KR100895521B1 - 스프레이 코팅을 이용한 탄소나노튜브 투명도전막 및 그제조방법 - Google Patents
스프레이 코팅을 이용한 탄소나노튜브 투명도전막 및 그제조방법 Download PDFInfo
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- KR100895521B1 KR100895521B1 KR1020070103258A KR20070103258A KR100895521B1 KR 100895521 B1 KR100895521 B1 KR 100895521B1 KR 1020070103258 A KR1020070103258 A KR 1020070103258A KR 20070103258 A KR20070103258 A KR 20070103258A KR 100895521 B1 KR100895521 B1 KR 100895521B1
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 84
- 239000002041 carbon nanotube Substances 0.000 title claims abstract description 79
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims abstract description 79
- 238000005507 spraying Methods 0.000 title claims abstract description 24
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- 125000004122 cyclic group Chemical group 0.000 claims abstract description 13
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
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- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 5
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- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
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- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- YWLXZCAOJYQMKY-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl.ClC1=CC=CC=C1Cl YWLXZCAOJYQMKY-UHFFFAOYSA-N 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
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Abstract
Description
스프레이 조건 | 패턴 특징 | 투명전극 면저항 (Ω/□) | 투명전극의 투과도 (%) | |
실시예 1 | 분사압력 5kgf/cm2 기질온도: 70℃ | 고리형 패턴 | 700 | 84 |
실시예 2 | 분사 압력 1kgf/cm2 기질온도 70℃ | 고리형 패턴 | 800 | 85 |
비교예 1 | 분사압력 75kgf/cm2 기질온도 70℃ | 불규칙적 모양 | 800 | 75 |
Claims (11)
- 탄소나노튜브, 분산제 및 용매를 혼합 및 분산하여 얻은 코팅 용액을 분사압력 0.05 내지 60kgf/cm2 에서 스프레이하고, 이를 건조하여 형성된 것으로서,서로 연결된 복수의 고리형 패턴을 갖고 있고, 상기 고리의 두께가 0.1-5μm이고, 상기 고리의 직경이 10 ~ 120 μm인 탄소나노튜브 투명도전막.
- 삭제
- 삭제
- 제1항에 있어서, 상기 고리가,내부 일부만 채워지거나 또는 내부가 모두 채워지지 않은 것을 특징으로 하는 탄소나노튜브 투명도전막.
- 탄소나노튜브, 분산제 및 용매를 혼합 및 분산하여 코팅 용액을 준비하는 단계; 및기질상에 상기 코팅 용액을 분사압력 0.05 내지 60kgf/cm2 에서 스프레이하고, 이를 건조하는 단계를 포함하고,상기 코팅 용액에서 탄소 나노튜브의 함량은 코팅 용액의 총중량 100 중량부에 대하여 0.01 내지 20 중량부인 것을 특징으로 하는 탄소나노튜브 투명도전막의 제조방법.
- 제5항에 있어서, 상기 기질이 50 내지 300℃로 가열된 것을 특징으로 하는 탄소나노튜브 투명도전막의 제조방법.
- 삭제
- 제5항에 있어서, 상기 용매의 함량은 탄소나노튜브 1 중량부를 기준으로 하여 100 내지 80000 중량부인 것을 특징으로 하는 탄소나노튜브 투명도전막의 제조방법.
- 제5항에 있어서, 상기 기질이 유리, 폴리머막, 세라믹필름으로 군으로부터 선택된 하나 이상인 것을 특징으로 하는 탄소나노튜브 투명도전막의 제조방법.
- 제5항에 있어서, 상기 용매가 물, 에탄올, 메탄올, 이소프로판올, 1,2-디 클로로 벤젠(1,2-Dichlorobenzene),클로로포름, 디메틸포름아미드 및 아세톤으로 이루어진 군으로부터 선택된 하나 이상인 것을 특징으로 하는 탄소나노튜브 투명도전막의 제조방법.
- 제1항에 있어서, 상기 코팅 용액에서 탄소 나노튜브의 함량은 코팅 용액의 총중량 100 중량부에 대하여 0.01 내지 20 중량부인 것을 특징으로 하는 탄소나노튜브 투명도전막.
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KR1020070103258A KR100895521B1 (ko) | 2007-10-12 | 2007-10-12 | 스프레이 코팅을 이용한 탄소나노튜브 투명도전막 및 그제조방법 |
US12/682,363 US8815399B2 (en) | 2007-10-12 | 2008-10-09 | Carbon nanotube conductive layer using spray coating and preparing method thereof |
PCT/KR2008/005921 WO2009048269A2 (en) | 2007-10-12 | 2008-10-09 | Carbon nanotube conductive layer using spray coating and preparing method thereof |
JP2010528804A JP5390526B2 (ja) | 2007-10-12 | 2008-10-09 | スプレーコーティングを用いたカーボンナノチューブ導電膜およびその製造方法 |
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KR1020070103258A KR100895521B1 (ko) | 2007-10-12 | 2007-10-12 | 스프레이 코팅을 이용한 탄소나노튜브 투명도전막 및 그제조방법 |
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KR20090037755A KR20090037755A (ko) | 2009-04-16 |
KR100895521B1 true KR100895521B1 (ko) | 2009-04-30 |
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US (1) | US8815399B2 (ko) |
JP (1) | JP5390526B2 (ko) |
KR (1) | KR100895521B1 (ko) |
WO (1) | WO2009048269A2 (ko) |
Cited By (1)
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US9617456B2 (en) | 2013-08-01 | 2017-04-11 | Waps Co., Ltd. | Method of manufacturing ceramic coated graphite |
Families Citing this family (11)
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JP5266889B2 (ja) * | 2008-06-04 | 2013-08-21 | ソニー株式会社 | 光透過性導電体の製造方法 |
KR101356260B1 (ko) * | 2009-10-06 | 2014-01-28 | 코오롱인더스트리 주식회사 | 전극기판의 제조방법 |
FR2961625A1 (fr) | 2010-06-16 | 2011-12-23 | Arkema France | Procede de preparation de films transparents conducteurs a base de nanotubes de carbone |
FR2966062B1 (fr) | 2010-10-13 | 2015-05-15 | Thales Sa | Procede de depot de nanoparticules sur une surface et appareil de depot de nanoparticules correspondant |
KR101820483B1 (ko) * | 2012-02-24 | 2018-01-19 | 에스프린팅솔루션 주식회사 | 저항발열 조성물, 및 이를 이용한 발열 복합체 및 그 제조방법, 가열장치 및 정착장치 |
CN105377449B (zh) * | 2013-07-10 | 2018-09-04 | 柯尼卡美能达株式会社 | 涂膜形成方法、带透明导电膜的基材、器件和电子设备 |
WO2015083160A2 (en) * | 2013-12-02 | 2015-06-11 | Clearjet Ltd | Process for controlling wettability features |
JP6446736B2 (ja) * | 2014-07-14 | 2019-01-09 | 株式会社ブイ・テクノロジー | 成膜方法及び成膜装置 |
FR3032362B1 (fr) * | 2015-02-06 | 2020-05-29 | Thales | Procede de depot de nanoparticules et de microparticules carbonees oxydees |
KR102624344B1 (ko) * | 2015-08-27 | 2024-01-11 | 서레이 나노시스템즈 리미티드 | 저반사율 코팅, 및 기판을 코팅하기 위한 방법 및 시스템 |
JP6423058B1 (ja) * | 2017-08-25 | 2018-11-14 | 日本航空電子工業株式会社 | 基材 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990045948A (ko) * | 1999-02-26 | 1999-06-25 | 임지순 | 전계방출팁 |
WO2004052559A2 (en) * | 2002-12-06 | 2004-06-24 | Eikos, Inc. | Optically transparent nanostructured electrical conductors |
JP2006310154A (ja) | 2005-04-28 | 2006-11-09 | Bussan Nanotech Research Institute Inc | 透明導電膜および透明導電膜用コーティング組成物 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004230690A (ja) * | 2003-01-30 | 2004-08-19 | Takiron Co Ltd | 制電性透明樹脂板 |
KR20060084666A (ko) * | 2005-01-20 | 2006-07-25 | 삼성전자주식회사 | 분무건조를 이용한 입상 탄소나노튜브의 제조방법 및 입상탄소나노튜브를 포함하는 페이스트 조성물 |
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2008
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- 2008-10-09 WO PCT/KR2008/005921 patent/WO2009048269A2/en active Application Filing
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990045948A (ko) * | 1999-02-26 | 1999-06-25 | 임지순 | 전계방출팁 |
WO2004052559A2 (en) * | 2002-12-06 | 2004-06-24 | Eikos, Inc. | Optically transparent nanostructured electrical conductors |
JP2006310154A (ja) | 2005-04-28 | 2006-11-09 | Bussan Nanotech Research Institute Inc | 透明導電膜および透明導電膜用コーティング組成物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9617456B2 (en) | 2013-08-01 | 2017-04-11 | Waps Co., Ltd. | Method of manufacturing ceramic coated graphite |
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JP5390526B2 (ja) | 2014-01-15 |
KR20090037755A (ko) | 2009-04-16 |
WO2009048269A2 (en) | 2009-04-16 |
US20100221531A1 (en) | 2010-09-02 |
WO2009048269A3 (en) | 2009-07-16 |
JP2011502034A (ja) | 2011-01-20 |
US8815399B2 (en) | 2014-08-26 |
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