KR100890380B1 - Board Bonding Device - Google Patents

Abstract

The present invention relates to a substrate bonding apparatus, the substrate bonding apparatus according to an embodiment of the present invention is a first chamber having a first cover, a first side wall protruding from the first cover; is disposed inside the first chamber A first surface plate supporting a first substrate, the first plate coupled to a side wall of the first chamber and spaced apart from the first cover; and disposed to face the first cover with the first side wall interposed therebetween, A second chamber configured to form a bonding space with the second substrate; supporting the second substrate in the bonding space and spaced apart from the second chamber; disposed outside the bonding space to support the first sidewall; An alignment unit for moving the first sidewall to align the position of the first substrate with respect to the second substrate; and an elevating unit supporting the first chamber and elevating the first chamber toward the second chamber side. By providing; Without being affected by the deformation of the chamber in accordance with the between the vacuum exhaust, it may proceed with the cementation process to maintain the alignment between the two substrates, there is an effect that it is possible to shorten the process time to be consumed in accordance with the rearranged between two substrates.

Description

Apparatus for assembling substrates}

The present invention relates to a substrate bonding apparatus, and more particularly to a substrate bonding apparatus for bonding two substrates.

As information society has developed, the demand for display devices has increased in various forms. Recently, various flat panel display devices such as liquid crystal display (LCD), plasma display panel (PDP), electro luminescent display (ELD), and vacuum fluorescent display (VFD) have been studied, and some of them are already widely used in real life.

Among them, LCDs are being used for mobile image display devices because of their excellent image quality compared to CRT (Cathode Ray Tube) and the advantages of light weight, thinness, and low power consumption.

The LCD is formed by injecting a liquid crystal between a TFT (Thin Film Transistor) substrate on which an electrode is formed and a CF (Color filter) substrate coated with phosphors. Sealers are provided on the outer circumferential surfaces of the two substrates to prevent leakage of the liquid crystal material, and a spacer is disposed between the two substrates to maintain a gap between the two substrates at predetermined intervals.

In general, the substrate bonding process is performed by a substrate bonding apparatus comprising a second chamber and a first chamber capable of forming an interior in a vacuum state, and the prior art for such substrate bonding apparatus is applied by Fujitsu Co., Ltd. International Publication No. "WO 2004/097509", "Joint Substrate Manufacturing Apparatus", International Publication No. "WO 2003/091970" filed by Shin-Etsu Engineering Co., Ltd. .

Such substrate bonding apparatuses are most often processed in a vacuum atmosphere when the substrates are bonded, and are affected by various main factors. One main element of these is to maintain the spacing between the substrates and to keep the alignment of the two substrates together to bond them together.

This process is preceded by a plurality of alignments to maintain a constant spacing between the two substrates, and then by moving the surface plate to finely align the spacing of the two substrates to perform the bonding.

In the conventional bonding apparatus, when two substrates are micro-adjacent for bonding after alignment, any one substrate is twisted due to flow on the surface plate, resulting in poor alignment due to poor alignment.

In addition, the conventional substrate bonding apparatus has a problem that the alignment between the two substrates due to the deformation of the chamber due to the vacuum exhaust of the bonding space is misaligned. This problem is getting worse as the size of the substrate increases.

Accordingly, an object of the present invention is to provide a substrate bonding apparatus for maintaining alignment of two substrates during vacuum exhaust of the bonding space.

Substrate bonding apparatus according to an embodiment of the present invention includes a first chamber having a first cover, a first side wall protruding from the first cover; disposed inside the first chamber to support the first substrate, the first A first surface plate coupled to the side wall of the chamber and spaced apart from the first cover; a second chamber disposed to face the first cover with the first side wall therebetween, and forming a bonding space together with the first chamber; A second surface plate supporting the second substrate in the bonding space and spaced apart from the second chamber; disposed outside the bonding space, supporting the first sidewall, and moving the first sidewall, And an alignment unit for aligning a position of the first substrate with respect to a second substrate; and an elevation unit supporting the first chamber and elevating the first chamber to the second chamber side.

The first sidewall may be separated from the first cover, and the first chamber may further include a first hermetic member disposed between the first cover and the first sidewall.

It may further include a second hermetic member disposed between the first side wall and the second chamber.

It may further include a frame disposed outside the second chamber, the second chamber is fixed.

A through hole may be formed in the second chamber, and one side may be fixed to the frame, and the other side may further include a surface support shaft fixed through the through hole to the second surface plate.

The diameter of the through hole may be larger than the diameter of the surface support shaft.

A third hermetic member may be further provided between the frame and the second cover.

The second chamber may include a second cover and a second sidewall protruding from the second cover toward the first chamber, and the second surface plate may be coupled to the second sidewall and spaced apart from the second cover. .

The electronic device may further include a detector configured to detect parallelism and an alignment position between the first substrate and the second substrate.

The alignment unit, a support pin for supporting the first side wall at the outside of the bonding space; a screw coupled to the support pin; a rotating motor for rotating the screw to reciprocate the support pin in the axial direction of the screw; And And a reciprocating rail which is spaced apart from the screw and has an axial direction parallel to the screw, supports the support pin and guides the reciprocation of the support pin.

The alignment unit, the screw, the rotating motor and the reciprocating rail is installed on one side, the base on which the cross rail groove is formed on the other side; and the axial direction crossing the axial direction of the screw, the cross rail And a cross rail for engaging the groove to reciprocate in the axial direction intersecting the axial direction of the screw.

The alignment portion may be provided in plurality, and the plurality of alignment portions may include a first alignment portion in which an axial direction of the screw is disposed in a carrying direction of the first substrate, and an axial direction of the screw intersects with a carrying direction of the first substrate. It may be divided into a second alignment portion disposed in the direction.

The lifting unit may include a lifting plate supporting the first chamber and the alignment unit; a lifting cylinder supporting the lifting plate and lifting up and down toward the second chamber; and a pump provided to drive the expansion cylinder. have.

A roller may be further disposed between the first cover and the lifting plate, and supports a movement of the first cover as the first side wall moves by the alignment unit.

The first surface plate and the second surface plate may further include a flatness adjusting unit that adjusts the flatness of the first chuck and the second chuck.

In the substrate bonding apparatus according to the present invention, when the vacuum exhaust of the bonding space, the bonding process can be performed by maintaining the alignment between the two substrates, there is an effect that can reduce the process time consumed according to the rearrangement between the two substrates.

In addition, the substrate bonding apparatus according to the present invention, because the bonding process proceeds in a state in which the alignment between the two substrates is maintained, there is an effect that can produce a high-quality bonding panel.

Hereinafter, a substrate bonding apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing a part of the substrate bonding apparatus according to an embodiment of the present invention. 1 to 2, the substrate bonding apparatus 100 includes a first chamber 110, a second chamber 120, a lifting unit 130, a sensing unit 140, an alignment unit 160, and a frame ( 170).

The first chamber 110 and the second chamber 120 form a bonding space 101 between the first substrate 10 and the second substrate 20. Here, the first chamber 110 may be a lower chamber, and the second chamber 120 may be an upper chamber. The first chamber 110 is provided to be elevated to the second chamber 120 side by the lifting unit 130. The lifting unit 130 raises and lowers the first chamber 110 in the second chamber 120 side direction (hereinafter, referred to as a 'z-axis direction') to seal the bonding space 101.

The first chamber 110 has a first cover 110a and a first sidewall 110b protruding from the first cover 110a. The first chamber 110 includes a first surface plate 111 for supporting the first substrate 10 therein. In this case, the first surface plate 111 is fixed to the first side wall 110b and spaced apart from the first cover 110a.

The first side wall 110b may be provided to be separated from the first cover 110a. In this case, the first chamber 110 further includes a first airtight member 113 such as an O-ring disposed between the first cover 110a and the first sidewall 110b. The first hermetic member 113 maintains hermeticity of the bonding space 101 from a gap formed by separating the first side wall 110b from the first cover 110a.

1 and 2, the first cover 110a and the first sidewall 110b are separated, and the first airtight member 103 is provided between the first cover 110a and the first sidewall 110b. In another embodiment, the first cover 110a and the first sidewall 110b may be integrally formed.

Meanwhile, the substrate bonding apparatus may further include a second hermetic member 103 such as an o-ring disposed between the first chamber 110 and the second chamber 120. In the second hermetic member 103, when the first chamber 110 is raised, the first chamber 110 and the second chamber 120 are in contact with each other, such that the bonding space 101 is sealed. In addition, the second hermetic member 102 maintains hermeticity of the bonding space 101 during the vacuum exhaust of the bonding space 101.

The second chamber 120 includes a second cover 120a and a second sidewall 120b protruding from the second cover 120a toward the first chamber 110. The second chamber 120 has a second surface plate 121 for supporting the second substrate 20 therein.

The frame 170 is disposed outside the second chamber 120, and the second chamber 120 is coupled with the second chamber 120 to have a fixed position with respect to the first chamber 110 that is lifted.

In this case, the substrate bonding apparatus 100 further includes a surface support shaft 151 having one side coupled to the frame 170 and the other side passing through the second chamber 120. The surface support shaft 151 supports the second surface plate 121 so that the second surface plate 121 is spaced apart from the second chamber 120.

Accordingly, the through-hole 151a through which the surface support shaft 151 penetrates is formed in the second chamber 120. The through hole 151a is preferably formed to have a diameter larger than the diameter of the surface support shaft 151. This maintains the supporting state of the second surface plate 121 from deformation of the second chamber 120, which may be generated according to the vacuum exhaust of the bonding space 101, so that the first substrate 10 and the second substrate 20 are maintained. ) To maintain alignment.

The substrate bonding apparatus 100 may further include a third hermetic member 153 disposed between the second chamber 120 and the frame 170. The third hermetic member 153 has a bonding space from the gap between the through-hole 151a and the surface support shaft 151 formed as the diameter of the through hole 151a is larger than the diameter of the surface support shaft 151 ( 101) to keep confidential.

The third hermetic member 153 may be provided in plural and may be installed to have coaxial axes with the plurality of surface support shafts 151, and in another embodiment, the third hermetic member 153 may be provided as a single plurality of surface rings. It may be installed to surround the support shaft 151. The third hermetic member 153 may be adopted as bellows.

Here, in the above description, the second surface plate 121 is supported by the surface support shaft 151 and described as being spaced apart from the second chamber 120. However, in another embodiment, the second surface plate 121 may have a second surface. It may be fixed to the side wall 120b.

3 is a cross-sectional view showing a substrate bonding apparatus according to another embodiment of the present invention. Referring to FIG. 3, in the substrate bonding apparatus 100a, the second surface plate 121 is fixed to the second side wall 120b, and the second surface plate 121 is spaced apart from the second cover 120a.

Accordingly, the above-described configuration of the surface support shaft 151, the through-hole 151a and the third hermetic member 153 of the substrate bonding apparatus 100 may be omitted, and for fixing the surface support shaft 151. Since the frame 170 is omitted, the size of the equipment can be reduced.

This is a configuration for supporting the second surface plate 121 apart from the second cover 120a, and the above-described substrate bonding apparatus 100 and its structure and operation may be considered to be similar to each other.

Again, referring to FIGS. 1 and 2, the first surface plate 111 and the second surface plate 121 may include a first chuck 111b for attaching the first substrate 10 and the second substrate 20, respectively. The first chuck fixing plate 111a, the second chuck 121b, and the second chuck fixing plate 121a may be provided. The first chuck 111b and the second chuck 121b may be one of an electrostatic chuck (ESC), a vacuum suction chuck, and an adhesive chuck.

In this case, a flatness control unit 105 may be provided between the first surface plate 111 and the first chuck fixing plate 111a and between the second surface plate 121 and the second chuck fixing plate 121a. The flatness control unit 105 adjusts the flatness of the first and second chuck fixing plates 111a and 121a with respect to the first and second surface plates 111 and 121, respectively, so as to adjust the flatness of the first and second substrates 10 and 20. Adjust the flatness.

On the other hand, the first substrate 10 is provided with a plurality of alignment marks 11, the second substrate 20 has an alignment hole 21 at a position corresponding to the alignment mark 11 of the first substrate 10. Is formed.

The sensing unit 140 aligns the first substrate 10 and the second substrate 20 by using the alignment mark 11 of the first substrate 10 and the alignment holes 21 of the second substrate 20. It is provided to detect the state. The sensing unit 140 may include a camera 141 for photographing the alignment mark 11, and an illumination device 143 that provides illumination so that the camera 141 may photograph the alignment mark 11. The camera 141 and the lighting device 143 may be provided in plurality in positions corresponding to the alignment mark 11 and the alignment groove 21.

Accordingly, the second chamber 120 penetrates through the second chamber 120 and the second surface plate 121 and is aligned with the alignment holes 21 of the second substrate 20 supported by the second surface plate 121. The communication hole 141a may be formed. In addition, the first chamber 110 penetrates through the first chamber 110 and the first surface plate 111 and is illuminated with an alignment mark 11 of the first substrate 10 supported by the first surface plate 111. The provided lighting hole 143a is formed. The photographing hole 141a and the lighting hole 143a may be provided in plural in positions corresponding to the camera 141 and the lighting device 143.

The sensing unit 140 measures the parallelism of the first substrate 10 and the second substrate 20, and whether the second substrate 20 and the second substrate 20 are aligned.

The parallelism of the first substrate 10 and the second substrate 20 is the sharpness of the alignment mark 11 photographed from each camera 141, or the focal length of each camera 141 photographing the alignment mark 11. Can be measured.

In addition, the alignment mark 11 of the first substrate 10 supported by the first surface plate 111 is connected to the second surface plate 121 to determine whether the second substrate 20 and the second substrate 20 are aligned. It may be determined by photographing whether it is located inside the alignment hole 21 of the second substrate 20 supported.

Here, in the above description, the parallelism of the first substrate 10 and the second substrate 20 is determined using the sharpness of the alignment mark 11 photographed from each camera 141 or the focal length of the camera 141. Although described as being able to measure, although not shown, in another embodiment, a separate gap detecting sensor (not shown) capable of detecting a gap between the first substrate 10 and the second substrate 20 is provided. The parallelism between the first substrate 10 and the second substrate 20 may be measured. As the gap detection sensor (not shown), any one of a non-contact optical sensor, an ultrasonic sensor, and a magnetic sensor may be adopted.

Meanwhile, the elevating unit 130 includes an elevating plate 135 supporting the first chamber 110 and the alignment unit 160, an expansion cylinder 131 supporting the elevating plate 135, and an elevating cylinder 131. A pump 133 is provided to power 131. The expansion cylinder 131 may be adopted as a hydraulic cylinder, and the pump 133 may be adopted as a hydraulic pump motor.

The expansion cylinder 131 and the pump 133 may measure the parallelism between the first substrate 10 and the second substrate 20 by the sensing unit 140, and thus the first substrate 10 and the second substrate 20. ) Can be adjusted. The expansion cylinder 131 and the pump 133 are provided in plural so as to support the edge of the elevating plate 135. The plurality of expansion cylinders 131 and the pump 133 may individually lift each edge of the lifting plate 135.

Meanwhile, the alignment unit 160 aligns the first substrate 10 and the second substrate 20 according to whether the first substrate 10 and the second substrate 20 are aligned by the sensing unit 140. It is provided to adjust the position. The alignment unit 160 is disposed outside the bonding space and provided to support the first sidewall 110b.

Figure 4 is an exploded perspective view showing a coupling relationship of the alignment portion of the substrate bonding apparatus according to an embodiment of the present invention. Referring to FIG. 4, the alignment unit 160 is disposed outside the bonding space 101 and includes a support pin 161 for supporting the first sidewall 110b.

In addition, the alignment unit 160 may have a carry-in direction of the first substrate 10 (hereinafter, referred to as an “x-axis direction”) or a direction intersecting with a carry-in direction of the first substrate 10 (hereinafter, referred to as “y-axis”). Direction ”, a reciprocating rail 163a, a screw 163b spaced apart from the reciprocating rail 163a and having an axial direction parallel to the reciprocating rail 163a, and a drive motor for rotating the screw 163b. 163c is provided. The reciprocating rail 163a, the screw 163b, and the driving motor 163c reciprocate the support pin 161 in the x-axis direction or the y-axis direction.

The reciprocating rail 163a guides the reciprocation of the support pin 161 reciprocated in the x-axis direction or the y-axis direction by the drive motor 163c and the screw 163b, and the drive motor 163c and the screw 163b. The support pins 161 can be reciprocated stably from vibrations that may be generated by driving of the support pins. In addition, the reciprocating rail 163a, together with the screw 163b, supports the support pin 161 from the load of the first side wall 110b.

The support pin 161 is screwed to the screw 163b to be reciprocated in the x-axis direction or the y-axis direction as the screw 163b is rotated. That is, the support pin 161 has a reciprocating rail groove 161a to which the reciprocating rail 163a is coupled, and a fastening hole 161b to be screwed to the screw 163b to form a screw 163b. It is reciprocated according to the rotation.

Here, in the above description, as a means for linearly moving the support pin 161 in the x-axis direction or the y-axis direction, the form of an LM guide including a reciprocating rail 163a, a screw 163b, and a driving motor 163c is provided. Although described as an example, all of the support pins 161 linearly moved in the x-axis direction or the y-axis direction, and the support pins 161 can stably support and reciprocate the first sidewall 110b. It may be adopted as one of the linear moving means.

Meanwhile, as illustrated in FIGS. 1 and 2, the alignment units 160 are provided in plural so as to support the edges of the side walls 110, and the plurality of alignment units 160 reciprocates the first side walls 110b. According to the direction, the first alignment unit 160a and the second alignment unit 160b may be divided.

The first alignment unit 160a may reciprocate the first sidewall 110b in the x-axis direction, and the second alignment unit 160b may reciprocate the first sidewall 110b in the y-axis direction. That is, the first alignment unit 160a reciprocates the support pin 161 in the x-axis direction, and the second alignment unit 160b reciprocates the support pin 161 in the y-axis direction.

At this time, when any one of the first alignment unit 160a and the second alignment unit 160b is aligned, the support pin 161 is not driven when the support pin 161 is in the x-axis direction or the y-axis direction. The other one alignment unit 160 is preferably installed to be interlocked according to the driving of the alignment unit 160 to be driven.

Accordingly, each of the alignment units 160 may further include a cross rail 165a in a direction crossing the reciprocating direction of the support pins 161, and the cross rail grooves may be provided at the base 165 of each alignment unit 160. 165b may be formed.

Referring back to FIGS. 1 and 2, a roller 115 may be provided between the first cover 110a and the lifting plate 135. The roller 115 supports the first cover 110a and moves the first cover 110a as the first sidewall 110b is reciprocated by the alignment unit 160.

The roller 115 is provided in plural and moves the first cover 110a according to the moving direction of the first sidewall 110b by the first alignment portion 160a and the second alignment portion 160b. It may be divided into a first roller 115a and a second roller 115b.

The plurality of rollers 115 may be provided to be individually elevated. That is, any one of the rollers 115 of the first roller 115a and the second roller 115b is driven so that the first lid 110a is not driven when the first lid 110a is in the x-axis direction or the y-axis direction. One roller 115 is preferably lowered so as not to contact the first cover (110a).

On the other hand, although not shown, the substrate bonding apparatus 100 includes a pump (not shown) for forming the bonding space 101 in a vacuum atmosphere for bonding the first substrate 10 and the second substrate 20, The control unit (not shown) for controlling the pump 133 and the alignment unit 160 may be provided according to the alignment state of the two substrates 10 and 20 measured by the sensing unit 140.

Hereinafter, the operation of the substrate bonding apparatus according to the embodiment of the present invention will be described in detail with reference to the accompanying drawings.

5, 6, and 7 are enlarged views showing an operation state of the substrate bonding apparatus according to the embodiment of the present invention, in which “A” portion shown in FIG. 1 is enlarged.

First, referring to FIG. 5, in the standby state, the first substrate 10 and the second substrate 20 (hereinafter, referred to as 'two substrates') are brought into the open bonding space 101 and the two substrates. 10 and 20 are supported by the first surface plate 111 and the second surface plate 121, respectively. That is, the two substrates 10 and 20 are supported to face each other in the bonding space 101. In this case, the flatness of the first and second surface plates 111 and 121 of the two substrates 10 and 20 is controlled by the flatness control unit 105.

In the first substrate 10, since the first surface plate 111 is coupled to the first sidewall 110b, the first substrate 10 is spaced apart from the first chamber 110. In addition, the second substrate 20 maintains a state in which the second surface plate 121 is spaced apart from the second chamber 120 and thus is spaced apart from the second chamber 120.

When the two substrates 10 and 20 are supported to face each other in the bonding space 101, the lifting unit 130 raises the expansion cylinder 131. As the expansion cylinder 131 is raised, the lifting plate 135 supported by the expansion cylinder 131, the first cover 110a and the alignment unit 160 supported by the lifting plate 135 also rise together. do. That is, as the expansion cylinder 131 is raised, the first chamber 110 is raised to the second chamber 120 side.

6, as the first chamber 110 is raised, the two substrates 10 and 20 are close to each other. When the two substrates 10 and 20 are in close proximity, the sensing unit 140 is in an alignment state of the two substrates 10 and 20, that is, the parallelism of the two substrates 10 and 20, and the position alignment of the two substrates 10 and 20. Measure whether or not. In other words, the lighting device 143 provides illumination to the alignment mark 11 through the lighting hole 143a, and the camera 141 captures the alignment mark 11 through the photographing hole 141a.

First, the sensing unit 140 measures the parallelism of the two substrates 10 and 20. When the distance between the two substrates 10 and 20 is parallel, each alignment mark 11 is clearly photographed by each camera 141.

On the other hand, when the distance between the two substrates 10 and 20 is not parallel, one of the plurality of cameras 141, the focus of the camera 141 is not accurately formed, the alignment mark 11 is blurred.

The control unit (not shown) controls the pump 133 provided on the side where the alignment mark 11 is located, and the expansion cylinder 131 photographs the lifting plate 135 with the alignment mark 11 clearly. Lift to the desired position.

In another embodiment, the controller (not shown) may adjust the focal length of the camera 141 in which the alignment mark 11 is located to obtain a focal length in which the alignment mark 11 is clearly captured. That is, a distance adjusting distance of the first surface plate 111 may be calculated by comparing the focal length with which the alignment mark 11 is blurred and the focal length with which the alignment mark 11 is clearly captured. The controller (not shown) controls the pump 133, and the expansion and contraction cylinder 131 raises and lowers the lifting plate 135 by the distance adjusting distance.

As described above, the sensing unit 140 measures the parallelism of the two substrates 10 and 20, and each expansion cylinder 131 and the pump 133 individually lift each edge of the elevating plate 135 to thereby increase the first substrate. By adjusting the distance of the second substrate 20 with respect to (10), the parallelism between the two substrates (10, 20) can be adjusted.

Subsequently, referring to FIG. 7, the sensing unit 140 measures whether the two substrates 10 and 20 are aligned. When the two substrates 10 and 20 are aligned at the alignment position, each alignment mark 11 is positioned inside each alignment hole 21, and each camera 141 may photograph the alignment mark 11. .

On the other hand, when the two substrates 10 and 20 are out of alignment, each alignment mark 11 moves away from each alignment hole 21, and each camera 141 photographs only a portion of the alignment mark 11. Alternatively, the alignment mark 11 may not be photographed.

The controller (not shown) controls the alignment unit 160 to move the first sidewall 110b such that the alignment mark 11 is positioned inside the alignment hole 21. In other words, the controller (not shown) controls the first alignment unit 160a, moves the support pins 161 in the x-axis direction, and controls the second alignment unit 160b to control the support pins 161. Move in the y-axis direction.

As the support pin 161 moves, the first sidewall 110b moves in the x-axis direction or the y-axis direction, and is supported by the first surface plate 111 coupled to the first sidewall 110b. The position of the substrate 20 is also moved together.

At this time, when the support pin is moved in the x-axis direction by the first alignment unit 160a, the second alignment unit 160b is interlocked in the x-axis direction along the cross rail 165a. In addition, when the support pin 161 moves in the y-axis direction by the second alignment part 160b, the second alignment part 160b is interlocked in the y-axis direction along the cross rail 165a.

Here, if the first sidewall 110b is moved by several μm for alignment between the two substrates 10 and 20, even if the first sidewall 110b is in contact with the first hermetic member 113, the bonding space 101 may be used. In the atmospheric pressure state, the first sidewall 110b is capable of slip movement. On the other hand, if the first sidewall 110b is to be moved beyond the micrometer unit for alignment between the two substrates 10 and 20, lubricant is applied to the contact surface between the first sidewall 110b and the first hermetic member 113 to be prepared. One side wall 110b may be smoothly moved.

In addition, in the above description, it is described that only the first sidewall 110b is reciprocated by the alignment unit 160 when the two substrates 10 and 20 are aligned. However, in another embodiment, the first sidewall 110b is used. According to the reciprocation of), the first cover 110a may also reciprocate together. In accordance with the reciprocation of the first side wall 110b, when the first cover 110a is reciprocated together, the roller 115 assists in reciprocating the first cover 110a.

In addition, in the above description, it is described that after adjusting the parallelism between the two substrates 10 and 20, the positions between the two substrates 10 and 20 are aligned, but the order of the two substrates 10 and 20 are changed. After aligning the position between the two, the parallelism between the two substrates (10, 20) may be adjusted.

As such, the sensing unit 140 measures whether the two substrates 10 and 20 are aligned, and each alignment unit 160 moves the position of the first sidewall 110b to the second substrate 20. The position of the first substrate 10 may be adjusted to align the position between the two substrates 10 and 20.

8 is a simplified view showing a vacuum exhaust state of the bonding space during the operation of the substrate bonding apparatus according to an embodiment of the present invention. Referring to FIG. 8, when the alignment between the two substrates 10 and 20 is finished, the first chamber 110 is raised to the second chamber 120 side, and as the first chamber 110 is raised, the second hermetic member 103 is in contact with the second chamber 120 and the bonding space 101 is closed.

 When the bonding space 101 is closed, vacuum exhaust of the bonding space 101 is performed, and as the vacuum exhaust is performed, the bonding space 101 is converted into a vacuum atmosphere. At this time, the central cover of the first cover 110a and the second cover 110b may be bent and deformed toward the bonding space 101 according to the vacuum exhaust of the bonding space 101.

The first substrate 10 is spaced apart from the first cover 110a, and the second substrate 20 maintains the spaced apart from the second cover 120a. Therefore, the two substrates 10 and 20 are not affected by the deformation of the first cover 110a and the second cover 120a according to the vacuum exhaust, and can maintain alignment between the two substrates 10 and 20. .

When the bonding space 101 is switched to the vacuum atmosphere, the second substrate 20 freely falls onto the first substrate 10, and the first substrate 10 and the second substrate 20 are bonded to each other.

As described above, the substrate bonding apparatus 100 according to the present invention is not affected by the deformation of the first and second chambers 110 and 120 according to the vacuum exhaust, and maintains the alignment state between the two substrates 10 and 20. The process can proceed.

1 is a cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

Figure 2 is an exploded perspective view showing a portion of the substrate bonding apparatus according to an embodiment of the present invention.

3 is a cross-sectional view showing a substrate bonding apparatus according to another embodiment of the present invention.

Figure 4 is an exploded perspective view showing a coupling relationship of the alignment portion of the substrate bonding apparatus according to an embodiment of the present invention.

5, 6, and 7 are enlarged views showing an operation state of the substrate bonding apparatus according to the embodiment of the present invention, in which “A” portion shown in FIG. 1 is enlarged.

8 is a simplified view showing a vacuum exhaust state of the bonding space during the operation of the substrate bonding apparatus according to an embodiment of the present invention.

<Description of Signs of Major Parts of Drawings>

100: substrate bonding apparatus 110: the first chamber

120: second chamber 130: elevating unit

140: detecting unit 151: surface support shaft

160: alignment unit

Claims (15)

A first chamber having a first lid, a first sidewall protruding from the first lid; A first surface plate disposed inside the first chamber to support a first substrate, and coupled to a side wall of the first chamber and spaced apart from the first cover; A second chamber disposed to face the first cover with the first sidewall interposed therebetween, and forming a bonding space together with the first chamber; A second surface plate supporting the second substrate in the bonding space and spaced apart from the second chamber; An alignment unit disposed outside the bonding space to support the first sidewall and move the first sidewall to align the position of the first substrate with respect to the second substrate; and And an elevating unit supporting the first chamber and elevating the first chamber toward the second chamber. According to claim 1, The first side wall is detachably installed from the first cover, And the first chamber further comprises a first hermetic member disposed between the first cover and the first sidewall. According to claim 1, And a second hermetic member disposed between the first sidewall and the second chamber. According to claim 1, And a frame disposed outside the second chamber, the frame fixing the second chamber. The method of claim 4, wherein Through holes are formed in the second chamber, And a surface support shaft having one side fixed to the frame and the other side passing through the through hole and fixed to the second surface plate. The method of claim 5, And a diameter of the through hole is larger than that of the surface support shaft. The method of claim 4, wherein And a third hermetic member disposed between the frame and the second cover. According to claim 1, The second chamber has a second cover and a second side wall protruding from the second cover toward the first chamber side, And the second surface plate is coupled to the second sidewall and spaced apart from the second cover. According to claim 1, And a sensing unit configured to detect parallelism and an alignment position between the first substrate and the second substrate. The method of claim 1, wherein the alignment unit, A support pin supporting the first sidewall at an outside of the bonding space; A screw to which the support pin is screwed; A rotating motor rotating the screw to reciprocate the support pin in the axial direction of the screw; and And a reciprocating rail which is spaced apart from the screw and has an axial direction parallel to the screw, supports the support pin, and guides the reciprocation of the support pin. The method of claim 10, wherein the alignment unit, A base having the screw, the rotary motor and the reciprocating rail installed on one side thereof, and a cross rail groove formed on the other side thereof; and And a crossing rail disposed in an axial direction intersecting the axial direction of the screw and intersecting the cross rail groove so that the base is reciprocated in the axial direction intersecting the axial direction of the screw. Device. The method of claim 11, wherein The alignment unit is provided in plurality, The plurality of alignment parts, A first alignment part in which an axial direction of the screw is arranged in a carrying direction of the first substrate, Substrate bonding apparatus characterized in that the axial direction of the screw is divided into a second alignment portion disposed in a direction intersecting the carrying direction of the first substrate. The method of claim 1, wherein the lifting unit, An elevating plate supporting the first chamber and the alignment unit; An expansion cylinder which supports the lifting plate and is lifted to the second chamber side; and And a pump provided to drive the expansion cylinder. The method of claim 13, A roller disposed between the first cover and the elevating plate, the roller supporting the movement of the first cover according to the movement of the first sidewall by the alignment unit. Substrate Bonding Device. The method of claim 1, wherein the first surface plate and the second surface plate, Substrate bonding apparatus further comprises a flatness adjustment unit for adjusting the flatness of the first chuck and the second chuck.

Images