KR100828482B1 - 무전해 복합 도금액의 자동분석·관리장치 - Google Patents
무전해 복합 도금액의 자동분석·관리장치 Download PDFInfo
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- KR100828482B1 KR100828482B1 KR1020027000929A KR20027000929A KR100828482B1 KR 100828482 B1 KR100828482 B1 KR 100828482B1 KR 1020027000929 A KR1020027000929 A KR 1020027000929A KR 20027000929 A KR20027000929 A KR 20027000929A KR 100828482 B1 KR100828482 B1 KR 100828482B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/12—Condition responsive control
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- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (7)
- 무전해 복합 도금액을 자동분석하고,적절한 액조성과 사용조건 중 한 가지 이상을 얻도록 자동관리하는 무전해 복합 도금액의 자동분석·관리장치에 있어서,도금액 중의 금속성분의 액중 농도를 흡광 광도법에 의해 측정하기 위해,목적으로 하는 금속 이온에 대하여 흡수성이 있는 파장(제1파장)과, 이 제1파장과 중복되지 않는 파장(제2파장)의 적어도 두 개의 다른 파장을 사용하여, 이들 파장에 의해 투과율 또는 흡광도를 측정하는 기구;제1파장 및 제2파장의 측정값과 아래의 식:제1파장의 흡광도=α×제2파장의 흡광도 +β의 연산 처리에 의해 계수 α, β를 산출하는 기구; 그리고제1파장의 흡광도-α×제2파장의 흡광도를 K값으로 한 경우, 이 K값과 표준 시료로서 미리 정량된 금속 이온의 농도(M)와의 관계에 있어서, 아래의 식:M=γK-δ의 연산 처리에 의해 계수 γ, δ를 산출하고, 이 γ, δ가 정해진 상기 식을 검량선으로 하여, 이 검량선으로부터 목적으로 하는 금속 이온의 미지의 농도를 구하고, 그 측정값을 표시하는 기구;를 구비하고 있는 것을 특징으로 하는 무전해 복합 도금액의 자동분석·관리장치.
- 제 1 항에 있어서, 측정 파장의 적어도 1개의 파장에 대한 반값폭이 1∼100nm 이하로 되도록 분광되어 있는 것을 특징으로 하는 무전해 복합 도금액의 자동분석·관리장치.
- 제 1 항 또는 제 2 항에 있어서, 측정파장의 조합이,적어도 1개의 측정파장으로서 250∼350nm 또는 450∼550nm의 파장범위를 선택하고,이 파장과 중복되지 않는 그 외의 측정파장으로서,그 적어도 1개의 측정 파장으로서 350∼450nm 또는 550∼800nm의 파장 범위를 선택한 조합인 것을 특징으로 하는 무전해 복합 도금액의 자동분석·관리장치.
- 제 1 항 또는 제 2 항에 있어서, 분석 셀내에 도금액을 자동으로 도입한 후, 투과율 또는 흡광도의 측정을 개시하기까지 15초 이상의 정치시간을 확보하도록 측정 타임 테이블이 설정되어 있는 것을 특징으로 하는 무전해 복합 도금액의 자동분석·관리장치.
- 제 1 항 또는 제 2 항에 있어서, 정기적으로 분석 셀내에 순수를 도입하여 분석 셀내를 세정함과 동시에,셀 내에 이 순수를 채운 상태에서 설정하고 있는 측정파장에 있어서 투과율 또는 흡광도의 측정을 하는 기능을 가지고,상기와 같이 순수를 채운 상태에서 측정한 투과율 또는 흡광도의 측정치를, 다음번 순수를 채운 상태에서의 측정을 하기까지의 시간내에 실시되는 도금액에서의 투과율 또는 흡광도의 측정치에 대한 100% 투과율 또는 흡광도 제로의 기준치로서 이용하는 것을 특징으로 하는 무전해 복합 도금액의 자동분석·관리장치.
- 제 1 항 또는 제 2 항에 있어서, 분석 셀에 도금액을 도입하는 샘플링 경로의 도중에,샘플링배관의 단면적보다도 2배 이상의 단면적을 가지는 수직 방향으로 긴 도금액 체류부분을 가지고,그 도금액 체류부분의 입구를 상부에 설치하고,출구를 하부에 설치함으로써,도금액에 싸여진 미세한 거품을 분석 셀내에 들어가지 않게 하기위한 트랩기구를 구비하고 있는 것을 특징으로 하는 무전해 복합 도금액의 자동분석·관리장치.
- 제 1 항 또는 제 2 항에 있어서, 무전해 복합 도금액이 무전해 복합 니켈 도금액이고,이 도금액 중의 니켈성분을 측정하도록 한 것을 특징으로 하는 무전해 복합 도금액의 자동분석·관리장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2000150474 | 2000-05-22 | ||
JPJP-P-2000-00150474 | 2000-05-22 |
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KR20020016911A KR20020016911A (ko) | 2002-03-06 |
KR100828482B1 true KR100828482B1 (ko) | 2008-05-13 |
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KR1020027000929A Expired - Fee Related KR100828482B1 (ko) | 2000-05-22 | 2001-05-21 | 무전해 복합 도금액의 자동분석·관리장치 |
Country Status (5)
Country | Link |
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US (2) | US20030049169A1 (ko) |
KR (1) | KR100828482B1 (ko) |
CN (1) | CN100399012C (ko) |
TW (1) | TWI259215B (ko) |
WO (1) | WO2001090727A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101678013B1 (ko) | 2016-02-15 | 2016-11-21 | 주식회사 베프스 | 금속성분의 액중 농도 지시체를 포함하는 도금액 및 이를 이용한 도금 방법 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040258848A1 (en) * | 2003-05-23 | 2004-12-23 | Akira Fukunaga | Method and apparatus for processing a substrate |
US20080236619A1 (en) * | 2007-04-02 | 2008-10-02 | Enthone Inc. | Cobalt capping surface preparation in microelectronics manufacture |
CN103498134B (zh) * | 2013-10-18 | 2015-11-18 | 北京吉阳技术股份有限公司 | 一种全自动槽式化学镀设备及化学镀方法 |
CN103785314B (zh) * | 2014-03-04 | 2016-05-11 | 厦门大学 | 一种混合器及流通式光度检测自动化分析仪 |
EP3316836A1 (en) | 2015-06-30 | 2018-05-09 | The Procter and Gamble Company | Low-bulk, closely-fitting disposable absorbent pant for children |
US10206823B2 (en) | 2015-10-06 | 2019-02-19 | The Procter & Gamble Company | Disposable diaper with convenient lay-open features |
JP7247067B2 (ja) | 2019-09-26 | 2023-03-28 | 三菱重工業株式会社 | 濃度監視システム、濃度管理システムおよび濃度監視方法 |
CN116219413B (zh) * | 2023-02-23 | 2024-10-22 | 江西景旺精密电路有限公司 | 一种金缸mto防呆的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699081A (en) * | 1986-08-25 | 1987-10-13 | Harshaw/Filtrol Partnership | Means for detecting and adjusting metal salt concentration in an electroless plating bath |
JPH1090275A (ja) * | 1996-09-12 | 1998-04-10 | Hitachi Ltd | 自動化学分析装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1953329A (en) * | 1931-01-22 | 1934-04-03 | Hoover Co | Method and apparatus for preventing the liquefied refrigerant from freezing |
JPS4860694A (ko) * | 1971-11-27 | 1973-08-25 | ||
BE793263A (fr) * | 1971-12-22 | 1973-06-22 | Ici Ltd | Procede de depot du cobalt |
JPS52703B2 (ko) * | 1972-03-31 | 1977-01-10 | ||
JPS5523433A (en) * | 1978-08-09 | 1980-02-19 | Toshiba Corp | Automatic analyzer |
US4324589A (en) * | 1979-02-05 | 1982-04-13 | Shipley Company Inc. | Solute monitoring process |
US4229218A (en) * | 1979-02-05 | 1980-10-21 | Shipley Company Inc. | Self-monitoring electroless plating solution |
US4353933A (en) * | 1979-11-14 | 1982-10-12 | C. Uyemura & Co., Ltd. | Method for controlling electroless plating bath |
JPS6016517B2 (ja) * | 1979-12-29 | 1985-04-25 | 上村工業株式会社 | 無電解めつき制御方法 |
JPS6344083Y2 (ko) * | 1981-04-21 | 1988-11-16 | ||
CN85202765U (zh) * | 1985-06-29 | 1986-04-30 | 上海自立仪器合作工厂 | 可直读浓度的双波长光度计 |
US4774101A (en) * | 1986-12-10 | 1988-09-27 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Automated method for the analysis and control of the electroless metal plating solution |
JPS6490275A (en) * | 1987-09-30 | 1989-04-06 | Ohtsu Tire & Rubber Co Ltd | Emulsion type lustering agent |
JPH0220149A (ja) | 1988-07-08 | 1990-01-23 | Fujitsu Ltd | パケット通信における送受信制御方法 |
JPH0220149U (ko) * | 1988-07-26 | 1990-02-09 | ||
JPH02110348A (ja) * | 1988-10-20 | 1990-04-23 | Fujitsu Ltd | 金メッキ液の管理装置 |
JPH03104856A (ja) | 1989-09-18 | 1991-05-01 | Toyota Motor Corp | 多孔質基板への成膜方法 |
JP2512828Y2 (ja) * | 1990-02-08 | 1996-10-02 | 日本テクトロン株式会社 | 自動分析装置における水処理機構 |
JP2602760B2 (ja) * | 1992-07-23 | 1997-04-23 | 石原薬品株式会社 | 無電解メッキ浴の自動管理方法 |
JPH0815266A (ja) * | 1994-06-28 | 1996-01-19 | Nippon Tectron Co Ltd | 脱ガス装置 |
JP3211196B2 (ja) * | 1995-06-08 | 2001-09-25 | 花王株式会社 | 配管内濁度評価装置 |
JPH10142143A (ja) * | 1996-11-11 | 1998-05-29 | Chuo Seisakusho Ltd | 無電解ニッケルめっき液のニッケル濃度測定方法 |
JP3753815B2 (ja) * | 1996-11-13 | 2006-03-08 | 株式会社中央製作所 | 無電解めっき液の金属イオン濃度測定方法 |
JPH10267935A (ja) * | 1997-03-25 | 1998-10-09 | Olympus Optical Co Ltd | キュベット補正方法 |
JP3297650B2 (ja) * | 1999-04-23 | 2002-07-02 | 大日本スクリーン製造株式会社 | 半導体処理装置 |
JP3104856U (ja) * | 2004-04-27 | 2004-10-14 | 史郎 本田 | 使い捨てのスリッパ用中敷 |
JP2007334463A (ja) * | 2006-06-13 | 2007-12-27 | Hitachi Global Storage Technologies Netherlands Bv | 補助記憶装置およびデータ転送方法 |
-
2001
- 2001-05-21 US US10/031,461 patent/US20030049169A1/en not_active Abandoned
- 2001-05-21 WO PCT/JP2001/004222 patent/WO2001090727A1/ja active Application Filing
- 2001-05-21 TW TW090112120A patent/TWI259215B/zh not_active IP Right Cessation
- 2001-05-21 KR KR1020027000929A patent/KR100828482B1/ko not_active Expired - Fee Related
- 2001-05-21 CN CNB018017894A patent/CN100399012C/zh not_active Expired - Lifetime
-
2005
- 2005-11-28 US US11/287,285 patent/US7507587B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699081A (en) * | 1986-08-25 | 1987-10-13 | Harshaw/Filtrol Partnership | Means for detecting and adjusting metal salt concentration in an electroless plating bath |
JPH1090275A (ja) * | 1996-09-12 | 1998-04-10 | Hitachi Ltd | 自動化学分析装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101678013B1 (ko) | 2016-02-15 | 2016-11-21 | 주식회사 베프스 | 금속성분의 액중 농도 지시체를 포함하는 도금액 및 이를 이용한 도금 방법 |
Also Published As
Publication number | Publication date |
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CN100399012C (zh) | 2008-07-02 |
US20030049169A1 (en) | 2003-03-13 |
CN1383484A (zh) | 2002-12-04 |
KR20020016911A (ko) | 2002-03-06 |
US20060078465A1 (en) | 2006-04-13 |
WO2001090727A1 (fr) | 2001-11-29 |
TWI259215B (en) | 2006-08-01 |
HK1051568A1 (zh) | 2003-08-08 |
US7507587B2 (en) | 2009-03-24 |
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