KR100894274B1 - Low dielectric photosensitive resin composition and organic insulating film using same - Google Patents

Abstract

The present invention provides a photosensitive resin composition comprising an alkali-soluble resin, a photosensitive agent and a solvent, wherein the alkali-soluble resin is an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof; Ii) fluorine-based compounds; And iii) a copolymer obtained from an olefinically unsaturated compound. The present invention relates to a photosensitive resin composition for forming an organic insulating film.

The photosensitive resin composition according to the present invention not only has excellent performance in transmittance, flatness, chemical resistance and the like, but also is particularly suitable for forming an interlayer organic insulating film in an LCD manufacturing process by remarkably improving insulation.

Insulating film, photosensitive resin, dielectric constant

Description

LOW-DIELECTRIC PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC PASSIVATION THEREOF}

1 is a cross-sectional view showing a unit cell of a TFT LCD having a typical high opening ratio.

<Description of Drawing>

2a: gate electrode

4a: storage electrode

5: gate insulating film

6: semiconductor layer

8: data line

9a: drain electrode

9b: source electrode

10: organic insulating film

12: pixel electrode

20: lower substrate

The present invention relates to a positive resist composition for forming an organic insulating film of a high-aperture liquid crystal display device, and more particularly, exhibits a low dielectric constant when forming an organic insulating film of a high-opening liquid crystal display device, as well as adhesion to metals and inorganic materials, UV transmittance, The present invention relates to an amphoteric resist composition having excellent physical properties such as residual film ratio, pattern formation property, and chemical resistance.

Generally, liquid crystal displays (hereinafter referred to as LCDs) are used in display devices such as televisions and graphic displays. In particular, an active matrix LCD having a switching element such as a thin film transistor (TFT) for each pixel has a high-speed response characteristic and can be applied to many pixels, which is comparable to a cathode ray tube (CRT). It is greatly contributing to the realization of high quality, large sized, and colorized display screens.

In order to obtain a high quality display screen on the LCD, improvement of the aperture ratio is a priority. Here, the aperture ratio refers to the actual light transmission ratio with respect to the area of the pixel electrode.

In the TFT-LCD, while the demand for its size and high resolution is increasing, while the speed of increasing the efficiency of the battery does not follow, a method of improving the transmittance of the liquid crystal has been developed. As a method of improving the transmittance of a liquid crystal, there are a method of greatly improving the aperture ratio of a liquid crystal panel, a method of improving the transmittance of a polarizing plate, and a method of improving the transmittance of a color filter. Among these methods, a method of improving the aperture ratio of a liquid crystal panel includes arranging ITO pixels having a structure in which an indium tin oxide (ITO) electrode made of a transparent metal called a pixel electrode is arranged on a TFT over the entire pixel region, and the pixels are arranged. The technique of increasing the area of a pixel electrode is used. With this technology, the aperture ratio of conventional TFT-LCDs can be improved from 50-60% to about 80-85%.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings to assist in understanding the high-aperture TFT LCD. 1 is a cross-sectional view of a plan view showing a unit cell of a conventional TFT LCD having a high opening ratio. As illustrated, the storage electrode 4a is formed on the lower substrate 20 at a position spaced apart from the gate electrode 2a by a predetermined distance, and the gate insulating film 5 is formed on the upper front surface of the lower substrate 20. Is formed. The semiconductor layer 6 is formed on the gate insulating film 5 in the form of a pattern through a known process, and the drain electrode 9a and the source electrode formed together at the time of forming the data line 8 on the semiconductor layer 6. 9b are formed spaced apart from each other.

In addition, an organic insulating film 10 having a low dielectric constant is coated on the upper surface of the lower substrate 20 on which the above-described structure is formed, and the organic insulating film 10 is provided with a contact hole (not shown) for exposing a source electrode. The pixel electrode 12 is formed on the organic insulating layer 10 to be in contact with the source electrode 9b through a contact hole in a portion corresponding to the pixel region and to overlap with a portion of the gate electrode 2a and the data line 8. . Here, the organic insulating film 10 functions to insulate the pixel electrode 12 from the data line 8 and to planarize the lower layer.

In order to form the organic insulating film of FIG. 1, it is common to use the positive resist composition which added the binder resin and the photosensitive agent to the solvent. However, when forming an organic insulating film using a positive resist composition containing a conventional binder resin, not only does not exhibit a sufficient low dielectric constant, but also has poor adhesion with metal and a low residual film rate after development, resulting in poor pattern flatness.

Accordingly, the technical problem to be achieved by the present invention is to provide a photosensitive resin film composition having not only low dielectric constant when forming an organic insulating film of a high-opening liquid crystal display device, but also good adhesion to metal, UV transmittance, residual film rate, flatness, and pattern stability. have.

In order to achieve the above technical problem, the present invention provides an organic insulating film-forming photosensitive resin composition comprising an alkali-soluble resin, a photosensitive agent and a solvent, wherein the alkali-soluble resin is a) unsaturated carboxylic acid, unsaturated carboxylic anhydride, or a mixture thereof. ; Ii) fluorine-based compounds; And (iii) a copolymer obtained from an olefinically unsaturated compound.

In addition, the present invention provides an organic insulating film prepared using the photosensitive resin composition.

In addition, the present invention provides a display device manufactured using the organic insulating film.

Hereinafter, the present invention will be described in more detail.

[A] alkali-soluble resin

Alkali-soluble resin used in the present invention serves to easily form a predetermined pattern that does not generate scum during development,

(Iii) unsaturated carboxylic acids, unsaturated carboxylic anhydrides, or mixtures thereof;

(Ii) fluorine-based compounds; And

(Iii) A copolymer obtained from an olefinically unsaturated compound is preferable, and the copolymer may be in any form such as a random copolymer, an alternating copolymer, a block copolymer, a graft copolymer, and the like.

As the (i) unsaturated carboxylic acid, unsaturated carboxylic anhydride, or mixtures thereof used in the present invention, unsaturated monocarboxylic acids such as acrylic acid and methacrylic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid and the like Unsaturated dicarboxylic acids and anhydrides of these unsaturated dicarboxylic acids, and the like, and these may be used alone or in combination of two or more thereof. Of these, acrylic acid and methacrylic acid are preferably used to have excellent copolymerization reactivity and solubility in aqueous alkali solution.

The weight ratio of the structural unit derived from the above (i) unsaturated carboxylic acid, unsaturated carboxylic anhydride, or mixtures thereof is preferably in the range of 30 to 80% by weight, preferably 45 to 70% by weight, based on the total weight of the copolymer. When the weight ratio of the structural unit is less than 30% by weight, it is difficult to dissolve in the aqueous alkali solution, whereas when it exceeds 80% by weight, the solubility in the aqueous alkali solution tends to be too large.

In addition, the (ii) fluorine-type compound used by this invention can be used individually or in mixture of 2 or more types of fluorine-containing unsaturated compounds represented by following formula (1).

(R1 is a hydrogen atom or a methyl group, R2 is an alkyl group having 1 to 10 carbon atoms unsubstituted or substituted with a fluorine atom)

In particular, as the fluorine-containing unsaturated compound, it is preferable to use a compound represented by the following formulas (2) to (7).

The weight ratio of the structural unit derived from the (ii) fluorine-based compound is in the range of 5 to 70% by weight, preferably 10 to 50% by weight, based on the total weight of the copolymer. If the weight ratio of the structural unit is less than 5% by weight may reduce the formability of the pattern and the reliability in the post-process, if it exceeds 70% by weight there is a fear that the storage stability of the copolymer.

In addition, (i) olefinically unsaturated compounds used in the present invention, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, methyl acrylate Isopropyl acrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, dicyclopentanyl methacrylate, Dicyclopentanyloxyethyl methacrylate, isoboroyl methacrylate, phenyl methacrylate, phenyl acrylate, benzyl acrylate, 2-hydroxyethyl methacrylate, styrene, α-methyl styrene, m- Methyl styrene, p-methyl styrene, vinyl toluene, p-methyl styrene, 1,3-butadiene, isopenne 2,3-dimethyl 1,3-butadiene, and the like It can be used as a mixture of two or more. Preferably styrene, dicyclopentanyl methacrylate, or p-methoxystyrene is advantageous in terms of copolymerization reactivity and solubility in aqueous alkali solution.

It is preferable that the weight ratio of the structural unit derived from the said (iii) olefin type compound is # 10-60 weight% with respect to the total weight of a copolymer, More preferably, it is 15-45 weight% range. When the weight ratio of the structural unit is less than 10% by weight, the pattern is not formed, whereas when it exceeds 60% by weight, the solubility in the aqueous alkali solution tends to increase, making it difficult to form the pattern.

The alkali-soluble resin of the present invention does not require a modification step and can be produced only by a copolymerization step, and can be obtained by radical polymerization of the compounds in the presence of a catalyst (polymerization initiator) in a solvent.

As a solvent used at this time, For example, Alcohol, such as methanol and ethanol; Ethers such as tetrahydrofuran; Cellosorb esters such as methyl cellosorb acetate; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; As other aromatic hydrocarbons, ketones, esters, etc., the same solvents as the solvent used for the composition of the present invention can be used.

The polymerization initiator used for solution polymerization of such monomers used in the present invention may use a radical polymerization initiator, specifically 2,2-azobisisobutyronitrile, 2,2-azobis (2,4 -Dimethylvaleronitrile), 2,2-azobis (4-methoxy 2,4-dimethylvaleronitrile), 1,1-azobis (cyclohexane-1-carbonitrile), or dimethyl-2,2 '-Azobisisobutyrate and the like can be used.

The polystyrene reduced weight average molecular weight (Mw) of the alkali-soluble resin is preferably 3,000 to 25,000, more preferably 5,000 to 15,000. In the case of a film having a molecular weight (Mw) of less than 3,000, developability, residual film ratio, or the like tends to be low, or pattern shape, heat resistance, adhesive strength, etc., tends to be inferior. When molecular weight (Mw) exceeds 25,000, sensitivity decreases and patterns There is a tendency for poor shape, reduced transmittance, and the like.

[B] photosensitizers

The photosensitive agent used in the present invention acts to impart alkali developability to the exposed portion of the composition after exposure, and is 1,2-quinonediazide 4-sulfonic acid ester and 1,2-quinone as 1,2-quinonediazide compounds. Diazide 5-sulfonic acid ester, 1,2-quinonediazide 6-sulfonic acid ester, and the like.

The quinone diazide compound is obtained by reacting a naphthoquinone diazide sulfonic acid halogen compound and a phenol compound under a weak base.

Specific examples of the phenolic compound include 2,3,4-trihydroxybenzophenone, # 2,4,6-trihydroxybenzophenone, 2,2 'or 4,4'-tetrahydroxybenzophenone, 2,3 , 4,3'-tetrahydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,3,4,2'-tetrahydroxy 4'-methylbenzophenone, 2,3, 4,4'-tetrahydroxy 3'-methoxybenzophenone, 2,3,4,2 'or 2,3,4,6'-pentahydroxybenzophenone, 2,4,6,3', 2 , 4,6,4 'or 2,4,6,5'-hexahydroxybenzophenone, 3,4,5,3', 3,4,5,4 'or 3,4,5,5'- Hexahydroxybenzophenone, bis (2,4-dihydroxyphenyl) methane, bis (p-hydroxyphenyl) methane, tri (p-hydroxyphenyl) methane, 1,1,1-tri (p-hydroxy Oxyphenyl) ethane, bis (2,3,4-trihydroxyphenyl) methane, 2,2-bis (2,3,4-trihydroxyphenyl) propane, 1,1,3-tris (2,5 -Dimethyl 4-hydroxyphenyl) -3-phenylpropane, # 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] Bisphenol, bis (2,5-dimethyl # 4-hydroxyphenyl) -2-hydroxyphenylmethane, and the like, and these may be used alone or in combination of two or more thereof.

In the synthesis of the compound, the esterification degree is preferably 45 to 85%, and when the esterification degree is less than 45%, the residual film ratio tends to be sharply worse and sensitivity is higher, and when it exceeds 85%, the storage stability is inferior. There may be a tendency.

The amount of the photosensitizer is preferably used in an amount of 5 to 80 parts by weight, more preferably 10 to 35 parts by weight, based on 100 parts by weight of the alkali-soluble resin. If the amount of the photosensitizer is less than 5 parts by weight, the difference in solubility between the exposed and non-exposed parts becomes small, and if it exceeds 80 parts by weight, the unreacted 1,2-quinone is unreacted when light is irradiated for a short time. Since a large amount of diazide compounds remain and the solubility in aqueous alkali solution becomes too low, development becomes difficult.

[C] solvent

The solvent used in the present invention is methanol, tetrahydrofuran, ethylene glycol monomethyl ether, ethyleglycol monoethyl ether, methyl vertical sol acetate, ethyl vertical sol acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, Ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, propylene glycol monoethyl ether, propylene glycol propyl ether, propylene glycol butyl ether, propylene glycol methyl ethyl acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate , Propylene glycol butyl ether acetate, propylene glycol methyl ethyl propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol butyl ether Lopionate, toluene, xylene, methylethylketone, cyclohexanone, 4-hydroxy 4-methyl 2-pentanone, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, 2-hydroxyethyl propionate, 2 Methyl hydroxy 2-methylpropionate, 2-hydroxy ethyl 2-methylpropionate, methyl hydroxy acetate, ethyl hydroxy ethyl acetate, hydroxy butyl acetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 3-hydroxy Methyl propionate, 3-hydroxyethyl propionate, 3-hydroxypropionic acid propyl, 3-hydroxy propionic acid butyl, 2-hydroxy 3-methylbutyrate, methyl methoxyacetate, ethyl methoxyacetate, methoxyacetic acid propyl, Methoxy butyl acetate, methyl ethoxy acetate, methoxy ethyl acetate, ethoxy acetate propyl, ethoxy butyl acetate, methyl propoxy acetate, ethyl propoxy acetate, propyl propoxy acetate, butyl propoxy acetate, methyl butoxy acetate, Butoxy ethyl acetate, Propyl oxyacetate, butyl butoxy acetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate Propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate, 3-methoxy ethylpropionate, 3-methoxypropionic acid propyl, 3-methoxypropionic acid butyl, 3-ethoxypropionic acid methyl, 3-ethoxypropionic acid ethyl, 3-ethoxypropionic acid propyl, 3-ethoxypropionic acid butyl, 3 Methyl propoxypropionate, 3-propoxypropionate ethyl, 3-propoxypropionic acid propyl, 3-propoxypropionate butyl, 3-butoxypropionate methyl, 3-butoxyethyl propionate, 3-butoxy Ethers such as propyl propionate and butyl 3-butoxypropionate, and the like, and these may be used alone or in combination of two or more thereof.

The solvent is preferably included so that the solid content of the entire photosensitive resin composition is 15 to 60% by weight, more preferably 20 to 45% by weight. When the solids content of the total composition is less than 15% by weight, the coating flatness decreases and the coating thickness becomes thin, and when the content exceeds 60% by weight, there is a problem in that it may give a burden to the coating equipment.

In addition, the photosensitive resin composition of this invention can contain a adhesive agent, an acryl compound, surfactant, etc. as needed.

The adhesive may be used to improve the adhesion between the organic insulating film pattern and the substrate formed through the present invention, and may be used in an amount of 0.1 to 30 parts by weight based on 100 parts by weight of the alkali-soluble resin. As such an adhesive, a silane compound having a reactive substituent such as carboxyl group, methacryl group, isocyanate group, epoxy group, or the like may be used. Specific examples include γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-3, 4-epoxy cyclohexyl ethyltrimethoxysilane, etc., These can be used individually or in combination of 2 or more types.

Moreover, the photosensitive resin composition of this invention can mix | blend surfactant for the effect of a coating improvement and the defect generation prevention effect as needed. As a surfactant, for example, BM-1000, BM-1100 (made by BM Chemie), mecha pack F 142D, copper F 172, copper F 173, copper F 183 (made by Dai Nippon Inki Chemical Co., Ltd.), Prorad FC-135, Copper FC-170C, Copper FC-430, Copper FC-431 (manufactured by Sumitomo 3M Co., Ltd.), Saffron S-112, Copper S-113, Copper S-131, Copper S-141 , S-145 (manufactured by Asahi Glass Co., Ltd.), SH-28PA, copper-190, copper-193, SZ-6032, SF-8428 (manufactured by Toray Silicone Co., Ltd.) Fluorine-based surfactants can be used. As for the usage-amount of these surfactant, it is preferable to use 0.001-5 weight part with respect to 100 weight part of alkali-soluble resin.

Hereinafter, although an Example is given and this invention is demonstrated in more detail, the following Example is only a preferable Example of this invention, and this invention is not limited to the following Example.

Synthesis Examples 1-8: (Preparation of alkali-soluble resin)

Synthesis Example 1

In a flask equipped with a cooling tube and a stirrer, 10 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile), 200 parts by weight of propylene glycol monomethyl ether acetate, 25 parts by weight of methacrylic acid, 15 parts by weight of methacrylic acid heptadecafluorodecyl of 2, 15 parts by weight of styrene, and 35 parts by weight of dicyclopentenyl methacrylate were added, followed by nitrogen substitution, and gently stirring was started. The reaction solution was raised to 70 ° C. to maintain this temperature for 4 hours to obtain a polymer comprising a copolymer. Solid content concentration of the obtained polymer mixed solution is 31% by weight, in order to remove the unreacted monomer of the polymer solution, 200 parts by weight of the polymer solution was precipitated in 1000 parts by weight of normal hexane to remove the solvent through a filtering process. Thereafter, vacuum-dried at 30 ° C or less to completely remove the solvent containing the unreacted monomer remaining after the filtering process to prepare a copolymer having a weight average molecular weight of 13,500.

[Formula 2]

Synthesis Example 2

The weight average molecular weight was carried out in the same manner as in Synthesis Example 1 except for using the methacrylate octafluoropentyl of the following Chemical Formula 3 in place of the methacrylic acid heptadecafluorodecyl of the Chemical Formula 2 in Synthesis Example 1 This 12,000 copolymer was prepared.

[Formula 3]

Synthesis Example 3

The weight average molecular weight was carried out in the same manner as in Synthesis Example 1 except for using hexafluorobutyl methacrylate of formula 4 in place of methacrylic acid heptadecafluorodecyl of formula 2 in Synthesis Example 1. This 11,000 copolymer was prepared.

[Formula 4]

Synthesis Example 4

A weight-average molecular weight was carried out in the same manner as in Synthesis Example 1 except for using pentafluoropentyl methacrylate of Chemical Formula 5 in place of Methacrylic acid heptadecafluorodecyl of Chemical Formula 1a in Synthesis Example 1 This 9,500 copolymer was prepared.

[Formula 5]

Synthesis Example 5

The weight average molecular weight was carried out in the same manner as in Synthesis Example 1 except for using methacrylate hexafluoropropyl of formula 6 in place of methacrylic acid heptadecafluorodecyl of formula 2 in Synthesis Example 1 This 11,000 copolymer was prepared.

[Formula 6]

Synthesis Example 6

A weight-average molecular weight was carried out in the same manner as in Synthesis Example 1, except that trifluoroethyl methacrylate of Chemical Formula 7 was used instead of the methacrylic acid heptadecafluorodecyl of Chemical Formula 2 in Synthesis Example 1. This 9,000 copolymer was prepared.

[Formula 7]

Synthesis Example 7

A weight average molecular weight of 12,000 was carried out in the same manner as in Synthesis Example 1, except that alkyl methacrylate of the following Formula 8 was used instead of the methacrylic acid heptadecafluorodecyl of Formula 2 in Synthesis Example 1. Phosphorus copolymer was prepared.

Synthesis Example 8

A weight average molecular weight of 10,500 was performed in the same manner as in Synthesis Example 1, except that alkyl methacrylate of Formula 9 was used instead of methacrylic acid octafluoropentyl of Formula 2 in Synthesis Example 1. Copolymers were prepared.

　

　

Synthesis Example 9: (Preparation of 1,2-quinonediazide compound)

1 mol of 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol and 1,2-naphthoquinonediazide 5-sulfonic acid [chloride] Condensation reaction of 2 mol [4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol 1,2-naphthoquinonediazide-5 Sulfonic acid esters].

Examples 1-6

[4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl obtained in Synthesis Example 9 based on 100 parts by weight of each copolymer obtained in Synthesis Examples 1 to 6 ] Ethylidene] bisphenol 1,2-naphthoquinone diazide-5-sulfonic acid ester] 20 parts by weight of the mixture, dissolved in diethylene glycol dimethyl ether so that the solid content concentration is 30% by weight, and then millipore filter having a thickness of 0.2 µm. Filtration was carried out to prepare a photosensitive resin composition.

Comparative Examples 1 and 2

Except having used the copolymer obtained in the synthesis examples 7-8, it carried out similarly to Examples 1-6, and manufactured the photosensitive resin composition.

Using the photosensitive resin composition prepared in Examples 1 to 6 and Comparative Examples 1 and 2 to evaluate the physical properties by the following method, the results are shown in Table 1 below.

(1) permittivity measurement

The photosensitive resin composition was formed on the substrate on which the aluminum electrode was formed using a spin coater to form a resist film, and a dielectric constant measuring cell was prepared. The dielectric constant was measured using an impedance analyzer.

(2) Adhesion with metals and inorganics

The photosensitive resin composition was applied onto the substrate using a spin coater for 20 seconds at a speed of 650 rpm, then prebaked at 90 ° C. for 2 minutes, exposed at 365 nm for 15 seconds, and then post-baked at 220 ° C. for 60 minutes. ) To form a resist film, which was put into an autoclave and aged at 100 ° C for 1 hour. The specimens aged in the autoclave are scratched to expose the substrate with a cross hatch cutter, and then attached with an adhesive tape and then detached.

If more than 80 cells out of 100 cells are not detached from the substrate, it is determined as 'good' or 'bad'.

(3) UV transmittance

The photosensitive resin composition was applied onto the substrate using a spin coater for 20 seconds at a speed of 650 rpm, then prebaked at 90 ° C. for 2 minutes, soaked in TMAH 2.38% solution for 50 seconds, and then for 60 seconds with pure water (DI Water). After rinsing, blowing with compressed air, exposing for 40 seconds (bleaching), and performing a postbake at 220 ° C. for 60 minutes to form a resist film of about 3.0 to 3.5 micrometers (um), followed by UV Was transmitted to measure the transmittance of the 400nm region.

(4) residual rate

The photosensitive resin composition was spin-coated on a substrate, the thickness after pre-baking and the thickness ratio (%) of the film formed after removing the solvent by post-baking were removed.

(5) pattern formation

The silicon wafer in which the photosensitive resin composition was formed was cut | disconnected from the vertical direction of a hole pattern, and the result observed with the electron microscope in the cross-sectional direction of the pattern was shown. The pattern side wall was erected at an angle of 80 degrees or more with respect to the substrate, the film was not reduced, and it was determined as 'good', and the reduction of the film was judged as 'film'.

(6) chemical resistance

After the photosensitive resin composition was applied onto the substrate using a spin coater, a resist film formed through a process such as prebake and postbake was applied to a stripper and etchant solution at 40 ° C., 10. After soaking for minutes, the transmittance and thickness of the resist film were examined. When there was no change in transmittance and thickness, it was set as 'good', and when there was a change in transmittance and thickness, it was determined as 'poor'.

division permittivity Adhesive UV transmittance (400nm,%) Residual rate Pattern formation Chemical resistance Example 1 2.9 Good 93 92 Good Good Example 2 2.9 Good 93 91 Good Good Example 3 2.9 Good 93 91 Good Good Example 4 2.9 Good 93 92 Good Good Example 5 3.0 Good 92 92 Good Good Example 6 3.0 Good 92 92 Good Good Comparative Example 1 3.4 Bad 89 88 Film Bad Comparative Example 2 3.4 Bad 89 88 Film Bad

From the Table 1, the photosensitive resin composition according to the present invention exhibited a low dielectric constant as compared to the Comparative Example composition, and had good adhesion to metals and inorganic materials, UV transmittance, residual film rate, pattern formation property, chemical resistance, and the like.

As described above, the photosensitive resin composition according to the present invention may improve adhesion, transmittance, residual film ratio, pattern formation, and chemical resistance properties in an interlayer organic insulating layer of a low dielectric constant, high-opening, liquid crystal display device.

Claims (11)

In the photosensitive resin composition containing [A] @ alkali-soluble resin, the [B] photosensitive agent, and the [C] solvent, the said alkali-soluble resin is (Iii) unsaturated carboxylic acids, unsaturated carboxylic anhydrides, or mixtures thereof; (Ii) a fluorine-based compound represented by the following formula (1); And (Iii) It is a copolymer obtained from an olefinic unsaturated compound, The photosensitive resin composition for organic insulating films. [Formula 1]

(R1 is a hydrogen atom or a methyl group, R2 is an alkyl group having 1 to 10 carbon atoms unsubstituted or substituted with a fluorine atom) delete The photosensitive resin composition for organic insulating films according to claim 1, wherein the alkali-soluble resin has a polystyrene reduced weight average molecular weight (Mw) of 3,000 to 25,000. The method of claim 1, The alkali-soluble resin is (i) 30 to 80% by weight of structural units derived from unsaturated carboxylic acid, unsaturated carboxylic anhydride, or mixtures thereof, (ii) 5 to 70% by weight of structural units derived from fluorine-based compounds, and A photosensitive resin composition for organic insulating films comprising 10 to 60% by weight of the structural unit derived from an olefinically unsaturated compound. The photosensitive resin composition for organic insulating films of Claim 1 in which the said composition contains 5 to 80 weight part of [B] photosensitizers with respect to 100 weight part of [A] alkali-soluble resins. 2. The photosensitive resin composition for organic insulating films according to claim 1, wherein the solid content of the composition is 15 to 60% by weight. The method of claim 1, wherein the photosensitive agent [B] is composed of 1,2-quinonediazide 4-sulfonic acid ester, 1,2-quinonediazide 5-sulfonic acid ester and 1,2-quinonediazide 6-sulfonic acid ester compound It is 1 or more types chosen from the group, The photosensitive resin composition for organic insulating films. The photosensitive resin composition for organic insulating films according to claim 1, wherein the composition further comprises 0.001 to 5 parts by weight of the fluorine-based surfactant based on 100 parts by weight of the alkali-soluble resin. The photosensitive resin composition for organic insulating films according to claim 1, wherein the fluorine-based compound is at least one selected from unsaturated compounds represented by the following Chemical Formulas 2 to 7. [Formula 2]

[Formula 3]

[Formula 4]

[Formula 5]

[Formula 6]

[Formula 7]

An organic insulating film of a display device manufactured using the composition of any one of claims 1 and 3 to 9. A display device comprising the organic insulating film of claim 10.

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