KR100874718B1 - Manufacturing method of built-in antenna module integrally molded with case - Google Patents

Abstract

The present invention relates to a manufacturing method for a built-in antenna (inner antenna or intenna) module for a wireless communication terminal, and more particularly to a pattern printing process for printing a pattern of the radiator on the base film using a conductive paste After inserting the base film printed with the radiator pattern into the mold, a built-in antenna module is manufactured through a case molding process by injection molding (main forming) together with the case itself, and finally, a radiator pattern layer is formed through a transfer printing method. Thereby, there is no problem in antenna transmission / reception performance while contributing to the tendency of light and short size of the terminal, and additionally printing a release layer for ease of peeling of the base film, an adhesive layer for strengthening the bonding force between the radiator and the case, and the radiator pattern protection layer. Of manufacturing method of built-in antenna module The.

Method of manufacturing a built-in antenna module integrally molded with a case according to the present invention comprises a pattern printing process comprising the step of printing a radiator pattern layer made of a conductive paste on the base film; And a case forming process comprising the step of forming a print film obtained in the pattern printing process.

Description

MANUFACTURING METHOD FOR INTENNA MODULE}

1 is a process diagram of a manufacturing method of a built-in antenna module integrally molded with a case according to the present invention;

Figure 2 is a schematic exploded perspective view for explaining the installation state of the built-in antenna module according to the present invention.

[Explanation of symbols on the main parts of the drawings]

A: built-in antenna module 10: radiator

11: Feed pin 13: Ground pin

20: case

30: motherboard 31: feeder

33: Ground 35: RF Connector

37: conductive connection

The present invention relates to a manufacturing method for a built-in antenna (inner antenna or intenna) module for a wireless communication terminal,

More specifically, through a pattern printing process of printing a pattern of a radiator on a base film using a conductive paste

After inserting the base film printed with the radiator pattern into the mold, the built-in antenna module is manufactured through a case forming process in which the carrier serving as a support for the built-in antenna module is omitted and the injection molding is performed together with the case itself. By manufacturing

As a result, the radiator pattern layer is formed through the transfer printing method, contributing to the tendency of light and small size of the terminal, and there is no problem in the antenna transmission / reception performance and the productivity is remarkably improved.

Along with this, a release layer for easy peeling of the base film, an adhesive layer for strengthening the bonding force between the radiator and the case, and a protective layer for physical protection (hard coating layer) or recognition prevention (shielding layer) of the radiator pattern layer are additionally printed. The present invention relates to a method of manufacturing a built-in antenna module with improved functionality.

Wireless communication terminals, especially portable wireless communication terminals such as mobile phones, PDAs, navigation, DMBs, GPS, wireless laptop computers,

In order to overcome the limitations of design changes caused by existing external antennas (such as rods or helical antennas) and to meet the trend of lighter and shorter wireless communication terminals, the adoption of internal antennas has become popular in recent years.

The built-in antenna should be diversified in size and shape to suit the shape of the antenna installation space and the volume of the space inside the terminal, and should be produced inexpensively and without problems in quality (especially communication quality).

Currently, the built-in antenna is mainly used with a Planar Inverted F Antenna (PIFA) antenna composed of a radiator and a carrier serving as a support for the radiator.

The radiator of the conductive material in the PIFA-type antenna has two contacts consisting of a contact electrically connected to the RF connector of the terminal main board and a contact grounded to the conductive connection of the main mode,

The carrier made of a non-conductive synthetic resin material is spaced apart from the ground by a certain distance to ensure the radiation characteristics and to reduce the SAR (Spac) Absorption Rate (SAR).

In mobile phones where the built-in antenna is most commonly used, the antenna is usually installed above the main board, so it is arranged above the key button, or in the hinged part of the clamshell terminal in consideration of the weak field radiation problem during a call.

In the conventional built-in antenna module, the radiator is

(Hereinafter referred to in the prior art, the terminology in the publication is arbitrarily modified to suit the terminology used herein (especially 'radiator' and 'carrier').)

There are many forms of cutting the sheet of conductive material into a certain shape and bending it and mounting it on the surface of the synthetic resin carrier formed by another process by ultrasonic welding, for example. Patent Registration No.0563976 (2006.03) .17) there is a built-in antenna and a method of manufacturing the same;

In general, the carrier is provided with a receiving groove formed in accordance with the shape of the radiator.

However, since the built-in antenna module requires many processes for manufacturing and combining the radiator and the carrier, productivity is reduced and there is a small gap between the radiator and the carrier, and there is a risk that the radiator is separated by an impact.

As a way to improve this

[Carrier pattern washing-etching-copper plating-laser radiator pattern forming-radiator nickel plating-post-treatment] Kim Jin-Soo's patent registration No. 0552529 (2006.02.08) 『Used in wireless handheld terminal Antenna manufacturing method]],

It has problems such as waste water generation and power consumption peculiar to the plating process, limit of cost reduction due to large unit, difficulty of micromachining,

[Formation of the depression part in the carrier by injection molding-Filling the conductive metal paste into the indentation part to form the radiator-Drying-post-processing] Bae, Chang-Hwan Patent Publication No. 2006-0040464 (2006.05.10) Manufacturing method of a built-in antenna for a mobile phone

There is a problem in that the radiator has a three-dimensional shape, there is no problem in the practicality because there is no proposal for a precise metal paste filling method.

On the other hand, as an example of forming the antenna module structure by printing using a conventional conductive paint

Patent Publication No. 2006-0082006 (July 14, 2006) of Ugentech Co., Ltd. related to screen printing of a radiator pattern on a carrier with a metal paste,

Since the radiator pattern portion protrudes more than the carrier plane, it has limitations such as the problem of the failure of the radiator due to friction and collision during the transport assembly process, and also the difficulty when it is necessary to manufacture the radiator in three-dimensional shape,

Although not in the field of communication terminals, Korean Patent Publication No. 2001-0011095 (2001.02.15), which relates to the printing of antenna patterns on a transfer paper with a conductive material and affixing them to a certain position on the helmet body, `` wireless hands free Antenna structure of helmet with telephone call function

Also, there is no suggestion on how to protect the pattern after removing the transfer paper.

The present invention is in keeping with the trend of designing a communication terminal, a tendency to produce small quantities of small quantities, and a tendency to make it light and small in recent years.

In the reality that terminal parts production proceeds mainly in the OEM method, communication terminal completion sellers (mainly large and multinational companies such as Samsung Electronics and Motorola) and small and medium-sized antenna module production suppliers are separated.

Considering that meeting the quality and reducing the production cost as much as possible while increasing productivity is a challenge for the supplier.

While dramatically simplifying the process to achieve cost reduction optimization,

With no gaps or protrusions between the case and the radiator, there is no risk of damage due to friction or impact during transportation, assembly and use of the terminal.

In order to prevent the risk that the unique radiator pattern developed by each company's effort is replicated immediately after the market launch without proper protection device, it is not possible to easily identify the radiator pattern by naked eye or scanning. It is suggested to do.

Accordingly, the present invention, after the pattern printing process comprising the step of printing a radiator pattern layer made of a conductive paste on the base film, by molding the case integrally by injection molding together with the print film, the completed case The radiator and the case are integrated in the integrated antenna module so that there is no risk of damage to the radiator by smoothing without step or gap.

Automated manufacturing is possible by a continuous process, and the newly developed radiator pattern can be mass-produced immediately by adjusting the printing pattern according to the change of the radiator pattern. The purpose of the present invention is to provide a method for manufacturing an embedded antenna module that is excellent in securing and applying a new design related to a radiator pattern and adjusting a pattern finely.

First of all, when constructing an internal antenna module using an existing carrier, it is necessary to make the carrier small so that it is embedded in the terminal as small as possible.

In addition, there was a limitation in that the total antenna area should be increased by bending the antenna pattern and making it three-dimensional so that there is no problem in transmission and reception quality.

In the present invention, since the antenna module is formed on the case itself of the wireless communication terminal (particularly, a mobile phone), there is almost no area limitation when designing the antenna pattern compared to the existing carrier-mounted antenna pattern design.

In addition, since the antenna pattern is formed on the case itself, there is no component that shields or obstructs transmission and reception signals except the case, and thus, the transmission and reception efficiency can be dramatically increased.

In another aspect, the present invention to equalize the color of the conductive paste for the radiator and the color of the synthetic resin for the case in order to prevent the unique radiator pattern developed by each effort to easily recognize and replicate,

Prevents the recognition of the radiator pattern by the naked eye by introducing a separate recognition prevention shielding layer,

Furthermore, a shielding layer is introduced to prevent the recognition of the radiator pattern by a scanning device using infrared rays or other light sources, and in this case, a contact blocking layer of a non-conductive material is interposed between the radiator pattern layer and the shielding layer to prevent the antenna from transmitting or receiving. The purpose is to provide a method for manufacturing the embedded antenna module introduced,

In addition, a hard coating layer may be introduced to protect the radiator pattern layer from physical damage.

Furthermore, the present invention, when the case forming process with the base film printed with various functional layers, including the radiator pattern layer

Preformed to obtain a more precise three-dimensional shape of the emitter pattern, or

I'm going to go through this forming step right away,

The main forming step is to proceed in a double injection or multiple injection method, it is an object of the present invention to provide a method for manufacturing a built-in antenna module suitable for introducing two physical properties to the case or introduce a complex layered structure.

The manufacturing method of the built-in antenna module integrally molded with the case according to the present invention to achieve the above object

A pattern printing process comprising printing a radiator pattern layer made of a conductive paste on a base film; And

A case molding process including the step of forming a print film obtained in the pattern printing process;

It is done, including.

In addition, the manufacturing method of the built-in antenna module molded integrally with the case according to the present invention

In order to prevent the radiator pattern layer from being broken apart from the injection molded case when the base film is peeled off, the adhesive layer printing step is finally performed to be located at the top layer of the base film in the pattern printing process.

Furthermore, in order to increase the ease of peeling of the base film, it is preferable that a release agent layer printing step is further introduced before the radiator pattern layer printing step (finally the first release agent layer is formed on the base film) in the pattern printing process to take a transfer printing method. Do.

In addition, the manufacturing method of the built-in antenna module molded integrally with the case according to the present invention

In the pattern printing process, before the radiating pattern layer printing step, a radiating pattern protective layer printing step is further performed.

The protective layer is a hard coating layer for protecting the radiator from physical impact,

In addition, the protective layer may be a shielding layer for preventing the recognition by the naked eye or a scanning device.

In addition, the manufacturing method of the built-in antenna module molded integrally with the case according to the present invention

In order to ensure a more precise three-dimensional shape, it is preferable to further include preforming the print film obtained in the pattern printing process between the pattern printing process and the case molding process.

In addition, the manufacturing method of the built-in antenna module molded integrally with the case according to the invention

When the printing film is put into the mold, the printing of the confirmation position for the recognition of the position is performed on the outer portion of the printing film obtained in the pattern printing process for the recognition of the position, and the mold used in the case forming process is It is preferable that the printing film fixing member is introduced at a position corresponding to the positioning position of the printing film.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

First with respect to the manufacturing method of the built-in antenna module for a wireless communication terminal in Figure 1 and the present specification, but to avoid confusion

The term 'process' refers to three processes: pattern printing (SP), case molding (SM), and completion (SC).

The term 'step' means a sub-process of the above three processes,

The term 'process' encompasses the meaning of 'process' and 'step' and is used to indicate the flow of a manufacturing method without any particular distinction.

In addition, in the case molding process SM of FIG. 1, the injection molding is performed when the printing film obtained in the pattern printing process SP has a three-dimensional shape (finally, the radiator body is formed in the finished antenna module A (see FIG. 2). 10) will have a three-dimensional shape)

In order for the radiator of the completed antenna module to be molded to more precise three-dimensional shape

Considering the case where the injection process is to be carried out in earnest after the first forming process,

Each is divided into 'preliminary' and 'main' forming stages.

The above-mentioned 'forming' forming step will be described separately when the progress in the double injection method and the multiple injection method, respectively,

The process of the two methods was separated by a chain of dots.

The continuity of each process is indicated by the dashed dashed arrows.

In Figure 1, the manufacturing method of the built-in antenna module integrally molded with the case according to the present invention is a pattern printing process (SP) comprising the step (S14) of printing a radiator pattern layer made of a conductive paste on the base film, and It includes a case forming process (SM) comprising the step (S30) of the main film forming the print film obtained in the pattern printing process.

As can be seen in Figure 2 schematically showing a mobile phone antenna module (A) completed by the manufacturing method according to the present invention,

The antenna module (A) is mounted to the main board 30 of the terminal, the case 20 of the non-conductive synthetic resin material is to ensure the radiation characteristics by spaced apart from the ground plane of the conductive material 10 a distance, The radiator 10 may have various shapes according to the design.

The radiator illustrated in FIG. 2 may be formed in a three-dimensional shape instead of a flat two-dimensional shape, if necessary.

There are two pins 11 and 13 arranged at both ends,

One of the two pins is a feed pin 11 connected to the connector 53 and the conductive connecting portion 37 for feeding the main board 30 to the RF connector 53 (in particular, the Electrically connected to the bottom of the motherboard)

The other ground pin 13 is connected to the ground portion 33 of the main board 30 (particularly in a portion extending to the bottom of the main board).

Although the case 20 is schematically illustrated in the drawings, in practice, the case 20 may have various three-dimensional shapes having accommodation spaces to accommodate various components including a mail board.

Arrangement position of the radiator 10 may be arranged at any position as necessary, such as the inner surface side, outer surface side or the intermediate layer, the upper, lower, center, left, right of the case 20.

In order to manufacture the antenna module (A), the manufacturing method of the present invention basically goes through a pattern printing process (SP) including a step (S14) of printing a radiator pattern layer on a base film for a transfer printing method, and a radiator pattern. After the process (SM) of forming a case through the main forming step (S30) made with the base film printed on the layer, the blanking (S51) and peeling removal of the base film ( S53), etc., the completion process (SC).

Printing (S14) of the radiator pattern layer as a core in the pattern printing process (SP) for the radiator uses a known conductive paste, preferably through an automated printing machine,

In general, considering that the paste containing the conductive particles and the case of the non-conductive synthetic resin material obtained in the case molding process (SM) are inferior to each other,

In order to prevent the printed radiator pattern layer from being broken apart from the injection molded case when the base film is peeled off.

In the pattern printing process SP, it is preferable that an adhesive layer printing step S15 is performed on the uppermost layer of the base film (that is, the layer which comes into contact with the final finished case surface, and finally corresponds to the layer that is finally printed).
(As shown in FIG. 1, when only the radiator pattern layer printing step (S14) is made, the adhesive layer serves to increase the bonding force between the pattern layer and the final case,
If the radiating pattern layer printing step (S14d) after the scanning prevention shielding layer printing step (S113d) is made, the adhesive layer serves to increase the bonding force between the shielding layer and the final case.

The base film may be a PET or PC film, but may be selected from nylon resin, polyamide resin, polyester resin, EVOH resin, polyurethane, polyethylene resin or polypropylene resin, surface hardness is about 2H ~ 4H Is preferably.

Basically, due to the function of the adhesive layer and the lack of adhesion between the radiator pattern layer and the base film, peeling and removing of the base film in the completion process (SC) may be performed without difficulty.

(If necessary, the base film may be left intact in the finished product (typically, the industry may use an insert molding method).

In order to further improve the ease of peeling and removing the base film, it is preferable that a release layer printing step S11 is further introduced before the radiating pattern layer printing step S14 in the pattern printing process SP.

The release agent layer is in direct contact with the base film (finally, the release agent layer is first printed on the base film).

The release agent is known (for example, acrylic polymer 4-5% by weight, PVC copolymer 8-20% by weight, nitrocellulose (NC) 1-2% by weight, methyl ethyl ketone (MEK) 69-70 % by weight) , Release agent composition consisting of 1 to 2% by weight of silica, and 1 to 2% by weight of dispersant).

In the pattern printing process, before the radiating pattern layer printing step, the radiating pattern protective layer printing step (S12) is further introduced.

The radiator pattern layer, and ultimately, to protect the radiator 10 (see FIG. 2) from the final antenna module A such as physical shock or recognition prevention,

As described above, when the release agent layer S11 and the adhesive layer S15 are introduced together, the radiator pattern protection layer will basically be located between the two layers.

If the protective layer printing step (S12) is a hard coating layer printing step (S12A) to protect the radiator from physical impact,

The material of the hard coating layer may be made of ABS resin, acrylic resin, PC resin, SAN resin, urethane resin, etc., and is selected in consideration of physical properties and formability,

It may have a light transmissive material such as a transparent material or have a color. In particular, when it has a color, it has a function of preventing visual recognition of the radiator pattern.

In addition, the hard coating layer is preferably not a UV curable coating agent, but a thermosetting coating agent, in particular, a urethane-based thermosetting coating agent does not cause cracks in the finished product while satisfying the hardness (2H ~ 5H) of the desired coating layer.

Next, when the protective layer printing step (S12) is a shielding layer printing step (S12B) for preventing the radiator pattern recognition, the unique radiator pattern developed by each effort with the help of the shielding layer is very easily recognized and copied. Can be prevented.

The shielding layer printing step is simply a shielding layer printing step for visual recognition prevention (S13) or

The shielding layer printing step may be a scanning layer shielding layer printing step (S113a) to prevent recognition by a scanning device.

The anti-scanning shielding layer may use a variety of known shielding compositions,

For example, metal fine particle composition presented in Utility Model Registration No. 0,383,485 (2005.04.27) 『Anti-counterfeiting Plastic Card』

The material for thin film presented in the patent registration 0617938 (2006.09.07) of ILJIN OPTEC Co., Ltd., and

It may be a composition for an infrared cut filter of a camera lens, as disclosed in TLS Patent Publication No. 2007-0005237 (January 10, 2007) "Flaw Detection Device of Infrared Cut Filter."

If the anti-scanning shielding layer is adopted, there should be basically no degradation of the transmitting / receiving performance of the antenna,

To this end, a printing step (S113b) for forming a contact blocking layer of a non-conductive material is preferably performed between the radiator pattern layer and the shielding layer.
The introduction of such a non-conductive material into the contact between the radiator pattern layer and the shielding layer is the contact between the radiator pattern layer made of a conductive paste and the shielding layer, which may also be made of a conductive material, which hinders transmission and reception performance of the antenna. It is to prevent that.

In addition, as shown in FIG. 2, not only the recognition of the radiator 10 pattern is shielded from the upper side of the completed antenna module, but also the shield of the recognition from the bottom side.

After the radiator pattern layer printing (S14), the shielding layer printing step (S113d) may further be performed after the contact blocking layer printing (S113c).

Meanwhile, the hard coating layer, the shielding layer, and the contact blocking layer obtained through the protective layer printing step may surround the feed pin 11 and the ground pin 13 so that at least the two pins 11 and 13 do not interfere with the electrical connection state. Should be introduced in a guaranteed form,

In addition, the hard coating layer, the shielding layer (visual recognition and anti-scanning), the contact blocking layer may all be introduced in a variety of selection or in combination.

When the pattern printing process SP is completed through the printing of the radiator pattern layer (S14) and the various protective layer printing (S12) as described above,

Case molding process (SM) through the injection molding by inserting the printed base film into the mold is made.

On the other hand, in the case molding process (SM) in the pattern printing process (SP) to the base film after the preforming step (S20) or the main forming step (S30) of the case forming process (SM), or both When inserting the printing film prints a confirmation position for correct position recognition,

The printing film by introducing a printing film fixing member (for example, a pin) corresponding to the positioning position of the printing film in the mold for the preforming step (S20) or the main forming step (S30). By fixing the

The printed radiator pattern layer was accurately aligned at the designed position of the completed antenna module, thereby preventing the product defect rate caused by deviation of the radiator pattern from the original position.

The case forming process (SM) is to form the core of the present invention with the introduction of the pattern of the radiator by the transfer printing method to the antenna module.

Since the pattern printing process (SP) through the printing base film is put into a mold and then the filling body is injected to form a case

Compared to conventional injection molding of the case, and then to fastening the radiator thin plate to the radiator introduction site forming the recessed groove, or to forming the radiator by plating or transfer method at the radiator introduction site of the completed case.

More perfectly, the gap between the case and the radiator can be prevented from occurring, and the smooth and smooth antenna module can be provided to eliminate the risk of damage caused by friction or impact during transportation, assembly and use of the terminal.

It can meet the needs of a user (commercial ordering terminal).

In the case molding process SM having such a feature, a step S20 of preliminarily forming the printing film obtained in the previous process SP may be selected.

This may be a method of forming a planar film into a three-dimensional shape by heating the print film to a deformable temperature and placing it in a frame having an uneven portion similar to the shape of the case 20 of the final antenna module A to increase the air pressure.

The preformed film is preferably subjected to an intermediate process test after punching.

However, the preforming step of the printing film is a main purpose to accurately transfer the three-dimensional pattern of the radiator designed on the antenna module to be completed, so it is not an indispensable process.

In particular, as described above, in the pattern printing process, the exact position recognition check spot is printed for accurate matching of the base film and the mold, and the printing film fixing member corresponding to the exact position check spot of the printing film is introduced into the mold. In consideration of the point, the preforming process of the printing film may be an unnecessary process depending on the type of communication terminal.

Subsequently, the preformed printing film is injected together with the preformed printing film to form a case by injecting a filling body for the actual antenna module, wherein the main forming (S30) is a double injection method or multiple injection. Way.

If the main forming step (S30) proceeds to the double injection method (S30A) is to manufacture one antenna module by molding separately at least twice using synthetic resin of different types, properties or colors,

At this time, the first molding (S31) with the first synthetic resin (eg ABS resin, acrylic resin, PC resin), and second molding with a second synthetic resin (eg, soft resin such as urethane, silicone, PVC, various rubber) (S41),

In the drawing, in order to describe general double injection (S30A) and multiple injection (S130A) as one common concept, the secondary layer forming step (S40) related to the secondary molding is a separate process from the main forming step (S30). Shown.

Next, the completion step (SC) including the punching (S51) and the removal of the release film (S53) (removal of the release film can be made in the final stage or intermediate stage as necessary) is made,

If necessary, the additionally manufactured case may be subjected to an appropriate curing step to remove the film, remove foreign substances such as a release agent, and undergo post-treatment such as cutting and applying a varnish, followed by shipping inspection and packaging.

Furthermore, the main forming step (S30) can be configured as a multi-stage injection method (S130A), which is a concept in contrast to the flat injection method in which the mold moves in a direction perpendicular to the direction of gravity, that is, in a vertical direction. Refers to the

In relation to the method for manufacturing an antenna module according to the present invention, it is generally suitable for a kind of three-dimensional case

First, the mold insertion primary molding (S131) is performed on the print film (or the film that has undergone the preforming step).

Subsequently, the secondary layer formation (S40) may be made as needed, but the secondary molding (S141) may also use a soft resin such as urethane, silicone, PVC, and various rubbers separately.

Punched (S143) and assembled by bonding the intermediate product and the adhesive (S145) through the adhesive.

Subsequently, the completion process (SC) including the removal of the release film (S151) (also, the removal of the release film may be performed at the final completion stage or intermediate stage as necessary) is performed. This can be done by packaging.

As described above, the method of manufacturing an integrated antenna module integrally formed with a case such as a mobile phone, a PDA, a navigation system, a DMB, a GPS, a wireless laptop computer according to the present invention

First, the pattern printing process including the step of printing a radiator pattern layer made of a conductive paste on the base film, followed by molding the case integrally by injection molding together with the print film to complete the antenna module. The radiator and the case are integrated so that there is no step or gap, so that the radiator is not damaged.

Automated manufacturing is possible by a continuous process, and the newly developed radiator pattern can be mass-produced immediately by adjusting the printing pattern according to the change of the radiator pattern. In terms of securing and applying new design related to the radiator pattern and fine-tuning the pattern,

Eventually, while keeping up with the trend of small quantity production of small quantities and small and small, the production of terminal parts was mainly carried out in the OEM method. In the reality that multi-national corporations) and small- and medium-sized antenna module production suppliers are separated, it is possible to meet the quality requirements of users (complete terminal vendors) while lowering production costs and increasing productivity.

In another aspect, the present invention prevents the recognition of the radiation pattern by the naked eye by the same color of the conductive paste for the radiator and the color of the synthetic resin for the case, or by introducing a separate anti-recognition shielding layer, furthermore, infrared or other light sources A shielding layer is introduced to prevent the radiator pattern recognition by a scanning device using a built-in antenna module. In this case, a contact blocking layer made of a non-conductive material is introduced between the radiator pattern layer and the shielding layer to prevent the antenna from transmitting and receiving. By providing manufacturing methods, the unique radiator pattern developed by each company's efforts can be prevented from being immediately replicated after the market launch without proper protection.

In addition, the present invention can introduce a hard coating layer as the radiator pattern protection layer to protect the radiator pattern layer from physical damage,

Furthermore, the present invention is subjected to preforming to obtain a more precise three-dimensional shape of the emitter pattern when the case molding process with the base film printed with various functional layers, including the radiator pattern layer, or immediately forming To proceed, the main forming step is carried out in a double injection or multiple injection method, it is possible to introduce two physical properties in the case or introduce a complex layered structure.

First of all, when constructing a built-in antenna module using an existing carrier, it is necessary to make the carrier small in order to be embedded in the terminal as small as possible, and to be able to bend and three-dimensional the antenna pattern so that there is no problem in transmission and reception quality. There is a limitation in that the antenna area needs to be increased, but the present invention has an antenna module formed in the case itself of the wireless communication terminal (particularly, a cellular phone). Almost no, and the present invention has an advantage that the antenna pattern is formed on the case itself, so there is no component that shields or interferes with the transmission and reception signals other than the case, thereby dramatically increasing the transmission and reception efficiency.

In the above description, although the conventionally known technologies related to the antenna module, the radiator, the case, the anti-scanning shielding layer, and the like are omitted, those skilled in the art will naturally be able to infer and deduce this.

In addition, in the following description of the present invention with reference to the accompanying drawings, a manufacturing method having a specific process order, but the present invention can be variously modified and changed by those skilled in the art, such modifications and changes belong to the protection scope of the present invention Should be interpreted as

Claims (12)

A pattern printing process comprising printing a radiator pattern layer made of a conductive paste on a base film; And Including the case forming process comprising the step of forming the print film obtained in the pattern printing process; In the pattern printing process, before the radiating pattern layer printing step, a radiating pattern protective layer printing step is further introduced. The protective layer of the protective layer printing step of manufacturing a built-in antenna module integrally molded with a case, characterized in that it comprises a shielding layer for preventing the radiation pattern recognition. The method of claim 1, wherein the pattern printing step A method of manufacturing an embedded antenna module integrally molded with a case , wherein the adhesive layer printing step is finally performed to be positioned at the top layer of the base film . The method of claim 1, Prior to the printing of the radiator pattern protective layer in the pattern printing process, a release agent layer printing step is further introduced, whereby the base film and the release agent layer are integrally molded with the case. . delete The method of claim 1, wherein the protective layer printing step of the protective layer Method of manufacturing a built-in antenna module integrally molded with a case, characterized in that it further comprises a hard coating layer. delete The method of claim 1 , wherein the shielding layer Method of manufacturing a built-in antenna module molded integrally with the case, characterized in that the anti-scanning layer. The method of claim 7, wherein To prevent contact between the scanning prevention shielding layer and the radiator pattern layer, The method of manufacturing an embedded antenna module integrally molded with a case after the printing of the shielding layer for preventing scanning and before the printing of the radiator pattern layer may further include a step of printing a contact blocking layer. The case forming process according to any one of claims 1 to 3, wherein Method of manufacturing a built-in antenna module molded integrally with the case, characterized in that made by a double injection method. The case forming process according to any one of claims 1 to 3, wherein Manufacturing method of the built-in antenna module molded integrally with the case, characterized in that made by a large injection molding method. delete The method according to any one of claims 1 to 3, The printing of the confirmation position for the exact position recognition is made on the outer portion of the printing film obtained in the pattern printing process, The mold used in the case forming process is a manufacturing method of a built-in antenna module which is integrally molded with a case, characterized in that the printing film fixing member is introduced at a position corresponding to the positioning position of the printing film.

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