KR100872696B1 - 광원 장치 및 이를 이용한 디스플레이 장치 - Google Patents
광원 장치 및 이를 이용한 디스플레이 장치 Download PDFInfo
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- KR100872696B1 KR100872696B1 KR1020070036855A KR20070036855A KR100872696B1 KR 100872696 B1 KR100872696 B1 KR 100872696B1 KR 1020070036855 A KR1020070036855 A KR 1020070036855A KR 20070036855 A KR20070036855 A KR 20070036855A KR 100872696 B1 KR100872696 B1 KR 100872696B1
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Liquid Crystal (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (22)
- 삭제
- 삭제
- 적어도 하나의 발광소자;상기 발광 소자가 배치되는 발광 소자 기판;상기 발광 소자 기판의 일단에 연결된 제 1커넥터;상기 발광 소자 기판의 타단에 연결된 제 2커넥터;상기 발광 소자 기판의 제 1커넥터에 접속되는 제 3커넥터가 연결되고, 상기 제 3커넥터에 연결되어 상기 발광소자 기판을 LED 드라이버에 연결해 주는 외부 연결 커넥터를 포함하는 제 1서브 기판; 및상기 발광 소자 기판의 제 2커넥터에 접속되는 제 4커넥터가 연결되고, 상기 제 4커넥터에 연결되어 상기 발광 소자 기판의 회로 종단을 폐 루프로 만들어 주는 폐 루프 패턴이 형성된 제 2서브 기판을 포함하는 광원 장치.
- 삭제
- 삭제
- 적어도 하나의 발광소자;상기 발광 소자가 배치되는 복수개의 발광 소자 기판;상기 각 발광 소자 기판의 일단에 연결된 제 1커넥터;상기 각 발광 소자 기판의 타단에 연결되며, 인접한 상기 발광 소자 기판의 제 1커넥터와 접속되는 제 2커넥터;시단측 상기 발광 소자 기판의 제 1커넥터에 접속되는 제 3커넥터가 연결되고, 상기 제 3커넥터에 연결되어 상기 발광소자 기판을 LED 드라이버에 연결해 주는 외부 연결 커넥터를 포함하는 제 1서브 기판; 및종단측 상기 발광 소자 기판의 제 2커넥터에 접속되는 제 4커넥터가 연결되고, 상기 제 4커넥터에 연결되어 상기 발광 소자 기판의 회로 종단을 폐 루프로 만들어 주는 폐 루프 패턴이 형성된 제 2서브 기판을 포함하는 광원 장치.
- 발광 소자를 포함하는 복수개의 발광 소자 기판이 배열되는 적어도 2열의 LED 바;상기 각 발광 소자 기판의 일단에 연결된 제 1커넥터;상기 발광 소자 기판의 타단에 연결되며, 인접한 상기 발광소자 기판의 제 1커넥터와 접속된 제 2커넥터;각 열의 시단측 상기 발광 소자 기판의 제 1커넥터에 각각 접속되는 제 3커넥터가 연결되고, 상기 제 3커넥터를 통해 시단측 상기 발광소자 기판을 LED 드라이버에 연결해 주는 외부 연결 커넥터를 포함하는 단일개의 제 1서브 기판을 포함하는 광원장치.
- 발광 소자를 포함하는 복수개의 발광 소자 기판이 배열되는 적어도 2열의 LED 바;상기 각 발광 소자 기판의 일단에 연결된 제 1커넥터; 상기 발광 소자 기판의 타단에 연결되며, 인접한 상기 발광 소자 기판의 제 1커넥터와 접속된 제 2커넥터;각 열의 종단측 상기 발광 소자 기판의 제 2커넥터에 각각 접속되는 제 4커넥터가 연결되고, 상기 제 4커넥터 각각에 연결되어 상기 발광 소자 기판의 회로 종단을 폐 루프로 만들어 주는 폐 루프 패턴이 형성된 단일개의 제 2서브 기판을 포함하는 광원 장치.
- 제 8항에 있어서,각 열의 시단측 상기 발광 소자 기판의 제 1커넥터에 각각 접속되는 제 3커넥터가 연결되고, 상기 제 3커넥터를 통해 시단측 상기 발광소자 기판을 LED 드라이버에 연결해 주는 외부 연결 커넥터를 포함하는 단일개의 제 1서브 기판을 포함하는 광원장치.
- 제 3항 또는 제6항 또는 제7항 또는 제8항 또는 제 9항 중 어느 하나의 항에 있어서,상기 발광 소자 기판의 양단에는 상기 제 1 커넥터 및 제 2커넥터의 핀이 관통되는 핀 구멍, 상기 핀 구멍에 형성된 리드 패턴을 포함하는 광원 장치.
- 제 3항, 제 6항 또는 제 9항 중 어느 하나의 항에 있어서,상기 제 1 및 제 3 커넥터는 암 커넥터로 구성되며,상기 제 2 및 제 4커넥터는 수 커넥터로 구성되는 광원 장치.
- 제 3항, 제 6항 또는 제 9항 중 어느 하나의 항에 있어서,상기 제 1 및 제 3커넥터에는 후크 돌기가 형성되며,상기 제 2 및 제 4커넥터에는 상기 후크 돌기에 대응되는 후크 홈이 형성되는 광원 장치.
- 제 3항 또는 제6항 또는 제7항 또는 제8항 또는 제 9항 중 어느 하나의 항에 있어서,상기 제 1 커넥터 및 제 2커넥터는 상기 발광 소자 기판의 아래에 배치되는 광원 장치.
- 제 3항 또는 제6항 또는 제7항 또는 제8항 또는 제 9항 중 어느 하나의 항에 있어서,상기 발광소자는 적어도 하나의 LED 칩을 포함하는 것을 특징으로 하는 광원 장치.
- 제 3항 또는 제6항 또는 제7항 또는 제8항 또는 제 9항 중 어느 하나의 항에 있어서,상기 발광소자는 Red LED 칩, Green LED 칩 및 blue LED 칩을 포함하는 것을 특징으로 하는 광원 장치.
- 제 3항 또는 제6항 또는 제7항 또는 제8항 또는 제 9항 중 어느 하나의 항에 있어서,상기 발광소자는 상기 발광소자기판 위에 적어도 1열로 배열된 것을 특징으로 하는 광원 장치.
- 제 6항 또는 제 9항을 포함하는 광원 장치;상기 광원 장치가 수납되는 바텀 커버;상기 바텀 커버 위에 배치된 적어도 한 장의 광학 시트;상기 광학 시트 위에 배치된 표시 패널을 포함하는 디스플레이 장치.
- 제 17항에 있어서,상기 바텀 커버에는 복수의 상기 발광소자기판이 연결된 LED 바가 병렬로 배열되는 것을 특징으로 하는 디스플레이 장치.
- 제 17항에 있어서,상기 제 1 및 제 2커넥터는 상기 발광 소자 기판의 아래에 배치되고,상기 제 3커넥터는 상기 제 1서브 기판의 아래에 배치되고,상기 제 4커넥터는 상기 제 2서브 기판의 아래에 배치되는 디스플레이 장치.
- 제 17항에 있어서,상기 발광소자기판을 상기 바텀 커버에 체결하는 체결수단을 포함하는 디스플레이 장치.
- 제 19항에 있어서,상기 바텀 커버의 베이스에는 상기 발광소자기판, 상기 제 1 및 제 2서브 기판의 아래에 배치된 상기 제 1 내지 제 4커넥터가 관통되는 커넥터 구멍을 포함하는 디스플레이 장치.
- 제 17항에 있어서,상기 바텀 커버의 양측에는 상기 제 1 서브기판 또는 상기 제 2서브 기판이 수납되도록 형성된 서브 기판 수납홈을 포함하는 디스플레이 장치.
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KR1020070036855A KR100872696B1 (ko) | 2007-04-16 | 2007-04-16 | 광원 장치 및 이를 이용한 디스플레이 장치 |
CN2008800005489A CN101542761B (zh) | 2007-04-16 | 2008-04-15 | 光源装置和具有光源装置的显示器装置 |
PCT/KR2008/002121 WO2008127064A1 (en) | 2007-04-16 | 2008-04-15 | Light source device and display device having the same |
US12/375,485 US8388162B2 (en) | 2007-04-16 | 2008-04-15 | Light source device and display device having the same |
JP2010503968A JP5318853B2 (ja) | 2007-04-16 | 2008-04-15 | 光源装置及びそれを備えた表示装置 |
EP08741366.2A EP2137772B8 (en) | 2007-04-16 | 2008-04-15 | Light source device and display device having the same |
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KR1020070036855A KR100872696B1 (ko) | 2007-04-16 | 2007-04-16 | 광원 장치 및 이를 이용한 디스플레이 장치 |
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KR100872696B1 true KR100872696B1 (ko) | 2008-12-10 |
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US (1) | US8388162B2 (ko) |
EP (1) | EP2137772B8 (ko) |
JP (1) | JP5318853B2 (ko) |
KR (1) | KR100872696B1 (ko) |
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Also Published As
Publication number | Publication date |
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US8388162B2 (en) | 2013-03-05 |
JP5318853B2 (ja) | 2013-10-16 |
CN101542761A (zh) | 2009-09-23 |
EP2137772B8 (en) | 2021-09-08 |
WO2008127064A1 (en) | 2008-10-23 |
EP2137772A1 (en) | 2009-12-30 |
EP2137772B1 (en) | 2021-07-28 |
CN101542761B (zh) | 2011-11-30 |
US20090310335A1 (en) | 2009-12-17 |
KR20080093221A (ko) | 2008-10-21 |
JP2010525523A (ja) | 2010-07-22 |
EP2137772A4 (en) | 2013-09-25 |
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