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KR100908030B1 - Flexible Thin LED Lighting Panel - Google Patents

Flexible Thin LED Lighting Panel Download PDF

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KR100908030B1
KR100908030B1 KR1020090001846A KR20090001846A KR100908030B1 KR 100908030 B1 KR100908030 B1 KR 100908030B1 KR 1020090001846 A KR1020090001846 A KR 1020090001846A KR 20090001846 A KR20090001846 A KR 20090001846A KR 100908030 B1 KR100908030 B1 KR 100908030B1
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light
led lighting
lighting panel
flexible
flexible thin
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박영식
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한국광기술원
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/0025Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/0066Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033Means for improving the coupling-out of light from the light guide
    • G02B6/0035Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

얇고 가벼우면서도 광효율이 높은 유연 박형 LED 조명 패널에 관해 개시하고 있다. 본 발명의 가장 큰 특징은, LED 조명 패널에서 광원에 해당하는 복수의 LED 칩들을 연성 인쇄회로기판에 실장하고 이들의 각각에 1:1 대응하는 수지 광학계를 몰딩하고, 또한 전체적 구조를 유연 재질로 제조한다는 것이다. 본 발명에 따르면, 얇고 가벼우면서도 고출력의 박형 LED 조명 패널을 구현할 수 있고 상기 복수개의 패널들을 조립함으로써 다양한 형태의 조명을 구성할 수 있기 때문에, 조명 및 디스플레이 분야에서 제품의 품질과 생산성 향상뿐 아니라 제품 디자인의 융통성을 기대할 수 있다.Disclosed is a flexible thin LED lighting panel that is thin, light and high in light efficiency. The biggest feature of the present invention is to mount a plurality of LED chips corresponding to the light source in the LED lighting panel on a flexible printed circuit board and molding a resin optical system corresponding to each of them 1: 1, and also the overall structure of the flexible material To make. According to the present invention, it is possible to implement a thin, light and high-power thin LED lighting panel and to configure various types of lighting by assembling the plurality of panels, thereby improving product quality and productivity in the field of lighting and display as well as You can expect design flexibility.

Description

유연 박형 LED 조명 패널 {Flexible thin LED lighting panel}Flexible thin LED lighting panel {Flexible thin LED lighting panel}

본 발명은 LED 조명 패널에 관한 것으로, 특히, 얇고 가벼우면서도 고광효율을 갖는 유연 박형 LED 조명 패널에 관한 것이다.The present invention relates to an LED lighting panel, and more particularly, to a flexible thin LED lighting panel having a thin, light and high light efficiency.

화합물 반도체의 특성을 이용하여 전기적인 신호를 빛으로 변화시키는 LED는 다른 발광체에 비해 수명이 길고, 구동 전압이 낮으며, 소비 전력이 적다는 장점을 가지고 있다. 또한, LED는 응답속도 및 내충격성이 우수할 뿐 만 아니라 소형 경량화가 가능하다는 장점도 가지고 있다. 따라서, 이러한 LED는 휴대폰 등 휴대용 전자기기의 광원으로 사용될 뿐만 아니라 최근에는 액정표시장치(Liquid Crystal Display, LCD)의 백라이트 유닛(Back Light Unit, BLU) 및 조명의 광원 등으로 널리 사용되고 있다.LED, which converts an electrical signal into light using characteristics of a compound semiconductor, has a long life, low driving voltage, and low power consumption compared to other light emitters. In addition, LED has the advantage of not only excellent response speed and impact resistance, but also small size and light weight. Therefore, the LED is not only used as a light source of a portable electronic device such as a mobile phone, but also widely used as a backlight unit (BLU) and a light source of illumination of a liquid crystal display (LCD).

그러나 기존의 대형 LED 백라이트 유닛은 직하형으로 기판 상에 다수의 LED가 실장된 어레이 형태의 LED 광원과 광확산판을 사용하는 데, 박형에서 광결합 효율이 좋지 않다. 한편 중·소형 LED 백라이트 유닛은 측광형으로 도광판의 측면을 통해 도광판에 광을 결합함으로써 높은 광 효율과 박형의 유닛을 구현할 수 있지 만, 대면적에서는 LED 광원 배열의 한계와 도광판의 광흡수로 인하여 오히려 직하형보다 낮은 광효율을 나타낸다. 또한 최근 실내조명으로 주목을 받는 LED 평판조명도 상기의 측광형 구조로 같은 단점을 갖는다. 따라서 미래의 LED 조명장치는 상기 형태의 LED 백라이트 유닛들의 장점만을 취할 수 있는 새로운 개념의 구조가 요구된다.However, the existing large-scale LED backlight unit uses an LED light source and an optical diffuser in the form of an array in which a plurality of LEDs are mounted on a substrate. On the other hand, the small and medium sized LED backlight unit can realize high light efficiency and thin unit by coupling light to the light guide plate through the side of the light guide plate in the light metering type.However, in large area, due to the limitation of LED light source arrangement and light absorption of the light guide plate, Rather, it shows lower light efficiency than the direct type. In addition, LED flat panel lighting, which is recently attracting attention as indoor lighting, has the same disadvantage as the above-described photometric structure. Therefore, the LED lighting apparatus of the future requires a new concept structure that can take advantage of the above-described LED backlight units only.

한편, 한국특허 제811061호에서는, 다수의 고휘도 LED를 직렬 또는 병렬로 연결한 매트릭스로 배열하고, LED 전방에 1:1로 대응되고 일정한 곡률을 갖는 다수의 고 투명도의 광학용 아크릴 사출 렌즈가 설치된 렌즈판에 부착하여 일정하고 향상된 조도를 갖도록 하고, LED 중에서 가장자리 쪽에 배열되는 LED는 전방에 대응하는 각 렌즈의 중심에서 벗어나 렌즈의 중심으로부터 안쪽에 위치하도록 설치함으로써 조명의 배광각도를 향상시키는 고휘도 LED를 이용한 조명기구에 관해 제안하고 있다. 그러나, 이러한 구조에서는 LED에서 나오는 광을 집속하기 위한 광학계인 렌즈가 1개의 렌즈판의 형태로 이루어져 있고 이 렌즈판이 LED들과 분리되어 고정되어 있어서, 전체적으로 LED 조명 패널의 두께를 줄이기 어렵고 조립비용이 높다는 문제가 있다. 또한, LED 조명기구 자체에 유연성을 부여하지 않았기 때문에 다양한 설치 환경에 쉽게 대응하기 어렵다는 문제도 있다.On the other hand, in Korean Patent No. 81061, a plurality of high brightness LEDs are arranged in a matrix connected in series or in parallel, and a plurality of high transparency optical acrylic injection lenses having a 1: 1 curvature and corresponding curvatures in front of the LEDs are installed. It is attached to the lens plate to have a constant and improved illuminance, and the LEDs arranged on the edge side among the LEDs are installed away from the center of each lens corresponding to the front and located inward from the center of the lens, thereby improving the light distribution angle of the illumination. Proposes a lighting fixture using. However, in this structure, the lens, which is an optical system for focusing the light emitted from the LED, is formed in the form of one lens plate, and the lens plate is fixed separately from the LEDs, so that it is difficult to reduce the thickness of the LED lighting panel as a whole and the assembly cost is high. There is a problem. In addition, there is a problem that it is difficult to easily respond to a variety of installation environment because it does not give flexibility to the LED luminaire itself.

따라서, 본 발명이 해결하고자 하는 과제는, 얇고 가벼우면서도 광효율이 높은 유연 박형 LED 조명 패널을 제공하는 것이다.Accordingly, the problem to be solved by the present invention is to provide a flexible thin LED lighting panel that is thin, light and high in light efficiency.

본 발명이 해결하고자 하는 다른 과제는, 다양한 설치 환경에 쉽게 대응할 수 있는 유연 박형 LED 조명 패널을 제공하는 것이다.Another object of the present invention is to provide a flexible thin LED lighting panel that can easily cope with various installation environments.

상기한 기술적 과제를 해결하기 위한 본 발명의 유연 박형 LED 조명 패널은:The flexible thin LED lighting panel of the present invention for solving the above technical problem:

유연성 재질로 만들어지며 회로 패턴이 형성된 인쇄회로기판과;A printed circuit board made of a flexible material and having a circuit pattern formed thereon;

상기 인쇄회로기판 상에 2차원 어레이 형태로 실장된 복수의 LED 칩들과;A plurality of LED chips mounted in the form of a two-dimensional array on the printed circuit board;

상기 LED 칩들에 1:1 대응되게 이들의 각각을 몰딩하여, 상기 LED 칩들의 각각에서 나오는 광의 형상을 만들어주는 복수의 수지 광학계들과;A plurality of resin optical systems for molding each of them in a 1: 1 correspondence with the LED chips to form a shape of light emitted from each of the LED chips;

상기 LED 칩들과 수지 광학계들의 각각에 대응되는 위치에 관통공을 가지며, 상기 인쇄회로기판에 설치되는 유연성 재질의 후면 반사판과;A rear reflector of a flexible material having a through hole at a position corresponding to each of the LED chips and the resin optical systems, and installed on the printed circuit board;

상기 광학계들을 나온 광을 효율적으로 몸체에 결합시키기 위해 상기 관통공에 대응되는 위치에 결합공을 가지며, 상기 후면 반사판의 상부에 위치하는 유연성 재질의 광확산판;A light diffusion plate made of a flexible material having a coupling hole at a position corresponding to the through hole to efficiently couple the light from the optical systems to the body, and positioned above the rear reflector;

을 구비하는 것을 특징으로 한다.It characterized by having a.

또한, 상기 광확산판 상에 위치하며, 상기 광확산판을 통과하는 광을 균일하게 외부에 방사시키는 유연성 재질의 광 시트를 더 구비하여도 좋은데, 특히, 복수 개의 광확산판을 연결하였을 때 접면과 접점에서 발생하는 암영을 줄이고 전체 광 출력의 균일성을 개선할 수 있다. The light diffusion plate may further include a light sheet made of a flexible material positioned on the light diffusion plate to uniformly radiate the light passing through the light diffusion plate to the outside. In particular, when a plurality of light diffusion plates are connected, It is possible to reduce the shadows generated at the contact point and to improve the uniformity of the overall light output.

또한, 상기 수지 광학계들의 각각이 실리콘계 수지, 에폭시 수지, 우레탄계 수지 및 그 혼합물로 구성된 군으로부터 선택된 어느 하나로 이루어진 것이 바람직 하다.In addition, each of the resin optical system is preferably made of any one selected from the group consisting of silicone resin, epoxy resin, urethane resin and mixtures thereof.

상기 복수의 LED 칩들이 상기 인쇄회로기판에 배열된 형태가 메시 형태이어도 좋다.The plurality of LED chips may be arranged in a mesh form in the printed circuit board.

한편, 더욱 넓은 면적의 유연 박형 LED 조명 패널을 구성하기 위하여 상기한 박형 LED 조명 패널을 유닛으로 하여 복수 개 연결한 후, 상기 조명 패널의 모두를 커버할 수 있는 유연성 재질의 광 시트를 부착할 수 있다. 이 경우, 상기 광 시트의 표면에 상기 복수 개 조명 패널의 접면 또는 접점에서 발생하는 어두운 부분을 줄일 목적으로 상기 수지 광학계에 홀로그램 혹은 회절 패턴을 형성할 수도 있다.On the other hand, in order to configure a flexible thin LED lighting panel of a larger area, after connecting a plurality of the thin LED lighting panel as a unit, it is possible to attach a light sheet of a flexible material that can cover all of the lighting panel. have. In this case, a hologram or a diffraction pattern may be formed on the resin optical system in order to reduce dark areas generated at the contact surfaces or the contacts of the plurality of lighting panels on the surface of the optical sheet.

본 발명에 따르면, 얇고 가벼우면서도 광효율이 높은 유연 박형 LED 조명 패널을 구현할 수 있기 때문에, 조명 및 디스플레이 분야에서 제품의 품질과 생산성 향상뿐 아니라 제품 디자인의 융통성을 기대할 수 있다.According to the present invention, it is possible to implement a flexible thin LED light panel with a thin, light and high light efficiency, it is possible to expect the flexibility of product design as well as the product quality and productivity in the field of lighting and display.

이하에서, 본 발명의 바람직한 실시예를 첨부한 도면들을 참조하여 상세히 설명한다. 아래의 실시예는 본 발명의 내용을 이해하기 위해 제시된 것일 뿐이며 당 분야에서 통상의 지식을 가진 자라면 본 발명의 기술적 사상 내에서 많은 변형이 가능할 것이다. 따라서 본 발명의 권리범위가 이러한 실시예에 한정되는 것으로 해석되어서는 아니된다.Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail. The following examples are only presented to understand the content of the present invention, and those skilled in the art will be capable of many modifications within the technical spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited to these examples.

도 1은 본 발명의 실시예에 따른 유연 박형 LED 조명 패널의 구조를 설명하기 위한 도면으로서, 더 구체적으로, 도 1의 (a)는 그 분해사시도, 도 1의 (b)는 그 단면도이다. 도 1을 참조하면, 유연 박형 LED 조명 패널(100)에서 광원에 해당되는 복수의 LED 칩(11)들과 그 각각을 몰딩하는 수지 광학계(124)는 회로 패턴(미도시)이 형성된 유연성 재질, 예컨대 폴리이미드로 만들어진 연성 인쇄회로기판(110) 상에 메시(mesh) 형태의 2차원 어레이로 배열되어 있다. 여기서, LED칩(122)을 피복하는 수지 광학계(124)의 외관 구조(미도시)를 도 1에서는 반구로 나타내었으나, 이에 국한되는 것은 아니며, LED칩(122)에서 출력되는 광의 형상(shape)을 어떻게 만들어줄 것인가에 따라 여러가지 다른 형태로 수지 광학계(124)를 만들 수 있다. 예를 들어서, 수지 광학계(124)를 반구 형상 이외에, 직육면체, 원기둥 또는 위로 볼록한 형상이 되도록 만들 수도 있다. 또한 광학계의 표면에 홀로그램 혹은 회절패턴 등 다양한 형상(미도시)이 각인될 수도 있다. 수지 광학계(124)를 통해 나오는 광은 광확산판(140)으로 들어 가거나, 인쇄회로기판(110) 위에 설치되는 유연성 재질의 후면 반사판(130)을 거치게 된다. 후면 반사판(130)은 수지 광학계(124)를 통해 밖으로 나온 광이 광확산판(140)을 거친 다음 다시 인쇄회로기판(110) 쪽으로 되돌아가는 것을 방지하기 위한 역할을 하는 것으로서, 이 역시 인쇄회로기판(110)과 마찬가지로 유연성 재질로 만들어지는데, 예컨대 알루미늄, PET, 스테인리스스틸 등을 그 재질로 삼을 수 있다. 후면 반사판(130)의 관통공(132)을 통과하는 광은, 이를 외부로 결합하기 위해 관통공(132)에 대응되는 위치에 결합공(142)를 가지며, 후면 반사판(130)의 상부에 위치하는 유연성 재질의 광확산판(140)을 거치게 된다. 광확산판(140)에 만들어진 결합공(142)은 위가 막힌 중공 실린더로 나타내었으나, 이에 국한되는 것은 아니며, 수지 광학계(124)로부터 나오는 광의 방사형태와, 광을 어떻게 광확산판(140)과 결합할 것인가에 따라 그 상면이 막힌 여러 가지 다른 형상으로 만들 수 있다. 대부분 결합공의 상면 구조체는 볼록렌즈 또는 원뿔 형태로 광확산판(140)의 몸체에 광을 효율적으로 결합하도록 해주는 역할을 한다. 광확산판(140) 상에는 광을 균일하게 외부에 방사시키는 유연성 재질의 광 시트(150)가 설치된다. 후술하겠지만, 특히 복수 개의 유연 박형 LED 조명 패널을 연결하여 대면적의 조명장치를 구성하였을 때 이와 같은 광 시트(150)가 없다면 패널의 접면과 접점에 암영이 발생하여 불균일한 조명이 이루어지게 된다. 또한, 인쇄회로기판(110)의 하부에는 LED 칩에서 발생하는 열을 외부로 방출하기 위한 방열판(heat spreader; 160)이 가압접착제(105)에 의해 부착되는데, 이 역시 알루미늄 시트와 같은 유연성 재질로 만들어진다. 이 뿐만 아니라, 광확산판(140)와 광 시트(150) 모두 유연성 재질로 만들어지는데, 그 재질로는 폴리올레핀계 수지, PET, 폴리카보네이트 시트 등을 사용하는 것이 바람직하다. 이와 같은 구조를 갖는 유연 박형 LED 조명 패널(100)에서는, 인쇄회로기판(110) 상에 2차원 어레이의 메시 형태로 복수의 LED 칩(122)들을 실장하고, LED 칩(122)들에 1:1 대응되게 이들의 각각을 몰딩하여, LED 칩(122)들의 각각에서 나오는 광의 형태를 만들어주는 렌즈 역할을 하는 복수의 수지 광학계(124)들로 LED 광원부가 이루어지기 때문에, 얇고 가벼운 LED 조명 패널을 구현할 수 있다. 또한, 인쇄회로기판(110), 후면 반사판(130), 광확산판(140), 광 시트(150) 및 방열판(160)이 모두 유연성 재질로 만들어져서, 다양한 설치 환경에 쉽게 대응할 수 있다.1 is a view for explaining the structure of a flexible thin LED lighting panel according to an embodiment of the present invention, more specifically, Figure 1 (a) is an exploded perspective view, Figure 1 (b) is a cross-sectional view thereof. Referring to FIG. 1, in the flexible thin LED lighting panel 100, a plurality of LED chips 11 corresponding to a light source and a resin optical system 124 molding each of them are flexible materials having a circuit pattern (not shown), For example, the flexible printed circuit board 110 made of polyimide is arranged in a mesh-shaped two-dimensional array. Here, the external structure (not shown) of the resin optical system 124 covering the LED chip 122 is shown as a hemisphere in FIG. 1, but is not limited thereto, and shapes of light output from the LED chip 122 may be provided. Depending on how to make the resin optical system 124 can be made in many different forms. For example, the resin optical system 124 may be made to have a rectangular parallelepiped, cylinder, or upward convex shape in addition to the hemispherical shape. In addition, various shapes (not shown) such as holograms or diffraction patterns may be imprinted on the surface of the optical system. The light emitted through the resin optical system 124 enters the light diffusion plate 140 or passes through the rear reflector 130 of a flexible material installed on the printed circuit board 110. The rear reflector 130 serves to prevent the light exiting through the resin optical system 124 from going back to the printed circuit board 110 after passing through the light diffusion plate 140, which is also a printed circuit board. Like 110, it is made of a flexible material, for example, aluminum, PET, stainless steel, etc. may be used as the material. The light passing through the through hole 132 of the rear reflector 130 has a coupling hole 142 at a position corresponding to the through hole 132 to be coupled to the outside, and is located above the rear reflector 130. The light diffusion plate 140 of the flexible material to pass through. Coupling hole 142 made in the light diffusion plate 140 is shown as a hollow cylinder blocked, but is not limited to this, the radiation form of the light emitted from the resin optical system 124, and how the light diffuser plate 140 Depending on whether or not to combine with the can be made into a number of different shapes with the top blocked. Most of the upper surface structure of the coupling hole serves to effectively couple the light to the body of the light diffusion plate 140 in the form of a convex lens or a cone. On the light diffusion plate 140, a light sheet 150 of a flexible material for uniformly radiating light to the outside is installed. As will be described later, in particular, when a plurality of flexible thin LED lighting panels are connected to constitute a large area lighting device, if there is no such light sheet 150, darkening occurs at the contact surfaces and the contacts of the panel, thereby making the illumination uneven. In addition, a heat spreader 160 for dissipating heat generated from the LED chip to the outside of the printed circuit board 110 is attached by the pressure-sensitive adhesive 105, which is also made of a flexible material such as an aluminum sheet. Is made. In addition, the light diffusion plate 140 and the light sheet 150 are both made of a flexible material, it is preferable to use a polyolefin resin, PET, polycarbonate sheet and the like. In the flexible thin LED lighting panel 100 having such a structure, the plurality of LED chips 122 are mounted on the printed circuit board 110 in the form of a mesh in a two-dimensional array, and the LED chips 122 have one: 1 The LED light source unit is made of a plurality of resin optical systems 124 serving as lenses to mold each of them correspondingly to form a shape of light emitted from each of the LED chips 122, thereby making a thin and light LED lighting panel. Can be implemented. In addition, the printed circuit board 110, the rear reflector 130, the light diffusion plate 140, the light sheet 150 and the heat sink 160 are all made of a flexible material, it can easily cope with various installation environments.

도 2는 본 발명의 실시예에 따른 박형 LED 조명 패널에서 인쇄회로기판(110) 상의 하나의 LED 칩(122)과 수지 광학계(124)를 단면으로 나타낸 도면이다. 도 2를 참조하면, 인쇄회로기판(110) 상에 배열된 복수의 LED 칩(122)들의 각각에 대해 1:1 대응되게 몰딩하는 수지 광학계(124)가 있음을 알 수 있다. 이러한 수지 광학계(124)는 LED 칩(122)에서 나오는 광의 형상을 만들어주는 역할을 하므로 투명 재질로 만들어져야 하는데, 그 기능을 수행하기만 하면 그 재질은 특별히 제한되지는 않으나, 실리콘계 수지, 에폭시 수지, 우레탄계 수지 및 그 혼합물로 구성된 군으로부터 선택된 어느 하나를 재질로 하여 만들 수 있다. 수지 광학계(124)는 직육면체 또는 원기둥 형상이거나 반구 또는 볼록한 형상일 수 있는데, 굴절 광학계(렌즈)인 경우 수지 광학계(124)는 볼록 형상 또는 반구형상을 가지고 위로 볼록할수록 지향각이 좁아지게 되므로 필요에 따라서 그 곡률반경을 조절하면 된다. 또한, 상기 경우 수지 광학계(124)에서 외부로 방출되는 광이 수지 광학계(124)와 외부와의 계면에 임계각보다 작게 입사하게 될 확률이 커져서 전반사가 감소하게 된다. 그 결과, 광추출 효율이 증가하게 된다. 회절광학계의 경우 수지 광학계(124)는 직육면체, 원기둥 또는 상기 굴절광학계와 동일한 형상으로 원하는 광형상을 만들기 위하여 그 표면에 회절 또는 홀로그램 패턴을 각인할 수도 있다. 한편 상기 수지 광학계(124)의 패턴은 핫엠보싱, 식각, 압축성형, UV 몰딩 등 여러 가지 방법에 의하여 형성될 수 있지만, LED 칩(122)의 실장과 함께 같은 유연 인쇄회로기판(110) 상에 수지 광학계(124)를 적층할 수 있는 압축성형이나 UV 몰딩 방법을 채용함으로써 LED 광원부의 양산성을 높일 수 있다.2 is a cross-sectional view of one LED chip 122 and a resin optical system 124 on a printed circuit board 110 in a thin LED lighting panel according to an embodiment of the present invention. Referring to FIG. 2, it can be seen that there is a resin optical system 124 that molds correspondingly to each of the plurality of LED chips 122 arranged on the printed circuit board 110. Since the resin optical system 124 serves to make the shape of the light emitted from the LED chip 122, it should be made of a transparent material, but the material is not particularly limited as long as the resin optical system 124 performs the function thereof. , Urethane-based resins and mixtures thereof may be made of any one selected from the group consisting of materials. The resin optical system 124 may have a rectangular parallelepiped or a cylindrical shape, or a hemispherical or convex shape. In the case of a refractive optical system (lens), the resin optical system 124 has a convex shape or a hemispherical shape, and as the convex upwards, the orientation angle becomes narrower. Therefore, the radius of curvature may be adjusted. In addition, in this case, the probability that the light emitted from the resin optical system 124 to the outside is incident on the interface between the resin optical system 124 and the outside becomes smaller than the critical angle, thereby reducing the total reflection. As a result, the light extraction efficiency is increased. In the case of a diffractive optical system, the resin optical system 124 may imprint a diffraction or hologram pattern on a surface thereof to form a desired optical shape in the same shape as a rectangular parallelepiped, a cylinder, or the refractive optical system. Meanwhile, the pattern of the resin optical system 124 may be formed by various methods such as hot embossing, etching, compression molding, and UV molding. However, the resin optical system 124 may be formed on the flexible printed circuit board 110 together with the mounting of the LED chip 122. By employing compression molding or a UV molding method in which the resin optical system 124 can be laminated, mass productivity of the LED light source unit can be improved.

도 3은 본 발명의 실시예에 따른 박형 LED 조명 패널을 여러 개 이용하여 더 욱 넓은 면적의 LED 조명 패널을 구현한 경우를 설명하기 위한 도면이다. 도 3을 참조하면, 도 1에 도시된 박형 LED 조명 패널에서 광 시트를 제거한 구조체를 하나의 유닛으로 하고 이들의 2x2개가 측면이 맞닿도록 연결한 후, 각각의 유닛 박형 LED 조명 패널에서 나오는 광을 외부로 균일하게 방사시키는 유연성 재질의 광 시트(150')가 상기 유닛 박형 LED 조명 패널의 모두를 커버하도록 대면적이 되게 만들어 부착하면, 결국 더욱 넓은 면적의 박형 LED 조명 패널을 구현할 수 있음을 알 수 있다.3 is a view for explaining a case of implementing a LED lighting panel of a larger area by using a plurality of thin LED lighting panel according to an embodiment of the present invention. Referring to FIG. 3, after the light sheet is removed from the thin LED lighting panel illustrated in FIG. 1 as a unit, and 2 × 2 of them are connected to each other, the light emitted from each unit thin LED lighting panel is connected. It can be seen that when the flexible sheet of light 150 ', which is uniformly radiated to the outside, is made to be attached to a large area to cover all of the unit thin LED lighting panels, a thinner LED lighting panel having a larger area can be realized. Can be.

도 1은 본 발명의 실시예에 따른 유연 박형 LED 조명 패널의 구조를 설명하기 위한 도면;1 is a view for explaining the structure of a flexible thin LED lighting panel according to an embodiment of the present invention;

도 2는 본 발명의 실시예에 따른 유연 박형 LED 조명 패널에서 인쇄회로기판 상의 하나의 LED 칩과 수지 몰딩부를 단면으로 나타낸 도면; 및2 is a cross-sectional view of one LED chip and a resin molding on a printed circuit board in a flexible thin LED lighting panel according to an embodiment of the present invention; And

도 3은 본 발명의 실시예에 따른 유연 박형 LED 조명 패널을 여러 개 이용하여 더욱 넓은 면적의 LED 조명 패널을 구현한 경우를 설명하기 위한 도면이다.3 is a view for explaining a case of implementing a LED lighting panel of a larger area by using a plurality of flexible thin LED lighting panel according to an embodiment of the present invention.

* 도면 중의 주요 부분에 대한 참조부호의 설명 *Explanation of reference numerals for main parts of the drawings

100: 유연 박형 LED 조명 패널100: flexible thin LED lighting panel

110: 연성 인쇄회로기판110: flexible printed circuit board

122: LED 칩122: LED chip

124: 수지 광학계124: resin optical system

130: 후면 반사판130: rear reflector

132: 관통공132: through hole

140: 광확산판140: light diffusion plate

142: 결합공142: coupling hole

150: 광 시트150: light sheet

160: 방열판160: heat sink

Claims (9)

유연성 재질로 만들어지며 회로 패턴이 형성된 인쇄회로기판과, 상기 인쇄회로기판 상에 2차원 어레이 형태로 실장된 복수의 LED 칩들과, 상기 LED 칩들에 1:1 대응되게 이들의 각각을 몰딩하되 상기 LED 칩들의 각각에서 나오는 광의 형상을 만들어주는 복수의 수지 광학계들과, 상기 LED 칩들과 수지 광학계들의 각각에 대응되는 위치에 관통공을 가지며 상기 인쇄회로기판에 설치되는 유연성 재질의 후면 반사판과, 상기 광학계들을 나온 광을 효율적으로 몸체에 결합시키기 위해 상기 관통공에 대응되는 위치에 결합공을 가지며 상기 후면 반사판의 상부에 위치하는 유연성 재질의 광확산판이 구비되어 이루어지는 LED 조명 패널 유닛을,A printed circuit board made of a flexible material and having a circuit pattern formed thereon, a plurality of LED chips mounted in a two-dimensional array form on the printed circuit board, and molding each of them in a one-to-one correspondence with the LED chips. A plurality of resin optical systems for forming a shape of light emitted from each of the chips, a rear reflector of a flexible material installed on the printed circuit board and having a through hole at a position corresponding to each of the LED chips and the resin optical systems, and the optical system LED lighting panel unit having a coupling hole in a position corresponding to the through hole in order to efficiently combine the light emitted to the body and is provided with a light diffusion plate of a flexible material located on the upper side of the rear reflector, 복수 개 연결한 후, 각각의 상기 LED 조명 패널 유닛에서 나오는 광을 균일하게 외부에 방사시키는 유연성 재질의 광 시트가 상기 LED 조명 패널 유닛을 모두를 커버하도록 대면적이 되게 만들어 부착한 것을 특징으로 하는 유연 박형 LED 조명 패널.After connecting a plurality of, the light sheet of a flexible material for uniformly radiating the light emitted from each of the LED lighting panel unit to the large area to cover the LED lighting panel unit, characterized in that attached to Flexible thin LED light panel. 제1항에 있어서, 상기 광 시트는 각각의 상기 광확산판 상에 위치하며, 상기 광확산판을 통과하는 광을 균일하게 외부에 방사시키는 유연성 재질로 이루어지는 것을 특징으로 하는 유연 박형 LED 조명 패널.The flexible thin LED lighting panel of claim 1, wherein the light sheet is disposed on each of the light diffusion plates, and is made of a flexible material that uniformly radiates the light passing through the light diffusion plates to the outside. 제2항에 있어서, 상기 복수의 LED 칩들과 1:1 대응하는 상기 수지 광학계들이 상기 LED 칩들과 같은 연성 인쇄회로기판에 몰딩되는 것을 특징으로 하는 유연 박형 LED 조명 패널.The flexible thin LED lighting panel of claim 2, wherein the resin optical systems corresponding to the plurality of LED chips 1: 1 are molded on a flexible printed circuit board such as the LED chips. 제2항에 있어서, 상기 광확산판의 결합공이 중공 실린더 형태로서, 그 상면이 막혀있는 것을 특징으로 하는 유연 박형 LED 조명 패널.The flexible thin LED lighting panel according to claim 2, wherein the coupling hole of the light diffusion plate is in the form of a hollow cylinder, and an upper surface thereof is blocked. 제2항에 있어서, 상기 수지 광학계가 직육면체, 원기둥, 위로 볼록한 형상 또는 반구형상을 가지는 것을 특징으로 하는 유연 박형 LED 조명 패널.The flexible thin LED lighting panel according to claim 2, wherein the resin optical system has a rectangular parallelepiped, a cylinder, an upwardly convex shape, or a hemispherical shape. 제5항에 있어서, 상기 수지 광학계의 표면에, 원하는 광형상을 만들기 위하여, 회절 또는 홀로그램 패턴이 각인된 것을 특징으로 하는 유연 박형 LED 조명 패널. The flexible thin LED lighting panel according to claim 5, wherein a diffraction or hologram pattern is imprinted on the surface of the resin optical system to create a desired optical shape. 제2항에 있어서, 상기 연성 인쇄회로기판이 폴리이미드로 만들어진 것을 특징으로 하는 유연 박형 LED 조명 패널.The flexible thin LED lighting panel according to claim 2, wherein the flexible printed circuit board is made of polyimide. 제2항에 있어서, 상기 광확산판 및 광시트가 폴리올레핀계 수지, PET 및 폴리카보네이트로 구성된 군으로부터 선택된 어느 하나의 재질로 만들어진 것을 특징으로 하는 유연 박형 LED 조명 패널.The flexible thin LED lighting panel according to claim 2, wherein the light diffusion plate and the light sheet are made of any one material selected from the group consisting of polyolefin resin, PET, and polycarbonate. 삭제delete
KR1020090001846A 2009-01-09 2009-01-09 Flexible Thin LED Lighting Panel Expired - Fee Related KR100908030B1 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101179288B1 (en) 2011-04-08 2012-09-03 이상근 A LED ligth having a epoxy reflection part
KR200462518Y1 (en) * 2011-04-06 2012-09-13 주식회사 유니테스트 LED Light Using High-Luminance Reflector
KR101316850B1 (en) 2013-07-19 2013-10-08 주식회사 금영 Fish-luring lamp having led
US8587747B2 (en) 2009-09-10 2013-11-19 Samsung Display Co., Ltd. Backlight assembly with a reflective member covering interface between substrate units
KR20160145421A (en) 2015-06-10 2016-12-20 주식회사코노바코리아 The folding surface illuminant apparatus
KR101940421B1 (en) 2017-12-01 2019-01-18 김종수 Portable flexible light emitting diode lighting device and producing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080060887A (en) * 2006-12-27 2008-07-02 엘지디스플레이 주식회사 Backlight Assembly for Flexible Liquid Crystal Display
KR100868204B1 (en) * 2006-12-20 2008-11-12 서울반도체 주식회사 Light emitting diode using diffusion material and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100868204B1 (en) * 2006-12-20 2008-11-12 서울반도체 주식회사 Light emitting diode using diffusion material and manufacturing method thereof
KR20080060887A (en) * 2006-12-27 2008-07-02 엘지디스플레이 주식회사 Backlight Assembly for Flexible Liquid Crystal Display

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587747B2 (en) 2009-09-10 2013-11-19 Samsung Display Co., Ltd. Backlight assembly with a reflective member covering interface between substrate units
US9746155B2 (en) 2009-09-10 2017-08-29 Samsung Display Co., Ltd. Backlight assembly with a reflective member covering interface between substrate units
KR200462518Y1 (en) * 2011-04-06 2012-09-13 주식회사 유니테스트 LED Light Using High-Luminance Reflector
KR101179288B1 (en) 2011-04-08 2012-09-03 이상근 A LED ligth having a epoxy reflection part
KR101316850B1 (en) 2013-07-19 2013-10-08 주식회사 금영 Fish-luring lamp having led
KR20160145421A (en) 2015-06-10 2016-12-20 주식회사코노바코리아 The folding surface illuminant apparatus
KR101940421B1 (en) 2017-12-01 2019-01-18 김종수 Portable flexible light emitting diode lighting device and producing method thereof

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