KR100844773B1 - Duplexer and its manufacturing method - Google Patents

Abstract

The present invention forms a transmission LC filter manufactured by a low temperature firing ceramic process integrally with a duplexer package used to transmit and receive a high frequency signal, and mounts a receiving saw filter on the package to cause degradation in the filter at the time of transmission. Disclosed is a method of manufacturing a duplexer which prevents a phenomenon and improves electric power resistance. The disclosed invention consists of a ground terminal for contacting external PCB circuits, a phase converter having a strip line formed on a ceramic substrate, and a stacked LC filter formed by forming and stacking an LC metal pattern on the ceramic substrate. Providing a concave-convex package; Mounting a saw filter for receiving signal processing on the inside of the uneven package; Wire bonding to electrically connect the saw filter and circuit terminals on the uneven package; And attaching a package cover to block the uneven package from the outside after the wire bonding is performed.

Duplexer, Chip, Saw, Filter, FBAR

Description

Duplexer and its manufacturing method {DUPLEXER AND MANUFACTURING METHOD THEREOF}

1A-1C illustrate a duplexer manufacturing process according to the prior art.

2 shows the structure of a stacked LC filter according to the invention;

3a to 3c illustrate a duplexer manufacturing process according to the present invention.

* Description of the symbols for the main parts of the drawings *

11: ceramic substrate 12: LC metal pattern

15: Via Hole 21: Duplexer Package

22: phase shifter 23a: saw filter

23b: Stacked LC filter 24: Package cover

25: wire

The present invention relates to a method of manufacturing a duplexer, and more particularly, to a method of manufacturing a duplexer having improved electric power resistance to prevent destruction due to degradation in the electrode region of the duplexer used to transmit and receive high frequency signals.                         

In general, surface acoustic waves represent a state of waves transmitted along the surface of the substrate and have a feature of rapidly attenuating in the depth direction. The SAW filter uses this feature as a frequency selective device.

That is, the SAW device temporarily forms a metal electrode on a highly insulative substrate and applies a piezoelectric twist to the substrate surface. This action causes a physical wave. Since the wave speed transmitting the SAW element surface is slower than the electromagnetic wave, it is used as a filter to temporarily delay an electric signal or pass only a specific frequency signal.

The SAW filter is a ceramic container that protects a semiconductor device or a function, and is formed in a package form that protects an internal circuit from a harmful environment and provides a means for dissipating heat generated therein and connecting it to the outside.

When the ceramic substrate is stacked and the filters according to the frequency bands are combined, the duplexer for transmitting and receiving is implemented in one ceramic stacked package.

According to the LTCC process, when ceramic substrates having inductors and capacitors are formed, an inductor substrate, a capacitor substrate, a phase shift substrate, and a power stage capacitor substrate are integrally stacked to form a package.

The inductance substrate, the capacitor substrate, the face shift substrate, and the ground substrates each have the ground pattern connected to a foot pad, in which signals processed on each substrate are applied to adjacent ceramic substrates. This is to avoid affecting. In addition, insertion loss between terminals can be prevented.

1A to 1C are diagrams illustrating a duplexer manufacturing process according to the prior art.

As shown in FIG. 1A, transmission and reception signals are essential in two-way wireless communication. A filter for separating both signals is used as a duplexer using two saw filters 3a and 3b to minimize mutual interference. do.

First, in order to manufacture a duplexer, in order to minimize signal interference, a phase converter 2 is formed together in the duplexer package 1 in a strip line form, and a phase formed under the duplexer package 1 is used. The transducer 2 is manufactured simultaneously with the duplexer package 1 by a lamination process or a filter forming process.

Both walls of the duplexer package 1 are provided with external ground terminals for electrical coupling with an external PCB and ground terminals for electrical contacts with a saw filter to be mounted.

The external ground terminals have a structure connected to electrical circuits with internal circuit patterns along via holes formed in both walls of the duplexer package 1.

As shown in FIG. 1B, when the duplexer package 1 in which the phase shifter 2 is built is manufactured, a duplexer for filtering the transmission / reception signal is mounted. In order to filter, two saw filters 3a and 3b connected to the transmitting end and the receiving end are respectively mounted.

When the saw filters 3a and 3b are mounted on the duplexer package 1, the ground terminals formed on the duplexer package 1 and the saw filters 3a and 3b are connected to the wires. 5) Make electrical contact by wire bonding.

Then, as shown in FIG. 1C, when the saw filters 3a and 3b are mounted on the duplexer package 1, the package cover 4 is covered to block the external environment.

When the package cover 4 is covered, a duplexer is completed in the form of a chip. Thus, a duplexer having two saw filters 3a and 3b is mounted on a PCB of a communication system as one element.

However, in a duplexer using a saw filter, the line width of the duplexer becomes narrower as the frequency signal used changes to a high frequency, and when the high power is applied as the thickness of the electrode becomes thinner, the electrode is deteriorated due to deterioration. There is a problem that the phenomenon occurs.

In particular, the filter processing the transmission signal in the duplexer transmits using a high power, so that the damage to the filter electrode is intensified and the electrode breakage phenomenon occurs.

In addition, there are manufacturing difficulties and difficulties in mounting two saw filters in a package.

 In the present invention, a transmission filter used in a duplexer is manufactured by a low temperature ceramic process, and uses a stacked LC filter having strong electric power resistance, and a receiver uses a saw filter to transmit a signal in a high frequency band. It is an object of the present invention to provide a duplexer manufacturing method that can prevent the filter breakage by.

In order to achieve the above object, the duplexer manufacturing method according to the present invention,

Concave-convex package consisting of a ground terminal for contact with external PCB circuits, a phase converter with strip lines formed on the ceramic substrate, and a stacked LC filter formed by laminating and forming an LC metal pattern on the ceramic substrate. Providing a;

Mounting a saw filter for receiving signal processing on the inside of the uneven package;

Wire bonding to electrically connect the saw filter and circuit terminals on the uneven package; And

And attaching a package cover to block the uneven package from the outside after performing the wire bonding.

Here, the wire bonding metal of the saw filter is Au or Al, the laminated LC filter formed integrally with the uneven duplexer package is characterized in that the filter for transmitting and transmitting the transmission signal.

In particular, the stacked LC filters are electrically connected to the circuit terminals in the uneven duplexer package by via holes.                     

According to the present invention, a saw-type saw filter having a low power resistance by high frequency transmission and reception among the saw duplexers is formed as a stacked LC filter, and is integrally formed with the duplexer package, and the receiving saw filter is mounted on the package to provide power resistance. There is an advantage in implementing a good duplexer.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a view showing the structure of a stacked LC filter according to the present invention.

As shown in FIG. 2, the stacked LC filter of the duplexer manufactured by using the LTCC process may apply a metal film on the ceramic substrate 11 to be etched or form an LC metal pattern 12 by screen printing.

The metal pattern 12 includes a capacitance electrode for forming a capacitance along the ceramic substrate 11 and a metal line for forming an inductance.

The ceramic substrate 11 is inserted and bonded between the metal patterns having the structure as described above, and the terminals of the LC metal pattern 12 formed on the ceramic substrate 11 are connected to the ceramic substrate 11. The via hole 15 is formed on the via hole 15 and the conductive metal is filled in the via hole 15 so that the metal line of the inductance component and the capacitance component connect the electrodes to each other.

Since the LTCC process can implement a phase converter, an inductor substrate, and a capacitor substrate in a stacked form, the Saw filter, which is used as a transmission filter, can be formed integrally with the duplexer package while replacing the Saw filter.                     

Therefore, the above process is manufactured by forming a stacked LC filter together when manufacturing the duplexer package, and mounting only a receiving saw filter on the duplexer package to complete the duplexer.

In general, the high frequency signal for transmission transmits a signal to the outside by high output power and thus generates high heat, and generates a lot of heat at the electrode terminal of the filter. Since the LC filter manufactured by the multilayer LTCC process is resistant to heat, It is possible to manufacture a strong duplexer.

When the stacked LC filter is manufactured as described above, a circuit that is equivalent to a general LC band filter is configured and used as a band filter.

Therefore, since the filter used for transmission is manufactured integrally with the package together with the phase shifter during the manufacturing process of the duplexer package, the duplexer is completed by mounting only the receiving saw filter inside the package and wire bonding to manufacture the duplexer. This is simplified.

3A to 3C are diagrams illustrating a duplexer manufacturing process according to the present invention.

As shown in FIG. 3A, transmission and reception signals are essential in bidirectional wireless communication. In order to minimize mutual interference, a filter device that separates both signals is used as a duplexer by mounting two saw filters.

However, in the present invention, the filter used for transmission is formed integrally with the duplexer package by the stacked LC filter 23b, and the duplexer is mounted on the duplexer package 21 by mounting the filter used for reception as a saw filter. Manufacture.                     

First, in order to manufacture a duplexer, the duplexer package 21 is manufactured by a low temperature ceramic process. In this case, an inductance, capacitance, and ground terminals are formed on a plurality of ceramic substrates at the bottom of the duplexer package having a multilayer ceramic structure, and each ceramic substrate is electrically connected to each other through via holes.

At this time, in the present invention, when manufacturing the duplexer package 21 by the LTCC process, by further stacking a transmission filter that is equivalent in inductance and capacitance to be manufactured in the form of a strip line to minimize signal interference inside the package. Together with the phase converter 22, a stacked LC filter 23b is formed.

That is, the phase converter 22 and the stacked LC filter 23b are formed together in the duplexer package 21.

Then, as illustrated in FIG. 3B, the receiving saw filter 23a is mounted on the duplexer package 21 in which the phase converter 22 and the stacked LC filter 23b are formed.

That is, only one filter is mounted on the duplexer package 21 and electrically connected to the circuit patterns on the duplexer package 21 by wire bonding.

Both walls of the duplexer package 21 are provided with external ground terminals for electrical coupling with an external PCB, and ground terminals for electrical contacts with the saw filter 23a and the stacked LC filter 23b to be mounted.

The ground terminals may be electrically connected to internal circuit patterns along via holes formed in both walls of the duplexer package 21.

The receiving saw filter 23a mounted on the duplexer package is electrically connected by wire bonding, and the stacked LC filter 23b of the transmitter formed integrally with the duplexer package 21 is electrically connected by a via hole. It is connected structure.

Then, as shown in FIG. 3c, the stacked LC filter 23b integrally formed with the duplexer package 21 extracts only a specific frequency in the process of receiving a high frequency of 1 to 15 kHz, removes noise, and improves sound quality. It is a core component that functions as a thin film coating technique and a lamination technique, and thus is used as a next-generation filter that is smaller and lighter than one tenth to one hundredth of the size compared to the existing dielectric filters and ceramic filters.

A stacked LC filter 23b is formed integrally with the duplexer package 21, and a SAW filter 23a is mounted on the duplexer package 21 on the receiving side. When bonded and electrically connected, the package cover (24) is covered and sealed.

As described above, in order to solve the problem of high frequency band and deterioration on the transmitting side of the duplexer, a stacked LC filter is formed together in the duplexer package manufacturing process, and a receiving saw filter is mounted on the package. By doing so, there is an advantage that the electric power resistance is excellent and the manufacturing process is simplified.

As described in detail above, the present invention forms a stacked LC filter having a strong power resistance to be used as a transmission unit integrally with the duplexer package, and the receiver is equipped with a saw filter to enhance power resistance when transmitting high frequency signals. It is effective.

In addition, when manufacturing the duplexer package by a low-temperature ceramic process, there is an advantage that the manufacturing process can be simplified by forming the stacked LC filter used together with the transmission unit, and then mounting the receiving saw filter.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Claims (4)

A concave-convex package including a phase shifter in contact with an external PCB, the phase shifter forming a strip line on a first ceramic substrate, and a stacked LC filter formed by forming and stacking an LC metal pattern on a plurality of second ceramic substrates. Providing; Disposing a saw filter for receiving signal processing on a recess of the uneven package; Connecting the saw filter and the terminals of the uneven package with a wire; And And attaching a package cover to cover the recesses of the uneven package. The method of claim 1, The LC metal pattern terminals formed on the plurality of second ceramic substrates are electrically connected to each other through via holes. A phase changer formed as a strip line on a first ceramic substrate, a stacked LC filter disposed on the first ceramic substrate and connected to each other on a stacked second ceramic substrate, and sidewalls disposed on both sides of the second ceramic substrate; Uneven package of a laminated ceramic structure comprising a; A reception filter disposed on a recess of the uneven package and electrically connected to a terminal formed on a sidewall of the package; And a package cover covering the concave-convex package on the receiving filter. The method of claim 3, wherein The stacked LC filter includes a second ceramic substrate including terminals of an LC metal pattern forming an inductance metal line and a capacitance electrode, and a terminal of the LC metal pattern of the second ceramic substrate stacked on the second ceramic substrate. A duplexer containing via holes that connect to each other.

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