KR100838461B1 - 표면 보호 필름 - Google Patents
표면 보호 필름 Download PDFInfo
- Publication number
- KR100838461B1 KR100838461B1 KR1020070007622A KR20070007622A KR100838461B1 KR 100838461 B1 KR100838461 B1 KR 100838461B1 KR 1020070007622 A KR1020070007622 A KR 1020070007622A KR 20070007622 A KR20070007622 A KR 20070007622A KR 100838461 B1 KR100838461 B1 KR 100838461B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- adhesive
- weight
- adhesive composition
- surface protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 claims abstract description 65
- 239000000203 mixture Substances 0.000 claims abstract description 37
- 230000001681 protective effect Effects 0.000 claims abstract description 29
- 238000007906 compression Methods 0.000 claims abstract description 23
- 239000012790 adhesive layer Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 45
- 239000003795 chemical substances by application Substances 0.000 claims description 42
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 239000004925 Acrylic resin Substances 0.000 claims description 21
- 229920000178 Acrylic resin Polymers 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 21
- 125000000524 functional group Chemical group 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 2
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920005990 polystyrene resin Polymers 0.000 claims description 2
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000001035 drying Methods 0.000 abstract description 6
- 230000007704 transition Effects 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 238000007639 printing Methods 0.000 abstract description 4
- 238000011161 development Methods 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 23
- 239000012948 isocyanate Substances 0.000 description 17
- 150000002513 isocyanates Chemical class 0.000 description 17
- 239000010410 layer Substances 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 206010010071 Coma Diseases 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (9)
- 기재 필름; 및 상기 기재 필름의 내측면 상에 형성되는 표면 보호 필름용 점착 조성물;을 포함하는 재박리성 표면 보호 필름으로서,상기 표면 보호 필름용 점착 조성물은 카르복실기 관능기를 가진 아크릴계 수지 및 에폭시계 경화제를 함유하되,상기 카르복실기 관능기를 가진 아크릴계 수지 100 중량부에 대하여, 상기 에폭시계 경화제를 1 내지 4 중량부 함유하는 것을 특징으로 하는 표면 보호 필름.
- 기재 필름; 및 상기 기재 필름의 내측면 상에 형성되는 표면 보호 필름용 점착 조성물;을 포함하는 재박리성 표면 보호 필름으로서,상기 표면 보호 필름용 점착 조성물은 카르복실기 관능기를 가진 아크릴계 수지 및 에폭시계 경화제를 함유하되,상기 카르복실기 관능기를 가진 아크릴계 수지 100 중량부에 대하여, 상기 에폭시계 경화제를 1 내지 4 중량부 함유하며, 상기 기재 필름에는 건조 도막 두께가 6 내지 18㎛가 되도록 상기 점착 조성물이 코팅되어 점착체층이 형성되는 것을 특징으로 하는 표면 보호 필름.
- 기재 필름; 및 상기 기재 필름의 내측면 상에 형성되는 표면 보호 필름용 점착 조성물;을 포함하는 재박리성 표면 보호 필름으로서,상기 표면 보호 필름용 점착 조성물은 카르복실기 관능기를 가진 아크릴계 수지; 및 에폭시계 경화제를 함유하되,상기 카르복실기 관능기를 가진 아크릴계 수지 100 중량부에 대하여, 상기 에폭시계 경화제를 1 내지 4 중량부 함유하며, 상기 기재 필름에는 건조 도막 두께가 6 내지 18㎛가 되도록 상기 점착 조성물이 코팅되어 점착체층이 형성되고,상기 표면 보호 필름은 합지 시에 초기 점착력이 10~30g/25mm이고, 가열 압축 후의 점착력이 10~40g/25mm인 것을 특징으로 하는 표면 보호 필름.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 기재 필름은 내열성을 가진 재료를 사용하여 만든 필름으로서, 10~200㎛ 범위의 두께를 갖는 필름을 사용하는 것을 특징으로 하는 표면 보호 필름.
- 제4항에 있어서,상기 내열성을 가진 재료는 폴리에스테르 (polyester) 수지, 폴리이미드 (polyimide) 수지, 폴리카보네이트 (polycarbonate) 수지, 폴리스티렌 (polystylene) 수지, 폴리아미드 (polyamide) 수지, 폴리에스테르 이미드 (polyeter imide) 수지, 폴리에스테르 에테르 (polyeter ether) 수지 중 어느 하나인 것을 특징으로 하는 표면 보호 필름.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 기재 필름은 MD 및 TD방향 모두 인장력이 16kg/mm2이상이고, 신장율이 80% 이상이며, 열수축이 MD방향 1.8% 이하인 필름을 사용하는 것을 특징으로 하는 표면 보호 필름.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 기재 필름으로 PET 필름을 사용하는 것을 특징으로 하는 표면 보호 필름.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 표면 보호 필름은 상기 점착 조성물 상에 형성되는 이형 필름을 더 포함하는 것을 특징으로 하는 표면 보호 필름.
- 제8항에 있어서,상기 이형 필름으로 실리콘이 한쪽 면에 코팅된 PET 필름을 사용하는 것을 특징으로 하는 표면 보호 필름.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070007622A KR100838461B1 (ko) | 2007-01-24 | 2007-01-24 | 표면 보호 필름 |
CN2008800029619A CN101594993B (zh) | 2007-01-24 | 2008-01-24 | 表面保护膜 |
PCT/KR2008/000452 WO2008091119A1 (en) | 2007-01-24 | 2008-01-24 | Surface protective film |
JP2009547174A JP2010516856A (ja) | 2007-01-24 | 2008-01-24 | 表面保護フィルム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070007622A KR100838461B1 (ko) | 2007-01-24 | 2007-01-24 | 표면 보호 필름 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100838461B1 true KR100838461B1 (ko) | 2008-06-16 |
Family
ID=39644662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070007622A Active KR100838461B1 (ko) | 2007-01-24 | 2007-01-24 | 표면 보호 필름 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2010516856A (ko) |
KR (1) | KR100838461B1 (ko) |
CN (1) | CN101594993B (ko) |
WO (1) | WO2008091119A1 (ko) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101142198B1 (ko) * | 2009-12-21 | 2012-05-07 | 도레이첨단소재 주식회사 | 연성인쇄회로기판용 점착보호필름 |
KR101188170B1 (ko) | 2011-01-21 | 2012-10-05 | 도레이첨단소재 주식회사 | 연성회로기판 보호필름용 점착제 및 이를 이용한 연성회로기판용 보호필름 |
KR101429959B1 (ko) | 2012-01-10 | 2014-08-14 | 후지모리 고교 가부시키가이샤 | 표면 보호 필름 및 그것이 첩착된 광학 부품과 공업 제품 |
KR101628551B1 (ko) * | 2014-12-02 | 2016-06-08 | 현대자동차주식회사 | 표면 보호 필름 |
KR20200003616A (ko) * | 2018-07-02 | 2020-01-10 | 도레이첨단소재 주식회사 | 노광 공정용 점착보호필름 |
KR20220133709A (ko) | 2021-03-25 | 2022-10-05 | 율촌화학 주식회사 | 내용제성이 우수한 다이싱 테이프 |
KR20230132266A (ko) | 2022-03-08 | 2023-09-15 | 도레이첨단소재 주식회사 | 보호필름용 저수축 점착시트 |
US11796719B2 (en) | 2018-10-11 | 2023-10-24 | Lg Chem, Ltd. | Protection film for foldable display and foldable display device comprising same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102555348B (zh) * | 2011-12-28 | 2014-08-13 | 广东生益科技股份有限公司 | 无胶双面挠性覆铜板生产用保护膜及其制造方法 |
CN102975460A (zh) * | 2012-11-23 | 2013-03-20 | 安文娟 | 一种透明耐磨型显示屏贴膜的制备方法 |
CN104097370A (zh) * | 2013-04-11 | 2014-10-15 | 汉达精密电子(昆山)有限公司 | 防拉伸变形橡胶贴片 |
CN103561546B (zh) * | 2013-11-10 | 2016-05-18 | 大连吉星电子有限公司 | 柔性电路板与金属片热压式贴附工艺 |
CN105647411B (zh) * | 2015-11-27 | 2018-09-07 | 东莞市航达电子有限公司 | 耐高温保护膜 |
CN105898988B (zh) * | 2016-06-01 | 2018-10-02 | 深圳市汇晨电子股份有限公司 | 背光源fpc整版胶膜及其整体贴胶工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0951164A (ja) * | 1995-08-08 | 1997-02-18 | Nitsukan Kogyo Kk | フレキシブル印刷配線基板およびカバーレイフィルム |
JP2002080810A (ja) | 2000-01-20 | 2002-03-22 | Shin Etsu Chem Co Ltd | 接着剤組成物、フレキシブル印刷配線用基板及びカバーレイフィルム |
KR20050075693A (ko) * | 2004-01-16 | 2005-07-21 | 린텍 가부시키가이샤 | 재박리성 공정 필름 |
KR20060051762A (ko) * | 2004-09-29 | 2006-05-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 아크릴계 난연성 접착제 조성물 및 아크릴계 난연성 접착제시트 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH061957A (ja) * | 1992-06-18 | 1994-01-11 | Mitsui Toatsu Chem Inc | 表面保護用粘着テープの製造方法 |
KR20040030811A (ko) * | 2001-07-16 | 2004-04-09 | 덴끼 가가꾸 고교 가부시키가이샤 | 표면 보호 필름 |
JP4191945B2 (ja) * | 2002-03-29 | 2008-12-03 | ソマール株式会社 | 粘着体、それを用いた粘着シート並びにフレキシブル回路基板用積層材料 |
JP4437638B2 (ja) * | 2002-08-09 | 2010-03-24 | 日本カーバイド工業株式会社 | 再剥離型表面保護シート用粘着剤組成物及び再剥離型表面保護シート |
JP4682299B2 (ja) * | 2003-11-17 | 2011-05-11 | 綜研化学株式会社 | 保護シート用感圧接着剤 |
JP4581061B2 (ja) * | 2004-06-25 | 2010-11-17 | 綜研化学株式会社 | 光学フィルム保護シート用粘着剤組成物及び光学フィルム保護シート |
-
2007
- 2007-01-24 KR KR1020070007622A patent/KR100838461B1/ko active Active
-
2008
- 2008-01-24 CN CN2008800029619A patent/CN101594993B/zh active Active
- 2008-01-24 WO PCT/KR2008/000452 patent/WO2008091119A1/en active Application Filing
- 2008-01-24 JP JP2009547174A patent/JP2010516856A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0951164A (ja) * | 1995-08-08 | 1997-02-18 | Nitsukan Kogyo Kk | フレキシブル印刷配線基板およびカバーレイフィルム |
JP2002080810A (ja) | 2000-01-20 | 2002-03-22 | Shin Etsu Chem Co Ltd | 接着剤組成物、フレキシブル印刷配線用基板及びカバーレイフィルム |
KR20050075693A (ko) * | 2004-01-16 | 2005-07-21 | 린텍 가부시키가이샤 | 재박리성 공정 필름 |
KR20060051762A (ko) * | 2004-09-29 | 2006-05-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 아크릴계 난연성 접착제 조성물 및 아크릴계 난연성 접착제시트 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101142198B1 (ko) * | 2009-12-21 | 2012-05-07 | 도레이첨단소재 주식회사 | 연성인쇄회로기판용 점착보호필름 |
KR101188170B1 (ko) | 2011-01-21 | 2012-10-05 | 도레이첨단소재 주식회사 | 연성회로기판 보호필름용 점착제 및 이를 이용한 연성회로기판용 보호필름 |
KR101429959B1 (ko) | 2012-01-10 | 2014-08-14 | 후지모리 고교 가부시키가이샤 | 표면 보호 필름 및 그것이 첩착된 광학 부품과 공업 제품 |
KR101628551B1 (ko) * | 2014-12-02 | 2016-06-08 | 현대자동차주식회사 | 표면 보호 필름 |
KR20200003616A (ko) * | 2018-07-02 | 2020-01-10 | 도레이첨단소재 주식회사 | 노광 공정용 점착보호필름 |
KR102117873B1 (ko) | 2018-07-02 | 2020-06-02 | 도레이첨단소재 주식회사 | 노광 공정용 점착보호필름 |
US11796719B2 (en) | 2018-10-11 | 2023-10-24 | Lg Chem, Ltd. | Protection film for foldable display and foldable display device comprising same |
KR20220133709A (ko) | 2021-03-25 | 2022-10-05 | 율촌화학 주식회사 | 내용제성이 우수한 다이싱 테이프 |
KR20230132266A (ko) | 2022-03-08 | 2023-09-15 | 도레이첨단소재 주식회사 | 보호필름용 저수축 점착시트 |
KR102627768B1 (ko) * | 2022-03-08 | 2024-01-19 | 도레이첨단소재 주식회사 | 보호필름용 저수축 점착시트 |
Also Published As
Publication number | Publication date |
---|---|
WO2008091119A1 (en) | 2008-07-31 |
CN101594993B (zh) | 2012-12-26 |
JP2010516856A (ja) | 2010-05-20 |
CN101594993A (zh) | 2009-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100838461B1 (ko) | 표면 보호 필름 | |
JP2012177084A (ja) | 耐熱仮着用の粘着剤組成物及び粘着テープ | |
CN112126372B (zh) | 抗静电表面保护膜的制造方法、抗静电表面保护膜 | |
TWI754102B (zh) | 補強膜 | |
JP7075893B2 (ja) | 両面粘着シートおよび半導体装置の製造方法 | |
JP2009035618A (ja) | 活性エネルギー線粘着力消失型粘着剤組成物および粘着テープ | |
JP5560965B2 (ja) | エネルギー線易剥離型粘着剤組成物 | |
JP5565173B2 (ja) | 耐熱仮着用粘着テープ | |
KR102752931B1 (ko) | 표면 보호 필름 | |
CN110791210A (zh) | 晶圆加工用胶带 | |
JP2000044896A (ja) | 耐熱再剥離性粘着フィルム | |
KR20200024088A (ko) | 적층체 | |
JP5565174B2 (ja) | 耐熱仮着用粘着テープ | |
JP5110852B2 (ja) | ソルダレジスト保護用粘着テープ | |
KR102808337B1 (ko) | 보강 필름을 구비하는 디바이스 및 그 제조 방법, 그리고 보강 방법 | |
KR20160073668A (ko) | 소자삽입형 인쇄회로기판용 점착 테이프 및 이의 제조방법 | |
JP5918668B2 (ja) | ソルダレジスト保護用粘着テープ | |
KR102132282B1 (ko) | 이형필름 | |
JP5436047B2 (ja) | ソルダレジスト保護用粘着テープ及びソルダレジストの表面平滑性制御方法 | |
TW202132115A (zh) | 組件、以及使用該組件之第三積層體之製造方法 | |
JP7214303B2 (ja) | 薄膜サポート粘着フィルム | |
JP7214302B2 (ja) | 薄膜サポート粘着フィルム | |
TW201825635A (zh) | 黏著劑組成物及其應用 | |
JP2005059220A (ja) | 耐熱性及び耐薬品性保護フィルム | |
CN105459562B (zh) | 配线基板制造工序用支持膜 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20070124 |
|
PA0201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20071129 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20080528 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20080609 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20080609 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20110518 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20120608 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20130607 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20130607 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140602 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20140602 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150602 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20150602 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20210601 Start annual number: 14 End annual number: 14 |
|
PR1001 | Payment of annual fee |
Payment date: 20220602 Start annual number: 15 End annual number: 15 |
|
PR1001 | Payment of annual fee |
Payment date: 20230601 Start annual number: 16 End annual number: 16 |