is composed of the first light emission signal and the first operation signal, the light emitting element 206 of the semiconductor chip A 201 receiving the first light emission signal receives the first light signal. The generated first optical signal is transmitted to the semiconductor chip B 203 through the optical waveguide 210 and the light receiving device 212 of the photoelectric bus unit 207.

The received signal received by the semiconductor chip B 203 is converted into a second light emitting signal and a third light emitting signal for driving the light emitting devices 228 and 229 of the semiconductor chip B 203 through internal calculations to drive the light emitting device. Let's do it. The second and third optical signals generated by the second and third light emitting signals are transmitted to the semiconductor chip C 221 and the semiconductor chip D 225 through the photoelectric bus units 220 and 223. .

In this case, the signal calculated by the semiconductor chip B 203 transfers the fourth light emission signal to the light emitting device 230 of the semiconductor chip B 203 to generate the fourth optical signal. The fourth optical signal is transmitted to the light receiving element 231 of the semiconductor chip A 201 to transmit and receive optical communication results on the semiconductor chip A 201 and the semiconductor chip B 203. Optical communication in the semiconductor chip C 221, the semiconductor chip D 225, and the like may be performed in the same manner as described above.

The electrical communication between the semiconductor chips according to the present invention may be as follows. The operation signal applied to the semiconductor chip A 201 from the outside is suitably calculated according to the component circuit and the component semiconductor circuit of the semiconductor chip A 201, and the result of the calculation generates the first calculation result signal.

The first operation result signal generated by the semiconductor chip A 201 is transferred to the second coupling portion of the receptacle portion 202 along the third electrical wiring 205 and the conductive guide of the first coupling portion of the optoelectronic bus portion 207 is provided. The pin 216 is transferred to the receptacle unit 204 and finally to the semiconductor chip B 203.

The second operation result signal computed by the semiconductor chip B 203 is also transferred to the semiconductor chip C 221 and the semiconductor chip D 225 in the same manner as described above.

In this case, the second operation result signal of the semiconductor chip B 203 may be a first operation result signal received from the semiconductor chip A 201 and a third operation result signal received from the semiconductor chip C 221 and the semiconductor chip D 225. This may be implemented by comprehensive operation of the fourth operation result signal. In this manner, the electrical communication between the semiconductor chip A 201, the semiconductor chip B 203, the semiconductor chip C 221, and the semiconductor chip D 225 is completed.

8A to 8C are views for explaining the configuration and optical transmission principle of the optical waveguide used in the optical waveguide unit of the optical bus module according to an embodiment of the present invention.

As shown in FIG. 8A, the optical waveguide 103 has a characteristic of transmitting incident light up to several centimeters in length by using metal lines having a thickness of several nanometers and several tens of microns embedded in the dielectric 104. Thus, the optical waveguide using the metal line is called a metal line optical waveguide.

In the present invention, the optical waveguide may be a metal line optical waveguide, and may be flexible. If the optical waveguide is a metal line optical waveguide, the optical transmission of the optical waveguide can be explained by the long-range surface plasmon polaritone (LR-SPP) theory.

Briefly describing the optical waveguide principle of a metal line optical waveguide, an optical signal is transmitted through polarization of free electrons in the metal line and mutual coupling of these polarizations.

Such continuous coupling of free electrons is called surface plasmon polariton, and long-distance light transmission using this is theoretically called long-range surface plasmon polariton.

Surface Plasmon (SP) is an oscillation wave of charge density that travels along a boundary where the real terms of the dielectric constants are opposite to each other, and the surface charge density oscillation forms a longitudinal surface constraint wave.

The longitudinal surface restraint wave is a component in which the electric field component of the incident wave is perpendicular to the interface, and only TM mode (Transverse Magnetic Mode) can excite and wave the long-distance surface plasmon polaritone.

Such a metal line optical waveguide can sufficiently transmit an optical signal with a metal wire having a fine size, for example, a thickness of about 5 to 200 nm and a width of about 2 to 100 μm.

FIG. 8B illustrates a state in which polarization of free electrons is properly formed and thus an optical signal is smoothly transmitted. FIG. 8C illustrates a state in which optical signal transmission is not smoothly formed due to improper polarization of free electrons.

That is, light transmission occurs smoothly when the TM mode Ex in the x-axis direction is asymmetrical through polarization of free electrons.

Intensity of the optical signal transmitted to the right portion is schematically represented. It can be seen that the optical signal is smoothly transmitted in FIG. 8B compared to FIG. 8C.

Meanwhile, the dielectric constants ε1 and ε3 of the dielectric above the metal wire and the metal wire below the metal wire may be different from each other, but may also be the same. By using this principle, the metal wire light may be surrounded by the same dielectric. A waveguide can be formed.

The invention can also be embodied as computer readable code on a computer readable recording medium. The computer-readable recording medium includes all kinds of recording devices in which data that can be read by a computer system is stored.

Examples of computer-readable recording media include ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage, and the like, and may also be implemented in the form of a carrier wave (for example, transmission over the Internet). Include. The computer readable recording medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.

So far I looked at the center of the preferred embodiment for the present invention. Those skilled in the art will appreciate that the present invention can be implemented in a modified form without departing from the essential features of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the scope will be construed as being included in the present invention.

As such, the optical bus module according to the present invention provides automatic, efficient, high speed, highly integrated multichip to multichip optical communication and telecommunication, and precise and efficient optical coupling.

Claims (20)

An optical bus part having at least one optical waveguide inserted into the dielectric and having a plurality of first coupling parts formed in a through hole structure from a lower portion of the dielectric to an upper portion thereof; And And a plurality of receptacle portions having a second coupling portion formed in a through-hole structure to be connected to the first coupling portion and the conductive guide pin of the photoelectric bus portion. The method of claim 1, And the receptacle portion is formed on a substrate on which a semiconductor chip for generating an electrical signal is mounted. The method of claim 2, The second coupling part includes a second electrical wiring formed in the through hole of the second coupling part to transfer an electrical signal generated from the semiconductor chip. The first coupling part includes a first electrical wiring connected to the lower portion of the dielectric in the through hole of the first coupling part and electrically coupled to the second electrical wiring by the conductive guide pin. . The method of claim 2, wherein the receptacle portion The opto-bus module, characterized in that it further includes a bench portion that can be mounted on the optoelectronic device, the third electrical wiring is extended to transfer the electrical signal between the optoelectronic device and the semiconductor chip therein. The method of claim 1, And the optical waveguide is a metal optical waveguide including at least one metal line through which an optical signal is transmitted and a polymer optical material surrounding the metal line. The method of claim 5, The metal optical waveguide has a thickness of 5 to 200 nm, a width of 2 to 100 ㎛ optobus module. The method of claim 5, And the metal optical waveguide is flexible. According to claim 1, wherein the optical bus unit Opto-bus module comprising a 45 degree reflector is formed on the left and right sides of the dielectric. The method of claim 8, And a polarizer for adjusting the polarization characteristic of the vertical optical signal under the 45 degree reflector. The method of claim 8, And a lens for condensing a vertical optical signal under the 45 degree reflector. An optical bus construction step of inserting at least one optical waveguide into a dielectric, and having a plurality of first coupling parts formed in a through hole structure from a lower portion of the dielectric to an upper portion thereof; A receptacle forming step of forming a second coupling portion on a substrate on which a semiconductor chip is mounted in a through hole structure so as to be connected to the first coupling portion and a conductive guide pin; And And connecting the first coupling part and the second coupling part with the conductive guide pins such that the optical waveguide is vertically and horizontally aligned with the optoelectronic device. The method of claim 11, And forming a second electrical wiring formed in the through hole of the second coupling part to transfer an electrical signal generated from the semiconductor chip. The method of claim 12, And forming a first electrical wiring connected to the lower portion of the dielectric inside the through hole of the first coupling portion and electrically coupled to the second electrical wiring by the conductive guide pin. How to make a module. The method of claim 11, wherein the receptacle configuration step A bench unit configured to form a bench unit capable of mounting the optoelectronic device on an upper portion of the bench unit, wherein a third electric wiring for transmitting an electrical signal between the optoelectronic device and the semiconductor chip is formed to be extended; Optobus module manufacturing method comprising a. The method of claim 11, And the optical waveguide is a metal optical waveguide including at least one metal line through which an optical signal is transmitted and a polymer optical material surrounding the metal line. The method of claim 15, The metal optical waveguide has a thickness of 5 to 200 nm, the width of the optical bus module manufacturing method, characterized in that 2 to 100 ㎛. The method of claim 15, And the metal optical waveguide is flexible. 12. The method of claim 11, wherein the optoelectronic bus configuration step And a reflector forming step of forming a 45 degree reflector on the left and right side surfaces of the dielectric. The method of claim 18, And a polarizer for adjusting the polarization characteristic of the vertical optical signal under the 45 degree reflector. The method of claim 18, And a lens for condensing a vertical optical signal under the 45 degree reflector.

Images